JPH10223817A - Electrode structure of side surface type electronic component and manufacture thereof - Google Patents
Electrode structure of side surface type electronic component and manufacture thereofInfo
- Publication number
- JPH10223817A JPH10223817A JP3570297A JP3570297A JPH10223817A JP H10223817 A JPH10223817 A JP H10223817A JP 3570297 A JP3570297 A JP 3570297A JP 3570297 A JP3570297 A JP 3570297A JP H10223817 A JPH10223817 A JP H10223817A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- electronic component
- insulating substrate
- type electronic
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 238000007789 sealing Methods 0.000 claims abstract description 14
- 238000007747 plating Methods 0.000 claims abstract description 13
- 229920005989 resin Polymers 0.000 claims abstract description 13
- 239000011347 resin Substances 0.000 claims abstract description 13
- 238000005476 soldering Methods 0.000 claims abstract description 12
- 238000005530 etching Methods 0.000 claims abstract description 8
- 239000000758 substrate Substances 0.000 claims description 40
- 238000005520 cutting process Methods 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 abstract description 7
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明はＳＭＤ型の側面受発
光デバイスに係わり、詳しくは、側面型電子部品の電極
構造及びその製造方法に関する。[0001] 1. Field of the Invention [0002] The present invention relates to an SMD type side light receiving / emitting device, and more particularly, to an electrode structure of a side type electronic component and a method of manufacturing the same.
【０００２】[0002]
【従来の技術】近年の電子機器は、高性能化、多機能化
とともに小型化、軽量化を追求している。そのため電子
部品をプリント基板上に実装し、樹脂封止するものが多
い。ＳＭＤ部品の多くは略直方体のプロックをしてお
り、プリント基板上の配線パターンに半田付け等の固着
手段で接続している。2. Description of the Related Art In recent years, electronic devices have been pursuing high performance and multiple functions, as well as miniaturization and weight reduction. Therefore, electronic components are often mounted on a printed circuit board and sealed with a resin. Many of the SMD components have a substantially rectangular parallelepiped block, and are connected to a wiring pattern on a printed board by a fixing means such as soldering.
【０００３】前記側面型電子部品の電極構造の技術が、
本出願人が先に出願した「下面電極付き側面使用電子部
品」（出願日、平成８年１１月１５日）に開示されてい
る。以下、図面に基づいてその概要を説明する。The technology of the electrode structure of the side-type electronic component is as follows.
It is disclosed in "Electronic component using side surface with bottom electrode" filed by the present applicant (filing date: November 15, 1996). The outline will be described below with reference to the drawings.
【０００４】図７は、側面使用電子部品をプリント基板
に実装した状態の斜視図、図８は、図７のＡ−Ａ線断面
図である。FIG. 7 is a perspective view showing a state in which electronic components for side use are mounted on a printed circuit board, and FIG. 8 is a sectional view taken along line AA of FIG.
【０００５】図７及び図８において、１は略直方体形状
の絶縁基板であり、２は該絶縁基板１の上面端部に対向
する一対の上面電極である。３は下面電極であり、前記
上面電極２及び前記下面電極３と連なるように側面電極
４が形成されている。前記上面電極２に電子素子５であ
る、例えば、ＬＥＤが、前記一対の上面電極２の一方に
ダイボンディングされ、他方にはボンディングワイヤ６
で接続されている。７は、前記電子素子５及び接続部の
保護と、前記ＬＥＤの発光を効果的にするために、透光
性のエポキシ樹脂等の封止樹脂で封止することで、前記
側面使用電子部品８が完成される。[0005] In FIGS. 7 and 8, reference numeral 1 denotes an insulating substrate having a substantially rectangular parallelepiped shape, and reference numeral 2 denotes a pair of upper electrodes facing the upper end of the insulating substrate 1. Reference numeral 3 denotes a lower electrode, and a side electrode 4 is formed so as to be continuous with the upper electrode 2 and the lower electrode 3. An electronic element 5, for example, an LED, is die-bonded to one of the pair of upper electrodes 2, and a bonding wire 6 is connected to the other of the pair of upper electrodes 2.
Connected by 7 is a side view of the electronic component 8 by sealing with a sealing resin such as a translucent epoxy resin in order to protect the electronic element 5 and the connection portion and to effectively emit light from the LED. Is completed.
【０００６】前記側面使用電子部品８は図７に示すよう
に、プリント基板等のマザーボード９上の配線パターン
１０に、前記側面使用電子部品８が側面発光するよう
に、横向きにして、固着手段として、例えば半田１１に
より半田付け実装される。As shown in FIG. 7, the side-use electronic component 8 is placed sideways on a wiring pattern 10 on a mother board 9 such as a printed circuit board so that the side-use electronic component 8 emits light from the side. , For example, by soldering.
【０００７】図８に示すように、前記側面使用電子部品
８と前記マザーボード９との固着は、前記半田１０が溶
融時に前記側面使用電子部品８に形成した側面電極４
と、前記マザーボード９上の配線パターン１０の双方を
濡らして接続される。[0008] As shown in FIG. 8, the side-use electronic component 8 and the motherboard 9 are fixed to each other by the side-surface electrode 4 formed on the side-use electronic component 8 when the solder 10 is melted.
And both the wiring patterns 10 on the motherboard 9 are wetted and connected.
【０００８】[0008]
【発明が解決しようとする課題】しかしながら、前述し
た側面型電子部品の電極構造には次のような問題点があ
る。即ち、側面使用電子部品とマザーボードとの固着
は、マザーボード９の配線パターン１０と、側面使用電
子部品８に形成された側面電極４の裏面と、その一部周
辺のみが半田付けされ、側面電極４との半田付け面積が
狭いため、半田付け不良が発生し易く、また、半田固定
力が弱く、外部から予期せぬ衝撃力が加わった時に、固
着面が剥がれ、前記マザーボードとの接触不良等の致命
的な問題があった。However, the above-described electrode structure of the side-type electronic component has the following problems. That is, only the wiring pattern 10 of the motherboard 9, the back surface of the side electrode 4 formed on the side surface electronic component 8, and a part of the periphery thereof are soldered. The soldering area is small, so soldering failure is likely to occur, and the solder fixing force is weak. There was a fatal problem.
【０００９】本発明は上記従来の課題に鑑みなされたも
のであり、その目的は、プリント基板に側面型電子部品
を確実に実装、固定する。生産性、経済性及び信頼性の
優れた側面型電子部品の電極構造及びその製造方法を提
供するものである。The present invention has been made in view of the above-mentioned conventional problems, and an object of the present invention is to securely mount and fix a side-type electronic component on a printed circuit board. An object of the present invention is to provide an electrode structure of a side-type electronic component excellent in productivity, economy and reliability, and a method of manufacturing the same.
【００１０】[0010]
【課題を解決するための手段】上記目的を達成するため
に、本発明における側面型電子部品の電極構造は、略直
方体形状の絶縁基板、該絶縁基板の上面端部に対向する
一対の上面電極を設け、該一対の上面電極は、それぞれ
その裏面に下面電極と、その側面に、前記上面電極及び
前記下面電極と連なる側面電極を形成して、前記上面電
極に電子素子を実装し、樹脂封止してなる側面型電子部
品の電極構造において、前記上面電極、側面電極、下面
電極が絶縁基板の端部周囲を一周し、且つ、前記側面電
極は絶縁基板のコーナー部で、上面電極から下面電極に
わたり凹部を有するように形成し、前記電子素子を側面
に向けて使用するとき、プリント基板に固着する絶縁基
板側の側面電極面に形成した凹部により、半田付け面積
を拡大したことを特徴とするものである。In order to achieve the above-mentioned object, an electrode structure of a side-type electronic component according to the present invention comprises a substantially rectangular parallelepiped insulating substrate, and a pair of upper surface electrodes opposed to upper surface edges of the insulating substrate. A pair of upper surface electrodes, a lower surface electrode on the back surface thereof, and a side electrode connected to the upper surface electrode and the lower surface electrode on the side surface thereof. An electronic element is mounted on the upper surface electrode, and a resin seal is formed. In the electrode structure of the side surface type electronic component, the upper surface electrode, the side surface electrode, and the lower surface electrode make a round around the end of the insulating substrate, and the side surface electrode is a corner portion of the insulating substrate, and the lower surface electrode extends from the upper surface electrode to the lower surface. When the electronic element is formed to have a concave portion over the electrode, and the electronic element is used facing the side surface, the soldering area is increased by the concave portion formed on the side surface electrode surface on the insulating substrate side fixed to the printed circuit board. It is an butterfly.
【００１１】また、前記側面電極の凹部は、前記側面電
極を形成するときの前記絶縁基板のコーナー部に設けた
スルーホールであることを特徴とするものである。Further, the recess of the side electrode is a through hole provided at a corner of the insulating substrate when the side electrode is formed.
【００１２】また、本発明における側面型電子部品の電
極構造の製造方法は、略直方体形状の絶縁基板、該絶縁
基板の上面端部に対向する一対の上面電極を設け、該一
対の上面電極は、それぞれその裏面に下面電極と、その
側面に、前記上面電極及び前記下面電極と連なる側面電
極を形成して、前記上面電極に電子素子を実装し、樹脂
封止してなる側面型電子部品の電極構造の製造方法にお
いて、多数個取りする集合絶縁基板に、所定間隔で複数
列の長穴状のスルーホールを配列し、該対向する長穴状
のスルーホールと連通し、且つ、所定間隔で対向する位
置に凹部を形成するスルーホール加工工程と、メッキ処
理により前記長穴状のスルーホールの内面を含む集合絶
縁基板の全表面に銅メッキ層を形成するメッキ工程と、
メッキレジストをラミネートし、露光現像後パターンマ
スクを形成し、パターンエッチングを行い、前記集合絶
縁基板の上面及び下面に上面電極及び下面電極を形成
し、前記凹部を含む長穴状スルーホール面に対向する側
面電極を形成して、前記上面電極、側面電極及び下面電
極が連続的に繋がるように形成するエッチング工程と、
前記上面電極に電子素子を固着する実装工程と、前記電
子素子を樹脂封止する封止工程と、前記側面型電子部品
集合体の前記長穴状のスルーホールの凹部を通るカット
ラインに沿って集合絶縁基板を切断して単個の完成側面
型電子部品に分割する切断工程とからなることを特徴と
するものである。Further, in the method of manufacturing an electrode structure of a side-type electronic component according to the present invention, a substantially rectangular parallelepiped-shaped insulating substrate is provided, and a pair of upper electrodes facing the upper end of the insulating substrate is provided. A lower surface electrode on the back surface thereof, and a side surface electrode connected to the upper surface electrode and the lower surface electrode on the side surface thereof. An electronic element is mounted on the upper surface electrode, and the side surface type electronic component is resin-sealed. In the manufacturing method of the electrode structure, a plurality of rows of elongated through-holes are arranged at predetermined intervals on a collective insulating substrate to be taken in large numbers, communicate with the opposed elongated-hole-shaped through-holes, and at predetermined intervals. A through-hole processing step of forming a concave portion at an opposing position, and a plating step of forming a copper plating layer on the entire surface of the collective insulating substrate including the inner surface of the elongated hole-shaped through hole by plating.
Laminate a plating resist, form a pattern mask after exposure and development, perform pattern etching, form upper and lower electrodes on the upper and lower surfaces of the collective insulating substrate, and face the elongated through-hole surface including the recess. An etching step of forming side electrodes to be formed, and forming the upper surface electrode, the side electrode, and the lower electrode so as to be continuously connected,
A mounting step of fixing an electronic element to the upper surface electrode, a sealing step of resin-sealing the electronic element, and a cut line passing through a recess of the elongated hole-shaped through hole of the side-surface type electronic component assembly. A cutting step of cutting the collective insulating substrate and dividing it into a single completed side-surface-type electronic component.
【００１３】[0013]
【発明の実施の形態】以下図面に基づいて本発明におけ
る側面型電子部品の電極構造及びその製造方法について
説明する。図１〜図６は本発明の実施の形態である側面
型電子部品の電極構造及びその製造方法に係わり、図１
は、側面型電子部品をプリント基板に実装した状態の斜
視図、図２は、図１のＢ−Ｂ線断面図、図３は側面型電
子部品の斜視図、図４は図３の平面図、図５は図３のＣ
−Ｃ線断面図、図６は側面型電子部品の電極構造の製造
方法を示す斜視図である。図において、従来技術と同一
部材は同一符号で示す。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an electrode structure of a side-type electronic component and a method of manufacturing the same according to the present invention will be described with reference to the drawings. 1 to 6 relate to an electrode structure of a side-type electronic component and a method of manufacturing the same according to an embodiment of the present invention.
Is a perspective view of a state in which the side-type electronic component is mounted on a printed circuit board, FIG. 2 is a cross-sectional view taken along line BB of FIG. 1, FIG. 3 is a perspective view of the side-type electronic component, and FIG. , FIG. 5 shows C in FIG.
FIG. 6 is a perspective view showing a method of manufacturing the electrode structure of the side-surface type electronic component. In the drawings, the same members as those of the prior art are denoted by the same reference numerals.
【００１４】図１〜図５において、側面型電子部品の電
極構造について説明する。１は略直方体形状の絶縁基
板、２は該絶縁基板１の上面端部に対向する一対の上面
電極、３は前記一対の上面電極２のそれぞれその裏面に
形成した下面電極である。４は前記絶縁基板１の側面
に、前記上面電極２及び前記下面電極３と連なる側面電
極である。前記上面電極２、下面電極３、側面電極４が
前記絶縁基板１の端部周囲を一周するように形成されて
いる。前記側面電極４は、少なくとも後述するマザーボ
ードと固着する電極面には、外側コーナー部で上面電極
２から下面電極３にわたり凹部（図１では円弧形状）４
ａが形成されている。５は電子素子、例えばＬＥＤであ
り、前記一対の上面電極２の一方に接着又は半田等の固
着手段でダイボンディングされ、他方はボンディングワ
イヤ６で接続されている。前記電子素子５及びその接続
部を保護するために，前記ＬＥＤの発光を効果的にする
ために、透光性のエポキシ樹脂等の封止樹脂７で封止す
る。以上により側面型電子部品２０が構成される。1 to 5, the electrode structure of the side-type electronic component will be described. Reference numeral 1 denotes a substantially rectangular parallelepiped insulating substrate, 2 denotes a pair of upper electrodes facing the upper end of the insulating substrate 1, and 3 denotes lower electrodes formed on the back surfaces of the pair of upper electrodes 2, respectively. Reference numeral 4 denotes a side electrode connected to the upper surface electrode 2 and the lower surface electrode 3 on the side surface of the insulating substrate 1. The upper surface electrode 2, the lower surface electrode 3, and the side surface electrode 4 are formed so as to make a circuit around the end of the insulating substrate 1. The side surface electrode 4 has a concave portion (an arc shape in FIG. 1) extending from the upper surface electrode 2 to the lower surface electrode 3 at an outer corner at least on an electrode surface to be fixed to a motherboard described later.
a is formed. Reference numeral 5 denotes an electronic element, for example, an LED, which is die-bonded to one of the pair of upper electrodes 2 by a bonding means such as bonding or soldering, and the other is connected by a bonding wire 6. In order to protect the electronic element 5 and the connection portion thereof, the LED is sealed with a sealing resin 7 such as a translucent epoxy resin in order to effectively emit light from the LED. As described above, the side electronic component 20 is configured.
【００１５】図１及び図２に示すように、前記側面型電
子部品２０の電子素子５が側面発光するように側面に向
けて使用するとき、前記側面型電子部品２０のマザーボ
ード９の配線パターン１０に固着する際に、前記マザー
ボード９に固着する絶縁基板１側の側面電極４の外側コ
ーナー部で、上面電極から下面電極にわたり凹部４ａが
形成されて、半田付け面積が拡大されているので、半田
１１は配線パターン１０と絶縁基板１の凹部４ａを含む
側面電極４を濡らして確実に固着されて、半田固定力は
向上する。半田付け不良が発生し難く、また、外部から
予期せぬ衝撃力が加わった時に、固着面が剥がることも
ない。As shown in FIGS. 1 and 2, when the electronic element 5 of the side-type electronic component 20 is used toward the side surface so as to emit light from the side, the wiring pattern 10 on the motherboard 9 of the side-type electronic component 20 is used. Since the recess 4a is formed from the upper surface electrode to the lower surface electrode at the outer corner portion of the side electrode 4 on the insulating substrate 1 side fixed to the motherboard 9, the soldering area is enlarged. Numeral 11 wets the wiring pattern 10 and the side surface electrode 4 including the concave portion 4a of the insulating substrate 1 and is securely fixed, so that the solder fixing force is improved. Insufficient soldering hardly occurs, and the fixing surface does not peel off when an unexpected impact force is applied from the outside.
【００１６】図６において、その製造方法を説明する。
図６（ａ）は側面型電子部品集合体、図６（ｂ）は表側
電極構造、図６（ｃ）は裏側電極構造を示す。Referring to FIG. 6, the manufacturing method will be described.
6A shows a side-type electronic component assembly, FIG. 6B shows a front-side electrode structure, and FIG. 6C shows a back-side electrode structure.
【００１７】先ず、スルーホール加工工程は、ガラスエ
ポキシ樹脂等よりなる多数個取りする集合絶縁基板２１
に、所定間隔で複数列の長穴状のスルーホール２２ｂ
と、それぞれ対向する２つの長穴状のスルーホール２２
ｂにおいて、所定間隔で前記長穴状のスルーホール２２
ｂと連なり、且つ、対向する位置に複数個の凹部、例え
ば、本実施の形態では、半円形状部２２ａを施すスルー
ホール２２を形成するスルーホール加工を、切削又はプ
レス等の加工手段により形成する。First, a through-hole processing step is performed by assembling a plurality of collective insulating substrates 21 made of glass epoxy resin or the like.
A plurality of rows of elongated through holes 22b at predetermined intervals;
And two opposed long-hole-shaped through holes 22
b, the elongated through-holes 22 at predetermined intervals.
b, and a plurality of recesses at positions opposed to each other, for example, in this embodiment, a through-hole processing for forming a through-hole 22 for forming the semi-circular portion 22a is formed by processing means such as cutting or pressing. I do.
【００１８】次に、メッキ工程において、前記スルーホ
ール２２の壁面を含む集合絶縁基板２１の全表面を洗浄
した後、前記集合絶縁基板２１の全表面に無電解メッキ
及び電解メッキにより銅メッキ層を形成する。Next, in a plating step, after cleaning the entire surface of the collective insulating substrate 21 including the wall surfaces of the through holes 22, a copper plating layer is formed on the entire surface of the collective insulating substrate 21 by electroless plating and electrolytic plating. Form.
【００１９】更に、エッチング工程において、メッキレ
ジストをラミネートし、露光現像してパターンマスクを
形成した後、通常の基板エッチング液を用いてパターン
エッチングを行うことにより、前記集合絶縁基板２１の
上面及び下面に上面電極２及び下面電極３を形成し、前
記長穴状スルーホール２２ｂと半円形状部２２ａの壁面
とで側面電極４を形成する。図６（ｂ）、（ｃ）に示す
ように、前記上面電極２及び下面電極３は、凹部４ａを
含む側面電極４を介して周囲を一周するように繋がって
形成される。Further, in the etching step, a plating resist is laminated, exposed and developed to form a pattern mask, and then subjected to pattern etching using a normal substrate etching solution, so that the upper and lower surfaces of the collective insulating substrate 21 are formed. The upper surface electrode 2 and the lower surface electrode 3 are formed on the upper surface, and the side surface electrode 4 is formed by the elongated hole 22b and the wall surface of the semicircular portion 22a. As shown in FIGS. 6B and 6C, the upper surface electrode 2 and the lower surface electrode 3 are formed so as to make a round around the periphery via a side surface electrode 4 including a concave portion 4a.
【００２０】次に、電子素子の実装工程において、前記
集合絶縁基板２１に形成された前記それぞれの一対の上
面電極２に、従来と同様に電子素子５、例えばＬＥＤを
接着剤または半田等の固着手段で実装する。Next, in a mounting step of the electronic element, the electronic element 5, for example, an LED is fixed to the pair of upper electrodes 2 formed on the collective insulating substrate 21 in the same manner as in the prior art using an adhesive or solder. Implement by means.
【００２１】樹脂封止工程は、透光性のエポキシ樹脂等
の封止樹脂７で、トランスファーモールド等のモールド
手段で、各列毎に前記電子素子５及び接続部を覆うよう
に樹脂封止され、側面型電子部品集合体２３ができる。In the resin sealing step, resin sealing is performed with a sealing resin 7 such as a translucent epoxy resin by a molding means such as transfer molding so as to cover the electronic elements 5 and the connection portions for each column. Thus, the side-type electronic component assembly 23 is formed.
【００２２】切断工程は、前記側面型電子部品集合体２
３を切断して単個の完成側面型電子部品に分割するの
に、各列の前記側面電極４の半円形状部２２ａの中心を
通るカットライン２４に沿ってダイシング又はスライシ
ングマシン等で１チップに切断、分離することにより、
図３に示すような、略直方体の絶縁基板１の四隅のコー
ナー部で、前記上面電極２から前記下面電極３にわたる
側面電極４に円弧状の凹部４ａを有する側面型電子部品
２０が完成される。In the cutting step, the side-type electronic component assembly 2
3 is cut and divided into single completed side-surface-type electronic components by dicing or slicing machine along a cut line 24 passing through the center of the semicircular portion 22a of the side electrode 4 in each row. By cutting and separating into
As shown in FIG. 3, a side-surface-type electronic component 20 having an arc-shaped concave portion 4a in a side electrode 4 extending from the upper electrode 2 to the lower electrode 3 at four corners of the substantially rectangular parallelepiped insulating substrate 1 is completed. .
【００２３】[0023]
【発明の効果】以上説明したように、本発明によれば、
側面型電子部品の電極構造において、側面電極を形成す
る長穴状のスルーホールの縦壁面の対向する位置に、凹
部を形成して、上面電極、下面電極及び側面電極が端部
を一周するように電極形成し、電子素子を実装、樹脂封
止後に、前記凹部形状上のカットラインに沿って切断す
ることにより、前記側面電極の外側コーナー部で、上面
電極から下面電極にわたり凹部が形成されて、前記側面
型電子部品の電子素子が側面発光するように側面に向け
て使用するとき、前記側面型電子部品をプリント基板等
のマザーボードに固着する際に、マザーボードと固着す
る側面電極の半田付け面積が拡大される。従って、側面
型電子部品はマザーボードに確実に固着され、半田固定
力は著しく向上する。半田付け不良が発生し難く、ま
た、外部から予期せぬ衝撃力が加わった時に、固着面が
剥がれることもない。前記側面電極の凹部形状の形成
は、長穴状のスルーホール形成時に行うので、コストア
ップすることはない。生産性、経済性及び信頼性の優れ
た側面型電子部品の電極構造及びその製造方法を提供す
ることが可能である。As described above, according to the present invention,
In the electrode structure of the side-surface-type electronic component, a concave portion is formed at a position facing the vertical wall surface of the elongated through-hole forming the side surface electrode so that the upper surface electrode, the lower surface electrode, and the side surface electrode go around the end. After the electrodes are formed, the electronic element is mounted, and after resin sealing, by cutting along the cut line on the concave shape, a concave portion is formed from the upper electrode to the lower electrode at the outer corner portion of the side electrode. When the electronic element of the side-type electronic component is used toward the side surface so as to emit side light, when the side-type electronic component is fixed to a motherboard such as a printed circuit board, a soldering area of a side electrode fixed to the motherboard. Is enlarged. Therefore, the side-surface-type electronic component is securely fixed to the motherboard, and the solder fixing force is significantly improved. Insufficient soldering hardly occurs, and the fixing surface does not peel off when an unexpected impact force is applied from the outside. Since the formation of the concave shape of the side electrode is performed at the time of forming the elongated through hole, the cost does not increase. It is possible to provide an electrode structure of a side-type electronic component excellent in productivity, economy and reliability, and a method for manufacturing the same.
【図１】本発明の実施の形態に係わるマザーボードに固
着した状態を示す側面型電子部品の斜視図である。FIG. 1 is a perspective view of a side-type electronic component showing a state of being fixed to a motherboard according to an embodiment of the present invention.
【図２】図１のＢ−Ｂ線断面図である。FIG. 2 is a sectional view taken along line BB of FIG.
【図３】図１の側面型電子部品の斜視図である。FIG. 3 is a perspective view of the side electronic component of FIG. 1;
【図４】図３の平面図である。FIG. 4 is a plan view of FIG. 3;
【図５】図３のＣ−Ｃ線断面図である。FIG. 5 is a sectional view taken along line CC of FIG. 3;
【図６】図６（ａ）は本発明の実施の形態に係わる側面
型電子部品集合体及びその製造方法を説明する斜視図、
図６（ｂ）、（ｃ）は表側、裏側の電極構造を示す斜視
図である。FIG. 6A is a perspective view illustrating a side-type electronic component assembly and a method of manufacturing the same according to an embodiment of the present invention;
FIGS. 6B and 6C are perspective views showing the front and back electrode structures.
【図７】従来のマザーボードに固着した状態を示す側面
型電子部品の斜視図である。FIG. 7 is a perspective view of a conventional side-type electronic component in a state of being fixed to a motherboard.
【図８】図７のＡ−Ａ線断面図である。FIG. 8 is a sectional view taken along line AA of FIG. 7;
１ 絶縁基板 ２ 上面電極 ３ 下面電極 ４ 側面電極 ４ａ 凹部 ５ 電子素子 ６ ボンディングワイヤ ７ 封止樹脂 ９ マザーボード １０ 配線パターン １１ 半田 ２０ 側面型電子部品 ２１ 集合絶縁基板 ２２ スルーホール ２２ａ 半円形状部 ２２ｂ 長穴状のスルーホール ２３ 側面型電子部品集合体 ２４ カットライン DESCRIPTION OF SYMBOLS 1 Insulating substrate 2 Upper surface electrode 3 Lower surface electrode 4 Side electrode 4a Depression 5 Electronic element 6 Bonding wire 7 Sealing resin 9 Motherboard 10 Wiring pattern 11 Solder 20 Side type electronic component 21 Collective insulating substrate 22 Through hole 22a Semicircular portion 22b Length Hole-shaped through-hole 23 Side-type electronic component assembly 24 Cut line
Claims (3)
上面端部に対向する一対の上面電極を設け、該一対の上
面電極は、それぞれその裏面に下面電極と、その側面
に、前記上面電極及び前記下面電極と連なる側面電極を
形成して、前記上面電極に電子素子を実装し、樹脂封止
してなる側面型電子部品の電極構造において、前記上面
電極、側面電極、下面電極が絶縁基板の端部周囲を一周
し、且つ、前記側面電極は絶縁基板のコーナー部で、上
面電極から下面電極にわたり凹部を有するように形成
し、前記電子素子を側面に向けて使用するとき、プリン
ト基板に固着する絶縁基板側の側面電極面に形成した凹
部により、半田付け面積を拡大したことを特徴とする側
面型電子部品の電極構造。An insulating substrate having a substantially rectangular parallelepiped shape, a pair of upper electrodes opposed to upper end portions of the insulating substrate, wherein each of the pair of upper electrodes has a lower electrode on its back surface and an upper surface on its side surface. In the electrode structure of a side-type electronic component in which an electrode and a side electrode connected to the lower electrode are formed, an electronic element is mounted on the upper electrode, and resin sealing is performed, the upper electrode, the side electrode, and the lower electrode are insulated. When the electronic device is used facing the side surface, the side surface electrode is formed so as to have a recess from the upper surface electrode to the lower surface electrode at the corner portion of the insulating substrate at the corner of the insulating substrate. An electrode structure for a side-type electronic component, characterized in that a soldering area is enlarged by a concave portion formed on a side surface electrode surface on an insulating substrate side fixed to the side surface.
形成するときの前記絶縁基板のコーナー部に設けたスル
ーホールであることを特徴とする請求項１記載の側面型
電子部品の電極構造。2. The electrode structure according to claim 1, wherein the recess of the side electrode is a through hole provided at a corner of the insulating substrate when the side electrode is formed. .
上面端部に対向する一対の上面電極を設け、該一対の上
面電極は、それぞれその裏面に下面電極と、その側面
に、前記上面電極及び前記下面電極と連なる側面電極を
形成して、前記上面電極に電子素子を実装し、樹脂封止
してなる側面型電子部品の電極構造の製造方法におい
て、多数個取りする集合絶縁基板に、所定間隔で複数列
の長穴状のスルーホールを配列し、該対向する長穴状の
スルーホールと連通し、且つ、所定間隔で対向する位置
に凹部を形成するスルーホール加工工程と、メッキ処理
により前記長穴状のスルーホールの内面を含む集合絶縁
基板の全表面に銅メッキ層を形成するメッキ工程と、メ
ッキレジストをラミネートし、露光現像後パターンマス
クを形成し、パターンエッチングを行い、前記集合絶縁
基板の上面及び下面に上面電極及び下面電極を形成し、
前記凹部を含む長穴状スルーホール面に対向する側面電
極を形成して、前記上面電極、側面電極及び下面電極が
連続的に繋がるように形成するエッチング工程と、前記
上面電極に電子素子を固着する実装工程と、前記電子素
子を樹脂封止する封止工程と、前記側面型電子部品集合
体の前記長穴状のスルーホールの凹部を通るカットライ
ンに沿って集合絶縁基板を切断して単個の完成側面型電
子部品に分割する切断工程とからなることを特徴とする
側面型電子部品の電極構造の製造方法。3. An insulating substrate having a substantially rectangular parallelepiped shape, a pair of upper electrodes facing an upper end of the insulating substrate, and a pair of upper electrodes each having a lower electrode on a back surface thereof and an upper surface on a side surface thereof. Forming a side electrode connected to the electrode and the lower electrode, mounting an electronic element on the upper electrode, and forming the electrode structure of the side-type electronic component by resin sealing; A through-hole processing step of arranging a plurality of rows of elongated through holes at predetermined intervals, communicating with the opposed elongated hole through holes, and forming a concave portion at a position opposed at predetermined intervals, and plating. A plating step of forming a copper plating layer on the entire surface of the collective insulating substrate including the inner surface of the elongated through-hole by processing, laminating a plating resist, forming a pattern mask after exposure and development, and forming a pattern mask. Performing etching, forming an upper electrode and a lower electrode on the upper and lower surfaces of the collective insulating substrate,
An etching step of forming a side electrode facing the elongated through-hole surface including the concave portion and forming the upper electrode, the side electrode and the lower electrode so as to be continuously connected, and fixing an electronic element to the upper electrode; A mounting step of sealing the electronic element with a resin, and a step of cutting the collective insulating substrate along a cut line passing through a concave portion of the elongated hole-shaped through hole of the side-surface type electronic component assembly. A method for manufacturing an electrode structure of a side-surface-type electronic component, comprising: a cutting step of dividing the completed side-type electronic component into pieces.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP03570297A JP4010424B2 (en) | 1997-02-05 | 1997-02-05 | Electrode structure of side surface type electronic component and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP03570297A JP4010424B2 (en) | 1997-02-05 | 1997-02-05 | Electrode structure of side surface type electronic component and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10223817A true JPH10223817A (en) | 1998-08-21 |
| JP4010424B2 JP4010424B2 (en) | 2007-11-21 |
Family
ID=12449214
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP03570297A Expired - Lifetime JP4010424B2 (en) | 1997-02-05 | 1997-02-05 | Electrode structure of side surface type electronic component and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4010424B2 (en) |
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