JPS54142649A - Boiling heat conducting wall - Google Patents
Boiling heat conducting wallInfo
- Publication number
- JPS54142649A JPS54142649A JP4980378A JP4980378A JPS54142649A JP S54142649 A JPS54142649 A JP S54142649A JP 4980378 A JP4980378 A JP 4980378A JP 4980378 A JP4980378 A JP 4980378A JP S54142649 A JPS54142649 A JP S54142649A
- Authority
- JP
- Japan
- Prior art keywords
- heat conductive
- slim
- outlet
- joining
- thin plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To improve performance (or capability) of a heat conductive thin plate of a special structure and having a penetrating holes by joining it to a heat conductive parent material provided with slim grooves.
CONSTITUTION: A heat conductive thin plate 1 fabricated by using electronic beam or laser to form numerous penetrating holes equipped with large diameter outlet 2 and small diameter outlet 3 is joined to a heat conductive parent material 4, which is provided with numerous slim grooves 5 in parallel position, crossing position and discontinous position, etc., by using such fabricating processes as press forming, roll forming and milling, etc., and this joining is to be done in such a manner that the large diameter outlet 2 comes to the slim groove's surface. In this mechanism, because of small diameter of outlet of the penetrating hole the generated foams depart from the penetrating hole after they have grown large accelerating improvement of heat conductivity, and at the same time, cooling media are conducted through the slim groove by capillary phenomena allowing further improvement of heat conductivity.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4980378A JPS54142649A (en) | 1978-04-28 | 1978-04-28 | Boiling heat conducting wall |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4980378A JPS54142649A (en) | 1978-04-28 | 1978-04-28 | Boiling heat conducting wall |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS54142649A true JPS54142649A (en) | 1979-11-07 |
Family
ID=12841293
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4980378A Pending JPS54142649A (en) | 1978-04-28 | 1978-04-28 | Boiling heat conducting wall |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54142649A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4602681A (en) * | 1982-11-04 | 1986-07-29 | Hitachi, Ltd. & Hitachi Cable, Ltd. | Heat transfer surface with multiple layers |
US4747448A (en) * | 1983-11-01 | 1988-05-31 | The Boc Group, Plc | Heat exchangers |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5162445A (en) * | 1974-11-27 | 1976-05-31 | Hitachi Ltd | DENNET SUHEKIMEN |
JPS5223758B2 (en) * | 1972-07-19 | 1977-06-27 |
-
1978
- 1978-04-28 JP JP4980378A patent/JPS54142649A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5223758B2 (en) * | 1972-07-19 | 1977-06-27 | ||
JPS5162445A (en) * | 1974-11-27 | 1976-05-31 | Hitachi Ltd | DENNET SUHEKIMEN |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4602681A (en) * | 1982-11-04 | 1986-07-29 | Hitachi, Ltd. & Hitachi Cable, Ltd. | Heat transfer surface with multiple layers |
US4747448A (en) * | 1983-11-01 | 1988-05-31 | The Boc Group, Plc | Heat exchangers |
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