JPS54128675A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS54128675A JPS54128675A JP3731278A JP3731278A JPS54128675A JP S54128675 A JPS54128675 A JP S54128675A JP 3731278 A JP3731278 A JP 3731278A JP 3731278 A JP3731278 A JP 3731278A JP S54128675 A JPS54128675 A JP S54128675A
- Authority
- JP
- Japan
- Prior art keywords
- stem
- leads
- emitter
- dissipation
- disc
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Abstract
PURPOSE:To make strong the semiconductor to the power cycle, by performing efficient heat dissipation from the electrode at the major plane close to the main dissipation part of the semiconductor to the stem. CONSTITUTION:The disc 13 is insulated and sealed to the hole 11 at the center of the stem substrate 1 via the glass 12, and the transistor 7 is fixed on the disc 13 via the solder 8 by using the stem 15 directly implanting the leads 14 to the stem substrate 1, and the emitter is connected to the leads 14 via the plate connector 16 of copper. With this construction, the heat of the base-to-emitter junction 75 being major heat dissipation is effectively dissipated to the stem substrate 1 via the emitter electrode 79, connector 16 and leads 14 and the thermal dissipation via the solder material is helped. Thus, based on the temperature difference and the difference of thermal expansion coefficient between the element and the stem 15, the stress exerted on the solder material is reduced and the strength against power cycle can be increased.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3731278A JPS54128675A (en) | 1978-03-29 | 1978-03-29 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3731278A JPS54128675A (en) | 1978-03-29 | 1978-03-29 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS54128675A true JPS54128675A (en) | 1979-10-05 |
Family
ID=12494163
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3731278A Pending JPS54128675A (en) | 1978-03-29 | 1978-03-29 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54128675A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54153871U (en) * | 1978-04-19 | 1979-10-25 |
-
1978
- 1978-03-29 JP JP3731278A patent/JPS54128675A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54153871U (en) * | 1978-04-19 | 1979-10-25 |
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