JPS54113247A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS54113247A
JPS54113247A JP2054678A JP2054678A JPS54113247A JP S54113247 A JPS54113247 A JP S54113247A JP 2054678 A JP2054678 A JP 2054678A JP 2054678 A JP2054678 A JP 2054678A JP S54113247 A JPS54113247 A JP S54113247A
Authority
JP
Japan
Prior art keywords
dielectric layer
bump
protective film
circumference
groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2054678A
Other languages
English (en)
Other versions
JPS5733862B2 (ja
Inventor
Masanobu Obara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2054678A priority Critical patent/JPS54113247A/ja
Publication of JPS54113247A publication Critical patent/JPS54113247A/ja
Publication of JPS5733862B2 publication Critical patent/JPS5733862B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Formation Of Insulating Films (AREA)
JP2054678A 1978-02-23 1978-02-23 Semiconductor device Granted JPS54113247A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2054678A JPS54113247A (en) 1978-02-23 1978-02-23 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2054678A JPS54113247A (en) 1978-02-23 1978-02-23 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS54113247A true JPS54113247A (en) 1979-09-04
JPS5733862B2 JPS5733862B2 (ja) 1982-07-20

Family

ID=12030143

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2054678A Granted JPS54113247A (en) 1978-02-23 1978-02-23 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS54113247A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63181450A (ja) * 1987-01-23 1988-07-26 Matsushita Electric Ind Co Ltd 半導体素子用バンプ及びその製造方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59146461U (ja) * 1983-03-19 1984-09-29 鹿島建設株式会社 工事現場用養生シ−ト
JPS6029860U (ja) * 1983-08-04 1985-02-28 株式会社長谷工コーポレーション 養生シ−ト

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63181450A (ja) * 1987-01-23 1988-07-26 Matsushita Electric Ind Co Ltd 半導体素子用バンプ及びその製造方法

Also Published As

Publication number Publication date
JPS5733862B2 (ja) 1982-07-20

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