JPS5239368A - Method for surface treatment of silicon wafer - Google Patents

Method for surface treatment of silicon wafer

Info

Publication number
JPS5239368A
JPS5239368A JP11468275A JP11468275A JPS5239368A JP S5239368 A JPS5239368 A JP S5239368A JP 11468275 A JP11468275 A JP 11468275A JP 11468275 A JP11468275 A JP 11468275A JP S5239368 A JPS5239368 A JP S5239368A
Authority
JP
Japan
Prior art keywords
surface treatment
silicon wafer
wafer
preserving
life time
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11468275A
Other languages
Japanese (ja)
Inventor
Kenji Suzuki
Tadanobu Hayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP11468275A priority Critical patent/JPS5239368A/en
Publication of JPS5239368A publication Critical patent/JPS5239368A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Weting (AREA)

Abstract

PURPOSE:To reduce variation in life time by preserving Si wafer in aqua regia after its wrapping treatment.
JP11468275A 1975-09-25 1975-09-25 Method for surface treatment of silicon wafer Pending JPS5239368A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11468275A JPS5239368A (en) 1975-09-25 1975-09-25 Method for surface treatment of silicon wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11468275A JPS5239368A (en) 1975-09-25 1975-09-25 Method for surface treatment of silicon wafer

Publications (1)

Publication Number Publication Date
JPS5239368A true JPS5239368A (en) 1977-03-26

Family

ID=14643992

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11468275A Pending JPS5239368A (en) 1975-09-25 1975-09-25 Method for surface treatment of silicon wafer

Country Status (1)

Country Link
JP (1) JPS5239368A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61159360U (en) * 1984-11-20 1986-10-02
JPH05140634A (en) * 1991-11-19 1993-06-08 Fuji Denshi Kogyo Kk High-frequency quenching method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61159360U (en) * 1984-11-20 1986-10-02
JPH0136907Y2 (en) * 1984-11-20 1989-11-08
JPH05140634A (en) * 1991-11-19 1993-06-08 Fuji Denshi Kogyo Kk High-frequency quenching method

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