JPS54162966A - Vapor growth method and its device for semiconductor substrate - Google Patents

Vapor growth method and its device for semiconductor substrate

Info

Publication number
JPS54162966A
JPS54162966A JP7150678A JP7150678A JPS54162966A JP S54162966 A JPS54162966 A JP S54162966A JP 7150678 A JP7150678 A JP 7150678A JP 7150678 A JP7150678 A JP 7150678A JP S54162966 A JPS54162966 A JP S54162966A
Authority
JP
Japan
Prior art keywords
plasma
container
vapor growth
gas
plasma discharge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7150678A
Other languages
Japanese (ja)
Inventor
Masashi Minato
Kazuo Niwa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP7150678A priority Critical patent/JPS54162966A/en
Publication of JPS54162966A publication Critical patent/JPS54162966A/en
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C23C16/511Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using microwave discharges

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)

Abstract

PURPOSE:To increase the uniformity of the film by introducing both the plasma- changed gas generated at the plasma discharge part and the vapor growth source gas given from other waveguide into the airtight reaction container and obtaining the uniform gas flow at the reaction part. CONSTITUTION:Semiconductor substrate 11 is provided into airtight reaction container 16, and the microwave produced from the microwave generator installed outside container 16 is sent to plasma discharge part 33 to generate the plasma discharge. The plasma discharge is then introduced to container 16 through plasma- changed gas introduction mouth 23. At the same time, the different vapor growth source gas is introduced from other waveguide, and the inside of container 16 is decompressed until the atmosphere of both gas is secured there. Thus the vapor growth is given by the plasma to substrate 11. In such way, the uniform gas flow is secured with use of no discharge electrode at the reaction part, thus enhancing the uniformity of the film.
JP7150678A 1978-06-15 1978-06-15 Vapor growth method and its device for semiconductor substrate Pending JPS54162966A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7150678A JPS54162966A (en) 1978-06-15 1978-06-15 Vapor growth method and its device for semiconductor substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7150678A JPS54162966A (en) 1978-06-15 1978-06-15 Vapor growth method and its device for semiconductor substrate

Publications (1)

Publication Number Publication Date
JPS54162966A true JPS54162966A (en) 1979-12-25

Family

ID=13462633

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7150678A Pending JPS54162966A (en) 1978-06-15 1978-06-15 Vapor growth method and its device for semiconductor substrate

Country Status (1)

Country Link
JP (1) JPS54162966A (en)

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