JPS5394875A - Package for semiconductor element - Google Patents

Package for semiconductor element

Info

Publication number
JPS5394875A
JPS5394875A JP991077A JP991077A JPS5394875A JP S5394875 A JPS5394875 A JP S5394875A JP 991077 A JP991077 A JP 991077A JP 991077 A JP991077 A JP 991077A JP S5394875 A JPS5394875 A JP S5394875A
Authority
JP
Japan
Prior art keywords
package
semiconductor element
feqturing
dectease
detouring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP991077A
Other languages
Japanese (ja)
Other versions
JPS6011462B2 (en
Inventor
Zensuke Matsuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP52009910A priority Critical patent/JPS6011462B2/en
Publication of JPS5394875A publication Critical patent/JPS5394875A/en
Publication of JPS6011462B2 publication Critical patent/JPS6011462B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/023—Redistribution layers [RDL] for bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To dectease the element size as well as to facilitate an easy element design, by providing the lead wiring feqturing the same function detouring the element in the package for the element.
COPYRIGHT: (C)1978,JPO&Japio
JP52009910A 1977-01-31 1977-01-31 semiconductor equipment Expired JPS6011462B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP52009910A JPS6011462B2 (en) 1977-01-31 1977-01-31 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP52009910A JPS6011462B2 (en) 1977-01-31 1977-01-31 semiconductor equipment

Publications (2)

Publication Number Publication Date
JPS5394875A true JPS5394875A (en) 1978-08-19
JPS6011462B2 JPS6011462B2 (en) 1985-03-26

Family

ID=11733253

Family Applications (1)

Application Number Title Priority Date Filing Date
JP52009910A Expired JPS6011462B2 (en) 1977-01-31 1977-01-31 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS6011462B2 (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58110063A (en) * 1981-12-23 1983-06-30 Nec Corp Integrated circuit device
JPS593960A (en) * 1982-06-29 1984-01-10 Toshiba Corp Semiconductor device
JPS625649A (en) * 1985-07-01 1987-01-12 Nec Ic Microcomput Syst Ltd Package for integrated circuit
JPS6314438A (en) * 1986-07-04 1988-01-21 Mitsubishi Electric Corp Semiconductor device
JPH02131357U (en) * 1989-04-05 1990-10-31
JPH03263334A (en) * 1990-03-13 1991-11-22 Toshiba Corp Resin-sealed semiconductor device
JPH04177846A (en) * 1990-11-13 1992-06-25 Toshiba Corp Semiconductor device
JPH0521691A (en) * 1991-12-05 1993-01-29 Hitachi Ltd Semiconductor device and assembling method thereof
JPH0521692A (en) * 1991-12-05 1993-01-29 Hitachi Ltd Semiconductor device
JPH0536890A (en) * 1991-12-05 1993-02-12 Hitachi Ltd Semiconductor device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6232682A (en) * 1985-08-03 1987-02-12 株式会社　ニフコ Improvement in integration density for 3-d circuit structural body

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58110063A (en) * 1981-12-23 1983-06-30 Nec Corp Integrated circuit device
JPS593960A (en) * 1982-06-29 1984-01-10 Toshiba Corp Semiconductor device
JPS634951B2 (en) * 1982-06-29 1988-02-01 Tokyo Shibaura Electric Co
JPS625649A (en) * 1985-07-01 1987-01-12 Nec Ic Microcomput Syst Ltd Package for integrated circuit
JPS6314438A (en) * 1986-07-04 1988-01-21 Mitsubishi Electric Corp Semiconductor device
JPH02131357U (en) * 1989-04-05 1990-10-31
JPH03263334A (en) * 1990-03-13 1991-11-22 Toshiba Corp Resin-sealed semiconductor device
JPH04177846A (en) * 1990-11-13 1992-06-25 Toshiba Corp Semiconductor device
JPH0521691A (en) * 1991-12-05 1993-01-29 Hitachi Ltd Semiconductor device and assembling method thereof
JPH0521692A (en) * 1991-12-05 1993-01-29 Hitachi Ltd Semiconductor device
JPH0536890A (en) * 1991-12-05 1993-02-12 Hitachi Ltd Semiconductor device

Also Published As

Publication number Publication date
JPS6011462B2 (en) 1985-03-26

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