JPH11186679A - Insulation board and manufacture thereof - Google Patents
Insulation board and manufacture thereofInfo
- Publication number
- JPH11186679A JPH11186679A JP34891197A JP34891197A JPH11186679A JP H11186679 A JPH11186679 A JP H11186679A JP 34891197 A JP34891197 A JP 34891197A JP 34891197 A JP34891197 A JP 34891197A JP H11186679 A JPH11186679 A JP H11186679A
- Authority
- JP
- Japan
- Prior art keywords
- insulating layer
- power circuit
- bonding
- base
- circuit conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、電動機の制御装
置などのような比較的通電電流の大きい回路を持ち、ベ
ース金属と絶縁層と導体部とを積層して形成する金属基
板およびその製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a metal substrate having a circuit having a relatively large conduction current, such as a control device for a motor, formed by laminating a base metal, an insulating layer and a conductor, and a method of manufacturing the same. About.
【０００２】[0002]
【従来技術】例えば、電動機の制御装置は、通電電流の
大きいパワー回路と、通電電流の小さい制御回路からな
り、そのための半導体、抵抗等の部品を搭載した回路基
板を有している。これらの回路基板の通電用導体配線
は、印刷や金属薄膜のエッチングによって形成される。
特にパワー回路用導体は通電電流が大きいため導体断面
積を大きくとる必要がある。ただし、基板面積を有効に
使うためには、導体の幅をむやみに大きくすることはで
きない。2. Description of the Related Art For example, a control device for a motor includes a power circuit having a large energizing current and a control circuit having a small energizing current, and has a circuit board on which components such as semiconductors and resistors are mounted. The current-carrying conductor wiring of these circuit boards is formed by printing or etching of a metal thin film.
In particular, since the power circuit conductor has a large current, it is necessary to increase the conductor cross-sectional area. However, in order to use the board area effectively, the width of the conductor cannot be unnecessarily increased.
【０００３】導体断面積を大きくとるための方法の一つ
としては、パワー回路導体の通電電流に耐えるように制
御回路導体も含めて全体の導体部の厚さを、例えば１４
０〜３００μｍと厚くする方法が取られている。別の方
法としては、最初パワー回路導体の厚さを制御回路導体
にあわせて薄くしておき、その後にパワー回路導体とし
て必要な厚さ分だけ銅板をはんだ付けする方法がある。One method for increasing the conductor cross-sectional area is to reduce the thickness of the entire conductor, including the control circuit conductor, to, for example, 14 so as to withstand the current flowing through the power circuit conductor.
A method of increasing the thickness to 0 to 300 μm has been adopted. As another method, there is a method in which the thickness of the power circuit conductor is first reduced to match the thickness of the control circuit conductor, and then a copper plate is soldered to a thickness required for the power circuit conductor.
【０００４】[0004]
【発明が解決しようとする課題】しかし、金属薄膜のエ
ッチングによって形成される通電用導体配線では、厚い
導体パターンを形成するためには、導体の厚さ分エッチ
ングを行わねばならないため、エッチングに要する時間
が長くなる。例えば、１４０μｍの銅薄膜のエッチング
およびその後の後処理には、１日以上を要する。またエ
ッチングに要するコストも多大になる。更に、導体厚さ
が例えば５００、１０００μｍと厚くなると、マスク形
成とエッチングを繰り返さねばならず、エッチングによ
るパターン形成という方法そのものが、実際的には殆ど
不可能になる。However, in the case of conducting conductor wiring formed by etching a metal thin film, it is necessary to perform etching by the thickness of the conductor in order to form a thick conductor pattern. The time gets longer. For example, the etching of a 140 μm copper thin film and subsequent post-treatment requires more than one day. In addition, the cost required for etching also becomes large. Further, when the conductor thickness is increased to, for example, 500 or 1000 μm, mask formation and etching must be repeated, and the method itself of pattern formation by etching becomes practically almost impossible.
【０００５】一方、薄い導体パターンの上に、厚い銅板
をはんだ付けする方法では、銅板の熱容量が大きく、は
んだ付け作業に手数と時間がかかり、やはりコストが多
大になる。この発明の目的は、厚い導体パターンを持つ
回路基板を容易に実現できる製造方法を提供することに
ある。On the other hand, in the method of soldering a thick copper plate on a thin conductor pattern, the heat capacity of the copper plate is large, the work and time required for the soldering work are increased, and the cost is also increased. An object of the present invention is to provide a manufacturing method that can easily realize a circuit board having a thick conductor pattern.
【０００６】[0006]
【課題を解決するための手段】上記課題解決のため本発
明の絶縁基板においては、ベース金属の表面上に、少な
くともベース絶縁層とベース絶縁層より薄い接着用絶縁
層とを積層し、その接着用絶縁層上にパターン形成した
パワー回路導体を接合したものとする。そのようにすれ
ば、従来エッチングでは困難であった厚いパワー回路導
体をもつ絶縁基板とすることができる。また絶縁層を二
層構造とするすることによって、少なくとも所定の絶縁
層厚さを持ったベース絶縁層で絶縁耐圧を確保すること
ができる。In order to solve the above-mentioned problems, in an insulating substrate according to the present invention, at least a base insulating layer and a bonding insulating layer thinner than the base insulating layer are laminated on a surface of a base metal, and the bonding is performed. It is assumed that a power circuit conductor pattern-formed on the insulating layer for use is joined. By doing so, it is possible to provide an insulating substrate having a thick power circuit conductor, which has been difficult by conventional etching. When the insulating layer has a two-layer structure, a withstand voltage can be ensured with a base insulating layer having at least a predetermined insulating layer thickness.
【０００７】特に、ベース絶縁層と接着用絶縁層とが同
一の絶縁材料で構成されているものとすれば、ベース絶
縁層と接着用絶縁層との密着性がよく、熱膨張の不均一
がなく、剥離しにくい。また、ベース絶縁層と接着用絶
縁層とが異種の絶縁材料で構成されているものとすれ
ば、接着力、熱抵抗や誘電率，誘電正接など優れた材料
を目的によって選択し、特性を向上させられる。In particular, if the base insulating layer and the bonding insulating layer are made of the same insulating material, the adhesion between the base insulating layer and the bonding insulating layer is good, and the thermal expansion is not uniform. And hard to peel off. In addition, if the base insulating layer and the bonding insulating layer are made of different types of insulating materials, excellent materials such as adhesive strength, thermal resistance, dielectric constant, and dielectric loss tangent are selected according to the purpose to improve the characteristics. Let me do.
【０００８】更に、接着用絶縁層がパワー回路導体の直
下にのみ形成されているものとすることができる。その
ようにすれば、接着用絶縁層として使用する絶縁材料の
量を低減できる。本発明の絶縁基板の製造方法として
は、ベース金属の表面上にベース絶縁層を形成し硬化さ
せた後、そのベース絶縁層の上に接着用絶縁層を形成
し、その接着用絶縁層の上にパワー回路導体を接合する
ものとする。Further, the bonding insulating layer may be formed only directly below the power circuit conductor. By doing so, the amount of insulating material used as the bonding insulating layer can be reduced. As a method of manufacturing the insulating substrate of the present invention, after forming and curing a base insulating layer on the surface of the base metal, forming an adhesive insulating layer on the base insulating layer, To the power circuit conductor.
【０００９】そのようにすれば、厚いパワー回路導体を
有し、絶縁耐圧が確保できる絶縁基板が短い工期と低い
コストで実現できる。特に、ベース金属の表面上にベー
ス絶縁層を形成し硬化させた後、そのベース絶縁層の上
にパワー回路導体の形状に選択的に接着用絶縁層を形成
し、その接着用絶縁層の上にパワー回路導体を接合する
とよい。In this case, an insulating substrate having a thick power circuit conductor and capable of securing a withstand voltage can be realized with a short construction period and low cost. In particular, after forming and hardening a base insulating layer on the surface of the base metal, an insulating layer for bonding is selectively formed on the base insulating layer in the shape of a power circuit conductor, and then formed on the bonding insulating layer. It is good to join a power circuit conductor.
【００１０】そのようにすれば、接着用絶縁層として使
用する絶縁材料の量を低減することができる。また、ベ
ース金属の表面上にベース絶縁層を形成し硬化させ、パ
ターン形成したパワー回路導体とほぼ同じ形状にパター
ン形成した接着用絶縁層とを仮接合したものを前記硬化
したベース絶縁層上に接合してもよい。In this case, the amount of the insulating material used as the bonding insulating layer can be reduced. Further, a base insulating layer is formed on the surface of the base metal and cured, and a temporarily bonded pattern of the power circuit conductor and the bonding insulating layer patterned in substantially the same shape is formed on the cured base insulating layer. You may join.
【００１１】そのような方法によっても、厚いパワー回
路導体を有し、絶縁耐圧が確保できる絶縁基板が短い工
期と低いコストで実現できる。特に、パワー回路導体の
材料に接着用絶縁層を仮接合した後、両者を一度にパワ
ー回路導体のパターンにパターン形成し、またはパター
ン形成したパワー回路導体上に接着用絶縁層を形成して
パワー回路導体とほぼ同じ形状にパターン形成された接
着用絶縁層を得て、その仮接合したものを前記硬化した
ベース絶縁層上に接合するものとすれば、パワー回路導
体と接着用絶縁層がずれたり、パワー回路導体直下にボ
イドが発生することが無い。[0011] According to such a method, an insulating substrate having a thick power circuit conductor and capable of securing a withstand voltage can be realized with a short construction period and low cost. In particular, after temporarily bonding the adhesive insulating layer to the power circuit conductor material, the two are simultaneously patterned into a power circuit conductor pattern, or the adhesive insulating layer is formed on the patterned power circuit conductor to form a power circuit. If an adhesive insulating layer patterned and formed in substantially the same shape as the circuit conductor is obtained, and the temporarily joined product is joined to the cured base insulating layer, the power circuit conductor and the adhesive insulating layer are misaligned. Also, no void is generated immediately below the power circuit conductor.
【００１２】パワー回路導体のパターン形成方法として
は、プレス打ち抜きでパターン形成するものとする。プ
レス打ち抜きであれば、厚さの厚いパワー回路導体のパ
ターンを再現性良く短い工期で多量に作ることができ
る。As a method of forming a pattern of a power circuit conductor, a pattern is formed by press punching. With press punching, a large number of power circuit conductor patterns having a large thickness can be produced with good reproducibility in a short period.
【００１３】[0013]
【発明の実施の形態】［実施例１］図１は本発明の方法
にかかる実施例１の金属基板の断面図である。図１にお
いて、ベース金属１の表面上にベース絶縁層２および接
着用絶縁層３を介して、パターニングした厚さの厚いパ
ワー回路導体４が形成されている。例えば各部は次のよ
うなものである。ベース金属１は厚さ２ｍｍのアルミニ
ウム合金であり、ベース絶縁層２および接着用絶縁層３
はともに熱伝導率の大きいフィラー入りエポキシ樹脂で
ある。ベース絶縁層２、接着用絶縁層３の厚さはそれぞ
れ１５０μｍ、３０μｍである。パワー回路導体４は、
厚さ３００μｍの銅板をパターニングしたものである。FIG. 1 is a sectional view of a metal substrate according to a first embodiment of the present invention. In FIG. 1, a patterned power circuit conductor 4 having a large thickness is formed on a surface of a base metal 1 with a base insulating layer 2 and an adhesive insulating layer 3 interposed therebetween. For example, each part is as follows. The base metal 1 is an aluminum alloy having a thickness of 2 mm, the base insulating layer 2 and the bonding insulating layer 3
Are both filled epoxy resins with high thermal conductivity. The thicknesses of the base insulating layer 2 and the bonding insulating layer 3 are 150 μm and 30 μm, respectively. The power circuit conductor 4
It is obtained by patterning a copper plate having a thickness of 300 μm.
【００１４】図２（ａ）から（ｄ）は実施例１の基板を
製造方法を説明するための工程順の断面図である。ま
ず、接着前のベース絶縁層２を、例えば次のような方法
で作製する。型枠にエポキシ樹脂を流し、約１５０℃で
３分間程度硬化させて流動性の無い半硬化状態（プリプ
レグ状態ともいう）にする。そのベース絶縁層２をベー
ス金属１上に載せ、真空加圧プレスで、接着と樹脂の硬
化とを同時に行う［図２（ａ）］。条件は、１８０℃
で、約５×１０6 Ｐａに加圧し、２時間程度硬化させ
る。硬化済みのベース絶縁層２を接着剤でベース金属１
に接着してもよい。FIGS. 2A to 2D are cross-sectional views in the order of steps for explaining a method of manufacturing the substrate of the first embodiment. First, the base insulating layer 2 before bonding is manufactured by, for example, the following method. An epoxy resin is poured into the mold and cured at about 150 ° C. for about 3 minutes to obtain a semi-cured state without fluidity (also referred to as a prepreg state). The base insulating layer 2 is placed on the base metal 1, and bonding and curing of the resin are simultaneously performed by a vacuum press (FIG. 2A). Condition is 180 ° C
And pressurized to about 5 × 10 6 Pa and cured for about 2 hours. The cured base insulating layer 2 is bonded to the base metal 1 with an adhesive.
May be adhered to.
【００１５】次に、ベース絶縁層２の表面全面に接着用
絶縁層３を形成し、少し硬化させてベタベタしない状態
（Ｂステージ状態ともいう）にする［同図（ｂ）］。パ
ワー回路導体４を金属板のプレス打ち抜きによってパタ
ーン状に形成する［同図（ｃ）］。銅板などの金属板を
ワイヤカット加工してもよい。その後パターニングした
パワー回路導体４を、接着用絶縁層３の上に接合する
［同図（ｄ）］。接合は真空加圧プレスで接着用絶縁層
３の硬化によって行う。Next, an adhesive insulating layer 3 is formed on the entire surface of the base insulating layer 2 and is slightly cured so that it is not sticky (also referred to as a B-stage state) (FIG. 1B). The power circuit conductor 4 is formed in a pattern by press punching of a metal plate [FIG. A metal plate such as a copper plate may be subjected to wire cutting. Thereafter, the patterned power circuit conductor 4 is bonded onto the bonding insulating layer 3 [FIG. The bonding is performed by curing the adhesive insulating layer 3 with a vacuum press.
【００１６】このようなエッチングを用いない製造方法
とした結果、この実施例では７５Ａの大電流を通電でき
る厚い導体をもつ基板が容易に形成できた。従来のエッ
チング法ではエッチングを繰り返すため二日以上要した
工期が、数時間に短縮されるとともにコストの低減が可
能になった。そして絶縁層をベース絶縁層２と接着用絶
縁層３の２層構造として、最初にベース絶縁層２を硬化
させた後に、パワー回路導体４を接着しているので、少
なくともベース絶縁層２の厚さによって、必要な絶縁厚
さが確保されている。この実施例１では、厚さ１５０μ
ｍのベース絶縁層２で、１０ｋＶ以上の絶縁耐圧を確保
することができた。As a result of such a manufacturing method not using etching, a substrate having a thick conductor through which a large current of 75 A can flow can be easily formed in this embodiment. In the conventional etching method, the work period that required two days or more to repeat the etching was shortened to several hours, and the cost was reduced. Since the insulating layer has a two-layer structure of the base insulating layer 2 and the bonding insulating layer 3, the base insulating layer 2 is first cured, and then the power circuit conductor 4 is bonded. This ensures the required insulation thickness. In the first embodiment, the thickness is 150 μm.
With the base insulating layer 2 of m, a withstand voltage of 10 kV or more could be secured.
【００１７】この例では、ベース絶縁層２と接着用絶縁
層３はともにエポキシ樹脂で同一の絶縁材料としたが、
熱抵抗を低減するためフィラーの含有量を変えたり、あ
るいは接着力増加や誘電率，誘電正接などの特性によっ
て例えば、エポキシ樹脂とフェノール樹脂など別の材料
の組み合わせとしても良い。 ［実施例２］図３は本発明の別の方法にかかる実施例２
の金属基板の断面図である。In this example, both the base insulating layer 2 and the bonding insulating layer 3 are made of the same insulating material of epoxy resin.
The content of the filler may be changed to reduce the thermal resistance, or a combination of another material such as an epoxy resin and a phenol resin may be used depending on characteristics such as an increase in adhesive strength, a dielectric constant, and a dielectric loss tangent. [Embodiment 2] FIG. 3 shows Embodiment 2 according to another method of the present invention.
FIG. 3 is a cross-sectional view of the metal substrate of FIG.
【００１８】図３において、ベース金属１の表面上にベ
ース絶縁層２および接着用絶縁層３を介して、パターニ
ングした厚さの厚いパワー回路導体４が形成されている
のは、図１の実施例１と同じであるが、接着用絶縁層３
がパワー回路導体４の下部にのみ形成されている点が違
っている。各部の材料としては実施例１と同じで良い。In FIG. 3, a patterned power circuit conductor 4 having a large thickness is formed on a surface of a base metal 1 with a base insulating layer 2 and an adhesive insulating layer 3 interposed therebetween. Same as Example 1, except that the adhesive insulating layer 3
Is formed only below the power circuit conductor 4. The material of each part may be the same as that of the first embodiment.
【００１９】図４（ａ）から（ｄ）は図２の工程（ａ）
〜（ｄ）と対応しており、実施例２の基板を製造方法を
説明するための工程順の断面図である。まず、接着前の
ベース絶縁層２をプリプレグ状態にしておき、ベース金
属１上にベース絶縁層２を接着する［図４（ａ）］。真
空加圧プレスで、樹脂の接着と硬化とを同時に行うのが
よい。条件は、１８０℃で、約５×１０6 Ｐａに加圧
し、２時間程度硬化させる。FIGS. 4A to 4D show steps (a) of FIG.
FIGS. 9A to 9D are cross-sectional views in the order of steps for explaining a method for manufacturing the substrate of Example 2; First, the base insulating layer 2 before bonding is kept in a prepreg state, and the base insulating layer 2 is bonded on the base metal 1 (FIG. 4A). It is preferable that the resin is bonded and cured at the same time by a vacuum press. The conditions are 180 ° C., pressurization to about 5 × 10 6 Pa, and curing for about 2 hours.
【００２０】次に、ベース絶縁層２の表面に、例えばス
クリーン印刷により選択的に接着用絶縁層３を形成し、
Ｂステージ状態にする［同図（ｂ）］。ベース絶縁層２
と同様に型枠に流し込んでパターンを形成しても良い。
パワー回路導体４を金属板のプレス打ち抜きによってパ
ターン状に形成する［同図（ｃ）］。銅板などの金属板
をワイヤカット加工してもよい。Next, an insulating insulating layer 3 is selectively formed on the surface of the base insulating layer 2 by, for example, screen printing.
The state is changed to the B stage [(b) in the figure]. Base insulating layer 2
Similarly, the pattern may be formed by pouring into a mold.
The power circuit conductor 4 is formed in a pattern by press punching of a metal plate [FIG. A metal plate such as a copper plate may be subjected to wire cutting.
【００２１】その後パターニングしたパワー回路導体４
を、接着用絶縁層３がある部分の上に接合する［同図
（ｄ）］。接合は真空加圧プレスで接着用絶縁層３の硬
化によって行う。このような製造方法とすれば、実施例
１と同様に大幅な工期の短縮およびコストの低減が可能
になるだけでなく、更に接着用絶縁層３の材料が節約で
きる。Thereafter, the patterned power circuit conductor 4
Is bonded on the portion where the insulating layer for bonding 3 is present [FIG. The bonding is performed by curing the adhesive insulating layer 3 with a vacuum press. According to such a manufacturing method, not only the working period and cost can be significantly reduced as in the first embodiment, but also the material for the bonding insulating layer 3 can be saved.
【００２２】ベース絶縁層２と接着用絶縁層３とは同一
の絶縁材料としても、あるいは別の材料としても良い。
［実施例３］図５（ａ）から（ｄ）は実施例２の金属基
板を製造する別の製造方法による工程順の断面図であ
る。The base insulating layer 2 and the bonding insulating layer 3 may be made of the same insulating material or different materials.
[Embodiment 3] FIGS. 5A to 5D are cross-sectional views in the order of steps according to another manufacturing method for manufacturing a metal substrate of Embodiment 2. FIG.
【００２３】ベース金属１とベース絶縁層２との接着を
実施例１、２と同様におこなう［図５（ａ）］。パワー
回路導体４の板材４ａに全面に接着用絶縁層３ａを塗布
し、Ｂステージ状態にする［同図（ｂ）］。仮接着した
両者をプレス打ち抜きによってパターン状に形成する
［同図（ｃ）］。ワイヤカット加工してもよい。The bonding between the base metal 1 and the insulating base layer 2 is performed in the same manner as in the first and second embodiments (FIG. 5A). An adhesive insulating layer 3a is applied to the entire surface of the plate member 4a of the power circuit conductor 4 to bring it into a B-stage state (FIG. 2B). The two parts that have been temporarily bonded are formed into a pattern by press punching (FIG. 3C). Wire cutting may be performed.
【００２４】最後にベース絶縁層２上ににパターニング
した接着用絶縁層３とパワー回路導体４とを接合する
［同図（ｄ）］。この接合は真空加圧プレスで接着用絶
縁層３の硬化によって行う。このような製造方法とすれ
ば、パワー回路導体４と接着用絶縁層３ａとを同時にパ
ターニングするので、別々のパターニングするより工程
を短縮でき、しかもパワー回路導体と接着用絶縁層がず
れたり、パワー回路導体直下にボイドが発生することが
無い。勿論、実施例１と同様に大幅な工期の短縮および
コストの低減が可能になる。Finally, the bonding insulating layer 3 patterned on the base insulating layer 2 and the power circuit conductor 4 are joined [FIG. This bonding is performed by hardening the adhesive insulating layer 3 by a vacuum press. According to such a manufacturing method, since the power circuit conductor 4 and the bonding insulating layer 3a are simultaneously patterned, the number of steps can be reduced as compared with the case of separate patterning. No void is generated immediately below the circuit conductor. Of course, as in the case of the first embodiment, it is possible to greatly shorten the construction period and reduce the cost.
【００２５】［実施例４］図６（ａ）から（ｄ）は実施
例２の金属基板を製造する更に別の製造方法による工程
順の断面図である。ベース金属１とベース絶縁層２との
接着を実施例１、２と同様におこなう［図６（ａ）］。[Embodiment 4] FIGS. 6A to 6D are cross-sectional views in the order of steps according to still another manufacturing method for manufacturing a metal substrate of Embodiment 2. FIG. The bonding between the base metal 1 and the base insulating layer 2 is performed in the same manner as in Examples 1 and 2 (FIG. 6A).
【００２６】パワー回路導体４を金属板のプレス打ち抜
きによってパターン状に形成する［同図（ｂ）］。銅板
などの金属板をワイヤカット加工してもよい。パターニ
ングしたパワー回路導体４に接着用絶縁層３を塗布し、
Ｂステージ状態にする［同図（ｃ）］。最後にベース絶
縁層２と接着用絶縁層３とパワー回路導体４を接合する
［同図（ｄ）］。この接合は真空加圧プレスで接着用絶
縁層３の硬化によって行う。The power circuit conductor 4 is formed in a pattern by press punching a metal plate [FIG. A metal plate such as a copper plate may be subjected to wire cutting. An adhesive insulating layer 3 is applied to the patterned power circuit conductor 4,
The state is changed to the B stage [(c) in the figure]. Finally, the base insulating layer 2, the bonding insulating layer 3, and the power circuit conductor 4 are joined [FIG. This bonding is performed by hardening the adhesive insulating layer 3 by a vacuum press.
【００２７】このような製造方法でも、実施例１と同様
に大幅な工期の短縮およびコストの低減が可能になるだ
けでなく、更に接着用絶縁層３の材料が節約できる。し
かも、実施例３の方法ではパワー回路導体と接着用絶縁
層の同時パターン化の時に接着着用絶縁層３とパワー回
路導体４との剥離が起こる場合があったが、この方法で
は剥離を防止できるという効果がある。According to such a manufacturing method as well as the first embodiment, it is possible to not only greatly shorten the construction period and reduce the cost, but also to save the material of the bonding insulating layer 3. In addition, in the method of the third embodiment, the peeling of the bonding insulating layer 3 and the power circuit conductor 4 may occur when the power circuit conductor and the bonding insulating layer are simultaneously patterned. However, this method can prevent the peeling. This has the effect.
【００２８】[0028]
【発明の効果】以上説明したように本発明の絶縁基板
は、ベース金属の表面上に、少なくともベース絶縁層と
ベース絶縁層より薄い接着用絶縁層とを積層し、その接
着用絶縁層上にパターン形成したパワー回路導体を接合
することによって、従来法のエッチングでは困難であっ
た厚さの厚いパワー導体をもつ絶縁基板が容易に実現で
き、工期も短縮されて、コストが低減される。絶縁層を
二層としたことによって、絶縁耐圧が確保されるように
なる。As described above, the insulating substrate according to the present invention has at least a base insulating layer and a bonding insulating layer thinner than the base insulating layer laminated on the surface of the base metal. By joining the patterned power circuit conductors, it is possible to easily realize an insulating substrate having a thick power conductor, which has been difficult by the conventional etching, shortening the construction period and reducing the cost. By having two insulating layers, the dielectric strength is ensured.
【００２９】ベース絶縁層と接着用絶縁層とは、同一の
絶縁材料で構成されていても、異種の絶縁材料で構成さ
れていてもよく、また、接着用絶縁層がパワー回路導体
の直下にのみ形成されていてもよい。そのような絶縁基
板の製造方法としては、ベース金属の表面上にベース絶
縁層を形成し硬化させた後、そのベース絶縁層の上に全
面に接着用絶縁層を形成し、その接着用絶縁層の上に、
例えばプレスによりパターン形成されたパワー回路導体
を接合する。パターン形成したパワー回路導体とほぼ同
じ形状にパターン形成した接着用絶縁層とを仮接合した
ものを、硬化したベース絶縁層上に接合してもよい。The base insulating layer and the bonding insulating layer may be made of the same insulating material or different types of insulating materials, and the bonding insulating layer may be formed immediately below the power circuit conductor. It may be formed only. As a method for manufacturing such an insulating substrate, a base insulating layer is formed on the surface of a base metal, cured, and then a bonding insulating layer is formed on the entire surface of the base insulating layer, and the bonding insulating layer is formed. on top of,
For example, a power circuit conductor patterned by pressing is joined. The provisionally joined pattern of the power circuit conductor and the bonding insulating layer patterned in substantially the same shape may be joined to the cured base insulating layer.
【００３０】いずれの方法でも厚さの厚いパワー導体を
もつ絶縁基板が容易に実現できるが、特に後者の方法に
よれば、パワー回路導体と接着用絶縁層の間に位置ずれ
が起きない。パワー回路で扱う電流が次第に大きくなる
傾向にあり、パワー回路用の絶縁基板として、極めて有
効である。In either method, an insulating substrate having a thick power conductor can be easily realized. However, according to the latter method, no displacement occurs between the power circuit conductor and the adhesive insulating layer. The current handled by power circuits tends to gradually increase, and is extremely effective as an insulating substrate for power circuits.
【図１】本発明実施例１の絶縁基板の断面図FIG. 1 is a cross-sectional view of an insulating substrate according to a first embodiment of the present invention.
【図２】（ａ）から（ｄ）は図１の金属基板の製造方法
を説明するための工程順の断面図2 (a) to 2 (d) are cross-sectional views in the order of steps for explaining a method of manufacturing the metal substrate of FIG. 1;
【図３】実施例２の金属基板の断面図FIG. 3 is a cross-sectional view of a metal substrate according to a second embodiment.
【図４】（ａ）から（ｄ）は図３の金属基板の製造方法
を説明するための工程順の断面図4 (a) to 4 (d) are cross-sectional views in the order of steps for explaining a method of manufacturing the metal substrate of FIG. 3;
【図５】（ａ）から（ｄ）は図３の金属基板の別の製造
方法を説明するための工程順の断面図5 (a) to 5 (d) are cross-sectional views in the order of steps for explaining another method for manufacturing the metal substrate of FIG. 3;
【図６】（ａ）から（ｄ）は図３の金属基板の更に別の
製造方法を説明するための工程順の断面図6 (a) to 6 (d) are sectional views in the order of steps for explaining still another manufacturing method of the metal substrate of FIG. 3;
１ ベース金属 ２ ベース絶縁層 ３、３ａ 接着用絶縁層 ４ パワー回路導体 ４ａ 導体板材 DESCRIPTION OF SYMBOLS 1 Base metal 2 Base insulating layer 3, 3a Adhesive insulating layer 4 Power circuit conductor 4a Conductor plate material
───────────────────────────────────────────────────── フロントページの続き (72)発明者 竹内 優一 神奈川県川崎市川崎区田辺新田１番１号 富士電機株式会社内 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Yuichi Takeuchi 1-1-1, Tanabe-Nitta, Kawasaki-ku, Kawasaki-shi, Kanagawa Prefecture Fuji Electric Co., Ltd.
Claims (10)
絶縁層とベース絶縁層より薄い接着用絶縁層とを積層
し、その接着用絶縁層上にパターン形成したパワー回路
導体を接合したことを特徴とする絶縁基板。At least a base insulating layer and a bonding insulating layer thinner than the base insulating layer are laminated on a surface of a base metal, and a power circuit conductor patterned on the bonding insulating layer is joined. And an insulating substrate.
縁材料で構成されていることを特徴とする請求項１記載
の絶縁基板。2. The insulating substrate according to claim 1, wherein the base insulating layer and the bonding insulating layer are made of the same insulating material.
縁材料で構成されていることを特徴とする請求項１記載
の絶縁基板。3. The insulating substrate according to claim 1, wherein the base insulating layer and the bonding insulating layer are made of different insulating materials.
み形成されていることを特徴とする請求項２または３に
記載の絶縁基板。4. The insulating substrate according to claim 2, wherein the bonding insulating layer is formed only immediately below the power circuit conductor.
絶縁層とベース絶縁層より薄い接着用絶縁層とを積層
し、その接着用絶縁層上にパターン形成したパワー回路
導体を接合した絶縁基板の製造方法において、ベース金
属の表面上にベース絶縁層を形成し硬化させた後、その
ベース絶縁層の上に接着用絶縁層を形成し、その接着用
絶縁層の上にパワー回路導体を接合することを特徴とす
る絶縁基板の製造方法。5. An insulating substrate in which at least a base insulating layer and a bonding insulating layer thinner than the base insulating layer are laminated on the surface of the base metal, and a power circuit conductor patterned on the bonding insulating layer is joined. In the manufacturing method, after forming and curing a base insulating layer on a surface of a base metal, an insulating layer for bonding is formed on the base insulating layer, and a power circuit conductor is bonded on the insulating layer for bonding. A method for manufacturing an insulating substrate, comprising:
の形状に選択的に接着用絶縁層を形成し、その接着用絶
縁層の上にパワー回路導体を接合することを特徴とする
請求項５記載の絶縁基板の製造方法。6. An adhesive insulating layer is formed selectively on the base insulating layer in a shape substantially similar to that of the power circuit conductor, and the power circuit conductor is bonded on the adhesive insulating layer. Item 6. The method for producing an insulating substrate according to Item 5.
絶縁層とベース絶縁層より薄い接着用絶縁層とを積層
し、その接着用絶縁層上にパターン形成したパワー回路
導体を接合した絶縁基板の製造方法において、ベース金
属の表面上にベース絶縁層を形成し硬化させ、パターン
形成したパワー回路導体とほぼ同じ形状にパターン形成
した接着用絶縁層とを仮接合したものを前記硬化したベ
ース絶縁層上に接合することを特徴とする絶縁基板の製
造方法。7. An insulating substrate in which at least a base insulating layer and a bonding insulating layer thinner than the base insulating layer are laminated on the surface of the base metal, and a power circuit conductor patterned on the bonding insulating layer is joined. In the manufacturing method, the base insulating layer is formed and cured on the surface of the base metal, and the cured base insulating layer is formed by temporarily bonding a patterned power circuit conductor and an adhesive insulating layer patterned in substantially the same shape. A method for manufacturing an insulating substrate, wherein the insulating substrate is bonded on the upper surface.
接合した後、両者を一度にパワー回路導体のパターンに
パターン形成することを特徴とする請求項７記載の絶縁
基板の製造方法。8. The method for manufacturing an insulating substrate according to claim 7, wherein after temporarily bonding the insulating layer for bonding to the material of the power circuit conductor, the two are simultaneously patterned into a pattern of the power circuit conductor.
用絶縁層を形成してパワー回路導体とほぼ同じ形状にパ
ターン形成された接着用絶縁層を得ることを特徴とする
請求項７記載の絶縁基板の製造方法。9. The insulation according to claim 7, wherein an adhesive insulating layer is formed on the patterned power circuit conductor to obtain an adhesive insulating layer patterned in substantially the same shape as the power circuit conductor. Substrate manufacturing method.
パターン形成することを特徴とする請求項５ないし９の
いずれかに記載の絶縁基板の製造方法。10. The method for manufacturing an insulating substrate according to claim 5, wherein the power circuit conductor is patterned by press punching.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34891197A JPH11186679A (en) | 1997-12-18 | 1997-12-18 | Insulation board and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34891197A JPH11186679A (en) | 1997-12-18 | 1997-12-18 | Insulation board and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11186679A true JPH11186679A (en) | 1999-07-09 |
Family
ID=18400222
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP34891197A Withdrawn JPH11186679A (en) | 1997-12-18 | 1997-12-18 | Insulation board and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11186679A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002335056A (en) * | 2001-05-08 | 2002-11-22 | Nitto Shinko Kk | Metal base substrate and its manufacturing method |
| KR100481227B1 (en) * | 2002-05-06 | 2005-04-07 | 한국전기연구원 | Method Of Fabricating A Circuit Board With Metal Circuit Patterns |
| US8001682B2 (en) | 2004-08-17 | 2011-08-23 | Mitsubishi Materials Corporation | Insulation substrate, power module substrate, manufacturing method thereof, and power module using the same |
| KR101307273B1 (en) * | 2012-12-28 | 2013-09-11 | 엘아이지넥스원 주식회사 | Printed circuit board and housing thereof |
| JP2017022265A (en) * | 2015-07-10 | 2017-01-26 | 日清紡ケミカル株式会社 | Metal circuit board and method for manufacturing the same |
| CN107667419A (en) * | 2015-05-18 | 2018-02-06 | 丹佛斯硅动力有限责任公司 | Method for manufacturing circuit carrier |
| JP2019169540A (en) * | 2018-03-22 | 2019-10-03 | 三菱マテリアル株式会社 | Insulation circuit board and manufacturing method of the insulation circuit board |
| CN111615266A (en) * | 2019-02-26 | 2020-09-01 | 日本发条株式会社 | Method for manufacturing semi-finished plate material for circuit board, and method for manufacturing metal-base circuit board |
-
1997
- 1997-12-18 JP JP34891197A patent/JPH11186679A/en not_active Withdrawn
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002335056A (en) * | 2001-05-08 | 2002-11-22 | Nitto Shinko Kk | Metal base substrate and its manufacturing method |
| KR100481227B1 (en) * | 2002-05-06 | 2005-04-07 | 한국전기연구원 | Method Of Fabricating A Circuit Board With Metal Circuit Patterns |
| US8001682B2 (en) | 2004-08-17 | 2011-08-23 | Mitsubishi Materials Corporation | Insulation substrate, power module substrate, manufacturing method thereof, and power module using the same |
| US8188376B2 (en) | 2004-08-17 | 2012-05-29 | Mitsubishi Materials Corporation | Insulation substrate, power module substrate, manufacturing method thereof, and power module using the same |
| KR101307273B1 (en) * | 2012-12-28 | 2013-09-11 | 엘아이지넥스원 주식회사 | Printed circuit board and housing thereof |
| CN107667419A (en) * | 2015-05-18 | 2018-02-06 | 丹佛斯硅动力有限责任公司 | Method for manufacturing circuit carrier |
| JP2017022265A (en) * | 2015-07-10 | 2017-01-26 | 日清紡ケミカル株式会社 | Metal circuit board and method for manufacturing the same |
| JP2019169540A (en) * | 2018-03-22 | 2019-10-03 | 三菱マテリアル株式会社 | Insulation circuit board and manufacturing method of the insulation circuit board |
| CN111615266A (en) * | 2019-02-26 | 2020-09-01 | 日本发条株式会社 | Method for manufacturing semi-finished plate material for circuit board, and method for manufacturing metal-base circuit board |
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