JPH11145330A - Circuit board - Google Patents

Circuit board

Info

Publication number
JPH11145330A
JPH11145330A JP32042297A JP32042297A JPH11145330A JP H11145330 A JPH11145330 A JP H11145330A JP 32042297 A JP32042297 A JP 32042297A JP 32042297 A JP32042297 A JP 32042297A JP H11145330 A JPH11145330 A JP H11145330A
Authority
JP
Japan
Prior art keywords
circuit board
light emitting
diode
circuit pattern
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP32042297A
Other languages
Japanese (ja)
Other versions
JP3943683B2 (en
Inventor
Hiroshi Fukuzuka
浩史 福塚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Idec Izumi Corp
Original Assignee
Idec Izumi Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Idec Izumi Corp filed Critical Idec Izumi Corp
Priority to JP32042297A priority Critical patent/JP3943683B2/en
Publication of JPH11145330A publication Critical patent/JPH11145330A/en
Application granted granted Critical
Publication of JP3943683B2 publication Critical patent/JP3943683B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Led Device Packages (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a circuit board with a circuit pattern which can be used commonly for mounting of chip parts which are different in polarity when mounted. SOLUTION: Two common bonding pads 9A, 9B shaped to enable both an electronic chip part D and a wire 10 to be mounted or fixed by bonding are arranged adjacently as a pair. The electronic chip part D is mounted on one of the common bonding pads 9A, 9B which form a pair, and the wire 10 connected to the electronic part D is subjected to bonding to the other thereof.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は、例えば発光ダイオ
ードモジュールなどに用いられる回路基板に関するもの
である。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board used for a light emitting diode module, for example.

【０００２】[0002]

【従来の技術】斯かる発光ダイオードモジュールでは、
小型化を促進するために、その主要構成部品である発光
ダイオードおよびダイオードブリッジを構成するダイオ
ードとして、端子からのリード線引出しを省いた、いわ
ゆるチップ部品が用いられている。また、発光ダイオー
ドチップには、主として、図４（ａ）に示す赤色発光ダ
イオードチップＤ１と、同図（ｂ）に示す赤色以外の緑
色や橙色などの発光色を有する非赤色発光ダイオードチ
ップＤ２の二種類が存在する。赤色発光ダイオードチッ
プＤ１は、発光波長が660 ｎｍの近傍であって、ＰＮ極
性が非赤色発光ダイオードＤ２とは逆に設定された高輝
度タイプまたは超高輝度タイプが近年において採用され
ている。2. Description of the Related Art In such a light emitting diode module,
In order to promote miniaturization, so-called chip components, in which lead wires are not drawn out from terminals, are used as light emitting diodes and diodes constituting diode bridges, which are main components thereof. The light-emitting diode chips mainly include a red light-emitting diode chip D1 shown in FIG. 4A and a non-red light-emitting diode chip D2 having a light emission color other than red and green or orange shown in FIG. There are two types. As the red light emitting diode chip D1, a high-brightness type or an ultra-brightness type in which the emission wavelength is near 660 nm and the PN polarity is set opposite to that of the non-red light-emitting diode D2 has been adopted in recent years.

【０００３】すなわち、（ａ）に示す赤色発光ダイオー
ドチップＤ１は、回路基板にボンディングすべき下部電
極の極性がＰで、且つワイヤーを接続すべき上部電極の
極性がＮとなって、上部電極が負側になっている。これ
に対し、（ｂ）に示す非赤色発光ダイオードチップＤ２
は、回路基板にボンディングすべき下部電極の極性がＮ
で、且つワイヤーを接続すべき上部電極の極性がＰとな
って、上部電極が正側になっている。That is, in the red light emitting diode chip D1 shown in (a), the polarity of a lower electrode to be bonded to a circuit board is P, the polarity of an upper electrode to be connected to a wire is N, and the upper electrode is It is on the negative side. On the other hand, the non-red light emitting diode chip D2 shown in FIG.
Means that the polarity of the lower electrode to be bonded to the circuit board is N
The polarity of the upper electrode to which the wire is to be connected is P, and the upper electrode is on the positive side.

【０００４】[0004]

【発明が解決しようとする課題】上述のように赤色発光
ダイオードチップＤ１と非赤色発光ダイオードチップＤ
２とでは、上下の電極の極性が互いに逆に設定されてい
るので、同一のパッド上にボンディングして実装した場
合に電流の流れる向きが互いに逆になる。そのため、例
えば図３（ａ），（ｂ）に示すように、発光ダイオード
Ｄ２，Ｄ１がダイオードブリンジＤＢ２，ＤＢ１を介し
て両入力端子Ｉ１，Ｉ２に接続される回路構成の場合、
非赤色発光ダイオードチップＤ２を実装する回路では、
図３（ａ）に矢印で示す方向に電流が流れるので、ダイ
オードブリッジＤＢ２をその入力端と出力端の極性が電
流の流れる極性の向きに合致した構成とする必要があ
る。一方、赤色発光ダイオードチップＤ１を実装する回
路では、図３（ｂ）に矢印で示す方向に電流が流れるの
で、ダイオードブリッジＤＢ２をその入力端と出力端の
極性が電流の流れる極性の向きに合致した構成とする必
要がある。As described above, the red light emitting diode chip D1 and the non-red light emitting diode chip D
In the case of No. 2, since the polarities of the upper and lower electrodes are set to be opposite to each other, the directions of current flow are opposite to each other when they are mounted on the same pad by bonding. Therefore, for example, as shown in FIGS. 3A and 3B, in the case of a circuit configuration in which the light emitting diodes D2 and D1 are connected to both input terminals I1 and I2 via diode bridges DB2 and DB1,
In the circuit for mounting the non-red light emitting diode chip D2,
Since the current flows in the direction indicated by the arrow in FIG. 3A, the diode bridge DB2 needs to have a configuration in which the polarity of the input terminal and the output terminal matches the direction of the polarity of the current flow. On the other hand, in the circuit in which the red light-emitting diode chip D1 is mounted, the current flows in the direction indicated by the arrow in FIG. 3B, so that the polarity of the input terminal and the output terminal of the diode bridge DB2 matches the direction of the current flow. It is necessary to have a configuration that is appropriate.

【０００５】このように、赤色発光ダイオードチップＤ
１と非赤色発光ダイオードチップＤ２とでは、入力端と
出力端の極性が互いに逆の回路パターンとなった２種の
ダイオードブリッジＤＢ１，ＤＢ２を使い分ける必要が
ある。そのため、従来では、図５に示すような非赤色発
光ダイオードチップＤ２用のダイオードブリッジ回路パ
ターンＰ２を有する回路基板２と、図６に示すような赤
色発光ダイオードチップＤ１用のダイオードブリッジ回
路パターンＰ１を有する回路基板１とを個々に製作して
いる。この両回路基板１，２を比較すると、発光ダイオ
ードＤ１，Ｄ２をそれぞれ実装するための負荷部回路パ
ターン３および全体の配線パターンが共に同一である共
通点がありながら、各々のダイオードブリッジ回路パタ
ーンＰ２，Ｐ１が異なるだけで個別の回路基板２，１に
形成しなければならない。すなわち、両ダイオードブリ
ッジ回路パターンＰ２，Ｐ１は、各々のチップボンディ
ングパッド４とワイヤーボンディングパッド７とが互い
に逆の配置に形成されている。As described above, the red light emitting diode chip D
1 and the non-red light-emitting diode chip D2, it is necessary to use two types of diode bridges DB1 and DB2 whose input terminals and output terminals have circuit patterns of opposite polarities. Therefore, conventionally, the circuit board 2 having the diode bridge circuit pattern P2 for the non-red light emitting diode chip D2 as shown in FIG. 5 and the diode bridge circuit pattern P1 for the red light emitting diode chip D1 as shown in FIG. And the circuit board 1 having them. Comparing the two circuit boards 1 and 2, each diode bridge circuit pattern P2 has a common point that the load circuit pattern 3 for mounting the light emitting diodes D1 and D2 and the entire wiring pattern are the same. , P1 must be formed on separate circuit boards 2 and 1 only. That is, in both diode bridge circuit patterns P2 and P1, the chip bonding pads 4 and the wire bonding pads 7 are formed in a reverse arrangement.

【０００６】また、ダイオードブリッジ回路パターンＰ
２またはＰ１および負荷部３の回路パターンを変更せず
に、配線パターンのみを図５の実線で図示の配線と同部
に２点鎖線で図示の配線とに変更することも考えられる
が、この場合にも二種類の回路基板を必要とするのは同
じであり、上述と同様の問題が発生する。一方、ダイオ
ードブリッジ回路パターンＰ２またはＰ１および配線パ
ターンを変更せずに、負荷部３の回路パターンを変更す
ることも考えられるが、やはり二種類の回路基板を必要
とするのは同じであり、それに加えて、両発光ダイオー
ドＤ１，Ｄ２によって実装位置が変わるので、光等の特
性に悪影響が生じる。Also, a diode bridge circuit pattern P
It is also conceivable to change only the wiring pattern to the wiring shown by the solid line in FIG. 5 and the wiring shown by the two-dot chain line in the same portion without changing the circuit pattern of P2 and P1 and the load unit 3. In this case, two types of circuit boards are required in the same case, and the same problem as described above occurs. On the other hand, it is conceivable to change the circuit pattern of the load unit 3 without changing the diode bridge circuit pattern P2 or P1 and the wiring pattern. However, it is the same that two types of circuit boards are required. In addition, since the mounting position is changed by the light emitting diodes D1 and D2, the characteristics of light and the like are adversely affected.

【０００７】このように、発光ダイオードＤ１，Ｄ２の
品種に応じて回路基板１，２の数が多くなるのに伴って
生産コストが高くなるとともに、在庫管理が煩雑とな
る。また、二種類の回路基板１，２を発光ダイオード
Ｄ，Ｄ２の種類に応じて使い分ける必要があるから、発
光ダイオードモジュールなどの製作時の生産性が低下
し、それによっても生産コストが一層高くなる問題があ
る。As described above, as the number of the circuit boards 1 and 2 increases according to the type of the light emitting diodes D1 and D2, the production cost increases and the inventory management becomes complicated. In addition, since it is necessary to use the two types of circuit boards 1 and 2 properly according to the type of the light emitting diodes D and D2, the productivity at the time of manufacturing the light emitting diode module and the like is reduced, thereby further increasing the production cost. There's a problem.

【０００８】そこで、本発明は、実装時の極性が互いに
異なるチップ部品の実装に共用することのできる回路パ
ターンを有する回路基板を提供することを目的とするも
のである。Accordingly, an object of the present invention is to provide a circuit board having a circuit pattern that can be shared for mounting chip components having different polarities during mounting.

【０００９】[0009]

【課題を解決するための手段】上記目的を達成するため
に、本発明は、電子チップ部品をボンディングにより実
装するパッドと前記電子チップ部品に接続するワイヤー
をボンディングするパッドとが隣接して配設された回路
パターンを有する回路基板において、前記電子チップ部
品および前記ワイヤーの何れもをボンディングにより実
装または取り付けることのできる形状を有する共通ボン
ディングパッドが、２個一対として隣接して配設されて
いる。In order to achieve the above-mentioned object, the present invention provides a method of disposing a pad for mounting an electronic chip component by bonding and a pad for bonding a wire connected to the electronic chip component adjacent to the pad. In the circuit board having the circuit pattern described above, two pairs of common bonding pads having a shape capable of mounting or attaching any of the electronic chip components and the wires by bonding are provided adjacent to each other.

【００１０】この回路基板では、同一の電子チップ部品
を、同一の２個一対の共通ボンディングパッドの何れか
一方を選択してボンディングにより実装することによ
り、同一の電子チップ部品をその電流の向きが異なるよ
うに実装することができる。したがって、同一位置に実
装しても電流の向きが互いに異なるタイプの電子部品を
取り付ける場合にも、その電流の向きに合致する方の共
通ボンディングパッドを選択して他の電子チップ部品を
実装するだけで、同一の回路基板を用いることができ
る。それにより、回路基板の種類を従来に比し削減でき
るのに伴って生産コストを低減できるとともに、在庫管
理が容易となり、さらに、この回路基板を用いて構成す
るモジュールなどの生産性が向上する。In this circuit board, the same electronic chip component is mounted by bonding by selecting one of a pair of the same two pairs of common bonding pads, so that the current direction of the same electronic chip component is changed. Can be implemented differently. Therefore, even when mounting electronic components of different types of current directions even if they are mounted in the same position, simply select the common bonding pad that matches the current direction and mount other electronic chip components. Thus, the same circuit board can be used. As a result, the number of types of circuit boards can be reduced as compared with the related art, so that production costs can be reduced, inventory management can be facilitated, and productivity of modules and the like using the circuit boards can be improved.

【００１１】上記発明において、各種の発光ダイオード
が実装される負荷部回路パターンと、この負荷部回路パ
ターンに接続されるダイオードブリッジ回路パターンと
を有し、このダイオードブリッジ回路パターンの四つの
辺に、それぞれ前記共通ボンディングパッドが２個一対
として隣接して配設されている構成とすることができ
る。In the above invention, there are provided a load circuit pattern on which various light emitting diodes are mounted, and a diode bridge circuit pattern connected to the load circuit pattern. Each of the common bonding pads may be arranged adjacent to each other as a pair.

【００１２】これにより、同一の回路基板のダイオード
ブリッジ回路パターンにおける各辺の一対の共通ボンデ
ィングパターンの何れか一方を選択してダイオードを実
装するだけで、ダイオードＤの極性の向きを変えること
ができ、同一の負荷部パターンに赤色発光ダイオードま
たは非赤色発光ダイオードの何れを所定の形態で実装し
た場合にも対応することができる。すなわち、同一の回
路基板を赤色発光ダイオードおよび非赤色発光ダイオー
ドの何れをも実装して所期の回路構成とすることができ
る。しかも、何れの発光ダイオードも同一の負荷部回路
パターンに実装してその実装形態を変更しないので、光
等の特性に何ら悪影響が生じない。Thus, the direction of the polarity of the diode D can be changed only by selecting one of the pair of common bonding patterns on each side of the diode bridge circuit pattern on the same circuit board and mounting the diode. It is possible to cope with the case where either the red light emitting diode or the non-red light emitting diode is mounted in a predetermined form on the same load portion pattern. That is, both the red light emitting diode and the non-red light emitting diode can be mounted on the same circuit board to obtain an intended circuit configuration. In addition, since all the light emitting diodes are mounted on the same load circuit pattern and the mounting form is not changed, there is no adverse effect on the characteristics of light and the like.

【００１３】[0013]

【発明の実施の形態】以下、本発明の好ましい実施の形
態について図面を参照しつつ説明する。図１は本発明の
一実施の形態に係る回路基板８の回路パターンを模式的
に示した図である。この回路基板８の回路パターンは、
図５および図６の回路基板２，１の各回路パターンに比
較して、発光ダイオードＤ１，Ｄ２をそれぞれ実装する
ための負荷部３の回路パターンおよび全体の配線パター
ンが共に同一であり、ダイオードブリッジ回路パターン
Ｐ３が異なるだけである。すなわち、ダイオードブリッ
ジ回路パターンＰ３は、矩形を形成する四つの各辺にお
いて、共に同一形状であって２個一対に組み合わされた
共通ボンディングパッド９Ａ，９Ｂが所定の間隔で対設
されている。この共通ボンディングパッド９Ａ，９Ｂ
は、図２（ａ），（ｃ）に示すように、ダイオードブリ
ッジの構成要素であるダイオードＤをボンディグにより
実装可能な面積を有しており、したがって、ワイヤー１
０のボンディングも勿論可能なものである。DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a diagram schematically showing a circuit pattern of a circuit board 8 according to one embodiment of the present invention. The circuit pattern of the circuit board 8 is
Compared with the circuit patterns of the circuit boards 2 and 1 of FIGS. 5 and 6, the circuit pattern of the load unit 3 for mounting the light emitting diodes D1 and D2 and the entire wiring pattern are the same, and the diode bridge Only the circuit pattern P3 is different. That is, in the diode bridge circuit pattern P3, common bonding pads 9A and 9B, which have the same shape and are combined in a pair, are provided at predetermined intervals on four sides forming a rectangle. These common bonding pads 9A, 9B
Has an area in which a diode D, which is a component of a diode bridge, can be mounted by bonding, as shown in FIGS.
Of course, 0 bonding is also possible.

【００１４】ダイオードブリッジ回路パターンＰ３の各
辺において、図２（ａ）に示すように、ダイオードＤを
他方の共通ボンディングパッド９Ｂ上にボンディングし
て実装するとともに、一端をダイオードＤに接続したワ
イヤー１０の他端を一方の共通ボンディングパッド９Ａ
にボンディングにより接続すると、このダイオードＤ
は、同図（ｂ）に示す方向に実装されて、図の左方に向
けて電流が流れる。一方、同図（ｃ）に示すように、ダ
イオードＤを一方の共通ボンディングパッド９Ａ上にボ
ンディングして実装するととともに、一端をダイオード
Ｄに接続したワイヤー１０の他端を他方の共通ボンディ
ングパッド９Ｂにボンディングにより接続すると、この
ダイオードＤは同図（ｄ）に示す極性の向きに実装され
て、図の右方に向けて電流が流れる。At each side of the diode bridge circuit pattern P3, as shown in FIG. 2A, a diode D is mounted on the other common bonding pad 9B by bonding, and a wire 10 having one end connected to the diode D is mounted. To the other common bonding pad 9A
Is connected to the diode D by bonding.
Are mounted in the direction shown in FIG. 2B, and a current flows to the left of the figure. On the other hand, as shown in FIG. 3C, the diode D is mounted on one common bonding pad 9A by bonding, and the other end of the wire 10 having one end connected to the diode D is connected to the other common bonding pad 9B. When connected by bonding, the diode D is mounted in the direction of the polarity shown in FIG. 4D, and a current flows to the right in the figure.

【００１５】したがって、負荷部３に赤色発光ダイオー
ドＤ１を実装する場合には、回路基板８におけるダイオ
ードブリッジ回路パターンＰ３の各辺において、図２
（ａ）に示すように他方の共通ボンディングパッド９Ｂ
にダイオードＤを、且つ一方の共通ボンディングパッド
９Ａにワイヤー１０をボンデイングする。これにより、
図３（ｂ）に示すような回路構成のダイオードブリッジ
ＤＢ１となり、各赤色発光ダイオードＤ１の極性に合致
する極性の向きに電流が流れ、ここで、赤色発光ダイオ
ードＤ１の光等の特性に何ら悪影響が生じない。Therefore, when the red light emitting diode D1 is mounted on the load section 3, each side of the diode bridge circuit pattern P3
As shown in (a), the other common bonding pad 9B
And a wire 10 on one of the common bonding pads 9A. This allows
The diode bridge DB1 has a circuit configuration as shown in FIG. 3B, and a current flows in the direction of the polarity that matches the polarity of each red light-emitting diode D1. Does not occur.

【００１６】一方、負荷部３に非赤色発光ダイオードＤ
２を実装する場合には、回路基板８におけるダイオード
ブリッジ回路パターンＰ３の各辺において、図２（ｃ）
に示すように一方の共通ボンディングパッド９Ａにダイ
オードＤを、且つ他方の共通ボンディングパッド９Ｂに
ワイヤー１０をボンデイングする。これにより、図３
（ａ）に示すような回路構成のダイオードブリッジＤＢ
２となり、各非赤色発光ダイオードＤ１の極性に合致す
る極性の向きに電流が流れる。On the other hand, a non-red light emitting diode D
2 is mounted on each side of the diode bridge circuit pattern P3 on the circuit board 8 as shown in FIG.
The diode D is bonded to one common bonding pad 9A and the wire 10 is bonded to the other common bonding pad 9B as shown in FIG. As a result, FIG.
Diode bridge DB having a circuit configuration as shown in FIG.
2, and the current flows in the direction of the polarity that matches the polarity of each non-red light emitting diode D1.

【００１７】このように、同一の回路基板８のダイオー
ドブリッジ回路パターンＰ３における各辺の一対の共通
ボンディングパターン９Ａ，９Ｂの何れか一方を選択し
てダイオードＤを実装するだけで、ダイオードＤの極性
の向きを変えることができ、同一の負荷部３のパターン
に赤色発光ダイオードＤ１または非赤色発光ダイオード
Ｄ２の何れを所定の形態で実装した場合にも対応するこ
とができる。すなわち、同一の回路基板８を赤色発光ダ
イオードＤ１および非赤色発光ダイオードＤ２の何れに
も実装して所期の回路構成とすることができるので、回
路基板８の種類を従来に比し削減できるのに伴って生産
コストが低減できるとともに、在庫管理が容易となり、
さらに、発光ダイオードモジュールなどの製作時の生産
性が向上して生産コストを一層低減できる。しかも、何
れの発光ダイオードＤ１，Ｄ２においても、同一の負荷
部３の回路パターンに実装して実装形態を変更しないの
で、光等の特性に何ら悪影響が生じない。As described above, by simply selecting one of the pair of common bonding patterns 9A and 9B on each side of the diode bridge circuit pattern P3 of the same circuit board 8 and mounting the diode D, the polarity of the diode D is changed. Can be changed, and it is possible to cope with a case where either the red light emitting diode D1 or the non-red light emitting diode D2 is mounted in a predetermined form on the same pattern of the load portion 3. That is, the same circuit board 8 can be mounted on both the red light emitting diode D1 and the non-red light emitting diode D2 to obtain an intended circuit configuration, so that the type of the circuit board 8 can be reduced as compared with the related art. As well as reducing production costs, inventory management becomes easier,
Further, the productivity at the time of manufacturing the light emitting diode module and the like is improved, and the production cost can be further reduced. Moreover, since the light emitting diodes D1 and D2 are mounted on the same circuit pattern of the load unit 3 and the mounting form is not changed, there is no adverse effect on characteristics such as light.

【００１８】[0018]

【発明の効果】以上のように本発明の回路基板によれ
ば、電子チップ部品および前記ワイヤーの何れもをボン
ディングにより実装または取り付けることのできる形状
を有する共通ボンディングパッドが、２個一対として隣
接して配設されている構成としたので、同一の電子チッ
プ部品を、同一の２個一対の共通ボンディングパッドの
何れか一方を選択してボンディングによって実装するこ
とにより、同一の電子チップ部品をその電流の向きが異
なるように実装することができるから、同一位置に実装
しても電流の向きが互いに異なるタイプの電子部品を取
り付ける場合にも、その電流の向きに合致する方の共通
ボンディングパッドを選択して他の電子チップ部品を実
装するだけで、同一の回路基板を用いることができる。
それにより、回路基板の種類を従来に比し削減できるの
に伴って生産コストを低減できるとともに、在庫管理が
容易となり、さらに、この回路基板を用いて構成するモ
ジュールなどの生産性が向上する。As described above, according to the circuit board of the present invention, two pairs of common bonding pads having a shape capable of mounting or attaching any of the electronic chip parts and the wires by bonding are adjacent to each other. The same electronic chip component is mounted by bonding by selecting one of the same two pairs of common bonding pads and bonding the same electronic chip component to the same electronic chip component. Can be mounted in different directions, so even when mounting electronic components with different current directions even when mounted in the same position, select the common bonding pad that matches the current direction. Then, the same circuit board can be used simply by mounting other electronic chip components.
As a result, the number of types of circuit boards can be reduced as compared with the related art, so that production costs can be reduced, inventory management can be facilitated, and productivity of modules and the like using the circuit boards can be improved.

【図面の簡単な説明】[Brief description of the drawings]

【図１】本発明の一実施の形態に係る回路基板の回路パ
ターンの模式図である。FIG. 1 is a schematic diagram of a circuit pattern of a circuit board according to an embodiment of the present invention.

【図２】（ａ）は同上回路基板への電子チップ部品の一
実装形態を示す側面図、（ｂ）は（ａ）の電子チップ部
品の向きを示す図、（ｃ）は同上回路基板への電子チッ
プ部品の他の一実装形態を示す側面図、（ｄ）は（ｃ）
の電子チップ部品の向きを示す図である。2A is a side view showing one embodiment of mounting the electronic chip component on the circuit board, FIG. 2B is a view showing the orientation of the electronic chip component on FIG. 2A, and FIG. FIG. 4D is a side view showing another mounting mode of the electronic chip component of FIG.
FIG. 3 is a view showing the orientation of the electronic chip component.

【図３】（ａ），（ｂ）は何れも同上回路基板に電子チ
ップ部品を異なる形態でそれぞれ実装した時の電気回路
図である。FIGS. 3A and 3B are electric circuit diagrams when electronic chip components are mounted on the circuit board in different forms, respectively.

【図４】同上回路基板に実装できる発光ダイオードを示
す側面図で、（ａ）は赤色発光ダイオード、（ｂ）は非
赤色発光ダイオードである。FIG. 4 is a side view showing a light emitting diode that can be mounted on the circuit board, wherein (a) is a red light emitting diode and (b) is a non-red light emitting diode.

【図５】従来の回路基板の回路パターンの模式図であ
る。FIG. 5 is a schematic diagram of a circuit pattern of a conventional circuit board.

【図６】同上回路基板と同種の回路基板の回路パターン
の模式図である。FIG. 6 is a schematic diagram of a circuit pattern of a circuit board of the same type as the above circuit board.

【符号の説明】[Explanation of symbols]

３ 負荷部回路パターン ８ 回路基板 ９Ａ，９Ｂ 共通ボンディングパッド １０ ワイヤー Ｄ１，Ｄ２ 発光ダイオード（電子チップ部品） Ｄ ダイオード（電子チップ部品） Ｐ３ ダイオードブリッジ回路パターン Reference Signs List 3 Load circuit pattern 8 Circuit board 9A, 9B Common bonding pad 10 Wire D1, D2 Light emitting diode (electronic chip component) D diode (electronic chip component) P3 Diode bridge circuit pattern

Claims (2)

【特許請求の範囲】[Claims] 【請求項１】電子チップ部品をボンディングにより実装
するパッドと前記電子チップ部品に接続するワイヤーを
ボンディングするパッドとが隣接して配設された回路パ
ターンを有する回路基板において、 前記電子チップ部品および前記ワイヤーの何れもをボン
ディングにより実装または取り付けることのできる形状
を有する共通ボンディングパッドが、２個一対として隣
接して配設されていることを特徴とする回路基板。1. A circuit board having a circuit pattern in which a pad for mounting an electronic chip component by bonding and a pad for bonding a wire connected to the electronic chip component are arranged adjacent to each other. A circuit board, comprising: a pair of common bonding pads having a shape capable of mounting or attaching any of the wires by bonding. 【請求項２】各種の発光ダイオードが実装される負荷部
回路パターンと、この負荷部回路パターンに接続される
ダイオードブリッジ回路パターンとを有し、このダイオ
ードブリッジ回路パターンの四つの辺に、それぞれ前記
共通ボンディングパッドが２個一対として隣接して配設
されている請求項１に記載の回路基板。2. A load circuit pattern on which various light-emitting diodes are mounted, and a diode bridge circuit pattern connected to the load circuit pattern. 2. The circuit board according to claim 1, wherein two common bonding pads are disposed adjacent to each other.
JP32042297A 1997-11-05 1997-11-05 Circuit board Expired - Fee Related JP3943683B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP32042297A JP3943683B2 (en) 1997-11-05 1997-11-05 Circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32042297A JP3943683B2 (en) 1997-11-05 1997-11-05 Circuit board

Publications (2)

Publication Number Publication Date
JPH11145330A true JPH11145330A (en) 1999-05-28
JP3943683B2 JP3943683B2 (en) 2007-07-11

Family

ID=18121289

Family Applications (1)

Application Number Title Priority Date Filing Date
JP32042297A Expired - Fee Related JP3943683B2 (en) 1997-11-05 1997-11-05 Circuit board

Country Status (1)

Country Link
JP (1) JP3943683B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1377139A1 (en) * 2002-06-26 2004-01-02 ORION ELECTRIC CO., Ltd. Foolproof polarity indications of poled electronic parts or devices in printed circuit board
CN113395828A (en) * 2021-05-27 2021-09-14 合肥鑫晟光电科技有限公司 Printed circuit board, display panel and electronic equipment

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1377139A1 (en) * 2002-06-26 2004-01-02 ORION ELECTRIC CO., Ltd. Foolproof polarity indications of poled electronic parts or devices in printed circuit board
CN113395828A (en) * 2021-05-27 2021-09-14 合肥鑫晟光电科技有限公司 Printed circuit board, display panel and electronic equipment

Also Published As

Publication number Publication date
JP3943683B2 (en) 2007-07-11

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