JPS5068275A - - Google Patents

Info

Publication number: JPS5068275A
Authority: JP; Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

JP438374A

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1973-10-15

Filing date

1973-12-25

Publication date

1975-06-07

1973-12-25 Application filed filed Critical

1975-06-07 Publication of JPS5068275A publication Critical patent/JPS5068275A/ja

Status Pending legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
- H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
- H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01058—Cerium [Ce]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01068—Erbium [Er]

Landscapes

Engineering & Computer Science (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Physics & Mathematics (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Die Bonding (AREA)
Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

JP438374A 1973-10-15 1973-12-25 Pending JPS5068275A (ja)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
DE19732351637 DE2351637A1 (de)	1973-10-15	1973-10-15	Halter fuer ein halbleiterbauelement

Publications (1)

Publication Number	Publication Date
JPS5068275A true JPS5068275A (ja)	1975-06-07

Family

ID=5895448

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP438374A Pending JPS5068275A (ja)	1973-10-15	1973-12-25

Country Status (2)

Country	Link
JP (1)	JPS5068275A (ja)
DE (1)	DE2351637A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS55118662A (en) *	1979-03-05	1980-09-11	Alsthom Atlantique	Power semiconductor chip support for dipping in hydrogen carbide fluorine
JPS5837929A (ja) *	1981-08-31	1983-03-05	Toshiba Corp	半導体装置の電極を導出する装置

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE2942401C2 (de) *	1979-10-19	1984-09-06	Siemens AG, 1000 Berlin und 8000 München	Halbleiterbauelement mit mehreren Halbleiterkörpern
DE102011004541B4 (de) *	2011-02-22	2014-07-17	Infineon Technologies Bipolar Gmbh & Co. Kg	Verbessertes Leistungshalbleitermodul, Anordnung aus Modul und Kühlkörper sowie Verwendung des Moduls
US11776874B2 (en) *	2020-03-24	2023-10-03	Solaredge Technologies Ltd.	Apparatus and method for holding a heat generating device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS4412424Y1 (ja) *	1966-06-17	1969-05-23

1973
- 1973-10-15 DE DE19732351637 patent/DE2351637A1/de active Pending
- 1973-12-25 JP JP438374A patent/JPS5068275A/ja active Pending

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS4412424Y1 (ja) *	1966-06-17	1969-05-23

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS55118662A (en) *	1979-03-05	1980-09-11	Alsthom Atlantique	Power semiconductor chip support for dipping in hydrogen carbide fluorine
JPS5837929A (ja) *	1981-08-31	1983-03-05	Toshiba Corp	半導体装置の電極を導出する装置

Also Published As

Publication number	Publication date
DE2351637A1 (de)	1975-04-24

Publication	Publication Date	Title
AR201758A1 (ja)	1975-04-15
AU476761B2 (ja)	1976-09-30
AU465372B2 (ja)	1975-09-25
AR201235Q (ja)	1975-02-21
AR201231Q (ja)	1975-02-21
AU474593B2 (ja)	1976-07-29
AU474511B2 (ja)	1976-07-22
AU474838B2 (ja)	1976-08-05
AU465453B2 (ja)	1975-09-25
AU465434B2 (ja)	1975-09-25
AU471343B2 (ja)	1976-04-15
AU450229B2 (ja)	1974-07-04
AU476714B2 (ja)	1976-09-30
AR201229Q (ja)	1975-02-21
AU466283B2 (ja)	1975-10-23
AU472848B2 (ja)	1976-06-03
AU476696B2 (ja)	1976-09-30
JPS5068275A (ja)	1975-06-07
AR199451A1 (ja)	1974-08-30
AU477823B2 (ja)	1975-06-19
AU471461B2 (ja)	1976-04-29
AU447540B2 (ja)	1974-03-25
AU477824B2 (ja)	1975-07-17
AR210729A1 (ja)	1977-09-15
AU476873B1 (ja)	1975-01-09

JPS5068275A - - Google Patents

Info

Links

Classifications

Landscapes

Applications Claiming Priority (1)

Publications (1)

Family

ID=5895448

Family Applications (1)

Country Status (2)

Cited By (2)

Families Citing this family (3)

Citations (1)

Patent Citations (1)

Cited By (2)

Also Published As

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