JPS5417335A - Method of continuously treating nickel plating solution - Google Patents

Method of continuously treating nickel plating solution

Info

Publication number
JPS5417335A
JPS5417335A JP7530478A JP7530478A JPS5417335A JP S5417335 A JPS5417335 A JP S5417335A JP 7530478 A JP7530478 A JP 7530478A JP 7530478 A JP7530478 A JP 7530478A JP S5417335 A JPS5417335 A JP S5417335A
Authority
JP
Japan
Prior art keywords
plating solution
nickel plating
continuously treating
treating nickel
continuously
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7530478A
Other languages
Japanese (ja)
Other versions
JPS5733360B2 (en
Inventor
Kuraizeru Ruudorufu
Maieru Buaruteru
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bayer Pharma AG
Original Assignee
Schering AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schering AG filed Critical Schering AG
Publication of JPS5417335A publication Critical patent/JPS5417335A/en
Publication of JPS5733360B2 publication Critical patent/JPS5733360B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Water Treatment By Sorption (AREA)
JP7530478A 1977-06-27 1978-06-21 Method of continuously treating nickel plating solution Granted JPS5417335A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19772729387 DE2729387A1 (en) 1977-06-27 1977-06-27 PROCESS FOR CONTINUOUS PREPARATION OF A GALVANIC NICKEL BATH AND DEVICE FOR CARRYING OUT THE PROCESS

Publications (2)

Publication Number Publication Date
JPS5417335A true JPS5417335A (en) 1979-02-08
JPS5733360B2 JPS5733360B2 (en) 1982-07-16

Family

ID=6012702

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7530478A Granted JPS5417335A (en) 1977-06-27 1978-06-21 Method of continuously treating nickel plating solution

Country Status (5)

Country Link
JP (1) JPS5417335A (en)
DE (1) DE2729387A1 (en)
FR (1) FR2396103A1 (en)
GB (1) GB2001101B (en)
IE (1) IE47007B1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5585699A (en) * 1978-12-20 1980-06-27 Ladney M Jr Recovery and reuse of nickel electroplating bath
JP2013237894A (en) * 2012-05-15 2013-11-28 Ebara Corp Plating apparatus and plating solution management method

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4595474A (en) * 1983-11-14 1986-06-17 Greco Bros., Inc. Electroplating solution recovery system
US4746414A (en) * 1987-09-08 1988-05-24 The United States Of America As Represented By The Secretary Of The Navy Zero discharge spray rinse system for electroplating operations
DE4405741C1 (en) * 1994-02-23 1995-06-01 Atotech Deutschland Gmbh Electrolytic deposition of metal coating
US6890414B2 (en) * 2001-09-04 2005-05-10 The Boc Group, Inc. Purification system and method
DE102009049565A1 (en) * 2009-10-09 2011-04-14 Gebr. Schmid Gmbh & Co. Process and plant for the metallization of silicon wafers
DE102011006616A1 (en) * 2011-03-31 2012-10-04 Dürr Systems GmbH Plant for the treatment of workpieces with a process fluid

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50159428A (en) * 1974-06-13 1975-12-24

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50159428A (en) * 1974-06-13 1975-12-24

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5585699A (en) * 1978-12-20 1980-06-27 Ladney M Jr Recovery and reuse of nickel electroplating bath
JPS5735280B2 (en) * 1978-12-20 1982-07-28
JP2013237894A (en) * 2012-05-15 2013-11-28 Ebara Corp Plating apparatus and plating solution management method

Also Published As

Publication number Publication date
IE781257L (en) 1978-12-27
DE2729387A1 (en) 1979-01-18
FR2396103B1 (en) 1982-10-15
GB2001101B (en) 1982-01-20
FR2396103A1 (en) 1979-01-26
JPS5733360B2 (en) 1982-07-16
DE2729387C2 (en) 1987-08-20
IE47007B1 (en) 1983-11-30
GB2001101A (en) 1979-01-24

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