JPH11170189A - Sucking-taching device for electronic parts - Google Patents
Sucking-taching device for electronic partsInfo
- Publication number
- JPH11170189A JPH11170189A JP9338643A JP33864397A JPH11170189A JP H11170189 A JPH11170189 A JP H11170189A JP 9338643 A JP9338643 A JP 9338643A JP 33864397 A JP33864397 A JP 33864397A JP H11170189 A JPH11170189 A JP H11170189A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- suction
- pins
- pin
- sucking
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Supply And Installment Of Electrical Components (AREA)
- Manipulator (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、半導体装置等の
電子部品を吸着して搬送する搬送装置における前記電子
部品の吸着・脱着装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for adsorbing / removing an electronic component, such as a semiconductor device, in a transfer device for sucking and transporting the electronic component.
【０００２】[0002]
【従来の技術】図５は従来の電子部品の吸着・脱着装置
を示す断面図である。図において、１は電子部品として
のＩＣ、２は貫通孔２ａを有するホルダー、３はホルダ
ー２の先端に装置され貫通孔３ａを有した軟質ゴム製の
吸着パッド、４はホルダー２を定位置に保持する取付
板、５は貫通孔５ａを有しホルダー２の他端に螺合され
た継手、６は継手５に装置された配管チューブである。2. Description of the Related Art FIG. 5 is a sectional view showing a conventional electronic component suction / removal device. In the drawing, 1 is an IC as an electronic component, 2 is a holder having a through-hole 2a, 3 is a suction pad made of a soft rubber having a through-hole 3a installed at the tip of the holder 2, and 4 is a holder having a fixed position. The mounting plate 5 to be held has a through-hole 5 a and is a joint screwed to the other end of the holder 2, and 6 is a piping tube provided in the joint 5.
【０００３】次に動作について説明する。駆動装置（図
示省略）により、この吸着パッド３の先端外周が電子部
品１の被吸着面１ａの所望位置に接触するまでパッド３
を移動させ、同時に真空発生装置（図示省略）を稼働さ
せて配管チューブ６と、継手５、ホルダ２及び吸着パッ
ド３それぞれの貫通孔５ａ、２ａ及び３ａとを通して真
空吸引することにより、吸着パッド３にて電子部品１を
吸着する。次に、吸着された電子部品１を分離脱着する
際は、真空発生装置を停止させ、配管チューブ６より微
量の圧空又は大気圧空気を送り込む。上記動作により、
吸着パッド３への電子部品１の吸着、脱着が行われ、電
子部品１の搬送が行われる。Next, the operation will be described. The driving device (not shown) operates the pad 3 until the outer periphery of the tip of the suction pad 3 comes into contact with a desired position on the suction surface 1a of the electronic component 1.
Is moved, and at the same time, a vacuum generator (not shown) is operated to vacuum-suction through the pipe tube 6 and the through holes 5a, 2a and 3a of the joint 5, the holder 2, and the suction pad 3, respectively. The electronic component 1 is sucked. Next, when the adsorbed electronic component 1 is separated and desorbed, the vacuum generator is stopped and a small amount of compressed air or atmospheric pressure air is sent from the piping tube 6. By the above operation,
Attraction and desorption of the electronic component 1 to and from the suction pad 3 are performed, and the electronic component 1 is transported.
【０００４】[0004]
【発明が解決しようとする課題】吸着パッド３は密着性
の高い軟質材（例えばゴム材）の為、吸着時の電子部品
１の姿勢が不安定で、傾きが出たりして搬送後、セット
する際の位置決めが悪くなるという問題点があった。
又、吸着時の姿勢に加え、外部力として圧空等気体のみ
にて吸着された電子部品１の分離、脱着を行なう為、圧
空圧や流量の微妙な変化により分離される姿勢が変わ
り、水平状態が保てず、受け渡しが出来ない等の問題点
があった。更に、電子部品１の自重のみによる分離では
吸着パッド３の密着力の方が大きく、分離出来ない等の
問題点があった。Since the suction pad 3 is a soft material (for example, rubber material) having high adhesion, the posture of the electronic component 1 at the time of suction is unstable. However, there is a problem that positioning at the time of performing is deteriorated.
In addition, in order to separate and desorb the electronic component 1 adsorbed only by gas such as compressed air as an external force, in addition to the posture at the time of adsorption, the separated posture changes due to subtle changes in pneumatic pressure and flow rate, and the horizontal state However, there were problems such as not being able to maintain and not being able to deliver. Further, in the case where the electronic component 1 is separated only by its own weight, there is a problem that the adhesion force of the suction pad 3 is larger and separation cannot be performed.
【０００５】上記問題点の解決を目的に、特開昭６２―
２４９９２号公報には吸着パッドの周辺に位置して電子
部品であるＩＣに対向するブッシャを設けると共に、こ
のブッシャを吸着パッドの軸心方向に往復駆動させる手
段を設け、吸着保持されたＩＣを吸着パッドから離間さ
せる方向に押動し得るように構成した真空吸着解除装置
が開示されている。この装置は、真空吸着していたＩＣ
を真空解放後、吸着パッドから速やかに離間させて所定
の位置に正確に置くことができるが、吸着パッドの真空
配管と別個にブッシャを往復駆動する真空配管を必要と
し、その分、搬送装置が複雑で比較的高価なものとなる
などの問題点があった。To solve the above problems, Japanese Patent Laid-Open No.
In Japanese Patent No. 24992, a busher is provided at the periphery of the suction pad and faces the IC which is an electronic component, and means for reciprocating the busher in the axial direction of the suction pad is provided. A vacuum suction release device configured to be able to be pushed in a direction to separate from a pad is disclosed. This device uses an IC
After releasing the vacuum, it can be quickly separated from the suction pad and accurately placed in a predetermined position.However, a vacuum pipe that reciprocates the busher separately from the vacuum pipe of the suction pad is required, There were problems such as being complicated and relatively expensive.
【０００６】この発明は上記の様な問題点を解消するた
めになされたもので、吸着時又は分離時に電子部品の姿
勢を水平状態に保つと共に、分離、脱着時における電子
部品の位置決めも容易であり、比較的安価に製造できる
電子部品の吸着・脱着装置を得ることを目的とする。SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is possible to maintain the posture of an electronic component in a horizontal state at the time of suction or separation, and to easily position the electronic component at the time of separation and detachment. It is an object of the present invention to provide an electronic component adsorption / desorption device which can be manufactured relatively inexpensively.
【０００７】[0007]
【課題を解決するための手段】第１の発明に係る電子部
品の吸着・脱着装置は、 電子部品を吸着する吸着パッ
ドと、該吸着パッドの周辺に配置され、前記電子部品の
吸着及び脱着方向に摺動可能な複数のピンと、前記電子
部品の姿勢を水平に保つように、該電子部品に前記複数
のピンの先端を当接させ、該複数のピンを往復摺動させ
るピン駆動手段とを備えたものである。According to a first aspect of the present invention, there is provided a suction / removal device for electronic components, wherein a suction pad for suctioning the electronic components and a suction / removal direction of the electronic components are disposed around the suction pads. A plurality of pins slidable to the electronic component, and pin driving means for bringing the tips of the plurality of pins into contact with the electronic component so as to keep the posture of the electronic component horizontal, and sliding the plurality of pins back and forth. It is provided.
【０００８】第２の発明に係る電子部品の吸着・脱着装
置は、第１の発明に係る電子部品の吸着・脱着装置にお
いて、ピン駆動手段が、複数のシリンダと該複数のシリ
ンダに嵌挿され、複数のピンを往復動させる複数のピス
トンとを備え、前記複数のシリンダが吸着パッドへ通ず
る吸引及びパフ用ガス孔に連通しているものである。According to a second aspect of the present invention, there is provided the electronic component suction / removal device according to the first aspect, wherein the pin driving means is inserted into the plurality of cylinders and the plurality of cylinders. And a plurality of pistons for reciprocating a plurality of pins, wherein the plurality of cylinders communicate with the suction and puff gas holes communicating with the suction pads.
【０００９】第３の発明に係る電子部品の吸着・脱着装
置は、第２の発明に係る電子部品の吸着・脱着装置にお
いて、吸引及びパフ用ガス孔は、吸引及びパフ用を兼ね
た単一のガス管と接続され、該ガス管との接続口と吸着
パッドとを同心状に直結する単一の孔であるものであ
る。According to a third aspect of the present invention, there is provided an electronic component suction / detachment / desorption apparatus according to the second aspect of the present invention, wherein the suction / puff gas hole is a single suction / puff gas hole. And a single hole concentrically directly connecting the connection port with the gas pipe and the suction pad concentrically.
【００１０】第４の発明に係る電子部品の吸着・脱着装
置は、第１の発明に係る電子部品の吸着・脱着装置にお
いて、ピン駆動手段が、複数のピンのそれぞれに対応し
て設けられた、該複数のピンを電子部品の脱着方向に付
勢する複数の弾性体を備え、前記電子部品の吸着時には
吸着パッドにおける吸引力より、脱着時には該弾性体の
付勢力により、前記複数のピンを摺動させるものであ
る。According to a fourth aspect of the present invention, there is provided the electronic component suction / removal device according to the first aspect, wherein the pin driving means is provided for each of the plurality of pins. A plurality of elastic bodies for urging the plurality of pins in the direction of attaching and detaching the electronic component, wherein the plurality of pins are biased by the attraction force of the elastic body when the electronic component is adsorbed, and by the urging force of the elastic body when the electronic component is detached. It is made to slide.
【００１１】第５の発明に係る電子部品の吸着・脱着装
置は、第１〜第４の発明に係る電子部品の吸着・脱着装
置において、複数のピンの先端部に凹部若しくは凸部を
形成し、電子部品の表面上における前記複数のピンと対
向する位置には前記複数のピンの先端部に形成した凹部
若しくは凸部と略嵌合する凸部若しくは凹部を設けたも
のである。According to a fifth aspect of the present invention, there is provided an electronic component suction / removal device according to the first to fourth inventions, wherein the plurality of pins have recesses or protrusions at the tips thereof. At the position facing the plurality of pins on the surface of the electronic component, a convex portion or a concave portion substantially fitting with a concave portion or a convex portion formed at the tip of the plurality of pins is provided.
【００１２】[0012]
【発明の実施の形態】実施の形態１．この発明の実施の
形態１を図１に基づき説明する。図１は電子部品の吸着
・脱着装置を示す断面図であり、図１（Ａ）は吸着動作
時、図１（Ｂ）は脱着動作時を示す。尚、図中、従来例
と同じ符号で示されたものは従来例のそれと同一もしく
は同等なものを示す。図において、１０はピン、１１は
ピン１０を往復動させる駆動手段の本体を構成するブロ
ックであり、ブロック１１の中心軸部に吸引及びパフ用
ガス孔としての貫通孔１１ａが形成されており、該貫通
孔１１ａの上端部には継手５を介して単一のガス管を構
成する配管チューブ６が接続され、下端部には吸着パッ
ド３が装着されている。又、ブロック１１にはピン１０
を摺動可能に貫挿させる摺動孔１１ｂ、摺動孔１１ｂと
同軸のシリンダ１１ｃ、分岐孔１１ｄ、貫通孔１１ｅ、
空気抜き１１ｆが形成されており、複数のシリンダが吸
着パッド３へ通ずる貫通孔１１ａに連通している。DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 Embodiment 1 of the present invention will be described with reference to FIG. FIG. 1 is a cross-sectional view showing an electronic component suction / removal device. FIG. 1A shows a suction operation, and FIG. 1B shows a desorption operation. In the drawings, the same reference numerals as those of the conventional example indicate the same or equivalent parts as those of the conventional example. In the figure, reference numeral 10 denotes a pin, and 11 denotes a block constituting a main body of a driving means for reciprocating the pin 10, and a through-hole 11a as a gas hole for suction and puff is formed in a central shaft portion of the block 11, A piping tube 6 forming a single gas pipe is connected to an upper end of the through hole 11a via a joint 5, and a suction pad 3 is attached to a lower end. The block 10 has a pin 10
11b, a cylinder 11c coaxial with the sliding hole 11b, a branch hole 11d, a through hole 11e,
An air vent 11f is formed, and a plurality of cylinders communicate with a through hole 11a leading to the suction pad 3.
【００１３】１２は前記ブロック１１のシリンダ１１ｃ
に内挿され、円筒状の一端部のピン１０と一体に直結さ
れ、円周上に溝１２ａを有するピストン、１３は前記ピ
ストン１２の溝１２ａに嵌着されたＯリング、１４、１
５は前記ブロック１１の分岐孔１１ｄ、貫通孔１１ｅの
入口を密封するフタである。尚、ピン１０は、電子部品
１の被吸着面１ａに対して吸着パッド３を中心に均等に
４本配置されている。Reference numeral 12 denotes a cylinder 11c of the block 11.
And a piston having a groove 12a on its circumference, which is directly connected integrally with the pin 10 at one end of the cylindrical shape, and 13 is an O-ring fitted to the groove 12a of the piston 12, 14, 1
Reference numeral 5 denotes a lid for sealing the entrances of the branch hole 11d and the through hole 11e of the block 11. The four pins 10 are arranged evenly around the suction pad 3 with respect to the suction surface 1 a of the electronic component 1.
【００１４】次に動作について説明する。図１（Ａ）に
おいて、ブロック１１を駆動する駆動装置（図示省略）
により電子部品１の被吸着面１ａの所望位置に吸着パッ
ド３の先端外周が接触するまでブロック１１移動すると
同時に真空発生装置（図示省略）を稼働させ、配管チュ
ーブ６と、継手５、ブロック１１及び吸着パッド３それ
ぞれの貫通孔５ａ、１１ａ及び３ａとを通して真空吸引
することにより、吸着パッド３は電子部品１を吸着す
る。Next, the operation will be described. In FIG. 1A, a driving device for driving the block 11 (not shown)
As a result, the block 11 moves until the outer periphery of the tip of the suction pad 3 comes into contact with a desired position of the suction surface 1a of the electronic component 1 and at the same time, the vacuum generator (not shown) is operated to operate the piping tube 6, the joint 5, the block 11, and The suction pad 3 sucks the electronic component 1 by vacuum suction through the through holes 5a, 11a and 3a of the suction pad 3 respectively.
【００１５】この際、４本のピン１０も図面上において
垂直方向に持ち上がり、その先端が電子部品１の被吸着
面１ａに均等に接触して電子部品１を水平状態に保つ。
即ち、前記真空発生装置（図示省略）の吸引力がブロッ
ク１１の分岐孔１１ｄ、貫通孔１１ｅを通してピストン
１２に働き、ピストン１２がシリンダ１１ｃを案内に、
ピン１０を持ち上げ、吸着パッド３により吸着された電
子部品１を４本のピン１０によって水平状態に保持す
る。At this time, the four pins 10 are also lifted in the vertical direction in the drawing, and their tips evenly contact the attracted surface 1a of the electronic component 1 to keep the electronic component 1 horizontal.
That is, the suction force of the vacuum generator (not shown) acts on the piston 12 through the branch hole 11d and the through hole 11e of the block 11, and the piston 12 guides the cylinder 11c.
The pin 10 is lifted, and the electronic component 1 sucked by the suction pad 3 is held in a horizontal state by the four pins 10.
【００１６】次に、吸着された電子部品１を分離する際
は、図１（Ｂ）において、前記真空発生装置（図示省
略）を停止させ、配管チューブ６より微量の圧空を送り
込むとブロック１１及び吸着パッド３の貫通孔１１ａ、
３ａを通して電子部品１をパフすると同時に、更に圧空
はブロック１１の分岐孔１１ｄ、貫通孔１１ｅを通して
ピストン１２を図面上において押し下げるように働き、
ブロック１１のシリンダ１１ｃによりピン１０が案内さ
れ垂直方向に下降し、電子部品１の被吸着面１ａを均等
に押して吸着パッド３より引離す位置まで電子部品１を
水平姿勢で分離する。Next, when the sucked electronic component 1 is separated, the vacuum generating device (not shown) is stopped in FIG. Through hole 11a of suction pad 3,
At the same time as the electronic component 1 is puffed through 3a, the compressed air further acts to push down the piston 12 on the drawing through the branch hole 11d and the through hole 11e of the block 11,
The pin 10 is guided by the cylinder 11 c of the block 11 and descends in the vertical direction, and the electronic component 1 is separated in a horizontal posture to a position where the suction surface 1 a of the electronic component 1 is evenly pressed and separated from the suction pad 3.
【００１７】ピン１０の圧空による押下げは、ピストン
１２の溝１２ａにＯリング１３が装着してあるので、ブ
ロック１１の摺動孔１１ｂ内を下部の大気圧とは密封し
た状態で摺動でき,更に下降時はブロック１１に設けた
空気抜き１１ｆにより、ピン１０のスムーズな動作を可
能にしている。又、上記吸着・脱着を繰返すことで電子
部品の搬送を行うことができる。Since the O-ring 13 is attached to the groove 12a of the piston 12, the pin 10 can be slid in the state of being sealed from the lower atmospheric pressure in the sliding hole 11b because the O-ring 13 is mounted on the groove 12a. When further descending, the pin 10 can be smoothly operated by the air vent 11f provided in the block 11. In addition, the electronic components can be transported by repeating the above-mentioned adsorption and desorption.
【００１８】上記のごとく、実施の形態１においては、
ピン駆動手段を、吸着パッド３へ通ずる吸引及びパフ用
の貫通孔１１ａより分岐し、単一の真空・パフ圧装置
（図示せず）により吸着パッド３及び複数のピン１０を
往復動させる構造としたので、電子部品１を吸着する
際、吸着と同時に吸着パッド３の周りに均等に配置され
た複数のピン１０を電子部品１の被吸着面１ａに均等に
当てることができ、又、吸着した電子部品１を分離する
際、前記複数のピン１０がパフと同時に電子部品１の被
吸着面１ａを均等に押下げることができ、電子部品１を
水平な姿勢で吸着・脱着できるものが比較的安価に得ら
れる。As described above, in the first embodiment,
A structure in which the pin driving means branches from the suction and puff through holes 11a leading to the suction pad 3 and the suction pad 3 and the plurality of pins 10 are reciprocated by a single vacuum / puff pressure device (not shown). Therefore, when the electronic component 1 is sucked, the plurality of pins 10 evenly arranged around the suction pad 3 can be evenly applied to the suction surface 1a of the electronic component 1 at the same time as the suction, and the suction is performed. When the electronic component 1 is separated, the plurality of pins 10 can uniformly push down the suction surface 1a of the electronic component 1 at the same time as the puff, and the electronic component 1 can be relatively attached and detached in a horizontal posture. Obtained inexpensively.
【００１９】又、実施の形態１においては、貫通孔１１
ａを吸引及びパフ用を兼ねた単一のガス管を構成する配
管チューブ６と接続し、単一の配管チューブ６との接続
口に配設した継手５の貫通孔５ａと吸着パッド３の貫通
孔３ａとを同心状に直結する単一の孔としたので、ガス
流の乱れが少ないと共にガス圧損が少なく、吸着パッド
３から安定した微圧のパフ圧が得られ、電子部品１の脱
着動作が安定するものが得られる。In the first embodiment, the through holes 11
a is connected to a pipe tube 6 constituting a single gas pipe for both suction and puff, and a through-hole 5 a of a joint 5 and a through-hole of the suction pad 3 provided at a connection port with the single pipe tube 6. Since a single hole is directly connected concentrically with the hole 3a, the gas flow is less turbulent and the gas pressure loss is small, and a stable and small puff pressure is obtained from the suction pad 3, and the detachment operation of the electronic component 1 is performed. Is obtained.
【００２０】実施の形態２．この発明の実施の形態２を
図２に基づき説明する。図２は電子部品の吸着・脱着装
置を示す断面図であり、図２（Ａ）は吸着動作時、図２
（Ｂ）は脱着動作時を示す。図２（Ａ）、（Ｂ）におい
て、２０はピンであり、段付部２０ａを有する。２１は
ブロック、２２は押え板であり、ブロック２１と押え板
２２は一体に結合され、ピン２０を往復動させる駆動手
段の本体を構成する。ブロック２１及び押え板２２の中
心軸部にはそれぞれ貫通孔２１ａ、２２ａが形成されて
おり、貫通孔２２ａの上端部には継手５を介して配管チ
ューブ６が接続され、貫通孔２１ａの下端部には吸着パ
ッド３が装着されている。Embodiment 2 Embodiment 2 of the present invention will be described with reference to FIG. FIG. 2 is a cross-sectional view showing a suction / removal device for an electronic component, and FIG.
(B) shows the time of the detaching operation. 2A and 2B, reference numeral 20 denotes a pin, which has a stepped portion 20a. Reference numeral 21 denotes a block, and reference numeral 22 denotes a pressing plate. The block 21 and the pressing plate 22 are integrally connected to each other, and constitute a main body of a driving unit that reciprocates the pin 20. Through holes 21a and 22a are formed in the central shaft portions of the block 21 and the holding plate 22, respectively. The piping tube 6 is connected to the upper end of the through hole 22a via the joint 5, and the lower end of the through hole 21a. Is provided with a suction pad 3.
【００２１】又、ブロック２１にはピン２０を摺動可能
に貫挿させる摺動孔２１ｂ、摺動孔２１ｂと同軸の逃が
し孔２１ｃが形成されている。２３はブロック２１の逃
がし孔２１ｃに収納された弾性体としての圧縮バネであ
り、ピン２０の逃がし孔２１ｃ側の端部に外挿されると
共に、一端がピン２０の段付部２０ａと係合し、他端が
押え板２２におけるブロック２１との接合面２２ｂに当
接し、圧縮された状態で逃がし孔２１ｃに収納されてい
る。そして、ピン２０は圧縮バネ２３の付勢力により電
子部品１側へ押圧され、図２（Ｂ）に示すように、段付
部２０ａが逃がし孔２１ｃの摺動孔２１ｂ側端部に当接
した状態にある。尚、ピン２０は電子部品１の被吸着面
１ａに対して吸着パッド３を中心に均等に４本配置され
ている。The block 21 has a sliding hole 21b through which the pin 20 is slidably inserted, and a relief hole 21c coaxial with the sliding hole 21b. Reference numeral 23 denotes a compression spring as an elastic body accommodated in the relief hole 21c of the block 21. The compression spring 23 is externally inserted into an end of the pin 20 on the side of the relief hole 21c, and one end engages with the stepped portion 20a of the pin 20. The other end abuts on the joint surface 22b of the holding plate 22 with the block 21, and is stored in the escape hole 21c in a compressed state. Then, the pin 20 is pressed toward the electronic component 1 by the urging force of the compression spring 23, and as shown in FIG. 2B, the stepped portion 20a contacts the end of the escape hole 21c on the side of the sliding hole 21b. In state. Incidentally, four pins 20 are evenly arranged around the suction pad 3 with respect to the suction surface 1a of the electronic component 1.
【００２２】次に動作について説明する。図２（Ａ）に
おいて、ブロック２１は駆動装置（図示省略）により電
子部品１の被吸着面１ａの所望位置に吸着パッド３の端
外周が接触するまで移動すると同時に真空発生装置（図
示省略）を稼働させ、配管チューブ６と、継手５、押え
板２２、ブロック２１及び吸着パッド３それぞれの貫通
孔５ａ、２２ａ、２１ａ、３ａを通し真空吸引され、吸
着パッド３は電子部品１を吸着する。Next, the operation will be described. In FIG. 2A, the block 21 is moved by a driving device (not shown) until the outer periphery of the suction pad 3 comes into contact with a desired position on the suction surface 1a of the electronic component 1, and at the same time, a vacuum generator (not shown) is used. When the electronic component 1 is suctioned, the vacuum suction is performed through the pipe tube 6, the joint 5, the holding plate 22, the block 21, and the through holes 5a, 22a, 21a, and 3a of the suction pad 3, respectively.
【００２３】この際、吸着パッド３を中心に均等に配置
された４本のピン２１は端部が電子部品１の被吸着面１
ａに接触した状態で、電子部品１により持上げられる。
即ち、圧縮バネ２３の付勢力がピン２０に加わり、ピン
２０により電子部品１を押圧しているが、吸着パッド３
の吸着力が圧縮バネ２３の付勢力より大きく、結果とし
て、電子部品１を吸着パッド３に吸着した状態にて圧縮
バネ２３の付勢力により、複数のピン２１にて電子部品
１を水平状態に保持することになる。At this time, the four pins 21 arranged evenly around the suction pad 3 have ends thereof at the suction surface 1 of the electronic component 1.
is lifted up by the electronic component 1 in a state of contact with a.
That is, the urging force of the compression spring 23 is applied to the pin 20 and the electronic component 1 is pressed by the pin 20.
Is larger than the urging force of the compression spring 23, and as a result, the electronic component 1 is horizontally moved by the plurality of pins 21 by the urging force of the compression spring 23 in a state where the electronic component 1 is attracted to the suction pad 3. Will be retained.
【００２４】次に、吸着された電子部品１を分離する際
は、図２（Ｂ）において、前記真空発生装置（図示省
略）を停止させ、配管チューブ６より微量の圧空を送り
込むと貫通孔５ａ、２２ａ、２１ａ及び３ａを通して電
子部品１をパフする。同時に複数のピン２０は圧縮バネ
２３の付勢力により電子部品１の被吸着面１ａを均等な
力で押し下げる。即ち、電子部品１は水平な姿勢で分離
することになる。又、上記吸着・脱着を繰返すことで電
子部品の搬送を行うことができる。Next, when the sucked electronic component 1 is separated, the vacuum generating device (not shown) is stopped in FIG. , 22a, 21a and 3a. At the same time, the plurality of pins 20 push down the attracted surface 1 a of the electronic component 1 with a uniform force by the urging force of the compression spring 23. That is, the electronic component 1 is separated in a horizontal posture. In addition, the electronic components can be transported by repeating the above-mentioned adsorption and desorption.
【００２５】上記のごとく、実施の形態２においては、
ピン駆動手段を、電子部品１の吸着時には圧縮バネ２３
の付勢力に逆らって吸着パッド３の吸引力により、脱着
時には圧縮バネ２３の付勢力により複数のピン２０を摺
動させるように構成し、前記圧縮バネ２３を複数のピン
２０のそれぞれに対応して設けたので、電子部品１の被
吸着面１ａに多少の凹凸がある場合や、被吸着面１ａの
長辺が短辺に比べて極端に長い形状であっても、電子部
品１を吸着する際、複数のピン２０を電子部品１の被吸
着面１ａに均等な接圧で当てることができ、又、吸着し
た電子部品１を分離する際、前記複数のピン２０を被吸
着面１ａに均等な接圧で均等に押下げることができ、電
子部品１を水平な姿勢で吸着・脱着できる。As described above, in the second embodiment,
When the electronic component 1 is attracted by the pin driving means,
The plurality of pins 20 are slid by the attraction force of the suction pad 3 against the urging force of the suction pad 3 and the urging force of the compression spring 23 at the time of attachment / detachment, so that the compression spring 23 corresponds to each of the plurality of pins 20. The electronic component 1 is attracted even when the surface to be attracted 1a of the electronic component 1 has some irregularities or the long side of the surface to be attracted 1a is extremely longer than the short side. In this case, the plurality of pins 20 can be applied to the attracted surface 1a of the electronic component 1 with an even contact pressure, and when separating the attracted electronic component 1, the plurality of pins 20 are evenly applied to the attracted surface 1a. The electronic component 1 can be pressed down evenly with an appropriate contact pressure, and the electronic component 1 can be sucked and detached in a horizontal posture.
【００２６】尚、上記実施の形態１及び２においては、
電子部品の吸着・脱着装置のピン数が４本である場合を
例示したが、ピン数は４本に限定されるものではなく、
吸着パッド３の周りにバランスが取れる状態に配置でき
る３本以上の複数本であっても同様な効果が得られる。In the first and second embodiments,
Although the case where the number of pins of the electronic component suction / removal device is four is illustrated, the number of pins is not limited to four.
The same effect can be obtained with a plurality of three or more pads that can be arranged in a balanced state around the suction pad 3.
【００２７】実施の形態３．この発明の実施の形態３を
図３に基づき説明する。図３は電子部品の吸着状態を示
す断面図である。図において、３０はピンであり、ピン
３０には球面をなす凸状の先端部３０ａが形成されてい
る。３１は電子部品であり、電子部品３１の吸着面にお
ける中心の周囲には、ピン３０の凸状の先端部３０ａと
対応する位置にこれと嵌まり込むように当接可能な凹部
３１ａが形成されている。Embodiment 3 Third Embodiment A third embodiment of the present invention will be described with reference to FIG. FIG. 3 is a cross-sectional view showing the state of suction of the electronic component. In the figure, reference numeral 30 denotes a pin, and the pin 30 is formed with a convex tip portion 30a that forms a spherical surface. Reference numeral 31 denotes an electronic component, and a concave portion 31a is formed around the center of the suction surface of the electronic component 31 at a position corresponding to the convex tip portion 30a of the pin 30 so as to be fitted therewith. ing.
【００２８】次に、図３により動作について説明する。
電子部品３１を吸着する際、複数のピン３０の凸状の先
端部３０ａが電子部品３１の凹部３１ａに嵌まり込むよ
うに当接する。この作用により、電子部品３１を一定位
置にて水平姿勢を保った状態で位置決めでき、更に、吸
着保持のまま電子部品を搬送する場合には電子部品３１
の位置ズレを防止することができる。Next, the operation will be described with reference to FIG.
When sucking the electronic component 31, the protruding tip portions 30 a of the plurality of pins 30 come into contact with each other so as to fit into the concave portions 31 a of the electronic component 31. By this action, the electronic component 31 can be positioned at a fixed position while maintaining the horizontal posture. Further, when the electronic component is transported while being held by suction, the electronic component 31 is moved.
Can be prevented from shifting.
【００２９】実施の形態４．この発明の実施の形態４を
図４に基づき説明する。図４は前記実施の形態３の変形
例であり、図において、４０はピンであり、ピン４０に
は凹状の先端部４０ａが形成されている。４１は電子部
品であり、電子部品４１の吸着面における中心の周囲に
は、ピン４０の凹状の先端部４０ａと対応する位置にこ
れと嵌まり込むように当接可能な凸部４１ａが形成され
ている。電子部品４１を吸着する際、複数のピン４０が
電子部品４１の凸部４１ａに嵌まり込むように当接さ
れ、前記実施の形態３と同様な作用、効果が得られる。Embodiment 4 Embodiment 4 of the present invention will be described with reference to FIG. FIG. 4 shows a modification of the third embodiment. In the figure, reference numeral 40 denotes a pin, and the pin 40 has a concave tip portion 40a. Reference numeral 41 denotes an electronic component, and a convex portion 41a is formed around the center of the suction surface of the electronic component 41 at a position corresponding to the concave front end portion 40a of the pin 40 so as to be fitted into the same. ing. When the electronic component 41 is sucked, the plurality of pins 40 are abutted so as to fit into the convex portions 41a of the electronic component 41, and the same operation and effect as those of the third embodiment can be obtained.
【００３０】尚、前記実施の形態１及び２に示した電子
部品の吸着・脱着装置におけるピン１０又は２０の先端
形状をピン３０の先端部３０ａ若しくはピン４０の先端
部４０ａと同様に形成することにより、この実施の形態
３若しくは４を適用し、電子部品３１若しくは４１を吸
着保持して搬送することができる。The tip shape of the pin 10 or 20 in the electronic component suction / removal device shown in the first and second embodiments is formed in the same manner as the tip portion 30a of the pin 30 or the tip portion 40a of the pin 40. By applying the third or fourth embodiment, the electronic component 31 or 41 can be suction-held and transported.
【００３１】[0031]
【発明の効果】第１の発明によれば、電子部品の吸着及
び脱着方向に摺動可能な複数のピンを吸着パッドの周辺
に配置し、前記複数のピンを往復摺動させるピン駆動手
段を備えたので、吸着と同時に複数のピンが電子部品の
吸着面に均等に当接し、前記電子部品の姿勢を水平に保
ちながら吸着・脱着及び搬送できるものが得られる効果
がある。According to the first aspect of the present invention, there is provided a pin driving means for arranging a plurality of pins slidable in the suction and desorption directions of the electronic component around the suction pad and sliding the plurality of pins back and forth. With this arrangement, a plurality of pins uniformly contact the suction surface of the electronic component at the same time as the suction, and there is an effect that the electronic component can be suctioned, detached and conveyed while the posture of the electronic component is kept horizontal.
【００３２】又、第２の発明によれば、ピン駆動手段
を、吸着パッドへ通ずる吸引及びパフ用ガス孔より分岐
し、単一の真空・パフ圧装置により吸着パッド及び複数
のピンを往復動させる構造としたので、電子部品を吸着
パッドからのパフと同時に吸着面側を均等に複数のピン
で押下げ、水平状態で吸着・脱着できるものを比較的安
価に得られる効果がある。According to the second invention, the pin driving means branches off from the suction and puff gas holes communicating with the suction pad, and the suction pad and the plurality of pins are reciprocated by a single vacuum / puff pressure device. Since the electronic component is puffed from the suction pad at the same time as the puff from the suction pad, the suction surface side is evenly pressed down by a plurality of pins, and there is an effect that a component that can be suctioned and detached in a horizontal state can be obtained relatively inexpensively.
【００３３】又、第３の発明によれば、吸引及びパフ用
ガス孔を吸引及びパフ用を兼ねた単一のガス管と接続
し、該ガス管との接続口と吸着パッドとを同心状に直結
する単一の孔としたので、ガス流の乱れが少ないと共に
ガス圧損が少なく、吸着パッドから安定した微圧のパフ
圧が得られ、電子部品の脱着動作が安定したものが得ら
れる効果がある。According to the third aspect of the present invention, the gas hole for suction and puff is connected to a single gas pipe for suction and puff, and the connection port with the gas pipe and the suction pad are concentric. A single hole directly connected to the pump, reduces gas flow turbulence and reduces gas pressure loss, provides a stable micropuff pressure from the suction pad, and provides a stable electronic component desorption operation. There is.
【００３４】又、第４の発明によれば、ピン駆動手段
を、電子部品の吸着時には弾性体の付勢力に逆らって吸
着パッドの吸引力により、脱着時には該弾性体の付勢力
により複数のピンを摺動させる構成とし、前記弾性体を
複数のピンのそれぞれに対応して設けたので、前記電子
部品の被吸着面が平面でなくとも水平状態で吸着・脱着
できるものを比較的安価に得られる効果がある。According to the fourth aspect of the present invention, the plurality of pins are driven by the pin driving means by the attraction force of the attraction pad against the urging force of the elastic body when the electronic component is attracted, and by the urging force of the elastic body at the time of detachment. Since the elastic body is provided corresponding to each of the plurality of pins, it is possible to obtain an electronic component which can be attached and detached in a horizontal state even if the surface to be attached of the electronic component is not flat, at a relatively low cost. Has the effect.
【００３５】又、第５の発明によれば、電子部品の吸着
面側に凹凸を設け、これに対応する複数のピンの端面を
前記凹凸に合せ嵌合させる様にしたので、電子部品を水
平状態を保ち、かつ、位置決め吸着できるものが得られ
る効果がある。According to the fifth aspect of the present invention, the unevenness is provided on the suction surface side of the electronic component, and the end faces of a plurality of pins corresponding to the unevenness are fitted to the unevenness, so that the electronic component can be horizontally mounted. There is an effect that a state that can be maintained and that can be positioned and adsorbed can be obtained.
【図１】第１又は第３の発明の一実施の形態を示す電子
部品の吸着・脱着装置の断面図である。FIG. 1 is a cross-sectional view of an electronic component suction / removal device according to an embodiment of the first or third invention.
【図２】第１又は第４の発明の一実施の形態を示す電子
部品の吸着・脱着装置の断面図である。FIG. 2 is a cross-sectional view of an electronic component suction / removal device according to an embodiment of the first or fourth invention.
【図３】第５の発明の一実施の形態を示す電子部品の部
分断面図である。FIG. 3 is a partial sectional view of an electronic component according to an embodiment of the fifth invention.
【図４】第５の発明の別の実施の形態を示す電子部品の
部分断面図である。FIG. 4 is a partial sectional view of an electronic component showing another embodiment of the fifth invention.
【図５】従来の電子部品の吸着・脱着装置を示す断面図
である。FIG. 5 is a cross-sectional view showing a conventional electronic component adsorption / desorption device.
１ 電子部品、１ａ 吸着面、２ ホルダ、２ａ 貫通
孔、３ 吸着パッド、３ａ 貫通孔、４ 取付板、５
継手、５ａ 貫通孔、６ 配管チューブ、１０ピン、１
１ ブロック、１１ａ 貫通孔、１１ｂ 摺動孔、１１
ｃ シリンダ、１１ｄ 分岐孔、１１ｅ 貫通孔、１１
ｆ 空気抜き、１２ ピストン、１２ｂ溝、１３ Ｏリ
ング、１４、１５ フタ、２０ ピン、２０ａ 段付
部、２１ブロック、２１ａ 貫通孔、２１ｂ 摺動孔、
２１ｃ 逃がし孔、２２ 押え板、２２ａ 貫通孔、２
２ｂ 接合面、２３ 圧縮バネ、３０ ピン、３０ａ凸
状の先端部、３１ 電子部品、３１ａ 凹部、４０ ピ
ン、４０ａ 凹状の先端部、４１ 電子部品、４１ａ
凸部。Reference Signs List 1 electronic component, 1a suction surface, 2 holder, 2a through hole, 3 suction pad, 3a through hole, 4 mounting plate, 5
Fittings, 5a through holes, 6 piping tubes, 10 pins, 1
1 block, 11a through hole, 11b sliding hole, 11
c cylinder, 11d branch hole, 11e through hole, 11
f Air vent, 12 piston, 12b groove, 13 O-ring, 14, 15 lid, 20 pin, 20a stepped portion, 21 block, 21a through hole, 21b sliding hole,
21c escape hole, 22 holding plate, 22a through hole, 2
2b joining surface, 23 compression spring, 30 pins, 30a convex tip, 31 electronic components, 31a recess, 40 pins, 40a concave tip, 41 electronic components, 41a
Convex part.
Claims (5)
着パッドの周辺に配置され、前記電子部品の吸着及び脱
着方向に摺動可能な複数のピンと、前記電子部品の姿勢
を水平に保つように該電子部品に前記複数のピンの先端
を当接させ、該複数のピンを往復摺動させるピン駆動手
段とを備えた電子部品の吸着・脱着装置。1. A suction pad for sucking an electronic component, a plurality of pins arranged around the suction pad and slidable in the suction and desorption directions of the electronic component, and a posture of the electronic component kept horizontal. And a pin driving means for causing the tips of the plurality of pins to abut on the electronic component and sliding the plurality of pins back and forth.
置において、ピン駆動手段は、複数のシリンダと該複数
のシリンダに嵌挿され、複数のピンを往復動させる複数
のピストンとを備え、前記複数のシリンダが吸着パッド
へ通ずる吸引及びパフ用ガス孔に連通していることを特
徴とする電子部品の吸着・脱着装置。2. A device according to claim 1, wherein said pin driving means includes a plurality of cylinders and a plurality of pistons inserted into said plurality of cylinders and reciprocating the plurality of pins. And a plurality of cylinders communicating with a suction and puff gas hole communicating with a suction pad.
置において、吸引及びパフ用ガス孔は、吸引及びパフ用
を兼ねた単一のガス管と接続され、該ガス管との接続口
と吸着パッドとを同心状に直結する単一の孔であること
を特徴とする電子部品の吸着・脱着装置。3. The suction / detachment device for an electronic component according to claim 2, wherein the suction and puff gas holes are connected to a single gas pipe serving both suction and puff, and a connection port with the gas pipe. A single hole that directly and concentrically connects the suction pad and the suction pad.
置において、ピン駆動手段は、複数のピンのそれぞれに
対応して設けられた、該複数のピンを電子部品の脱着方
向に付勢する複数の弾性体を備え、前記電子部品の吸着
時には吸着パッドにおける吸引力より、脱着時には該弾
性体の付勢力により、前記複数のピンを摺動させること
を特徴とする電子部品の吸着・脱着装置。4. The electronic component suction / removal device according to claim 1, wherein the pin driving means urges the plurality of pins in a direction in which the electronic component is detached, the pin being provided corresponding to each of the plurality of pins. Wherein the plurality of pins are slid by the attraction force of the attraction pad at the time of suction of the electronic component and by the biasing force of the elastic body at the time of attachment and detachment of the electronic component. apparatus.
電子部品の吸着・脱着装置において、複数のピンの先端
部に凹部若しくは凸部を形成し、電子部品の表面上にお
ける前記複数のピンと対向する位置には前記複数のピン
の先端部に形成した凹部若しくは凸部と略嵌合する凸部
若しくは凹部を設けたことを特徴とする電子部品の吸着
・脱着装置。5. The electronic component suction / removal device according to claim 1, wherein a concave portion or a convex portion is formed at a tip portion of the plurality of pins, and the plurality of pins are provided on a surface of the electronic component. An attraction / detachment / removal device for an electronic component, wherein a protrusion or a recess which is substantially fitted to a recess or a protrusion formed at the tip of each of the plurality of pins is provided at a position facing the pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9338643A JPH11170189A (en) | 1997-12-09 | 1997-12-09 | Sucking-taching device for electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9338643A JPH11170189A (en) | 1997-12-09 | 1997-12-09 | Sucking-taching device for electronic parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11170189A true JPH11170189A (en) | 1999-06-29 |
Family
ID=18320113
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9338643A Pending JPH11170189A (en) | 1997-12-09 | 1997-12-09 | Sucking-taching device for electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11170189A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013161845A (en) * | 2012-02-02 | 2013-08-19 | Fuji Mach Mfg Co Ltd | Component holding head, and installation work machine equipped with the component holding head |
| JP5803034B1 (en) * | 2014-11-05 | 2015-11-04 | アキム株式会社 | Conveying device and conveying method |
| JP5804465B1 (en) * | 2014-11-05 | 2015-11-04 | アキム株式会社 | Component holding mechanism, transfer device, transfer method |
| JP2020123665A (en) * | 2019-01-30 | 2020-08-13 | 株式会社東京精密 | Positioning apparatus and positioning method for transported object |
-
1997
- 1997-12-09 JP JP9338643A patent/JPH11170189A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013161845A (en) * | 2012-02-02 | 2013-08-19 | Fuji Mach Mfg Co Ltd | Component holding head, and installation work machine equipped with the component holding head |
| JP5803034B1 (en) * | 2014-11-05 | 2015-11-04 | アキム株式会社 | Conveying device and conveying method |
| JP5804465B1 (en) * | 2014-11-05 | 2015-11-04 | アキム株式会社 | Component holding mechanism, transfer device, transfer method |
| JP2020123665A (en) * | 2019-01-30 | 2020-08-13 | 株式会社東京精密 | Positioning apparatus and positioning method for transported object |
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