JPS51111993A - Apparatus for fabricating thin work as semiconductor or the like - Google Patents

Apparatus for fabricating thin work as semiconductor or the like

Info

Publication number
JPS51111993A
JPS51111993A JP50036033A JP3603375A JPS51111993A JP S51111993 A JPS51111993 A JP S51111993A JP 50036033 A JP50036033 A JP 50036033A JP 3603375 A JP3603375 A JP 3603375A JP S51111993 A JPS51111993 A JP S51111993A
Authority
JP
Japan
Prior art keywords
semiconductor
fabricating thin
thin work
work
fabricating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50036033A
Other languages
English (en)
Inventor
Ryosuke Tojo
Hatsuyuki Arai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SUPIIDE FUAMU KK
SUPIIDOFUAMU KK
Original Assignee
SUPIIDE FUAMU KK
SUPIIDOFUAMU KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SUPIIDE FUAMU KK, SUPIIDOFUAMU KK filed Critical SUPIIDE FUAMU KK
Priority to JP50036033A priority Critical patent/JPS51111993A/ja
Publication of JPS51111993A publication Critical patent/JPS51111993A/ja
Pending legal-status Critical Current

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP50036033A 1975-03-27 1975-03-27 Apparatus for fabricating thin work as semiconductor or the like Pending JPS51111993A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50036033A JPS51111993A (en) 1975-03-27 1975-03-27 Apparatus for fabricating thin work as semiconductor or the like

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50036033A JPS51111993A (en) 1975-03-27 1975-03-27 Apparatus for fabricating thin work as semiconductor or the like

Publications (1)

Publication Number Publication Date
JPS51111993A true JPS51111993A (en) 1976-10-02

Family

ID=12458392

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50036033A Pending JPS51111993A (en) 1975-03-27 1975-03-27 Apparatus for fabricating thin work as semiconductor or the like

Country Status (1)

Country Link
JP (1) JPS51111993A (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55157471A (en) * 1979-05-19 1980-12-08 Nippon Telegr & Teleph Corp <Ntt> Dish for bonding workpieces
JPS58137555A (ja) * 1982-02-09 1983-08-16 Kyocera Corp 研摩盤とそれを用いた研摩方法
JPS59124564A (ja) * 1982-12-28 1984-07-18 Kyocera Corp ウェーハ固定用ワックス張り具およびこれを用いたウェーハのワックス付け方法
JPS59167141U (ja) * 1983-04-21 1984-11-09 旭化成株式会社 浴室用設備ダクト
JPH09129712A (ja) * 1996-07-29 1997-05-16 Canon Inc 半導体製造装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4899796A (ja) * 1972-03-30 1973-12-17

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4899796A (ja) * 1972-03-30 1973-12-17

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55157471A (en) * 1979-05-19 1980-12-08 Nippon Telegr & Teleph Corp <Ntt> Dish for bonding workpieces
JPS5742472B2 (ja) * 1979-05-19 1982-09-08
JPS58137555A (ja) * 1982-02-09 1983-08-16 Kyocera Corp 研摩盤とそれを用いた研摩方法
JPS59124564A (ja) * 1982-12-28 1984-07-18 Kyocera Corp ウェーハ固定用ワックス張り具およびこれを用いたウェーハのワックス付け方法
JPH0424188B2 (ja) * 1982-12-28 1992-04-24 Kyocera Corp
JPS59167141U (ja) * 1983-04-21 1984-11-09 旭化成株式会社 浴室用設備ダクト
JPH0220343Y2 (ja) * 1983-04-21 1990-06-04
JPH09129712A (ja) * 1996-07-29 1997-05-16 Canon Inc 半導体製造装置

Similar Documents

Publication Publication Date Title
DE3169336D1 (en) Machine for grinding thin plates such as semiconductor wafers
AT348887B (de) Schleifmaschine zum bearbeiten der raender von plattenfoermigen werkstuecken
DE2965006D1 (en) Method for the selective detection of defects, caused by polishing, on the surface of silicon wafers
DE2966008D1 (en) Device for the precise alignment of planar workpieces, e.g. semiconductor wafers
JPS51111993A (en) Apparatus for fabricating thin work as semiconductor or the like
JPS51150972A (en) Process for cleaning semiconductor substrate polished
JPS5216172A (en) Rotatory treatment device
JPS5640246A (en) Surface treatment of silicon wafer
CA987792A (en) Method for processing semiconductor wafers
JPS5214996A (en) Method for halting polishing work
JPS51140471A (en) Device for washing semiconductor wafer
JPS52118696A (en) Apparatus for grinding semi-conductor wafer
JPS5210080A (en) Method for manufacturing semiconductor device
JPS5310966A (en) Semiconductor wafer
JPS51145094A (en) Surface grinding
JPS51139773A (en) Method of cutting a semiconductor material
JPS5335372A (en) Beveling method of wafers
JPS545380A (en) Impurity introducing method for semiconductor wafer and its jig
JPS51140470A (en) Method of cutting semiconductor crystal
JPS52144900A (en) Lapping method
JPS5276872A (en) Cutting method of semiconductor wafer
JPS5257592A (en) Sheet for processing lenses
JPS5223265A (en) Method of processing semiconductor materials
JPS5279875A (en) Oxidation of silicon wafer
JPS5279781A (en) Production of semiconductor device