JPS546357B2 - - Google Patents

Info

Publication number
JPS546357B2
JPS546357B2 JP5392374A JP5392374A JPS546357B2 JP S546357 B2 JPS546357 B2 JP S546357B2 JP 5392374 A JP5392374 A JP 5392374A JP 5392374 A JP5392374 A JP 5392374A JP S546357 B2 JPS546357 B2 JP S546357B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP5392374A
Other versions
JPS5019379A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5019379A publication Critical patent/JPS5019379A/ja
Publication of JPS546357B2 publication Critical patent/JPS546357B2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/7827Vertical transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40Electrodes ; Multistep manufacturing processes therefor
    • H01L29/41Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
    • H01L29/423Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
    • H01L29/42312Gate electrodes for field effect devices
    • H01L29/42316Gate electrodes for field effect devices for field-effect transistors
    • H01L29/4232Gate electrodes for field effect devices for field-effect transistors with insulated gate
    • H01L29/42356Disposition, e.g. buried gate electrode
    • H01L29/4236Disposition, e.g. buried gate electrode within a trench, e.g. trench gate electrode, groove gate electrode
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/143Shadow masking

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Junction Field-Effect Transistors (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Bipolar Transistors (AREA)
JP5392374A 1973-05-16 1974-05-16 Expired JPS546357B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US00360996A US3851379A (en) 1973-05-16 1973-05-16 Solid state components

Publications (2)

Publication Number Publication Date
JPS5019379A JPS5019379A (ja) 1975-02-28
JPS546357B2 true JPS546357B2 (ja) 1979-03-27

Family

ID=23420237

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5392374A Expired JPS546357B2 (ja) 1973-05-16 1974-05-16

Country Status (5)

Country Link
US (1) US3851379A (ja)
JP (1) JPS546357B2 (ja)
DE (1) DE2423670A1 (ja)
FR (1) FR2230082B1 (ja)
GB (1) GB1465629A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5733358Y2 (ja) * 1977-12-28 1982-07-22
JPS6342319Y2 (ja) * 1984-07-19 1988-11-07

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2341154C2 (de) * 1973-08-14 1975-06-26 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zur Herstellung einer Zweiphasen-Ladungsverschiebeanordnung
IE39611B1 (en) * 1973-08-14 1978-11-22 Siemens Ag Improvements in or relating to two-phase charge coupled devices
US3951708A (en) * 1974-10-15 1976-04-20 Rca Corporation Method of manufacturing a semiconductor device
US4070690A (en) * 1976-08-17 1978-01-24 Westinghouse Electric Corporation VMOS transistor
JPS5380976A (en) * 1976-12-25 1978-07-17 Toshiba Corp Semiconductor device
US4129879A (en) * 1977-04-21 1978-12-12 General Electric Company Vertical field effect transistor
JPS6013313B2 (ja) * 1977-05-19 1985-04-06 松下電器産業株式会社 半導体装置の製造方法
US4206469A (en) * 1978-09-15 1980-06-03 Westinghouse Electric Corp. Power metal-oxide-semiconductor-field-effect-transistor
US4198250A (en) * 1979-02-05 1980-04-15 Intel Corporation Shadow masking process for forming source and drain regions for field-effect transistors and like regions
US4262296A (en) * 1979-07-27 1981-04-14 General Electric Company Vertical field effect transistor with improved gate and channel structure
US4377899A (en) * 1979-11-19 1983-03-29 Sumitomo Electric Industries, Ltd. Method of manufacturing Schottky field-effect transistors utilizing shadow masking
US4393391A (en) * 1980-06-16 1983-07-12 Supertex, Inc. Power MOS transistor with a plurality of longitudinal grooves to increase channel conducting area
FR2507821A1 (fr) * 1981-06-16 1982-12-17 Thomson Csf Transistor a effet de champ vertical a jonction et procede de fabrication
US4449285A (en) * 1981-08-19 1984-05-22 The Secretary Of State For Defence In Her Britannic Majesty's Government Of The United Kingdom Of Great Britain And Northern Ireland Method for producing a vertical channel transistor
US4570174A (en) * 1981-08-21 1986-02-11 The United States Of America As Represented By The Secretary Of The Army Vertical MESFET with air spaced gate electrode
US4625388A (en) * 1982-04-26 1986-12-02 Acrian, Inc. Method of fabricating mesa MOSFET using overhang mask and resulting structure
US4419811A (en) * 1982-04-26 1983-12-13 Acrian, Inc. Method of fabricating mesa MOSFET using overhang mask
US4525919A (en) * 1982-06-16 1985-07-02 Raytheon Company Forming sub-micron electrodes by oblique deposition
US4738936A (en) * 1983-07-01 1988-04-19 Acrian, Inc. Method of fabrication lateral FET structure having a substrate to source contact
FR2555816B1 (fr) * 1983-11-25 1986-04-11 Thomson Csf Transistor a effet de champ a structure verticale
FR2557368B1 (fr) * 1983-12-27 1986-04-11 Thomson Csf Transistor a effet de champ, de structure verticale submicronique, et son procede de realisation
US4888626A (en) * 1985-03-07 1989-12-19 The United States Of America As Represented By The Secretary Of The Navy Self-aligned gaas fet with low 1/f noise
US4941026A (en) * 1986-12-05 1990-07-10 General Electric Company Semiconductor devices exhibiting minimum on-resistance
US5166769A (en) * 1988-07-18 1992-11-24 General Instrument Corporation Passitvated mesa semiconductor and method for making same
JP2768988B2 (ja) * 1989-08-17 1998-06-25 三菱電機株式会社 端面部分コーティング方法
JP3461277B2 (ja) * 1998-01-23 2003-10-27 株式会社東芝 半導体装置及びその製造方法
US6667215B2 (en) * 2002-05-02 2003-12-23 3M Innovative Properties Method of making transistors

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2875505A (en) * 1952-12-11 1959-03-03 Bell Telephone Labor Inc Semiconductor translating device
US3387360A (en) * 1965-04-01 1968-06-11 Sony Corp Method of making a semiconductor device
US3761785A (en) * 1971-04-23 1973-09-25 Bell Telephone Labor Inc Methods for making transistor structures
US3689993A (en) * 1971-07-26 1972-09-12 Texas Instruments Inc Fabrication of semiconductor devices having low thermal inpedance bonds to heat sinks

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5733358Y2 (ja) * 1977-12-28 1982-07-22
JPS6342319Y2 (ja) * 1984-07-19 1988-11-07

Also Published As

Publication number Publication date
DE2423670A1 (de) 1974-12-05
JPS5019379A (ja) 1975-02-28
FR2230082A1 (ja) 1974-12-13
FR2230082B1 (ja) 1979-02-16
GB1465629A (en) 1977-02-23
US3851379A (en) 1974-12-03

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