JPS5355962A - Semiconductor integrated circuit - Google Patents

Semiconductor integrated circuit

Info

Publication number
JPS5355962A
JPS5355962A JP13102876A JP13102876A JPS5355962A JP S5355962 A JPS5355962 A JP S5355962A JP 13102876 A JP13102876 A JP 13102876A JP 13102876 A JP13102876 A JP 13102876A JP S5355962 A JPS5355962 A JP S5355962A
Authority
JP
Japan
Prior art keywords
integrated circuit
semiconductor integrated
wiring
corrosion
perform
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13102876A
Other languages
Japanese (ja)
Inventor
Takeo Yamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP13102876A priority Critical patent/JPS5355962A/en
Publication of JPS5355962A publication Critical patent/JPS5355962A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electrodes Of Semiconductors (AREA)

Abstract

PURPOSE: To perform a connection between the junction pad part and the internal Al wiring via the diffusion layer of the substrate surface, and thus to prevent the corrosion of the Al wiring.
COPYRIGHT: (C)1978,JPO&Japio
JP13102876A 1976-10-29 1976-10-29 Semiconductor integrated circuit Pending JPS5355962A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13102876A JPS5355962A (en) 1976-10-29 1976-10-29 Semiconductor integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13102876A JPS5355962A (en) 1976-10-29 1976-10-29 Semiconductor integrated circuit

Publications (1)

Publication Number Publication Date
JPS5355962A true JPS5355962A (en) 1978-05-20

Family

ID=15048314

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13102876A Pending JPS5355962A (en) 1976-10-29 1976-10-29 Semiconductor integrated circuit

Country Status (1)

Country Link
JP (1) JPS5355962A (en)

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