JPH10308573A - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPH10308573A JPH10308573A JP13041697A JP13041697A JPH10308573A JP H10308573 A JPH10308573 A JP H10308573A JP 13041697 A JP13041697 A JP 13041697A JP 13041697 A JP13041697 A JP 13041697A JP H10308573 A JPH10308573 A JP H10308573A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- solder
- solder resist
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、プリント配線板に
関し、特に電子部品をはんだ付けする際、低コストでは
んだ接続信頼性を向上させ、高密度プリント配線板に好
適なプリント配線板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board and, more particularly, to a printed wiring board suitable for high-density printed wiring boards, which has improved solder connection reliability at low cost when soldering electronic components.
【０００２】[0002]
【従来の技術】この種の従来のプリント配線板として、
例えば文献（（株）東芝、材料デバイス研究所、森三
樹、栂嵜隆著、ＳＨＭ会誌、１９９７、Ｖｏｌ．１３，
Ｎｏ．１、１９９７年１月１日発行、第２９頁）等の記
載が参照される。この文献には、表面実装技術におい
て、プリント配線板上のはんだ付けパッド表面と、これ
に実装される部品電極裏面との距離を６０μｍ以上離す
ことにより、はんだ付けパッドの大きさが、実装される
部品電極と同等でも充分なはんだ接続信頼性を持つこと
が記載されている。2. Description of the Related Art As a conventional printed wiring board of this kind,
For example, literature (Toshiba Corporation, Materials and Devices Laboratory, Miki Mori, Takashi Tsugasaki), SHM Journal, 1997, Vol.
No. 1, issued January 1, 1997, page 29). According to this document, in the surface mounting technology, the size of the soldering pad is mounted by separating the distance between the surface of the soldering pad on the printed wiring board and the back surface of the component electrode mounted on the printed wiring board by 60 μm or more. It is described that even if it is equivalent to a component electrode, it has sufficient solder connection reliability.
【０００３】従来、はんだ接続信頼性を向上させるため
に、はんだ内に適当な大きさのフィラーを入れ、表面実
装部品をそのフィラーにより支持した状態でリフローは
んだ付けを行う、あるいは、予めプリント配線板上の表
面実装部品配置部に、ある厚みのスペーサーを配置して
おき、表面実装部品をそのスペーサーにより支持した状
態ではんだ付けを行う等の手段が用いられている。Conventionally, in order to improve the reliability of solder connection, a filler of an appropriate size is put in solder, and reflow soldering is performed with the surface-mounted component supported by the filler, or a printed wiring board is prepared in advance. Means are used in which a spacer having a certain thickness is disposed in the upper surface mounting component placement portion, and soldering is performed while the surface mounting component is supported by the spacer.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、上記従
来技術は下記記載の問題点を有している。However, the above prior art has the following problems.
【０００５】（１）第一の問題点は、フィラー入りはん
だ、及びスペーサーの使用は、コスト的に高い、という
ことである。(1) The first problem is that the use of filler-containing solder and spacers is costly.
【０００６】その理由は、フィラー入りはんだは、均一
な大きさのフィラーを均一にはんだ内に混入させなけれ
ばならず、結果として、はんだの価格を上げてしまうか
らである。[0006] The reason for this is that the filler-containing solder must uniformly mix a filler of a uniform size into the solder, thereby increasing the price of the solder.
【０００７】また、スペーサーを使用する場合は、スペ
ーサー自体の価格とともに、スペーサーをプリント配線
板上に配置するという工程を必要する、からでである。[0007] Further, when a spacer is used, a step of arranging the spacer on a printed wiring board is required together with the cost of the spacer itself.
【０００８】（２）第二の問題点は、フィラー入りはん
だを用いる場合、リフローはんだ付け後のはんだ付け修
正や部品交換等の手はんだ付けが極めて困難であり、手
はんだ付けした部品とそうでない部品とでは、はんだ接
続信頼性において差が出てしまう、ということである。(2) The second problem is that when filler-containing solder is used, it is extremely difficult to correct soldering after reflow soldering or to manually replace components, etc. This means that there is a difference in solder connection reliability between the component and the component.
【０００９】その理由は、フィラー入りはんだの場合、
表面実装部品の全ての電極と全てのはんだ付けパッド間
にフィラーを入れなければ高い接続信頼性を得られず、
この作業を、手はんだ付けにて行うことは、ほとんど不
可能に等しいからである。The reason is that in the case of solder containing filler,
High connection reliability cannot be obtained unless a filler is inserted between all electrodes of the surface mount component and all soldering pads.
This is because it is almost impossible to perform this work by hand soldering.
【００１０】したがって、本発明は、上記問題点に鑑み
てなされたものであって、その目的は、低コストで、高
いはんだ接続信頼性を実現する、プリント配線板を提供
することを目的とする。本発明は、上記目的を達成する
と共にその結果として、はんだ付けパッドの小型化を図
り、高密度プリント配線板の実現を達成すると共に、リ
フロー時のはんだ付け品質の向上を図るプリント配線板
を提供することもその目的としている。[0010] Accordingly, the present invention has been made in view of the above problems, and has as its object to provide a printed wiring board which realizes high solder connection reliability at low cost. . The present invention provides a printed wiring board that achieves the above-mentioned objects and, as a result, reduces the size of soldering pads, achieves a high-density printed wiring board, and improves soldering quality during reflow. To do so.
【００１１】[0011]
【課題を解決するための手段】前記目的を達成する本発
明のプリント配線板は、プリント配線板上のソルダーレ
ジストにより電子部品を支持した状態ではんだ付けを行
うことにより、低コストで、高いはんだ接続信頼性を実
現し、結果としてはんだ付けパッドの小型化を可能と
し、高密度プリント配線板を実現を可能とする。また、
はんだ付けパッド小型化に伴いはんだ量が減少するの
で、リフロー時のはんだ表面張力が減少することにな
り、チップ部品の位置ズレやチップ立ちを減少させるこ
とを可能とする。According to the present invention, there is provided a printed wiring board which achieves the above-mentioned objects by performing soldering in a state where electronic components are supported by a solder resist on the printed wiring board. Achieves connection reliability and, as a result, enables downsizing of soldering pads and enables realization of a high-density printed wiring board. Also,
Since the amount of solder decreases along with the miniaturization of the soldering pad, the solder surface tension at the time of reflow decreases, which makes it possible to reduce the displacement of chip components and the rise of chips.
【００１２】[0012]
【発明の実施の形態】本発明の実施の形態について以下
に説明する。本発明のプリント配線板は、その好ましい
実施の形態において、プリント配線基板上のソルダーレ
ジストのはんだ付けパッド表面からのソルダーレジスト
表面までの高さが、はんだ付けパッド表面から実装され
る部品の電極裏面との間隔と同等に形成されており、部
品実装時に、前記ソルダーレジストにより前記部品が前
記パッド表面から前記高さに保持された状態で前記部品
の電極と前記パッドとがはんだ付けされてなる、ことを
特徴としたものである。Embodiments of the present invention will be described below. In a preferred embodiment of the printed wiring board of the present invention, the height of the solder resist on the printed wiring board from the solder pad surface to the solder resist surface is lower than the electrode back surface of the component mounted from the solder pad surface. Are formed at the same interval as the component, and at the time of component mounting, the electrodes of the component and the pad are soldered in a state where the component is held at the height from the pad surface by the solder resist, It is characterized by the following.
【００１３】より詳細には、後述する実施例の説明で参
照される図１に示すように、はんだ付けパッド３を有す
る銅パターン層１上に、はんだ付けパッド３表面からの
厚みが、例えば６０μｍ以上となるよう絶縁樹脂２を塗
布し、はんだ付けパッド３上を選択的に開口することに
より、実装される電子部品の電極裏面とはんだ付けパッ
ド３の表面とがリフロー、もしくは手はんだ付けのいず
れの場合も、６０μｍ以上離れてはんだ接続されること
となり、高い接続信頼性を持つことを可能としたもので
ある。More specifically, as shown in FIG. 1 which will be referred to in the description of the embodiment described later, the thickness from the surface of the soldering pad 3 is, for example, 60 μm on the copper pattern layer 1 having the soldering pad 3. By applying the insulating resin 2 as described above and selectively opening the soldering pad 3, the back surface of the electrode of the electronic component to be mounted and the surface of the soldering pad 3 are either reflowed or manually soldered. In this case, the solder connection is made at a distance of 60 μm or more, thereby enabling high connection reliability.
【００１４】なお、本発明の実施の形態において、プリ
ント配線板の製造工程は、上述の通り、従来プリント配
線板製造工程をそのまま流用できるため、低コストで、
製造可能とする。In the embodiment of the present invention, as described above, the manufacturing process of the printed wiring board can be diverted from the conventional manufacturing process of the printed wiring board as described above.
Can be manufactured.
【００１５】このように、本発明のプリント配線板は、
その好ましい実施の形態において、従来のプリント配線
板製造工程を流用して、実装される電子部品の支持用ス
ペーサーを作成することを可能としたものであり、この
ため、低コストで高いはんだ接続信頼性を実現でき、は
んだ付けパッドの小型化による高密度プリント配線板の
実現を可能とする。As described above, the printed wiring board of the present invention
In the preferred embodiment, it is possible to make a spacer for supporting the electronic component to be mounted by diverting the conventional printed wiring board manufacturing process. And realizes a high-density printed wiring board by reducing the size of soldering pads.
【００１６】また、はんだ付けパッドが小型化されるこ
とにより、はんだ量が減少するためはんだ表面張力も減
少し、リフロー時のチップ部品の位置ズレやチップ立ち
の減少を可能とする。Further, since the size of the soldering pad is reduced, the amount of solder is reduced, so that the surface tension of the solder is also reduced. This makes it possible to reduce the displacement of the chip components and the chip standing during reflow.
【００１７】[0017]
【実施例】本発明の実施例について図面を参照して以下
に説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the drawings.
【００１８】［実施例１］図１は、本発明の第１の実施
例を説明するための工程断面図である。最初に、銅パタ
ーン層１上に、絶縁樹脂２を、銅パターン層１表面から
厚さが略６０μｍ以上となるようカーテンコート、ある
いはスピンコートの重ね塗り等の手段を用いて塗布する
（図１（ｂ）参照）。[Embodiment 1] FIG. 1 is a process sectional view for explaining a first embodiment of the present invention. First, the insulating resin 2 is applied on the copper pattern layer 1 by means of curtain coating, spin coating, or the like so that the thickness becomes approximately 60 μm or more from the surface of the copper pattern layer 1 (FIG. 1). (B)).
【００１９】次に、はんだ付けパッド３上の絶縁樹脂２
をエッチング等により選択的に開口させ、ソルダーレジ
ストを形成する（図１（ｃ）参照）。この時、必要に応
じ、ソルダーレジスト表面を、バフ、あるいは薬品等に
より、平坦に研磨、あるいはエッチング等を行い、厚み
を調整する。Next, the insulating resin 2 on the soldering pad 3
Is selectively opened by etching or the like to form a solder resist (see FIG. 1C). At this time, if necessary, the surface of the solder resist is polished or etched flat with a buff or a chemical to adjust the thickness.
【００２０】このようにして製造されたプリント配線板
上に電子部品４を実装した場合、リフロー、手はんだ付
けにかかわらず（図で６がはんだを示す）、はんだ付け
パッド３表面とそれに実装される電子部品４の電極５裏
面との距離を６０μｍ以上離した状態ではんだ付けする
ことが可能となる（図１（ｄ）参照）。When the electronic component 4 is mounted on the printed wiring board manufactured in this manner, regardless of reflow or manual soldering (6 indicates solder in the figure), the surface of the soldering pad 3 and the surface mounted on the soldering pad 3 are mounted. It is possible to perform soldering in a state where the distance between the electronic component 4 and the back surface of the electrode 5 is 60 μm or more (see FIG. 1D).
【００２１】［実施例２］図２は、本発明の第２の実施
例を説明するための工程断面図である。[Embodiment 2] FIG. 2 is a process sectional view for explaining a second embodiment of the present invention.
【００２２】最初に、銅パターン層１上に、感光性を持
つ絶縁樹脂２ａを適当な厚みに塗布し、マスク露光法や
レーザー加工等によりビア（ＶＩＡ）ホールを形成す
る。First, an insulating resin 2a having photosensitivity is applied to a proper thickness on the copper pattern layer 1, and a via (VIA) hole is formed by a mask exposure method, laser processing or the like.
【００２３】次に、絶縁樹脂２ｂを、後に行う銅メッキ
表面からの厚みが６０μｍ以上となるよう塗布し、マス
ク露光法やエッチング等により、絶縁樹脂２ｂをパター
ニングする（図２（ｃ）参照）。Next, the insulating resin 2b is applied so that the thickness from the copper plating surface to be performed later becomes 60 μm or more, and the insulating resin 2b is patterned by a mask exposure method, etching or the like (see FIG. 2C). .
【００２４】さらに銅メッキにより、はんだ付けパッド
３やその他のパターンを形成する。この場合、絶縁樹脂
２ａは絶縁層、絶縁樹脂２ｂはソルダーレジストとな
る。この時、必要に応じ、ソルダーレジスト表面を、バ
フ、或いは薬品等により平坦に研磨、或いはエッチング
を行い厚みを調整する。これにより、リフロー、手はん
だ付けにかかわらず、図１に示した第１の実施例と同様
に、はんだ付けパッド３表面とそれに実装される電子部
品４の電極５裏面との距離を６０μｍ以上離した状態で
はんだ付けすることが可能となる。Further, soldering pads 3 and other patterns are formed by copper plating. In this case, the insulating resin 2a becomes an insulating layer, and the insulating resin 2b becomes a solder resist. At this time, if necessary, the surface of the solder resist is polished or etched flat with a buff or a chemical to adjust the thickness. Accordingly, the distance between the surface of the soldering pad 3 and the back surface of the electrode 5 of the electronic component 4 mounted thereon is 60 μm or more, regardless of reflow or manual soldering, as in the first embodiment shown in FIG. It is possible to perform soldering in a state where the soldering is performed.
【００２５】なお、絶縁樹脂２ａ、２ｂは同じ樹脂でも
異なる樹脂でも良い。The insulating resins 2a and 2b may be the same resin or different resins.
【００２６】[0026]
【発明の効果】以上説明したように、本発明によれば、
下記記載の効果を奏する。As described above, according to the present invention,
The following effects are obtained.
【００２７】（１）本発明の第１の効果は、従来のプリ
ント配線板製造工程を流用して、プリント配線板上にソ
ルダーレジストによる電子部品はんだ付け時のスペーサ
ーを作成することが可能である、ということである。こ
れにより、リフロー、手はんだ付けのいずれの場合も、
低コストで高いはんだ接続信頼性のプリント配線板を実
現可能としている。(1) The first effect of the present invention is that a spacer can be formed on a printed wiring board at the time of soldering electronic components using a solder resist, by diverting a conventional printed wiring board manufacturing process. ,That's what it means. As a result, in both cases of reflow and manual soldering,
This makes it possible to realize printed wiring boards with low cost and high solder connection reliability.
【００２８】その理由は、プリント配線板上のはんだ付
けパッドとそこに実装される電子部品の電極裏面との距
離が大きいほど、はんだ接続信頼性に優れており、本発
明によれば、プリント配線板において、はんだ付け時に
電子部品がソルダーレジストにより支持される構造とな
っている、ためである。The reason is that the greater the distance between the soldering pad on the printed wiring board and the back surface of the electrode of the electronic component mounted thereon, the better the solder connection reliability, and according to the present invention, This is because the board has a structure in which the electronic components are supported by the solder resist during soldering.
【００２９】（２）本発明の第２の効果は、上記第１の
効果により、はんだ付けパッドの小型化が可能であると
いう、ことである。このため、本発明によれば、高密度
プリント配線板が実現可能となる。(2) A second effect of the present invention is that the first effect enables the size of the soldering pad to be reduced. Therefore, according to the present invention, a high-density printed wiring board can be realized.
【００３０】その理由は、はんだ接続信頼性が向上する
ことにより、従来、はんだ接続信頼性に大きく貢献して
いたはんだフィレットを小さくしても、言い換えれば、
はんだ付けパッドを小型化しても、充分なはんだ接続信
頼性を持つことが可能となるからである。The reason for this is that even though the solder fillet, which has conventionally greatly contributed to the solder connection reliability, is made smaller by improving the solder connection reliability, in other words,
This is because even if the size of the soldering pad is reduced, sufficient solder connection reliability can be obtained.
【００３１】（３）本発明の第３の効果は、上記第２の
効果により、はんだ量が減少し、チップ部品の位置ズレ
やチップ立ちを減少させることが可能である、というこ
とである。これにより、リフロー時のはんだ付け品質向
上が可能となる。(3) A third effect of the present invention is that, due to the second effect, the amount of solder is reduced, and it is possible to reduce the displacement of chip components and the rise of chips. This makes it possible to improve the soldering quality during reflow.
【００３２】その理由は、本発明においては、はんだ付
けパッドの小型化に伴いはんだ量が減少するため、リフ
ロー時のはんだ表面張力も減少し、チップ部品がはんだ
から受ける力が減少する、からである。The reason for this is that, in the present invention, since the amount of solder decreases with the miniaturization of the soldering pad, the solder surface tension during reflow also decreases, and the force received by the chip component from the solder decreases. is there.
【図１】本発明の第１の実施例を説明するための工程断
面図である。FIG. 1 is a process cross-sectional view for explaining a first embodiment of the present invention.
【図２】本発明の第２の実施例を説明するための工程断
面図である。FIG. 2 is a process cross-sectional view for explaining a second embodiment of the present invention.
１ 銅パターン層 ２ 絶縁樹脂 ３ はんだ付けパッド ４ 電子部品 ５ 電子部品電極 ６ はんだ DESCRIPTION OF SYMBOLS 1 Copper pattern layer 2 Insulating resin 3 Solder pad 4 Electronic component 5 Electronic component electrode 6 Solder
Claims (6)
レジストにより特定の高さで支持された状態ではんだ付
けされてなる、ことを特徴とするプリント配線板。1. A printed wiring board, wherein an electronic component is soldered while being supported at a specific height by a solder resist on the printed wiring board.
レジストにおいて、はんだ付けパッド表面からの前記ソ
ルダーレジスト表面までの高さが、前記はんだ付けパッ
ド表面から実装される部品の電極裏面までの間隔と同等
に形成されており、 部品実装時に、前記ソルダーレジストにより前記部品が
前記はんだ付けパッド表面から前記高さに保持された状
態で前記部品の電極と前記パッドとがはんだ付けされて
なる、ことを特徴とするプリント配線板。2. A solder resist formed on a printed wiring board, wherein the height from the surface of the solder pad to the surface of the solder resist is equal to the distance from the surface of the solder pad to the back surface of the electrode of a component to be mounted. And the electrodes of the component and the pad are soldered in a state where the component is held at the height from the surface of the soldering pad by the solder resist during component mounting. Printed wiring board featuring.
レジストにおいて、はんだ付けパッド表面からの厚みが
所定の値以上となるよう絶縁樹脂を塗布し、はんだ付け
パッド上を選択的に開口を形成することでソルダーレジ
ストを形成し、前記ソルダーレジストの前記はんだ付け
パッド表面からのソルダーレジスト表面までの高さが、
前記はんだ付けパッド表面から、実装される部品の電極
裏面までの間隔と同等となるように、前記ソルダーレジ
スト表面を加工してその厚みを調整してなる、ことを特
徴とするプリント配線板。3. An insulating resin is applied to a solder resist formed on a printed wiring board so that the thickness from the surface of the soldering pad becomes a predetermined value or more, and an opening is selectively formed on the soldering pad. By forming a solder resist, the height of the solder resist from the solder pad surface to the solder resist surface,
A printed wiring board characterized in that the surface of the solder resist is processed and its thickness is adjusted so as to be equal to the distance from the surface of the soldering pad to the back surface of an electrode of a component to be mounted.
ジストにより特定の高さで支持された状態ではんだ付け
され、低コストではんだ接続信頼性を向上させる、よう
にしたことを特徴とするプリント配線板。4. A print wherein an electronic component is soldered while being supported at a specific height by a solder resist on a printed wiring board, thereby improving solder connection reliability at low cost. Wiring board.
プリント配線板上の電子部品用はんだ付けパッドの小型
化を可能とし、高密度プリント配線板を実現可能とし
た、ことを特徴とする請求項４記載のプリント配線板。5. Improving the reliability of solder connection,
5. The printed wiring board according to claim 4, wherein the soldering pads for electronic components on the printed wiring board can be reduced in size, and a high-density printed wiring board can be realized.
パッドが小型化することにより、はんだ量を減少させ、
リフロー時のはんだ表面張力が減少することによりチッ
プ部品の位置ズレやチップ立ちを減少させる、ようにし
たことを特徴とする請求項５記載のプリント配線板。6. An electronic component soldering pad on a printed wiring board is reduced in size, thereby reducing the amount of solder.
6. The printed wiring board according to claim 5, wherein the positional deviation of the chip component and the standing of the chip are reduced by reducing the solder surface tension at the time of reflow.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13041697A JP3173423B2 (en) | 1997-05-02 | 1997-05-02 | Printed wiring board |
| GB9809281A GB2324753B (en) | 1997-05-02 | 1998-04-30 | Printed circuit and printed wiring boards and methods of manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13041697A JP3173423B2 (en) | 1997-05-02 | 1997-05-02 | Printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10308573A true JPH10308573A (en) | 1998-11-17 |
| JP3173423B2 JP3173423B2 (en) | 2001-06-04 |
Family
ID=15033744
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13041697A Expired - Fee Related JP3173423B2 (en) | 1997-05-02 | 1997-05-02 | Printed wiring board |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP3173423B2 (en) |
| GB (1) | GB2324753B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011142130A (en) * | 2010-01-05 | 2011-07-21 | Murata Mfg Co Ltd | Structure for mounting electronic component on mounting substrate, mounting substrate, and mounting substrate having electronic component mounted thereon |
| JP2012004590A (en) * | 2011-08-31 | 2012-01-05 | Hitachi Automotive Systems Ltd | Method for manufacturing on-vehicle electronic circuit device or electronic circuit device |
| WO2012032654A1 (en) * | 2010-09-10 | 2012-03-15 | 株式会社メイコー | Substrate with built-in components |
| JP2014045152A (en) * | 2012-08-28 | 2014-03-13 | Panasonic Corp | Component mounting board |
| JP2015099889A (en) * | 2013-11-20 | 2015-05-28 | スズキ株式会社 | Printed circuit board |
| WO2022085566A1 (en) * | 2020-10-19 | 2022-04-28 | Tdk株式会社 | Mounting board and circuit board |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2417139A (en) * | 2004-08-13 | 2006-02-15 | Siemens Aktiengesellschaft | Printed circuit board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2134026B (en) * | 1983-01-27 | 1985-11-20 | Allen Bradley Int | A method of joining a component part to an integrated circuit |
-
1997
- 1997-05-02 JP JP13041697A patent/JP3173423B2/en not_active Expired - Fee Related
-
1998
- 1998-04-30 GB GB9809281A patent/GB2324753B/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011142130A (en) * | 2010-01-05 | 2011-07-21 | Murata Mfg Co Ltd | Structure for mounting electronic component on mounting substrate, mounting substrate, and mounting substrate having electronic component mounted thereon |
| WO2012032654A1 (en) * | 2010-09-10 | 2012-03-15 | 株式会社メイコー | Substrate with built-in components |
| KR20140006771A (en) * | 2010-09-10 | 2014-01-16 | 메이코 일렉트로닉스 컴파니 리미티드 | Substrate with built-in components |
| JP5659234B2 (en) * | 2010-09-10 | 2015-01-28 | 株式会社メイコー | Component built-in board |
| JP2012004590A (en) * | 2011-08-31 | 2012-01-05 | Hitachi Automotive Systems Ltd | Method for manufacturing on-vehicle electronic circuit device or electronic circuit device |
| JP2014045152A (en) * | 2012-08-28 | 2014-03-13 | Panasonic Corp | Component mounting board |
| JP2015099889A (en) * | 2013-11-20 | 2015-05-28 | スズキ株式会社 | Printed circuit board |
| WO2022085566A1 (en) * | 2020-10-19 | 2022-04-28 | Tdk株式会社 | Mounting board and circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| GB2324753B (en) | 1999-09-01 |
| GB9809281D0 (en) | 1998-07-01 |
| JP3173423B2 (en) | 2001-06-04 |
| GB2324753A (en) | 1998-11-04 |
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