GB2001101A - Process and apparatus for the electrodeposition of nickel - Google Patents

Process and apparatus for the electrodeposition of nickel

Info

Publication number
GB2001101A
GB2001101A GB7827942A GB7827942A GB2001101A GB 2001101 A GB2001101 A GB 2001101A GB 7827942 A GB7827942 A GB 7827942A GB 7827942 A GB7827942 A GB 7827942A GB 2001101 A GB2001101 A GB 2001101A
Authority
GB
United Kingdom
Prior art keywords
via conduit
electrodeposition
nickel
electrolyte
bath
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB7827942A
Other versions
GB2001101B (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bayer Pharma AG
Original Assignee
Schering AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schering AG filed Critical Schering AG
Publication of GB2001101A publication Critical patent/GB2001101A/en
Application granted granted Critical
Publication of GB2001101B publication Critical patent/GB2001101B/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Water Treatment By Sorption (AREA)

Abstract

In the electrodeposition of nickel onto articles, a proportion of the nickel electrolyte is continuously removed via conduits 5, 7 from the electrodeposition bath 1, a part of the removed electrolyte is combined with used liquid from the rinsing apparatus 12 (via conduit 18) and passed via conduit 20 through a filter 22 (especially active carbon) for organic decomposition products, and the filtrate is combined in collecting chamber 21 with the remainder of the removed electrolyte via conduit 19. A major proportion of the resulting mixture is returned directly via conduit 23 to the electrodeposition bath. A minor proportion of the mixture is treated in cleaning system 25 to remove metal impurities and then in electrolytic cell 26 to recover excess nickel dissolved in the electrodeposition bath, and is then also returned to the bath via conduit 27. No waste liquid is produced, and evaporation losses are counterbalanced by appropriate control of the introduction of fresh rinsing liquid. <IMAGE>
GB7827942A 1977-06-27 1978-06-27 Process and apparatus for the electrodeposition of nickel Expired GB2001101B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19772729387 DE2729387A1 (en) 1977-06-27 1977-06-27 PROCESS FOR CONTINUOUS PREPARATION OF A GALVANIC NICKEL BATH AND DEVICE FOR CARRYING OUT THE PROCESS

Publications (2)

Publication Number Publication Date
GB2001101A true GB2001101A (en) 1979-01-24
GB2001101B GB2001101B (en) 1982-01-20

Family

ID=6012702

Family Applications (1)

Application Number Title Priority Date Filing Date
GB7827942A Expired GB2001101B (en) 1977-06-27 1978-06-27 Process and apparatus for the electrodeposition of nickel

Country Status (5)

Country Link
JP (1) JPS5417335A (en)
DE (1) DE2729387A1 (en)
FR (1) FR2396103A1 (en)
GB (1) GB2001101B (en)
IE (1) IE47007B1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4595474A (en) * 1983-11-14 1986-06-17 Greco Bros., Inc. Electroplating solution recovery system
US4746414A (en) * 1987-09-08 1988-05-24 The United States Of America As Represented By The Secretary Of The Navy Zero discharge spray rinse system for electroplating operations
EP1291455A1 (en) * 2001-09-04 2003-03-12 The Boc Group, Inc. Purification system and method used for a plating bath
WO2011042324A2 (en) * 2009-10-09 2011-04-14 Gebr. Schmid Gmbh & Co. Method and installation for producing metallised semiconductor substrates

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4197167A (en) * 1978-12-20 1980-04-08 Michael Ladney, Jr. Recovery and reuse of nickel electroplating baths carried away by workpieces
DE4405741C1 (en) * 1994-02-23 1995-06-01 Atotech Deutschland Gmbh Electrolytic deposition of metal coating
DE102011006616A1 (en) * 2011-03-31 2012-10-04 Dürr Systems GmbH Plant for the treatment of workpieces with a process fluid
JP5876767B2 (en) * 2012-05-15 2016-03-02 株式会社荏原製作所 Plating apparatus and plating solution management method

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5534880B2 (en) * 1974-06-13 1980-09-10

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
None *

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4595474A (en) * 1983-11-14 1986-06-17 Greco Bros., Inc. Electroplating solution recovery system
US4746414A (en) * 1987-09-08 1988-05-24 The United States Of America As Represented By The Secretary Of The Navy Zero discharge spray rinse system for electroplating operations
EP1291455A1 (en) * 2001-09-04 2003-03-12 The Boc Group, Inc. Purification system and method used for a plating bath
US6890414B2 (en) 2001-09-04 2005-05-10 The Boc Group, Inc. Purification system and method
WO2011042324A2 (en) * 2009-10-09 2011-04-14 Gebr. Schmid Gmbh & Co. Method and installation for producing metallised semiconductor substrates
WO2011042324A3 (en) * 2009-10-09 2011-06-30 Gebr. Schmid Gmbh & Co. Method and installation for producing metallised semiconductor substrates
CN102695821A (en) * 2009-10-09 2012-09-26 吉布尔·施密德有限责任公司 Method and installation for producing metallised semiconductor substrates
CN102695821B (en) * 2009-10-09 2016-04-13 吉布尔·施密德有限责任公司 For the manufacture of the method and apparatus of metallized semiconducter substrate

Also Published As

Publication number Publication date
DE2729387C2 (en) 1987-08-20
DE2729387A1 (en) 1979-01-18
GB2001101B (en) 1982-01-20
IE781257L (en) 1978-12-27
JPS5733360B2 (en) 1982-07-16
IE47007B1 (en) 1983-11-30
FR2396103B1 (en) 1982-10-15
JPS5417335A (en) 1979-02-08
FR2396103A1 (en) 1979-01-26

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee