JPS5313877A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5313877A
JPS5313877A JP8727076A JP8727076A JPS5313877A JP S5313877 A JPS5313877 A JP S5313877A JP 8727076 A JP8727076 A JP 8727076A JP 8727076 A JP8727076 A JP 8727076A JP S5313877 A JPS5313877 A JP S5313877A
Authority
JP
Japan
Prior art keywords
semiconductor device
leads
prevent shorting
solders
accidents
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8727076A
Other languages
Japanese (ja)
Inventor
Wataru Nozaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP8727076A priority Critical patent/JPS5313877A/en
Publication of JPS5313877A publication Critical patent/JPS5313877A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Formation Of Insulating Films (AREA)

Abstract

PURPOSE: To prevent shorting accidents by applying an insulation coating to leads as well as to prevent shorting despite mutual contacting by connecting an element to the leads in the condition wherein solders are held in place.
COPYRIGHT: (C)1978,JPO&Japio
JP8727076A 1976-07-23 1976-07-23 Semiconductor device Pending JPS5313877A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8727076A JPS5313877A (en) 1976-07-23 1976-07-23 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8727076A JPS5313877A (en) 1976-07-23 1976-07-23 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5313877A true JPS5313877A (en) 1978-02-07

Family

ID=13910062

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8727076A Pending JPS5313877A (en) 1976-07-23 1976-07-23 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5313877A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56154400A (en) * 1980-04-24 1981-11-28 Nissan Motor Separator for division type nose fearing
JPS6298242U (en) * 1985-12-10 1987-06-23
JPS63100847U (en) * 1986-12-19 1988-06-30

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56154400A (en) * 1980-04-24 1981-11-28 Nissan Motor Separator for division type nose fearing
JPS582120B2 (en) * 1980-04-24 1983-01-14 日産自動車株式会社 Separation device for split type nose fairing
JPS6298242U (en) * 1985-12-10 1987-06-23
JPS63100847U (en) * 1986-12-19 1988-06-30
JPH0438524Y2 (en) * 1986-12-19 1992-09-09

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