JPH10195666A - Pretreating solution for electroless plating and electroless planting method - Google Patents
Pretreating solution for electroless plating and electroless planting methodInfo
- Publication number
- JPH10195666A JPH10195666A JP35685096A JP35685096A JPH10195666A JP H10195666 A JPH10195666 A JP H10195666A JP 35685096 A JP35685096 A JP 35685096A JP 35685096 A JP35685096 A JP 35685096A JP H10195666 A JPH10195666 A JP H10195666A
- Authority
- JP
- Japan
- Prior art keywords
- electroless plating
- solution
- plated
- electroless
- pretreatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【発明が属する技術分野】本発明は、非金属である被め
っき体への無電解めっきを容易にするための前処理液
と、非金属である被めっき体への無電解めっき方法に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pretreatment liquid for facilitating electroless plating of a nonmetallic object to be plated and a method of electroless plating of a nonmetallic object to be plated.
【０００２】[0002]
【従来の技術】無電解めっき法は複雑な形状面にも均一
な析出が可能であり、種々の用途に用いられている。例
えば、酸化インジウムスズ（ＩＴＯ）被膜からなる透明
導電膜において、他の機器との接続をとるために無電解
めっきによってＩＴＯの接続部位の表面を金属化するこ
とが行われており、また、樹脂基板やセラミックス基板
等の絶縁性基板上への金属被膜の形成等にも用いられて
いる。2. Description of the Related Art The electroless plating method enables uniform deposition even on a complicated shape surface, and is used for various purposes. For example, in a transparent conductive film made of an indium tin oxide (ITO) film, a surface of a connection portion of the ITO is metallized by electroless plating in order to establish a connection with another device. It is also used for forming a metal film on an insulating substrate such as a substrate or a ceramic substrate.
【０００３】ところで、無電解めっき法は、上述のＩＴ
Ｏや絶縁性基板等のように触媒活性のない表面に金属被
膜等を形成する場合、金属被膜等の形成部位に予めパラ
ジウム等の触媒金属核を付与する必要がある。従来、触
媒金属核の付与に用いられる触媒液としては、例えば、
塩化パラジウムと塩酸からなるＰｄＣｌ2 溶液が知られ
ている。しかし、このＰｄＣｌ2 溶液は、浴安定性は良
好なもののＩＴＯや絶縁性基板等のような非金属からな
る被めっき体に対しては使用できないという問題があっ
た。このため、非金属からなる被めっき体への触媒金属
核の付与には、 塩化パラジウムと塩酸の混合溶液にアルカリを組み合
わせたＰｄＣｌ2 溶液、 塩化パラジウムと塩化第一スズと塩酸とを組み合わせ
たＳｎ−Ｐｄコロイド溶液等が使用されていた。By the way, the electroless plating method uses the above-described IT.
When a metal coating or the like is formed on a surface having no catalytic activity, such as O or an insulating substrate, it is necessary to previously provide a catalytic metal nucleus such as palladium to the formation site of the metal coating or the like. Conventionally, as a catalyst liquid used for providing a catalytic metal nucleus, for example,
A PdCl 2 solution consisting of palladium chloride and hydrochloric acid is known. However, this PdCl 2 solution has a problem that although it has good bath stability, it cannot be used for a non-metallic plating object such as ITO or an insulating substrate. Therefore, in order to provide the catalytic metal nucleus to the non-metallic plating object, a PdCl 2 solution in which alkali is combined with a mixed solution of palladium chloride and hydrochloric acid, and a Sn in which palladium chloride, stannous chloride and hydrochloric acid are combined are used. -A Pd colloid solution or the like has been used.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、上記
のＰｄＣｌ2 溶液は、ＩＴＯ上への無電解めっきに使用
する場合、浴ｐＨを中性付近に調整する必要があり、ｐ
Ｈの許容範囲が狭く工程管理が煩雑であるとともに、浴
安定性が悪いという問題があった。さらに、絶縁性基板
への無電解めっきに使用できないという問題もあった。However, when the above PdCl 2 solution is used for electroless plating on ITO, it is necessary to adjust the pH of the bath to near neutrality.
There is a problem that the allowable range of H is narrow, the process control is complicated, and the bath stability is poor. Further, there is a problem that it cannot be used for electroless plating on an insulating substrate.
【０００５】一方、上記のＳｎ−Ｐｄコロイド溶液
は、ＩＴＯのみならず絶縁性基板への無電解めっきにも
使用でき、また、浴安定性も良好であるが、製造が難し
く価格が高いという問題があった。さらに、触媒金属核
を付与した後、無電解めっき工程前にスズ除去処理が必
要となり、無電解めっき工程が煩雑になるという問題も
あった。On the other hand, the above-mentioned Sn-Pd colloid solution can be used not only for ITO but also for electroless plating on an insulating substrate and has good bath stability, but is difficult to manufacture and expensive. was there. Further, after the catalytic metal nucleus is provided, a tin removal treatment is required before the electroless plating step, and there is a problem that the electroless plating step becomes complicated.
【０００６】本発明は上述のような事情に鑑みてなされ
たものであり、安定性が良好で廉価な触媒液を使用して
非金属である被めっき体に良好な無電解めっきを可能な
らしめる前処理液と、非金属である被めっき体への無電
解めっき方法を提供することを目的とする。The present invention has been made in view of the above-mentioned circumstances, and enables good electroless plating of a non-metallic object to be plated by using a low-cost catalyst solution having good stability. An object of the present invention is to provide a pretreatment solution and a method for electroless plating a non-metallic object to be plated.
【０００７】[0007]
【課題を解決するための手段】このような目的を達成す
るために、本発明の無電解めっきの前処理液は、水溶性
の不飽和有機化合物を０．５〜２００ｇ／ｌの範囲で含
有するような構成とした。In order to achieve the above object, the pretreatment liquid for electroless plating according to the present invention contains a water-soluble unsaturated organic compound in a range of 0.5 to 200 g / l. Configuration.
【０００８】また、本発明の無電解めっきの前処理液
は、前記不飽和有機化合物が不飽和アルコールであるよ
うな構成とした。Further, the pretreatment liquid for electroless plating of the present invention has a constitution in which the unsaturated organic compound is an unsaturated alcohol.
【０００９】本発明の無電解めっき方法は、無電解めっ
きによる金属被膜の形成前に、上述のような前処理液に
被めっき体を浸漬して予め前処理を施し、次いで、前記
被めっき体に、パラジウム、白金、金、銀および銅の塩
の１種と無機酸からなる触媒液を用いて金属触媒核を付
与するような構成とした。According to the electroless plating method of the present invention, before forming a metal film by electroless plating, the object to be plated is immersed in a pretreatment liquid as described above to perform a pretreatment in advance, and then the object to be plated is A metal catalyst nucleus was provided by using a catalyst solution comprising one of palladium, platinum, gold, silver and copper salts and an inorganic acid.
【００１０】[0010]
【発明の実施の形態】次に、本発明の最適な実施形態に
ついて説明する。Next, an embodiment of the present invention will be described.
【００１１】本発明の無電解めっきの前処理液を構成す
る水溶性の不飽和有機化合物としては、２−プロピン−
１−オール、２−プロペン−１−オール、３−メチル−
１−ブチン−３−オール、３−メチル−１−ペンチン−
３−オール、２−ブチン−１，４−ジオール、２，４，
７，９−テトラメチル−５−デシン−４，７−ジオー
ル、１，４−ブタンジオール、３，６−ジメチル−４−
オクチン−３，６−ジオール等の１価あるいは多価の不
飽和アルコール；アクリル酸、アクリル酸エチル等の不
飽和カルボン酸およびその誘導体等を挙げることができ
る。そして、前処理液中の水溶性の不飽和有機化合物の
濃度は、０．５〜２００ｇ／ｌ程度、好ましくは１．０
〜１００ｇ／ｌ程度とすることができる。水溶性の不飽
和有機化合物の濃度が０．５ｇ／ｌ未満であると、従来
の塩化パラジウムと塩酸からなるＰｄＣｌ2 触媒液等に
よる金属触媒核の付与処理後の無電解めっきにおける金
属析出が不可能となる。一方、水溶性の不飽和有機化合
物の濃度が２００ｇ／ｌを超えても金属析出が更に向上
することはなく、材料コストの増大を来すので好ましく
ない。The water-soluble unsaturated organic compound constituting the pretreatment liquid for electroless plating of the present invention is 2-propyne-
1-ol, 2-propen-1-ol, 3-methyl-
1-butyn-3-ol, 3-methyl-1-pentyne-
3-ol, 2-butyne-1,4-diol, 2,4,
7,9-tetramethyl-5-decyne-4,7-diol, 1,4-butanediol, 3,6-dimethyl-4-
Monohydric or polyhydric unsaturated alcohols such as octin-3,6-diol; unsaturated carboxylic acids such as acrylic acid and ethyl acrylate; and derivatives thereof. The concentration of the water-soluble unsaturated organic compound in the pretreatment liquid is about 0.5 to 200 g / l, preferably about 1.0 to 200 g / l.
１００100 g / l. When the concentration of the water-soluble unsaturated organic compound is less than 0.5 g / l, metal deposition in the electroless plating after the treatment of applying a metal catalyst nucleus with a conventional PdCl 2 catalyst solution comprising palladium chloride and hydrochloric acid or the like does not occur. It becomes possible. On the other hand, even if the concentration of the water-soluble unsaturated organic compound exceeds 200 g / l, metal precipitation is not further improved and the material cost is increased, which is not preferable.
【００１２】本発明の無電解めっき方法は、無電解めっ
きによる金属被膜の形成前に、上述の本発明の前処理液
に被めっき体を浸漬して予め前処理を施し、次いで、被
めっき体に、パラジウム、白金、金、銀および銅の塩の
１種と無機酸からなる触媒液を用いて金属触媒核を付与
し、その後、無電解めっきを行うものである。According to the electroless plating method of the present invention, before forming a metal film by electroless plating, the object to be plated is immersed in the above-mentioned pretreatment solution of the present invention to perform pretreatment in advance, and then the object to be plated is A metal catalyst nucleus is provided by using a catalyst solution comprising one of palladium, platinum, gold, silver and copper salts and an inorganic acid, followed by electroless plating.
【００１３】本発明の前処理液による被めっき体の前処
理は、例えば、浴温度５〜５０℃、浸漬時間１〜６０分
の範囲で適宜条件を設定して行うことができる。但し、
実用的ではないが６０分を超える浸漬時間でも前処理液
としての性能に問題はない。The pretreatment of the object to be plated with the pretreatment solution of the present invention can be performed, for example, by appropriately setting conditions at a bath temperature of 5 to 50 ° C. and an immersion time of 1 to 60 minutes. However,
Although not practical, there is no problem in the performance as a pretreatment liquid even if the immersion time exceeds 60 minutes.
【００１４】対象となる被めっき体は、酸化インジウム
スズ（ＩＴＯ）等の透明導電膜、樹脂基板やセラミック
ス基板等の非金属体である。このような被金属からなる
被めっき体は、上記の前処理を施さずに、例えば、塩化
パラジウムと塩酸からなるＰｄＣｌ2 触媒液を用いてパ
ラジウム触媒核を付与しても、その後の無電解めっきに
おける金属析出は不可能である。The object to be plated is a transparent conductive film such as indium tin oxide (ITO) or a non-metallic body such as a resin substrate or a ceramic substrate. The object to be plated made of such a metal is not subjected to the above pretreatment, for example, even if a palladium catalyst nucleus is applied using a PdCl 2 catalyst solution comprising palladium chloride and hydrochloric acid, the subsequent electroless plating Is not possible.
【００１５】上記の前処理が完了し、洗浄、乾燥した
後、パラジウム、白金、金、銀および銅の塩の１種と無
機酸からなる触媒液を用いて被めっき体にパラジウム触
媒核を付与する。この触媒液は、ｐＨ調節が不要で浴安
定性が極めて良好であり、前処理が行われた被めっき体
に対する金属触媒核の付与を長期にわたって行うことが
できる。After completion of the above pretreatment, washing and drying, a palladium catalyst nucleus is applied to the object to be plated using a catalyst solution comprising one of palladium, platinum, gold, silver and copper salts and an inorganic acid. I do. This catalyst solution does not require pH adjustment, has extremely good bath stability, and can provide a metal catalyst nucleus to the pretreated body for a long time.
【００１６】本発明の前処理液は、例えば、無電解ニッ
ケル・リンめっき、無電解ニッケル・ボロンめっき、無
電解銅めっき、無電解コバルト・リンめっき等の無電解
めっき用として使用することができる。The pretreatment liquid of the present invention can be used for electroless plating such as electroless nickel / phosphorus plating, electroless nickel / boron plating, electroless copper plating, and electroless cobalt / phosphorus plating. .
【００１７】[0017]
【実施例】次に、実施例を示して本発明を更に詳細に説
明する。Next, the present invention will be described in more detail with reference to examples.
【００１８】まず、水溶性の不飽和有機化合物として、
２−ブチン１，４−ジオール、２−プロピン−１−オー
ル、２−プロペン−１−オール、アクリル酸、および、
アクリル酸エチルの５種を準備し、この不飽和有機化合
物を下記の表１に示すような濃度で含有させた水溶液
を、前処理液（Ａ−１〜Ａ−７）、前処理液（Ｂ−１〜
Ｂ−７）、前処理液（Ｃ−１〜Ｃ−７）、前処理液（Ｄ
−１〜Ｄ〜７）、前処理液（Ｅ−１〜Ｅ〜７）として調
製した。First, as a water-soluble unsaturated organic compound,
2-butyne 1,4-diol, 2-propyn-1-ol, 2-propen-1-ol, acrylic acid, and
Five kinds of ethyl acrylates were prepared, and an aqueous solution containing the unsaturated organic compound at a concentration shown in Table 1 below was used as a pretreatment liquid (A-1 to A-7) and a pretreatment liquid (B -1 to
B-7), pretreatment liquid (C-1 to C-7), pretreatment liquid (D
-1 to D-7) and pretreatment liquids (E-1 to E-7).
【００１９】次に、被めっき体として、酸化インジウム
スズ（ＩＴＯ）被膜を準備し、界面活性剤を１５ｇ／ｌ
含有する５０℃の浴中にＩＴＯ被膜を５分間浸漬して脱
脂を行い、次いで、上記の前処理液を２５℃に保った浴
中にＩＴＯ被膜を５分間浸漬して前処理を施し、その
後、水洗、乾燥した。Next, an indium tin oxide (ITO) film was prepared as an object to be plated, and a surfactant was added at 15 g / l.
The ITO film was immersed in a bath at 50 ° C. for 5 minutes to perform degreasing, and then pretreated by immersing the ITO film in a bath maintained at 25 ° C. for 5 minutes. , Washed and dried.
【００２０】一方、下記組成の塩化パラジウムと塩酸か
らなるＰｄＣｌ2 触媒液Ｉを調製した。On the other hand, a PdCl 2 catalyst solution I consisting of palladium chloride and hydrochloric acid having the following composition was prepared.
【００２１】 触媒液Ｉの組成 ・塩化パラジウム … ０．１ｇ／ｌ ・３６％塩酸 … ３．０ｇ／ｌ この触媒液Ｉを使用した２５℃の浴中に、上述の前処理
が完了した各ＩＴＯ被膜を５分間浸漬してパラジウム触
媒核の付与を行い、その後、下記組成の無電解めっき浴
（浴温８０℃、ｐＨ４．６）に５分間浸漬して無電解め
っきを行った。 Composition of catalyst solution I : palladium chloride: 0.1 g / l; 36% hydrochloric acid: 3.0 g / l Each of the ITOs having been subjected to the above pretreatment was placed in a bath at 25 ° C. using the catalyst solution I. The coating was immersed for 5 minutes to provide a palladium catalyst nucleus, and then immersed in an electroless plating bath (bath temperature 80 ° C., pH 4.6) having the following composition for 5 minutes to perform electroless plating.
【００２２】 無電解めっき浴組成 ・硫酸ニッケル・６水和物 … ２７ｇ／ｌ ・次亜リン酸 … １３ｇ／ｌ ・リンゴ酸 … １５ｇ／ｌ ・コハク酸 … ３．０ｇ／ｌ ・硝酸鉛 … ０．８ｍｇ／ｌ このような無電解めっきによるＩＴＯ被膜上へのニッケ
ル・リンの析出状態を下記の基準で評価して、結果を下
記の表１に示した。 Electroless plating bath composition : nickel sulfate hexahydrate 27 g / l hypophosphorous acid 13 g / l malic acid 15 g / l succinic acid 3.0 g / l lead nitrate 0 0.8 mg / l The state of precipitation of nickel and phosphorus on the ITO film by such electroless plating was evaluated according to the following criteria. The results are shown in Table 1 below.
【００２３】ニッケル・リンの析出評価基準 ○：全体にニッケル・リンが析出する △：部分的にニッケル・リンが析出する ×：未析出 また、比較として、界面活性剤を１５ｇ／ｌ含有する５
０℃の浴中にＩＴＯ被膜を５分間浸漬して脱脂を行い、
次いで、フッ素化合物を２ｇ／ｌ含有する２５℃の浴中
にＩＴＯ被膜を５分間浸漬してコンディショニングを行
い、その後、下記組成の塩化パラジウムと塩酸の混合溶
液にアルカリを組み合わせたＰｄＣｌ2触媒液IIを使用
した２５℃の浴中に、ＩＴＯ被膜を５分間浸漬してパラ
ジウム触媒核の付与を行った。次いで、上記の組成の無
電解めっき浴（浴温８０℃、ｐＨ４．６）に５分間浸漬
して無電解めっきを行った。 Evaluation criteria for nickel / phosphorus deposition ○: Nickel / phosphorus precipitates over the entire surface △: Nickel / phosphorus precipitates partially x: Not precipitated Also, as a comparison, 5 containing a surfactant of 15 g / l
The ITO film was immersed in a bath at 0 ° C. for 5 minutes to perform degreasing,
Next, by conditioning the ITO film was dipped for 5 minutes a fluorine compound in a bath of 2 g / l 25 ° C. containing, thereafter, PdCl 2 catalyst solution II which combines an alkali in a mixed solution of palladium chloride and hydrochloric acid following composition The ITO coating was immersed in a bath at 25 ° C. for 5 minutes to give palladium catalyst nuclei. Next, it was immersed in an electroless plating bath having the above composition (bath temperature 80 ° C., pH 4.6) for 5 minutes to perform electroless plating.
【００２４】 触媒液IIの組成 ・塩化パラジウム … ０．１ｇ／ｌ ・３６％塩酸 … ３．０ｇ／ｌ ・水酸化ナトリウム … １．２ｇ／ｌ このような無電解めっきによるＩＴＯ被膜上へのニッケ
ル・リンの析出状態を上記と同様の基準で評価して、結
果を下記の表１に示した。 Composition of catalyst liquid II : palladium chloride: 0.1 g / l; 36% hydrochloric acid: 3.0 g / l; sodium hydroxide: 1.2 g / l nickel on the ITO film by such electroless plating -The deposition state of phosphorus was evaluated based on the same criteria as above, and the results are shown in Table 1 below.
【００２５】[0025]
【表１】 表１に示されるように、本発明の無電解めっき方法、す
なわち、本発明の前処理液（Ａ−２〜Ａ−７、Ｂ−２〜
Ｂ−７、Ｃ−２〜Ｃ−７、Ｄ−２〜Ｄ−７、Ｅ−２〜Ｅ
−７）を使用して前処理を行い、次いで、触媒液Ｉを用
いたパラジウム触媒核の付与を行った後に無電解めっき
を行った場合、ＩＴＯ被膜へのニッケル・リン析出が可
能であることが確認された。尚、使用した触媒液Ｉの浴
安定性は３週間以上であった。[Table 1] As shown in Table 1, the electroless plating method of the present invention, that is, the pretreatment liquids of the present invention (A-2 to A-7, B-2 to
B-7, C-2 to C-7, D-2 to D-7, E-2 to E
-7) Pretreatment is performed, and then, after applying a palladium catalyst nucleus using the catalyst solution I, and then performing electroless plating, nickel and phosphorus can be deposited on the ITO film. Was confirmed. The bath stability of the used catalyst solution I was 3 weeks or more.
【００２６】一方、触媒液IIを使用した従来の無電解め
っき方法にしたがった場合も、ＩＴＯ被膜へのニッケル
・リン析出が可能であることが確認された。しかし、使
用した触媒液IIの浴安定性は１日程度であった。On the other hand, when the conventional electroless plating method using the catalyst solution II was followed, it was confirmed that nickel and phosphorus could be deposited on the ITO film. However, the bath stability of the used catalyst solution II was about one day.
【００２７】[0027]
【発明の効果】以上詳述したように、本発明によれば前
処理液は、水溶性の不飽和有機化合物を０．５〜２００
ｇ／ｌの範囲で含有するものであり、このような前処理
液に被めっき体を浸漬して予め前処理を施すことによ
り、非金属である被めっき体に対して使用不可能であっ
たパラジウム、白金、金、銀および銅の塩の１種と無機
酸からなる触媒液、例えば、塩化パラジウムと塩酸から
なるＰｄＣｌ2 溶液のような触媒液を使用して非金属で
ある被めっき体に良好な無電解めっきを行うことが可能
となる。そして、本発明の無電解めっき方法では、上記
のＰｄＣｌ2 溶液のような安定性が良好で廉価な触媒液
の使用が可能となり、無電解めっきの工程管理が容易に
なるとともに、コストの低減が可能になる。As described above in detail, according to the present invention, the pretreatment liquid contains a water-soluble unsaturated organic compound in an amount of 0.5 to 200.
g / l, and the object to be plated was immersed in such a pretreatment liquid and subjected to pretreatment in advance, so that it could not be used for the object to be plated which was nonmetallic. Using a catalyst solution such as a PdCl 2 solution composed of palladium chloride and hydrochloric acid, using a catalyst solution composed of one of palladium, platinum, gold, silver and copper salts and an inorganic acid, Good electroless plating can be performed. In the electroless plating method of the present invention, a stable and inexpensive catalyst solution such as the PdCl 2 solution described above can be used, and the process control of the electroless plating can be facilitated, and the cost can be reduced. Will be possible.
フロントページの続き (72)発明者 初川 拓朗 埼玉県大宮市吉野町２丁目３番地１号 メ ルテックス株式会社研究部内 (72)発明者 江村 繁則 埼玉県大宮市吉野町２丁目３番地１号 メ ルテックス株式会社研究部内Continued on the front page (72) Inventor Takuro Hatsukawa 2-3-1, Yoshino-cho, Omiya-shi, Saitama Prefecture Meltex Co., Ltd. Research Department (72) Inventor Shigenori Emura 2-3-3, Yoshino-cho, Omiya-shi, Saitama Lutex Co., Ltd.
Claims (3)
００ｇ／ｌの範囲で含有することを特徴とする無電解め
っきの前処理液。1. The method according to claim 1, wherein the water-soluble unsaturated organic compound is 0.5 to 2
A pretreatment liquid for electroless plating, which is contained in a range of 00 g / l.
ルであることを特徴とする請求項１に記載の無電解めっ
きの前処理液。2. The pretreatment liquid for electroless plating according to claim 1, wherein the unsaturated organic compound is an unsaturated alcohol.
に、請求項１または請求項２に記載の前処理液に被めっ
き体を浸漬して予め前処理を施し、次いで、前記被めっ
き体に、パラジウム、白金、金、銀および銅の塩の１種
と無機酸からなる触媒液を用いて金属触媒核を付与する
ことを特徴とする無電解めっき方法。3. Prior to forming a metal film by electroless plating, the object to be plated is immersed in the pretreatment liquid according to claim 1 or 2 and subjected to pretreatment beforehand. An electroless plating method, characterized in that a metal catalyst nucleus is provided using a catalyst solution comprising one of salts of palladium, platinum, gold, silver and copper and an inorganic acid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP35685096A JPH10195666A (en) | 1996-12-26 | 1996-12-26 | Pretreating solution for electroless plating and electroless planting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP35685096A JPH10195666A (en) | 1996-12-26 | 1996-12-26 | Pretreating solution for electroless plating and electroless planting method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10195666A true JPH10195666A (en) | 1998-07-28 |
Family
ID=18451080
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP35685096A Pending JPH10195666A (en) | 1996-12-26 | 1996-12-26 | Pretreating solution for electroless plating and electroless planting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10195666A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007037176A1 (en) * | 2005-09-27 | 2007-04-05 | C. Uyemura & Co., Ltd. | Electroless palladium plating bath and electroless palladium plating method |
| JP2012001817A (en) * | 2011-08-09 | 2012-01-05 | C Uyemura & Co Ltd | Electroless palladium plating bath and electroless palladium plating method |
-
1996
- 1996-12-26 JP JP35685096A patent/JPH10195666A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007037176A1 (en) * | 2005-09-27 | 2007-04-05 | C. Uyemura & Co., Ltd. | Electroless palladium plating bath and electroless palladium plating method |
| JP2007092092A (en) * | 2005-09-27 | 2007-04-12 | C Uyemura & Co Ltd | Non-electrolyzed palladium plating bath, and electroless paradium plating method |
| US7678183B2 (en) | 2005-09-27 | 2010-03-16 | C. Uyemura & Co., Ltd. | Electroless palladium plating bath and electroless palladium plating method |
| JP2012001817A (en) * | 2011-08-09 | 2012-01-05 | C Uyemura & Co Ltd | Electroless palladium plating bath and electroless palladium plating method |
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