JPH1198815A - Power converter, and multilayer conductor and electric component connector - Google Patents
Power converter, and multilayer conductor and electric component connectorInfo
- Publication number
- JPH1198815A JPH1198815A JP9254677A JP25467797A JPH1198815A JP H1198815 A JPH1198815 A JP H1198815A JP 9254677 A JP9254677 A JP 9254677A JP 25467797 A JP25467797 A JP 25467797A JP H1198815 A JPH1198815 A JP H1198815A
- Authority
- JP
- Japan
- Prior art keywords
- plate
- conductor
- shaped
- insulator
- connection member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Power Conversion In General (AREA)
- Inverter Devices (AREA)
- Rectifiers (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電力変換装置に係
わり、特に配線の寄生インダクタンスを低減するのに好
適な高電圧電力変換装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a power converter, and more particularly to a high-voltage power converter suitable for reducing parasitic inductance of wiring.
【０００２】[0002]
【従来の技術】現在、産業・交通・公共等の分野ではイ
ンバータによる電動機の可変速駆動や無停電電源装置な
どが広く適用されている。2. Description of the Related Art At present, variable speed driving of an electric motor by an inverter, an uninterruptible power supply, and the like are widely applied in the fields of industry, transportation, and the public.
【０００３】図１２は代表的なインバータの構成を示す
ものである。FIG. 12 shows a configuration of a typical inverter.
【０００４】これらのインバータにおいて、平滑コンデ
ンサ１１とスイッチ素子群２１，２２，２３の間、ある
いはスイッチ素子群の素子同士の間の配線インダクタン
スは、スイッチ素子のオン・オフ時過大な電圧をスイッ
チ素子に印加させる要因となる。このため、図示してい
ないが一般にコンデンサと抵抗とで構成されるスナバ回
路をそれぞれスイッチ素子と並列に設けて過大な電圧の
発生を防止している。しかし、スナバ回路は過大な電圧
の抑制には効果的である反面、スナバ回路のコンデンサ
の蓄積エネルギーが損失となり、変換器の効率を低下さ
せるほか、部品点数が増大し、変換器のコスト上昇を引
き起こす欠点がある。従来、この問題を軽減するために
平滑コンデンサとスイッチ素子群あるいはスイッチ素子
群中の素子同士を多層積層導体で接続する方式がとられ
てきた。多層積層導体は、複数の板状導体と板状絶縁材
を交互に積層した構造を持ち、板状導体間に逆極性の電
流を流すことによってインダクタンスの低減を図るもの
である。この種の技術としては、例えば、特開平7−131
981 号，特開平7−245951 号，特開平8−19245号の各公
報に記載の技術が知られている。In these inverters, the wiring inductance between the smoothing capacitor 11 and the switch element groups 21, 22, 23 or between the elements of the switch element group causes an excessive voltage when the switch elements are turned on and off. Is applied. For this reason, although not shown, a snubber circuit generally composed of a capacitor and a resistor is provided in parallel with each switch element to prevent generation of an excessive voltage. However, while the snubber circuit is effective in suppressing excessive voltage, the energy stored in the capacitor of the snubber circuit is lost, which reduces the efficiency of the converter and increases the number of parts, increasing the cost of the converter. There are drawbacks to cause. Conventionally, in order to alleviate this problem, a method has been adopted in which a smoothing capacitor and a switch element group or elements in the switch element group are connected by a multilayer laminated conductor. The multilayer laminated conductor has a structure in which a plurality of plate-like conductors and a plate-like insulating material are alternately laminated, and reduces the inductance by flowing a current of opposite polarity between the plate-like conductors. Examples of this type of technology include, for example,
The techniques described in JP-A-981, JP-A-7-245951 and JP-A-8-19245 are known.
【０００５】[0005]
【発明が解決しようとする課題】しかし、近年変換器の
大容量化のニーズに応え、スイッチ素子の高耐電圧，大
電流化が進展し、従来の多層積層導体には次の問題が生
じるようになった。However, in recent years, in response to the need for increasing the capacity of the converter, the switch element has been developed to have a higher withstand voltage and a larger current, and the following problems will occur in the conventional multilayer laminated conductor. Became.
【０００６】例えば、多層積層導体のうちスイッチ素子
の端子に接続する板状導体は、多層積層導体に貫通穴を
設けて導電性のネジ等の接続部材でスイッチ素子の端子
と接続する。しかし、スイッチ素子の端子に接続しない
板状導体は、この接続部材と電気的に絶縁をとる必要が
ある。そこで、接続部材と絶縁をとる必要のある板状導
体は、接続部材の径より十分大きな径の穴を設け、接続
部材との間に沿面距離を確保して電気的な絶縁を行って
いる。電気的な絶縁をとるために必要な沿面距離は規格
で定められており、絶縁に必要な電圧が高くなるほど沿
面距離も長くしなければならない。For example, a plate-shaped conductor connected to a terminal of a switch element of a multilayer laminated conductor is provided with a through hole in the multilayer laminated conductor and connected to a terminal of the switch element by a connecting member such as a conductive screw. However, a plate-like conductor that is not connected to the terminal of the switch element needs to be electrically insulated from the connection member. Therefore, the plate-shaped conductor which needs to be insulated from the connection member is provided with a hole having a diameter sufficiently larger than the diameter of the connection member, and a creeping distance is secured between the plate-shaped conductor and the connection member to perform electrical insulation. Creepage distances required for electrical insulation are defined by standards, and the higher the voltage required for insulation, the longer the creepage distances must be.
【０００７】近年、電力変換装置の電圧が高くなるに連
れ、電気的絶縁を確保するための沿面距離も大きな長さ
を必要とするようになった。このため、板状導体に設け
るべき穴の径も大きくする必要が生じ、隣接する穴に到
達するような沿面距離が必要になる場合もある。この場
合、多層積層導体の面積を大きくして隣接する穴までの
距離を大きくとれる構造にする必要があり、電力変換装
置は部品を高密度で実装できなくなり、大型化する問題
がある。更に、穴の径を大きくするほど多層積層導体の
インダクタンスの低減効果が小さくなり多層積層導体の
本来の目的が達成できなくなる問題もある。[0007] In recent years, as the voltage of the power converter has increased, the creepage distance for ensuring electrical insulation has also increased. For this reason, it is necessary to increase the diameter of the hole to be provided in the plate-shaped conductor, and a creepage distance to reach an adjacent hole may be required. In this case, it is necessary to increase the area of the multilayer laminated conductor so as to increase the distance to an adjacent hole, so that the power conversion device has a problem that components cannot be mounted at a high density and the size thereof is increased. Further, as the diameter of the hole is increased, the effect of reducing the inductance of the multilayer laminated conductor is reduced, so that the original purpose of the multilayer laminated conductor cannot be achieved.
【０００８】本発明の目的は、使用電圧が高い電力変換
装置においても、接続部材と非接続にする板状導体の穴
の径や板状導体のサイズを小さくできる積層導体の構造
を提供することにある。An object of the present invention is to provide a laminated conductor structure which can reduce the diameter of the hole of the plate-like conductor and the size of the plate-like conductor to be disconnected from the connection member even in a power converter having a high working voltage. It is in.
【０００９】[0009]
【課題を解決するための手段】本発明による電力変換装
置においては、複数の板状導体と複数の板状絶縁材とが
交互に積層される多層積層導体と電気部品とが接続部材
によって接続されるが、少なくとも二つの板状絶縁材に
よって挟まれる少なくとも一つの板状導体の端部と、多
層積層導体と電気部品との接続体における導体表面部と
が隣接し、板状導体の端部の表面が絶縁物によって覆わ
れている。これにより、多層積層導体に印加される電圧
に対して、板状導体の端部とこれに隣接する導体表面部
との間の沿面の制約がなくなるので、一つの板状導体と
非接続にする他の板状導体の穴のサイズや板状導体のサ
イズを小さくできる。従って、電力変換装置が小型化で
きたり、インダクタンスの低減によりノイズや損失を低
減できる。In a power converter according to the present invention, a multilayer laminated conductor in which a plurality of plate-like conductors and a plurality of plate-like insulating materials are alternately laminated and an electric component are connected by a connecting member. However, the end of at least one plate-like conductor sandwiched by at least two plate-like insulating materials is adjacent to the conductor surface in the connection body between the multilayer laminated conductor and the electric component, and the end of the plate-like conductor is The surface is covered with an insulator. This eliminates the restriction of the creeping surface between the end of the plate-shaped conductor and the conductor surface adjacent to the end of the plate-shaped conductor with respect to the voltage applied to the multilayer laminated conductor. The size of the hole of another plate-shaped conductor and the size of the plate-shaped conductor can be reduced. Therefore, the power converter can be reduced in size, and noise and loss can be reduced by reducing the inductance.
【００１０】上記のような構成は、多層積層導体と電気
部品とが板状導体の穴を貫通する接続部材によって接続
される個所や、多層積層導体の外周部に適用できる。前
者の個所の場合、絶縁物は、多層積層導体と一体化され
ていてもよいし、接続部材と一体化されていてもよい。
いずれの場合も、絶縁物が板状絶縁材に密着し、板状導
体の端部の表面が露出していないことが好ましい。The above configuration can be applied to a place where the multilayer laminated conductor and the electric component are connected by a connecting member penetrating the hole of the plate-shaped conductor, and to an outer peripheral portion of the multilayer laminated conductor. In the former case, the insulator may be integrated with the multilayer laminated conductor, or may be integrated with the connection member.
In any case, it is preferable that the insulator is in close contact with the plate-like insulating material and the surface of the end of the plate-like conductor is not exposed.
【００１１】絶縁物の材料としては、テフロン材などの
樹脂が好ましい。また、板状導体を絶縁物で被覆する手
段としては、板状導体または板状絶縁材に絶縁部材を設
けるほか、板状導体の端部の表面に樹脂を塗布する方法
などもある。As a material of the insulator, a resin such as a Teflon material is preferable. As a means for coating the plate-shaped conductor with an insulator, there is a method in which an insulating member is provided on the plate-shaped conductor or the plate-shaped insulating material, and a method in which a resin is applied to the end surface of the plate-shaped conductor.
【００１２】なお、本発明は、インバータ，コンバー
タ，スイッチング電源などの各種の電力変換装置のほ
か、多層積層導体と電気部品が接続される電気部品接続
体に適用することができる。The present invention can be applied not only to various power converters such as an inverter, a converter, and a switching power supply, but also to an electrical component connector in which a multilayer laminated conductor and an electrical component are connected.
【００１３】[0013]
（実施例１）図１，図２，図３は本発明を用いてなる第
１の実施例であり、図１２に示すインバータ回路を多層
積層導体で構成した電力変換装置の部分構成図である。(Embodiment 1) FIGS. 1, 2 and 3 show a first embodiment of the present invention, which is a partial configuration diagram of a power converter in which the inverter circuit shown in FIG. 12 is composed of multilayer laminated conductors. .
【００１４】図１，図２，図３において、図１２と同一
の部品には同じ記号を付してある。図１は、図１２のイ
ンバータ回路を多層積層導体で配線した構造例の斜視
図、図２は、上面図である。また、図３は図２に示すＡ
−Ａ′間における多層積層導体の断面図である。また、
図１，図２，図３において、多層積層導体５は板状導体
３１と３２及び板状絶縁材料８１，８２，８３で構成さ
れ、板状導体３１はコンデンサ１１，１２の正極同士を
接続すると共に、スイッチ素子群２１，２２，２３の一
方の電極同士を接続する。板状導体３２は、コンデンサ
１１，１２の負極同士を接続すると共に、スイッチ素子
群２１，２２，２３の他方の電極同士を接続する。板状
絶縁材料８１，８２，８３は板状導体３１，３２を絶縁
するため、３１，３２の最上面，中間及び最下面にそれ
ぞれ配置されている。５１，５２，５３，５４，５５
は、板状導体３１をコンデンサ１１，１２の正極及びス
イッチ素子群２１，２２，２３の一方の電極にそれぞれ
接続するための導電性の接続部材であり、５６，５７，
５８，５９，６０は板状導体３２をコンデンサ１１，１
２の負極及びスイッチ素子群２１，２２，２３の他方の
電極にそれぞれ接続するための接続部材である。４１，
４２，４３は、スイッチ素子群２１，２２，２３から負
荷に電力を供給するための配線であり、７は前記スイッ
チ素子群を冷却するための放熱フィンである。1, 2, and 3, the same parts as those in FIG. 12 are denoted by the same reference numerals. FIG. 1 is a perspective view of an example of a structure in which the inverter circuit of FIG. 12 is wired with multilayer laminated conductors, and FIG. 2 is a top view. FIG. 3 shows A
It is sectional drawing of the multilayer laminated conductor between -A '. Also,
1, 2 and 3, the multilayer laminated conductor 5 is composed of plate-like conductors 31 and 32 and plate-like insulating materials 81, 82 and 83, and the plate-like conductor 31 connects the positive electrodes of the capacitors 11 and 12. At the same time, one electrodes of the switch element groups 21, 22, 23 are connected to each other. The plate-shaped conductor 32 connects the negative electrodes of the capacitors 11 and 12 and also connects the other electrodes of the switch element groups 21, 22 and 23. The plate-like insulating materials 81, 82, and 83 are arranged on the uppermost surface, the middle, and the lowermost surface of the plate-like conductors 31, 32, respectively, for insulating the plate-like conductors 31, 32. 51, 52, 53, 54, 55
Are conductive connecting members for connecting the plate-shaped conductor 31 to the positive electrodes of the capacitors 11 and 12 and one electrode of the switch element groups 21, 22, 23, respectively.
Reference numerals 58, 59, and 60 denote the plate-shaped conductor 32 as the capacitors 11, 1
2 is a connection member for connecting to the negative electrode 2 and the other electrode of the switch element groups 21, 22, 23, respectively. 41,
Reference numerals 42, 43 denote wirings for supplying power from the switch element groups 21, 22, 23 to the load, and reference numeral 7 denotes radiation fins for cooling the switch element groups.
【００１５】以下、図３を用いて本実施例を説明する。
図３は、図２に示したＡ−Ａ′の部分について多層積層
導体５と接続部材５５，６０の断面を示したもので、放
熱フィン７は省略している。また、図３においてｐは板
状導体３１と接続するスイッチ素子群２３の端子、ｎは
板状導体３２と接続するスイッチ素子群２３の端子であ
る。いま、接続部材５５で板状導体３１とスイッチ素子
群２３の端子ｐを接続する部分に着目してみる。接続部
材５５は、例えばボルトを用いて多層積層導体５の最上
面から板状導体３１とｐ端子を接続するように締め付け
る。このとき、板状導体３１と接続部材５５はもう一方
の板状導体３２とは絶縁をとらなければならないことは
言うまでもない。ここで、接続部材５５を多層積層導体
５の最上部から締め付けを行うために設けた穴の内部に
おける板状導体３２の端部に絶縁物９がない場合を考え
る。この場合でも板状導体３１と接続部材５５は、板状
絶縁材料８２によって電気的に絶縁される構造になって
いる。しかし、この場合は接続部材５５を多層積層導体
５の最上部から締め付けを行うために板状導体３２の端
部から板状絶縁材料８２の表面を介して板状導体３１に
至る距離すなわち沿面距離が問題となる。この沿面距離
は板状導体３１と３２の間に印加されている電圧が高く
なるほど大きくとる必要があり、板状導体３２に設ける
穴の径を大きくする必要がある。板状導体３２と接続部
材６０との間を流れる電流は板状導体３２に設ける穴の
形が大きくなるほどこの穴を迂回して流れるようにな
り、多層積層導体５のインダクタンス低減効果が低下し
てしまう。Hereinafter, this embodiment will be described with reference to FIG.
FIG. 3 shows a cross section of the multilayer laminated conductor 5 and the connecting members 55 and 60 for the portion AA 'shown in FIG. 2, and the radiation fins 7 are omitted. In FIG. 3, p is a terminal of the switch element group 23 connected to the plate conductor 31, and n is a terminal of the switch element group 23 connected to the plate conductor 32. Attention is now directed to a portion where the connection member 55 connects the plate-shaped conductor 31 and the terminal p of the switch element group 23. The connection member 55 is tightened using, for example, a bolt so as to connect the plate-shaped conductor 31 and the p-terminal from the uppermost surface of the multilayer laminated conductor 5. At this time, it is needless to say that the plate-shaped conductor 31 and the connection member 55 must be insulated from the other plate-shaped conductor 32. Here, a case where there is no insulator 9 at the end of the plate-shaped conductor 32 inside the hole provided for fastening the connection member 55 from the uppermost part of the multilayer laminated conductor 5 is considered. Also in this case, the plate-shaped conductor 31 and the connection member 55 are configured to be electrically insulated by the plate-shaped insulating material 82. However, in this case, the distance from the end of the plate-shaped conductor 32 to the plate-shaped conductor 31 via the surface of the plate-shaped insulating material 82, that is, the creeping distance, in order to tighten the connection member 55 from the uppermost portion of the multilayer laminated conductor 5 Is a problem. The creepage distance needs to be increased as the voltage applied between the plate conductors 31 and 32 increases, and the diameter of the hole provided in the plate conductor 32 needs to be increased. The current flowing between the plate-shaped conductor 32 and the connection member 60 flows more bypassing the hole provided in the plate-shaped conductor 32 as the shape of the hole becomes larger, and the inductance reducing effect of the multilayer laminated conductor 5 decreases. I will.
【００１６】次に、図３に示すように、接続部材５５を
取り囲むように設けられた板状導体３２の穴の内部にお
ける板状導体３２の端部に絶縁物９を設けた場合を考え
る。この場合、板状導体３２の上下に配置された板状絶
縁材料８１，８２に密着して絶縁物９が設けられ、板状
導体３２の端部が覆われる構造になる。このような構造
では前述した沿面距離の制約がなくなり、板状導体３１
と３２間に印加されている電圧に耐え得る材料及び厚さ
（穴の径方向の厚さ）の絶縁物９で板状導体３２の端部
を穴の内部で導体表面が露出しないように覆えば、電気
的絶縁を確保できる。従って、本構造を用いることによ
って板状導体３２に設ける穴の径を小さくすることがで
きる。例えば、板状導体３１と３２の間に３ｋＶ程度の
電圧が印加される場合、絶縁物９を用いない構造では穴
の直径は少なくとも７０〜８０mmに達するが、絶縁物９
で穴の端部を覆った構造では穴の直径を１／４以下まで
小さくできる。Next, as shown in FIG. 3, it is assumed that the insulator 9 is provided at the end of the plate-shaped conductor 32 inside the hole of the plate-shaped conductor 32 provided so as to surround the connection member 55. In this case, the insulator 9 is provided in close contact with the plate-like insulating materials 81 and 82 disposed above and below the plate-like conductor 32, and the end of the plate-like conductor 32 is covered. In such a structure, the above-described restriction on the creepage distance is eliminated, and the plate-like conductor 31
The end of the plate-like conductor 32 is covered with an insulating material 9 having a thickness and a thickness (thickness in the radial direction of the hole) capable of withstanding the voltage applied between the holes 32 and 32 so that the conductor surface is not exposed inside the hole. For example, electrical insulation can be secured. Therefore, by using this structure, the diameter of the hole provided in the plate-shaped conductor 32 can be reduced. For example, when a voltage of about 3 kV is applied between the plate-shaped conductors 31 and 32, the diameter of the hole reaches at least 70 to 80 mm in a structure without the insulator 9, but the insulator 9
In the structure in which the end of the hole is covered with, the diameter of the hole can be reduced to 1/4 or less.
【００１７】以上述べたことは、板状導体３２をスイッ
チ素子群２３の端子ｎに接続部材６０を用いて接続する
ために板状導体３１に設けた穴の部位についても全く同
じことになり、絶縁物９で穴の内部における板状導体３
１の端部を覆うことによって穴の直径を１／４以下にで
きる。The above description is exactly the same for the holes provided in the plate-shaped conductor 31 for connecting the plate-shaped conductor 32 to the terminals n of the switch element group 23 by using the connection members 60. Plate conductor 3 inside hole with insulator 9
By covering one end, the diameter of the hole can be reduced to １ ／ or less.
【００１８】以上の説明は、多層積層導体の少なくとも
一つの板状導体と他の板状導体あるいは電気部品を接続
部材で接続する部位について述べた。次に、図２に示し
たように多層積層導体のＢ−Ｂ′の部位、すなわち多層
積層導体の外周端部について述べる。In the above description, a portion where at least one plate-shaped conductor of the multilayer laminated conductor is connected to another plate-shaped conductor or an electric component by a connection member has been described. Next, as shown in FIG. 2, a portion of BB ′ of the multilayer laminated conductor, that is, an outer peripheral end portion of the multilayer laminated conductor will be described.
【００１９】図４に、多層積層導体のＢ−Ｂ′における
断面図を示す。図において、Ｂ側が多層積層導体の外周
部にあたり、図１〜図３と同じ部品は同一の記号を付し
てある。板状導体３１と３２の外周部に絶縁物９がない
場合、前述したように板状導体３２の外周端部から板状
絶縁材料８２の上部，下部を経て板状導体３１の外周端
部に至る距離が絶縁に必要な沿面距離になる。上述した
ように、３１と３２の間に３ｋＶ程度の電圧が印加され
る場合、沿面距離は７０〜８０mm程度必要になるため、
板状絶縁材料８２は板状導体３１，３２の外周端部から
３５〜４０mm程度張り出させる必要がある。このこと
は、図１，図２に示した多層積層導体の外周部全体で必
要になり、多層積層導体のサイズが大きくなり、高密
度，小型な電力変換装置を得るための妨げになる。FIG. 4 is a sectional view taken along line BB 'of the multilayer laminated conductor. In the figure, the side B corresponds to the outer peripheral portion of the multilayer laminated conductor, and the same parts as those in FIGS. 1 to 3 are denoted by the same symbols. When the insulator 9 is not present on the outer peripheral portions of the plate-shaped conductors 31 and 32, as described above, the outer peripheral end of the plate-shaped conductor 32 passes through the upper and lower portions of the plate-shaped insulating material 82 and extends to the outer peripheral end of the plate-shaped conductor 31 The distance to be reached is the creepage distance required for insulation. As described above, when a voltage of about 3 kV is applied between 31 and 32, the creepage distance needs to be about 70 to 80 mm.
The plate-like insulating material 82 needs to protrude from the outer peripheral ends of the plate-like conductors 31 and 32 by about 35 to 40 mm. This is necessary for the entire outer peripheral portion of the multilayer laminated conductor shown in FIGS. 1 and 2, which increases the size of the multilayer laminated conductor and hinders obtaining a high-density and small-sized power converter.
【００２０】次に、図４に示すように板状導体３１，３
２の外周端部を絶縁物９で覆った場合を考える。この場
合、沿面距離の制約を受けず、３１，３２の間に印加さ
れる電圧に耐え得る絶縁物９で板状導体３１，３２の外
周端部を覆えば、導体間の絶縁を確保できる。この構造
では板状絶縁材料８２の張り出しは不要になる。また、
図４では板状導体３１，３２の両方を絶縁物９で覆った
構造を示したが、いずれか一方の板状導体を絶縁物で覆
っても同様な効果が得られる。さらに、図４に示す絶縁
物９を用いることなく、板状絶縁材料８１，８３の少な
くとも一方を、板状導体の外周端部に延材させて板状絶
縁材料８２と密着させ、板状導体３１，３２の少なくと
も一方の端部を覆っても良い。Next, as shown in FIG.
Consider a case where the outer peripheral end of No. 2 is covered with an insulator 9. In this case, insulation between the conductors can be ensured by covering the outer peripheral ends of the plate-like conductors 31 and 32 with the insulator 9 that can withstand the voltage applied between the conductors 31 and 32 without being restricted by the creepage distance. In this structure, it is not necessary to project the plate-like insulating material 82. Also,
FIG. 4 shows a structure in which both the plate-shaped conductors 31 and 32 are covered with the insulator 9, but the same effect can be obtained by covering either one of the plate-shaped conductors with the insulator. Further, without using the insulator 9 shown in FIG. 4, at least one of the plate-like insulating materials 81 and 83 is extended to the outer peripheral end portion of the plate-like conductor and is brought into close contact with the plate-like insulating material 82, so that the plate-like conductor You may cover at least one end part of 31 and 32.
【００２１】（実施例２）図５に他の実施例を示す。図
は、板状絶縁材料８４，８５，８６，８７及び板状導体
３３，３４，３５で構成される多層積層導体の断面を示
す例であり、板状導体３３と３５は接続部材６１で接続
されている。また、電気部品２４は接続部材６２によっ
て板状導体３４と接続されている。ここで、接続部材６
１は板状導体３４と絶縁をとる必要があり、また、接続
部材６２は板状導体３３，３５と絶縁をとる必要があ
る。この実施例では、３層の板状導体のうち接続部材６
１および６２と絶縁をとる必要のある部位では各々の接
続部材の周囲を絶縁物１０で囲んだ構造をなしている。
ここで、接続部材６１と板状導体３４との間を例に本実
施例を説明する。(Embodiment 2) FIG. 5 shows another embodiment. The figure shows an example of a cross section of a multilayer laminated conductor composed of plate-like insulating materials 84, 85, 86, 87 and plate-like conductors 33, 34, 35. The plate-like conductors 33 and 35 are connected by a connection member 61. Have been. The electric component 24 is connected to the plate-shaped conductor 34 by a connecting member 62. Here, the connecting member 6
1 needs to be insulated from the plate conductor 34, and the connecting member 62 needs to be insulated from the plate conductors 33 and 35. In this embodiment, the connection member 6 of the three-layer plate-shaped conductor is used.
At portions where it is necessary to insulate the connection members 1 and 62, the connection members are surrounded by an insulator 10.
Here, the present embodiment will be described with an example between the connection member 61 and the plate-shaped conductor 34.
【００２２】図５において、接続部材６１は絶縁物１０
で周囲を囲み、しかも絶縁物１０は板状絶縁材料８５と
８６に密着するように設けられている。このため、互い
に絶縁すべき板状導体３４と接続部材６１は導体表面が
露出された状態で配置されることなく、両者の間に沿面
距離は不要になる。接続部材６２と板状導体３３の間、
および６２と板状導体３５の間を見ても両者がむき出し
で配置されておらず、沿面距離を確保する必要のないこ
とがわかる。なお、接続部材６２と板状導体３３の間の
絶縁のために、本実施例においては接続部材６２の頭部
を絶縁物１０で覆っている。In FIG. 5, the connecting member 61 is made of an insulator 10
The insulator 10 is provided so as to be in close contact with the plate-like insulating materials 85 and 86. For this reason, the plate-shaped conductor 34 and the connecting member 61 to be insulated from each other are not arranged with the conductor surface exposed, and a creeping distance between the two is unnecessary. Between the connecting member 62 and the plate-shaped conductor 33,
Looking at the space between the first and second conductors 62 and the plate-shaped conductor 35, it is understood that both are not exposed, and it is not necessary to secure the creepage distance. In this embodiment, the head of the connection member 62 is covered with the insulator 10 for insulation between the connection member 62 and the plate-shaped conductor 33.
【００２３】（参考例）図６は、図３の構成において、
絶縁物９が板状絶縁材料８１または８２のうち一方にし
か密着していない場合の実施例を示す。図６では、板状
導体３２に接続部材５５を挿入するために設けた穴の内
部における板状導体３２の端部を覆う絶縁物９が、板状
絶縁材料８２のみに密着し、８１とは離れている。この
場合、板状導体３２の板状絶縁材料８１側が露出するこ
とになり、図中に矢印で示す距離を沿面距離として必要
な長さを確保する必要が生じる。同様に、接続部材６０
を挿入するための板状導体３１に設けた穴の内部におけ
る板状導体３１の端部が板状絶縁材料８３と離れている
場合も同様である。従って、沿面距離の制約から逃れる
には、接続部材と絶縁すべき板状導体の穴の端部は、そ
の板状導体の上下に配置される板状絶縁材と密着するよ
うに絶縁物９を設けなければならない。(Reference Example) FIG. 6 shows the configuration of FIG.
An embodiment in which the insulator 9 is in close contact with only one of the plate-like insulating materials 81 and 82 will be described. In FIG. 6, the insulator 9 covering the end of the plate-shaped conductor 32 inside the hole provided for inserting the connection member 55 into the plate-shaped conductor 32 is in close contact with only the plate-shaped insulating material 82. is seperated. In this case, the plate-shaped insulating material 81 side of the plate-shaped conductor 32 is exposed, and it is necessary to secure a necessary length as a creeping distance using a distance indicated by an arrow in the figure. Similarly, the connection member 60
The same applies to the case where the end of the plate-shaped conductor 31 inside the hole provided in the plate-shaped conductor 31 for inserting the hole is separated from the plate-shaped insulating material 83. Therefore, in order to escape from the restriction of the creepage distance, the insulator 9 is so arranged that the ends of the holes of the plate-shaped conductor to be insulated from the connection member are in close contact with the plate-shaped insulating materials arranged above and below the plate-shaped conductor. Must be provided.
【００２４】次に、図７について考察する。接続部材６
１，６２を囲む絶縁材が、図７に示すように接続部材と
絶縁すべき板状導体の上下に配置される板状絶縁材のう
ち一方にしか密着していない構造では、図６の場合と同
様に接続部材の一部が露出している。この場合、接続部
材６１と板状導体３４との間は図中矢印で示す距離を必
要とする沿面距離として確保する必要が生じる。同様
に、接続部材６２と板状導体３５の間でも図中矢印で示
す距離を必要とする沿面距離として確保する必要があ
る。従って、図５の例でも接続部材を囲む絶縁物は、絶
縁を確保すべき板状導体の上下に設けられる板状絶縁材
と密着して設ける必要がある。Next, consider FIG. Connection member 6
In the structure in which the insulating material surrounding the first and the second 62 is in close contact with only one of the plate-shaped insulating materials disposed above and below the plate-shaped conductor to be insulated from the connecting member as shown in FIG. A part of the connection member is exposed in the same manner as in FIG. In this case, it is necessary to ensure the creepage distance between the connecting member 61 and the plate-shaped conductor 34 that requires the distance indicated by the arrow in the figure. Similarly, between the connecting member 62 and the plate-like conductor 35, it is necessary to secure the distance indicated by the arrow in the figure as the required creeping distance. Therefore, in the example of FIG. 5 as well, the insulator surrounding the connecting member needs to be provided in close contact with the plate-shaped insulating material provided above and below the plate-shaped conductor for which insulation is to be ensured.
【００２５】（実施例３）次に、図８の実施例について
説明する。図８は、板状導体の外周端部を覆う絶縁物９
が、板状導体３２にしか設けられていない例を示す。こ
の場合、板状導体３１の外周端部は露出しているが、板
状導体３２の外周端部は絶縁物で覆われている。従っ
て、外周端部で見れば板状導体３２が絶縁物９で覆われ
ているため、板状導体３１との間に沿面距離の制約はな
くなる。しかし、絶縁物９が板状絶縁材料８１または８
２の一方にしか密着していない構造では、図６，図７に
示したように板状導体３２と３１は互いに露出部を持っ
て配置されるため、必要とされる沿面距離を確保する必
要が生じる。(Embodiment 3) Next, the embodiment of FIG. 8 will be described. FIG. 8 shows an insulator 9 covering the outer peripheral end of the plate-shaped conductor.
Shows an example in which only the plate-like conductor 32 is provided. In this case, the outer peripheral end of the plate-shaped conductor 31 is exposed, but the outer peripheral end of the plate-shaped conductor 32 is covered with an insulator. Therefore, when viewed from the outer peripheral end, since the plate-like conductor 32 is covered with the insulator 9, there is no restriction on the creeping distance between the plate-like conductor 31 and the plate-like conductor 31. However, when the insulator 9 is made of the plate-like insulating material 81 or 8
6, the plate-shaped conductors 32 and 31 are arranged so as to have an exposed portion as shown in FIGS. 6 and 7, so that it is necessary to secure a required creepage distance. Occurs.
【００２６】以上に述べた通り、板状導体に設けた穴の
内部における板状導体の端部を絶縁物で覆って接続部材
との絶縁を確保する構造，接続部材の周囲を絶縁物で囲
んで板状導体と絶縁を確保する構造，板状導体の外周端
部を絶縁物で覆って他の板状導体との絶縁を確保する構
造等、いずれの構造であっても絶縁を確保するために設
けた絶縁物は、その絶縁物が存在する部位で板状導体の
上下面に配置される板状絶縁材の両方と密着している必
要がある。As described above, the end of the plate-like conductor inside the hole provided in the plate-like conductor is covered with the insulator to ensure insulation from the connection member, and the periphery of the connection member is surrounded by the insulator. In order to ensure insulation in any structure, such as a structure that secures insulation from a plate-shaped conductor by using a method and a structure that covers the outer peripheral end of a plate-shaped conductor with an insulator to ensure insulation from other plate-shaped conductors Is required to be in close contact with both the plate-like insulating materials disposed on the upper and lower surfaces of the plate-like conductor at the portion where the insulator exists.
【００２７】（実施例４）図９は、コンデンサの端子部
を多層積層導体で接続する場合の実施例を示す組立図で
ある。本実施例は、接続部材５１，５６とは非接続とす
る板状導体に接続部材５１，５６を通すための穴を設
け、この穴の内側にリング状の絶縁部材101を設けると
共に、このリング状の絶縁部材を設けた板状導体の上下
に配置された板状絶縁材とリング状の絶縁部材が密着す
る構造としたものである。この実施例では、板状導体３
１，３２の厚さと同等以上の厚さを持つリング状の絶縁
部材をあらかじめ板状導体３１，３２の穴の内部にはめ
込むか接着するかした後に、板状導体と板状絶縁材とを
交互に積層し、接続部材５１，５６でコンデンサ１１の
端子に取り付ける。板状導体における絶縁部材１０１が
設けられる穴の直径は、その穴の上下における板状絶縁
材の穴の直径よりも大きい。従って、リング状の絶縁部
材は板状導体３１，３２の上下にそれぞれ設けられたそ
れぞれ該当する板状絶縁材と密着する構造となり、接続
部材と板状導体との間で沿面距離の制約から逃れること
ができる。(Embodiment 4) FIG. 9 is an assembly view showing an embodiment in which the terminal portions of the capacitor are connected by a multilayer laminated conductor. In the present embodiment, a hole for passing the connection members 51 and 56 is provided in a plate-like conductor that is not connected to the connection members 51 and 56, and a ring-shaped insulating member 101 is provided inside the hole, and the ring-shaped insulating member 101 is provided. A ring-shaped insulating member and a plate-shaped insulating material arranged above and below a plate-shaped conductor provided with a ring-shaped insulating member are in close contact with each other. In this embodiment, the plate-shaped conductor 3
After inserting or bonding a ring-shaped insulating member having a thickness equal to or greater than the thickness of the first and second conductors into the holes of the first and second conductors 31 and 32 in advance, the first conductor and the second insulator are alternated. And attached to the terminals of the capacitor 11 with the connecting members 51 and 56. The diameter of the hole where the insulating member 101 is provided in the plate-shaped conductor is larger than the diameter of the hole of the plate-shaped insulating material above and below the hole. Therefore, the ring-shaped insulating member has a structure in which it comes into close contact with the corresponding plate-shaped insulating materials provided above and below the plate-shaped conductors 31 and 32, respectively, and escapes from the restriction of the creeping distance between the connecting member and the plate-shaped conductor. be able to.
【００２８】（実施例５）図１０も、コンデンサの端子
部を多層積層導体で接続する場合の実施例を示す組立図
である。本実施例においては、接続部材と非接続とすべ
き板状導体の上下に配置される板状絶縁材の少なくとも
一方に、非接続とすべき板状導体に設けた穴を通して他
方の板状絶縁材に密着するような筒状絶縁リング１０２
を設け、この筒状の絶縁リングで接続部材の周囲が囲ま
れる。(Embodiment 5) FIG. 10 is also an assembly view showing an embodiment in which the terminal portions of the capacitor are connected by a multilayer laminated conductor. In the present embodiment, at least one of the plate-shaped insulating members disposed above and below the plate-shaped conductor to be disconnected from the connection member is passed through a hole provided in the plate-shaped conductor to be disconnected, and the other plate-shaped insulating material is connected to the connection member. Cylindrical insulating ring 102 that is in close contact with the material
Is provided, and the periphery of the connection member is surrounded by the cylindrical insulating ring.
【００２９】ここで、接続部材５１と板状導体３２を非
接続とする部位を例に本実施例を説明する。板状導体３
２には接続部材５１を貫通させる穴が設けられており、
３２の上下には板状絶縁材料８１と８２が設けられてい
る。ここで、板状絶縁材料８２にはこれと接着するか一
体形成される筒状絶縁リング１０２が設けられ、多層積
層導体を形成するときは筒状絶縁リング１０２は板状導
体３２の穴を通する。この穴の直径は、その上に位置す
る板状絶縁材料８１の穴の直径よりも大きい。また、筒
状絶縁リング１０２の外径は板状絶縁材料８１の穴の直
径よりも大きい。従って、筒状絶縁リング１０２は、板
状絶縁材料８１に密着する。接続部材５１は、コンデン
サ１１の端子に接続する場合、まず板状絶縁材料８１を
通り、板状導体３２を通して板状絶縁材料８１に密着し
た筒状絶縁リング１０２を通る。この筒状絶縁リング１
０２が接続部材の周囲を取り囲み、板状導体３２と接続
部材５１を絶縁する。次に接続部材５１は板状導体３１
に接続され、さらに板状絶縁材料８３を通してコンデン
サ１１の端子と接続される。すなわち接続部材５１は板
状導体３２と非接続となった状態で板状導体３１とコン
デンサ１１の端子とを接続する。接続部材５６も同様に
板状導体３１と非接続となる。本実施例では、板状導体
の上下に設けられる板状絶縁材の一方に筒状絶縁リング
を設け、これによって接続部材の周囲を覆って、接続部
材と板状導体とを絶縁したが、板状導体の上下に設けら
れる板状絶縁材の両方に筒状絶縁リングを設け、両筒状
絶縁リングが互いに密着して接続部材の周囲を覆う構造
としても同様な効果を得ることができ、接続部材と板状
導体との間の沿面距離の制約から逃れることができる。Here, the present embodiment will be described by taking as an example a portion where the connecting member 51 and the plate-shaped conductor 32 are not connected. Plate conductor 3
2 is provided with a hole through which the connection member 51 passes.
Plate-like insulating materials 81 and 82 are provided above and below 32. Here, the plate-like insulating material 82 is provided with a tubular insulating ring 102 bonded or integrally formed with the plate-like insulating material 82. When a multilayer laminated conductor is formed, the tubular insulating ring 102 passes through a hole of the plate-like conductor 32. I do. The diameter of this hole is larger than the diameter of the hole of the plate-shaped insulating material 81 located thereon. The outer diameter of the tubular insulating ring 102 is larger than the diameter of the hole of the plate-shaped insulating material 81. Therefore, the cylindrical insulating ring 102 comes into close contact with the plate-shaped insulating material 81. When connecting to the terminal of the capacitor 11, the connecting member 51 first passes through the plate-shaped insulating material 81, and then passes through the tubular insulating ring 102 that is in close contact with the plate-shaped insulating material 81 through the plate-shaped conductor 32. This cylindrical insulating ring 1
02 surrounds the periphery of the connection member, and insulates the plate-like conductor 32 from the connection member 51. Next, the connecting member 51 is connected to the plate-shaped conductor 31.
To the terminal of the capacitor 11 through the plate-shaped insulating material 83. That is, the connection member 51 connects the plate-shaped conductor 31 and the terminal of the capacitor 11 in a state where the connection is not made with the plate-shaped conductor 32. Similarly, the connection member 56 is not connected to the plate-shaped conductor 31. In the present embodiment, a tubular insulating ring is provided on one of the plate-like insulating materials provided above and below the plate-like conductor, thereby covering the periphery of the connection member, and insulating the connection member and the plate-like conductor. The same effect can be obtained by providing a tubular insulating ring on both of the plate-shaped insulating materials provided above and below the conductor, so that both tubular insulating rings are in close contact with each other and cover the periphery of the connection member. It is possible to escape from the limitation of the creepage distance between the member and the plate-shaped conductor.
【００３０】（実施例６）他の実施例を図１１に示す。
本図において、３６は多層積層導体を形成する板状導体
のうちの１枚であり接続部材と非接続とすべき板状導体
である。２０１〜２０４は接続部材を非接続として通す
ための穴であり、３０１〜３０４は他の板状導体または
電気部品と接続部材により接続されている部位を示し、
穴３０１から穴３０２へ、穴３０３から穴３０４へそれ
ぞれ電流を流している場合を例に示している。ここで、
穴２０１と穴２０２は近接して設けたためにつながって
いる。一方、穴２０３と穴２０４はつながることなく設
けられ、穴の間に板状導体の一部が介在する。(Embodiment 6) Another embodiment is shown in FIG.
In the figure, reference numeral 36 denotes one of the plate-shaped conductors forming the multilayer laminated conductor, which is a plate-shaped conductor to be disconnected from the connection member. Reference numerals 201 to 204 denote holes through which connection members are passed as non-connections, and reference numerals 301 to 304 denote portions connected to other plate-shaped conductors or electric components by the connection members,
An example is shown in which a current is flowing from the hole 301 to the hole 302 and a current is flowing from the hole 303 to the hole 304, respectively. here,
The holes 201 and 202 are connected because they are provided close to each other. On the other hand, the holes 203 and 204 are provided without being connected, and a part of the plate-like conductor is interposed between the holes.
【００３１】いま、穴３０１から穴３０２へ電流が流れ
る時の経路を考えると、図に示すように穴２０１，穴２
０２を迂回して流れざるを得ず、その流路は長くなって
しまう。一方、穴３０３から穴３０４への電流経路を見
ると、穴２０３と穴２０４の間を通して最短距離で流れ
ることができる。一般に、電流の流れる経路が長くなる
ほど配線のインダクタンスは大きくなるため、２０１と
２０２のように二つの穴がつながった場合には多層積層
導体のインダクタンス低減効果が小さくなる欠点があ
る。このような場合には、穴２０３，穴２０４のように
穴の径を小さくし、穴同士がつながらないようにする必
要がある。一方、２０１〜２０４は接続部材を非接続と
して通すべき穴であり、これらの穴に通る接続部材の径
よりも大きな径を持つ必要がある。このように、多層積
層導体のインダクタンスを低減し、さらに接続部材を板
状導体に非接続で通すためには最接近して設けられる穴
が互いにつながらないで、しかも接続部材の径よりも大
きな径を持つ穴を設けることが必要である。Now, considering the path when current flows from the hole 301 to the hole 302, as shown in FIG.
02 has to be bypassed and the flow path becomes long. On the other hand, looking at the current path from the hole 303 to the hole 304, the current can flow through the hole 203 and the hole 204 at the shortest distance. In general, the longer the path through which the current flows, the greater the inductance of the wiring. Therefore, when two holes are connected as in 201 and 202, there is a disadvantage that the effect of reducing the inductance of the multilayer laminated conductor is reduced. In such a case, it is necessary to reduce the diameter of the holes like the holes 203 and 204 so that the holes are not connected to each other. On the other hand, reference numerals 201 to 204 denote holes through which the connecting members are to be passed in a non-connected state, and need to have a diameter larger than the diameter of the connecting members passing through these holes. As described above, in order to reduce the inductance of the multilayer laminated conductor and to allow the connection member to pass through the plate-shaped conductor without being connected, the holes provided closest to each other do not connect with each other, and the diameter larger than the diameter of the connection member is required. It is necessary to provide a hole to hold.
【００３２】[0032]
【発明の効果】接続部材と板状導体との間、あるいは板
状導体間で、絶縁を確保するための沿面距離が不要とな
り、高い電圧で使用する多層積層導体でも、接続部材を
通すための穴の径や多層積層導体のサイズを小さくでき
る。According to the present invention, a creeping distance for securing insulation between the connecting member and the plate-shaped conductor or between the plate-shaped conductors is not required. The hole diameter and the size of the multilayer laminated conductor can be reduced.
【図１】本発明による多層積層導体を用いて構成したイ
ンバータ回路の斜視図。FIG. 1 is a perspective view of an inverter circuit configured using a multilayer laminated conductor according to the present invention.
【図２】図１のインバータ回路の上面図。FIG. 2 is a top view of the inverter circuit shown in FIG. 1;
【図３】図１の多層積層導体の接続部の構造図。FIG. 3 is a structural view of a connection portion of the multilayer laminated conductor of FIG. 1;
【図４】本発明を板状導体の外周端部に実施した例の断
面図。FIG. 4 is a sectional view of an example in which the present invention is applied to an outer peripheral end of a plate-shaped conductor.
【図５】他の実施例の接続部の断面図。FIG. 5 is a sectional view of a connection portion according to another embodiment.
【図６】参考例を示す断面図。FIG. 6 is a sectional view showing a reference example.
【図７】他の参考例を示す断面図。FIG. 7 is a sectional view showing another reference example.
【図８】他の実施例の接続部の断面図。FIG. 8 is a sectional view of a connection portion according to another embodiment.
【図９】他の実施例の組立図。FIG. 9 is an assembly view of another embodiment.
【図１０】他の実施例の組立図。FIG. 10 is an assembly view of another embodiment.
【図１１】本発明による板状導体を示す図。FIG. 11 is a view showing a plate-shaped conductor according to the present invention.
【図１２】基本的なインバータ回路の構成図。FIG. 12 is a configuration diagram of a basic inverter circuit.
７…放熱フィン、９，１０…絶縁物、１１，１２…コン
デンサ、２１〜２３…スイッチ素子群、３１〜３６…板
状導体、５１〜６２…接続部材、８１〜８６…板状絶縁
材料、１０１…絶縁部材、１０２…筒状絶縁リング。7: radiation fins, 9, 10: insulator, 11, 12: capacitor, 21 to 23: switch element group, 31 to 36: plate conductor, 51 to 62: connection member, 81 to 86: plate insulating material, 101: an insulating member; 102: a cylindrical insulating ring.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 飛世 正博 茨城県日立市大みか町五丁目２番１号 株 式会社日立製作所大みか工場内 ──────────────────────────────────────────────────の Continuing on the front page (72) Inventor Masahiro Tobiyo 5-2-1 Omika-cho, Hitachi City, Ibaraki Prefecture Inside the Omika Plant of Hitachi, Ltd.
Claims (9)
互に積層される多層積層導体と、電気部品とが、接続部
材によって接続される電力変換装置において、 少なくとも二つの前記板状絶縁材によって挟まれる少な
くとも一つの前記板状導体の端部と、前記多層積層導体
と前記電気部品との接続体における導体表面部とが隣接
し、 前記板状導体の前記端部の表面が絶縁物によって覆われ
ていることを特徴とする電力変換装置。1. A power conversion device in which a multilayer laminated conductor in which a plurality of plate-like conductors and a plurality of plate-like insulating materials are alternately laminated, and an electric component are connected by a connecting member. The end of at least one of the plate-like conductors sandwiched by the plate-like insulating material and the conductor surface of the connection body between the multilayer laminated conductor and the electric component are adjacent to each other, and the surface of the end of the plate-like conductor is A power converter characterized by being covered with an insulator.
続部材の貫通する穴を有し、前記一つの板状導体の前記
端部が前記穴の内部における端部であり、前記導体表面
部が前記穴を貫通する前記接続部材の表面であることを
特徴とする電力変換装置。2. The conductor surface according to claim 1, wherein the plate-shaped conductor has a hole through which the connection member penetrates, the end of the one plate-shaped conductor is an end inside the hole, A power conversion device, wherein a portion is a surface of the connection member penetrating the hole.
積層導体と一体化されていることを特徴とする電力変換
装置。3. The power converter according to claim 2, wherein the insulator is integrated with the multilayer laminated conductor.
部材と一体化され、前記接続部材の前記表面が前記絶縁
部材によって覆われていることを特徴とする電力変換装
置。4. The power converter according to claim 2, wherein the insulator is integrated with the connection member, and the surface of the connection member is covered by the insulation member.
前記端部が前記多層積層導体の外周部における端部であ
り、前記導体表面部が、前記端部に隣接する他の板状導
体の体の端部の表面であることを特徴とする電力変換装
置。5. The plate-shaped conductor according to claim 1, wherein the end of the one plate-shaped conductor is an end in an outer peripheral portion of the multilayer laminated conductor, and the conductor surface portion is another plate-shaped adjacent to the end. A power converter characterized by being a surface of an end of a conductor body.
の板状絶縁材に密着していることを特徴とする電力変換
装置。6. The power converter according to claim 1, wherein the insulator is in close contact with the two plate-shaped insulating members.
の絶縁部材であることを特徴とする電力変換装置。7. The power converter according to claim 3, wherein the insulator is an insulating member on a ring.
絶縁材に一体化された筒状絶縁リングであることを特徴
とする電力変換装置。8. The power converter according to claim 3, wherein the insulator is a tubular insulating ring integrated with the plate-shaped insulating material.
互に積層される多層積層導体と、電気部品とが接続部材
によって接続される電気部品接続体において、 少なくとも二つの前記板状絶縁材によって挟まれる少な
くとも一つの前記板状導体の端部の表面を、絶縁物で覆
うことを特徴とする電気部品接続体。9. An electrical component connector in which a plurality of plate conductors and a plurality of plate insulators are alternately laminated and an electrical component is connected by a connection member. An electrical component connector, wherein an end surface of at least one of the plate-like conductors sandwiched between the insulating members is covered with an insulator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25467797A JP3550970B2 (en) | 1997-09-19 | 1997-09-19 | Power converter, multilayer laminated conductor and electrical component connector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25467797A JP3550970B2 (en) | 1997-09-19 | 1997-09-19 | Power converter, multilayer laminated conductor and electrical component connector |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH1198815A true JPH1198815A (en) | 1999-04-09 |
| JP3550970B2 JP3550970B2 (en) | 2004-08-04 |
Family
ID=17268337
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25467797A Expired - Fee Related JP3550970B2 (en) | 1997-09-19 | 1997-09-19 | Power converter, multilayer laminated conductor and electrical component connector |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3550970B2 (en) |
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