JPS54113247A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS54113247A
JPS54113247A JP2054678A JP2054678A JPS54113247A JP S54113247 A JPS54113247 A JP S54113247A JP 2054678 A JP2054678 A JP 2054678A JP 2054678 A JP2054678 A JP 2054678A JP S54113247 A JPS54113247 A JP S54113247A
Authority
JP
Japan
Prior art keywords
dielectric layer
bump
protective film
circumference
groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2054678A
Other languages
Japanese (ja)
Other versions
JPS5733862B2 (en
Inventor
Masanobu Obara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2054678A priority Critical patent/JPS54113247A/en
Publication of JPS54113247A publication Critical patent/JPS54113247A/en
Publication of JPS5733862B2 publication Critical patent/JPS5733862B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Formation Of Insulating Films (AREA)

Abstract

PURPOSE: To prevent a protective film from generating cracks by providing a groove, which reaches a dielectric layer along the bump circumference through a ground protective film, and giving a structure where this groove is buried around the bump.
CONSTITUTION: Dielectric layer 2 such as SiO2 and Si3N4 is provided on semiconductor substrate 1 formed by Si, and electrode pad 3 formed by Al, etc., is separated from substrate 1 by dielectric layer 2 and has one end connected to the wiring on the semiconductor element. Further, protective film 4 for the dielectric layer is formed on dielectric layer 2 and the circumference of electrode pad 3. Here, groove 8 is provided which reaches dielectric layer 2 through protective film 4 surrounding the circumference of electrode pad 3, and bump 4 is so formed that the circumference of bump 4 or the part near the circumference of bump 4 may be agreed with groove 8. As a result, the stress from bump 6 is absorbed by groove 8 and acts on dielectric layer 2 and does not act on protective film 4. Consequently, coverage part 4a of protective film 4 is prevented from generating cracks, and the lowering of reliability can be prevented.
COPYRIGHT: (C)1979,JPO&Japio
JP2054678A 1978-02-23 1978-02-23 Semiconductor device Granted JPS54113247A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2054678A JPS54113247A (en) 1978-02-23 1978-02-23 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2054678A JPS54113247A (en) 1978-02-23 1978-02-23 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS54113247A true JPS54113247A (en) 1979-09-04
JPS5733862B2 JPS5733862B2 (en) 1982-07-20

Family

ID=12030143

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2054678A Granted JPS54113247A (en) 1978-02-23 1978-02-23 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS54113247A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63181450A (en) * 1987-01-23 1988-07-26 Matsushita Electric Ind Co Ltd Bump for semiconductor device and its manufacture

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59146461U (en) * 1983-03-19 1984-09-29 鹿島建設株式会社 Construction site curing sheet
JPS6029860U (en) * 1983-08-04 1985-02-28 株式会社長谷工コーポレーション curing sheet

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63181450A (en) * 1987-01-23 1988-07-26 Matsushita Electric Ind Co Ltd Bump for semiconductor device and its manufacture

Also Published As

Publication number Publication date
JPS5733862B2 (en) 1982-07-20

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