JPH10128742A - Manufacture of semiconductor sealing epoxy resin composition - Google Patents
Manufacture of semiconductor sealing epoxy resin compositionInfo
- Publication number
- JPH10128742A JPH10128742A JP29027296A JP29027296A JPH10128742A JP H10128742 A JPH10128742 A JP H10128742A JP 29027296 A JP29027296 A JP 29027296A JP 29027296 A JP29027296 A JP 29027296A JP H10128742 A JPH10128742 A JP H10128742A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin composition
- resin
- tablet
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は半導体封止用エポキ
シ樹脂組成物の製造方法に関するものである。The present invention relates to a method for producing an epoxy resin composition for encapsulating a semiconductor.
【０００２】[0002]
【従来の技術】一般的な半導体封止用樹脂組成物（以下
樹脂組成物という）は電気特性、耐熱性等に優れるエポ
キシ樹脂とフェノール樹脂硬化剤および硬化促進剤、離
型剤、難燃剤、着色剤等の添加剤に無機充填材５０〜９
０重量％含む構成からなる。該樹脂組成物の製造方法と
しては、樹脂組成物を構成する各成分をミキサーで予備
混合後、ロールあるいは押出機によりシート状にした後
冷却しハンマーミル等を用いて粉砕した後、所望の形状
のタブレットに成形するものである。しかしながら、粉
砕された樹脂組成物のタブレットは粉体圧縮して製造さ
れるためタブレット中に多量の空気を含み、成形する
際、脱気が不十分となり成形品中に気泡を含み封止され
た半導体の信頼性を損ねている。また、粉砕及びタブレ
ット化工程中に発生する粉塵により作業環境の悪化を招
き、成形工程中ではタブレットから粉塵が発生し設備の
汚染による成形品の信頼性の低下や作業環境の悪化を生
じさせている。また、粉砕設備からの金属粉の混入等封
止成形品の品質を損ねる要因ともなっている。2. Description of the Related Art A general resin composition for encapsulating a semiconductor (hereinafter referred to as a resin composition) is an epoxy resin and a phenol resin curing agent and a curing accelerator, a release agent, a flame retardant, Inorganic fillers 50 to 9 for additives such as colorants
It consists of 0% by weight. As a method for producing the resin composition, the components constituting the resin composition are premixed by a mixer, formed into a sheet by a roll or an extruder, cooled, pulverized using a hammer mill, or the like, and then cooled to a desired shape. It is molded into a tablet. However, since the tablet of the pulverized resin composition is manufactured by compressing the powder, it contains a large amount of air in the tablet, and when molding, the degassing is insufficient and the molded product contains bubbles and is sealed. The reliability of the semiconductor is impaired. In addition, dust generated during the pulverization and tableting processes causes a deterioration of the working environment, and during the molding process, dust is generated from the tablets, which lowers the reliability of the molded product due to contamination of the equipment and deteriorates the working environment. I have. In addition, it is a factor that impairs the quality of the sealed molded product, such as the incorporation of metal powder from the crushing equipment.
【０００３】[0003]
【発明が解決しようとする課題】本発明は、従来の混
練、粉砕、タブレットにいたる工程で得られる樹脂組成
物の粉塵、脱気不良、金属異物混入等に起因する信頼性
不足、成形時の整列等の工数増の問題点を解決するため
種々の検討の結果なされたもので、その目的とするとこ
ろは従来のタブレットから得られる諸特性を劣化させる
ことなく製造工程中も粉塵の発生がなく、タブレット中
には気泡の混入がなく、成形工程中にタブレットからの
粉落ちによる粉塵がなく、粉砕工程などからの金属粉の
混入不安のない半導体封止用エポキシ樹脂組成物の製造
方法を提供するものである。DISCLOSURE OF THE INVENTION The present invention relates to a resin composition obtained in the conventional steps of kneading, pulverizing, and tableting, which results in insufficient reliability due to dust, poor deaeration, mixing of foreign metal, etc. It has been the result of various studies to solve the problem of increased man-hours such as alignment, and its purpose is to eliminate dust during the manufacturing process without deteriorating the characteristics obtained from conventional tablets. Provided is a method for producing an epoxy resin composition for semiconductor encapsulation, in which no bubbles are mixed in the tablet, no dust is generated by powder falling from the tablet during the molding process, and there is no fear of mixing metal powder from the pulverizing process. Is what you do.
【０００４】[0004]
【課題を解決するための手段】本発明は、エポキシ樹
脂、フェノール樹脂硬化剤、無機充填材及び硬化促進剤
を必須成分とし、該無機充填材を全樹脂組成物中に６５
〜９３重量％含有する半導体封止用エポキシ樹脂組成物
を押出機を用いて混練する際に、樹脂温度が７０℃〜１
２０℃で所望の断面を複数持ちかつそれぞれが連結され
た賦形用ダイを用いてダイ温度が５０〜８５℃で押出成
形することを特徴とする半導体封止用エポキシ樹脂組成
物の製造方法に関するものである。所望の断面形状とし
ては、円形、楕円形、半楕円形、正方形、長方形、六角
形、八角形、菱形等が挙げられる。また、連結部は樹脂
組成物が押出し成形され所望の断面形状の成形品となっ
た際に折り曲げ切断の容易な断面形状で有ればよく、で
きるだけ厚さは薄く、長さは短い方がよく、共に５mm以
下であることが好ましい。According to the present invention, an epoxy resin, a phenol resin curing agent, an inorganic filler and a curing accelerator are essential components, and the inorganic filler is contained in the total resin composition in an amount of 65%.
When kneading an epoxy resin composition for semiconductor encapsulation containing up to 93% by weight using an extruder, the resin temperature is 70 ° C. to 1 ° C.
The present invention relates to a method for producing an epoxy resin composition for semiconductor encapsulation, wherein extrusion molding is performed at a die temperature of 50 to 85 ° C. using a shaping die having a plurality of desired cross sections at 20 ° C. and connected to each other. Things. Desired cross-sectional shapes include circular, elliptical, semi-elliptical, square, rectangular, hexagonal, octagonal, rhombic, and the like. Also, the connecting portion may have a cross-sectional shape that can be easily bent and cut when the resin composition is extruded and formed into a molded product having a desired cross-sectional shape, and it is better that the thickness is as thin as possible and the length is shorter. Are preferably 5 mm or less.
【０００５】[0005]
【発明の実施の形態】本発明に用いる樹脂組成物を構成
しているエポキシ樹脂、フェノール樹脂硬化剤、無機充
填材及び硬化促進剤は、通常半導体封止用エポキシ樹脂
組成物に用いるものならば、特に限定されるものではな
い。エポキシ樹脂としては、例えばクレゾールノボラッ
ク型エポキシ樹脂、ビフエニル型エポキシ樹脂、ジシク
ロペンタジエン型エポキシ樹脂等がある。フェノール樹
脂としては、フェノールノボラック型、フェノールアラ
ルキル型、ジシクロペンタジエン型等がある。無機充填
材の主体にはシリカ、アルミナ等がある。これらの充填
材の形状、粒度等には特別な限定はない。硬化促進剤に
は一般にイミダゾール、有機ホスフィン、１，８−ジア
ザビシクロ（５，４，０）ウンデセン−７等が使用され
る。更に、必要に応じてシランカップリング剤、三酸化
アンチモン等の難燃剤、カーボンブラック、カルナバワ
ックスあるいは低分子量ポリエチレン等の離型剤、樹脂
組成物の柔軟性を保持させるためのシリコーンオイル、
ゴム等を適宜添加してもよい。全樹脂組成物中の無機充
填材の量が６５重量％未満では封止後の成形収縮が大き
く成形品の信頼性が損なわれ、９３重量％を越えると極
端に設備摩耗が大きくなり流動性も悪く実用的ではな
い。BEST MODE FOR CARRYING OUT THE INVENTION The epoxy resin, phenolic resin curing agent, inorganic filler and curing accelerator constituting the resin composition used in the present invention are those which are usually used in epoxy resin compositions for semiconductor encapsulation. However, there is no particular limitation. Examples of the epoxy resin include a cresol novolak type epoxy resin, a biphenyl type epoxy resin, a dicyclopentadiene type epoxy resin, and the like. Examples of the phenol resin include a phenol novolak type, a phenol aralkyl type and a dicyclopentadiene type. The main inorganic filler includes silica, alumina and the like. There is no particular limitation on the shape, particle size and the like of these fillers. Generally, imidazole, organic phosphine, 1,8-diazabicyclo (5,4,0) undecene-7 and the like are used as the curing accelerator. Further, if necessary, a silane coupling agent, a flame retardant such as antimony trioxide, a release agent such as carbon black, carnauba wax or low molecular weight polyethylene, a silicone oil for maintaining the flexibility of the resin composition,
Rubber or the like may be appropriately added. If the amount of the inorganic filler in the entire resin composition is less than 65% by weight, molding shrinkage after sealing is large, and the reliability of the molded article is impaired. If it exceeds 93% by weight, equipment wear becomes extremely large and fluidity is also increased. Bad and not practical.
【０００６】本発明に用いる予熱混練装置は同方向回転
二軸押出機であり、使用するスクリュー、シリンダーの
形状及び材質には特に限定はないが多量に充填されてい
る無機系充填材に対する摩耗抵抗の高いものが望まし
い。混練時の樹脂温度が７０℃未満では樹脂を構成する
素原料の分散性、混練性が悪く、１２０℃を越えると急
速に硬化が生じてしまい所定の品質のものが得られな
い。所望の断面形状に賦形する押出機先端部に設置する
ダイの温度は８５℃を越えると外観がササクレ立ち、５
０℃未満ではダイ内の流動抵抗が大きくなり安定した形
状の押出ができない。The preheating kneading apparatus used in the present invention is a co-rotating twin-screw extruder. The shape and material of the screw and cylinder to be used are not particularly limited, but the abrasion resistance to a large amount of the filled inorganic filler is not limited. Is desirable. If the resin temperature during kneading is less than 70 ° C., the dispersibility and kneading properties of the raw materials constituting the resin are poor, and if it exceeds 120 ° C., curing occurs rapidly, and a product of predetermined quality cannot be obtained. When the temperature of the die installed at the tip of the extruder for shaping into a desired cross-sectional shape exceeds 85 ° C., the appearance becomes crispy,
If the temperature is less than 0 ° C., the flow resistance in the die becomes large, and extrusion of a stable shape cannot be performed.
【０００７】[0007]
【実施例】以下本発明の実施例を概略図で詳細し、比較
例との対比のもとで説明する。 《実施例１〜４、比較例１》下記に示す配合Ａ、Ｂ、
Ｃ、Ｄ、Ｅにて各原料をスーパーミキサーにより５分間
粉砕混合した。この混合原料を直径６５ｍｍのシリンダ
ー内径を持つ同方向回転二軸押出機１にてスクリュー回
転数３０ＲＰＭにて１１０℃の樹脂温度で溶融混練す
る。押出機に連結されたダイ２には所望の形状の成形品
３を９個連結した状態のダイリップ４で押出を行った。
ダイにはダイ冷却用のジャケットが設置され温水タイプ
の金型温調機を使用して６０℃に調節した。押出された
成形品は冷却を兼ねたスチールベルト式引き取り機５に
て引き取られる。室温まで冷却後、所定の長さに切断
し、次いで連結部分から折り所望の成形品を得た。得ら
れた成形品をトランスファー成形機（成形条件；金型温
度：１７５℃、圧力：７０kg／cm2 、成形時間：２分）
のポットに供給し樹脂封止し、離型後１７５℃、５時間
の条件下で後硬化をおこなった。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to schematic diagrams, and will be described in comparison with comparative examples. << Examples 1-4, Comparative Example 1 >> Formulations A and B shown below,
In C, D, and E, each raw material was pulverized and mixed by a super mixer for 5 minutes. This mixed raw material is melt-kneaded at a resin temperature of 110 ° C. at a screw rotation speed of 30 RPM by a co-rotating twin-screw extruder 1 having a cylinder inner diameter of 65 mm in diameter. The die 2 connected to the extruder was extruded with a die lip 4 in a state where nine molded articles 3 having a desired shape were connected.
The die was provided with a die cooling jacket, and the temperature was adjusted to 60 ° C. using a hot water type mold temperature controller. The extruded molded product is taken up by a steel belt type take-up machine 5 also serving as cooling. After cooling to room temperature, it was cut to a predetermined length, and then folded from the connection to obtain a desired molded product. The obtained molded product is transferred to a transfer molding machine (molding conditions: mold temperature: 175 ° C., pressure: 70 kg / cm 2 , molding time: 2 minutes).
And then resin-sealed, and after release, post-curing was performed at 175 ° C. for 5 hours.
【０００８】 配合Ａ 配合Ｂ 配合Ｃ 配合Ｄ 配合Ｅクレソ゛ールノホ゛ラック 型エホ゜キシ樹脂 １５ １０ ８ ５ ３ 臭素化エポキシ樹脂 ５ ３ ３ １ １ フェノールノボラック樹脂 １０ ５ ４ ２ １ 硬化促進剤(2ーメチルイミタ゛ソ゛ール) ０.５ ０.４ ０.３ ０.１ ０.１ 無機充填材（シリカ） ６６ ８０ ８４ ９１ ９４ カルナバワックス ０.３ ０.１ ０.１ ０.１ ０.１ 低分子量ポリエチレン ０.４ ０.１ ０.１ ０.１ ０.１ カーボンブラック ０.３ ０.２ ０.２ ０.１ ０.１ カップリング剤 ０.５ ０.２ ０.２ ０.１ ０.１ 三酸化アンチモン ２ １ １ ０.５ ０.５Formulation A Formulation B Formulation C Formulation D Formulation E Cresole novolak type epoxy resin 15 10 8 5 3 Brominated epoxy resin 5 3 3 1 1 Phenol novolak resin 10 5 4 2 1 Curing accelerator (2-methylimidazole) 0 0.5 0.4 0.3 0.1 0.1 Inorganic filler (silica) 66 80 84 91 94 Carnauba wax 0.3 0.1 0.1 0.1 0.1 Low molecular weight polyethylene 0.4 0.4 1 0.1 0.1 0.1 Carbon black 0.3 0.2 0.2 0.1 0.1 Coupling agent 0.5 0.2 0.2 0.1 0.1 Antimony trioxide 21 1 0.5 0.5
【０００９】《比較例２〜６》この実施例に対し従来法
である比較例は、ノズルから押し出されたものを冷却後
６メッシュ全通の粒度に粗粉砕し、押出成形品と同じ形
状に粉体圧縮した（得られたものはタブレットと通称さ
れている）。このタブレットを実施例と同様にトランス
ファー成形機に供給し樹脂封止を行った。実施例並びに
比較例における封止樹脂体の評価結果は表１のとおりで
あった。表中の判定基準を 粉塵 ×；有り ○；無し タブレット外観 ×；悪い ○；良い タブレット中のボイド ×；悪い ○；良い タフ゛レットハント゛リンク゛中の粉落ち ×；ササクレ有り ○；平滑 金型汚れ ×；有り ○；無し 成形機汚れ ×；有り ○；無し 成形性 ×；悪い ○；良い 総合判定 ×：欠点有り ○：すべて良好 で表示した。成形できない、あるいはササクレ状で成形
機にセットできないなどの理由によって判定ができない
ものは「−」で表示した。<Comparative Examples 2 to 6> In contrast to this example, a comparative example, which is a conventional method, is obtained by cooling a material extruded from a nozzle and then coarsely pulverizing it to a particle size of 6 meshes to obtain the same shape as an extruded product. Powder compacted (result obtained is commonly called a tablet). This tablet was supplied to a transfer molding machine and sealed with a resin in the same manner as in the example. Table 1 shows the evaluation results of the sealing resin bodies in Examples and Comparative Examples. The criteria in the table are: Dust ×; Yes ○; No Tablet appearance ×; Poor ○; Good Void in tablet ×; Poor ○; Good Tublet Hunt {Link} Powder omission ×; ○; No Molding machine stain ×; Yes ○; No Moldability ×; Poor ○; Good Overall judgment ×: Defects present ○: All displayed good. Those which could not be determined due to reasons such as being unable to be molded or being set in a molding machine in a crescent shape are indicated by "-".
【００１０】尚、本実施例３の配合Ｃにおいてダイ温度
を６０℃にし溶融混練時の樹脂温度を変更した場合の評
価結果を表２に、溶融混練時の樹脂温度を９０℃に維持
しダイ温度を変更した場合の評価結果を表３に示した。[0010] Table 2 shows the evaluation results when the die temperature was changed to 60 ° C and the resin temperature during melt-kneading was changed in Formulation C of Example 3, and the resin temperature during melt-kneading was maintained at 90 ° C. Table 3 shows the evaluation results when the temperature was changed.
【００１１】 表 １ 実 施 例 比 較 例 １ ２ ３ ４ １ ２ ３ ４ ５ ６ 樹脂組成物の配合 Ａ Ｂ Ｃ Ｄ Ｅ Ａ Ｂ Ｃ Ｄ Ｅ 樹脂製造工程 粉塵 ○ ○ ○ ○ ○ × × × × × タブレット 外観 ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ボイド ○ ○ ○ ○ ○ × × × × × 粉落ち ○ ○ ○ ○ ○ × × × × × 成形工程 粉塵 ○ ○ ○ ○ − ○ ○ ○ ○ − 金型汚れ ○ ○ ○ ○ − × × × × − 成形機汚れ ○ ○ ○ ○ − × × × × − 成形品 ボイド発生率(％) ０ ０ ０ ０ − ７ ５ ５ ４ − 電気抵抗率(Ω-cm) − 5x1014 − − − − 3x1013 − − − 総合判定 ○ ○ ○ ○ × × × × × × Table 1 Example Comparative Example 1 2 3 4 1 2 3 4 5 5 6 Mixing of resin composition ABCDEABBCDE resin manufacturing process dust ○ ○ ○ ○ ○ × × × × × Tablet Appearance ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ Void ○ ○ ○ ○ ○ × × × × × Powder drop ○ ○ ○ ○ ○ × × × × × Molding process Dust ○ ○ ○ ○ − ○ ○ ○ ○ − Mold stain ○ ○ ○ ○ − × × × × − Molding machine contamination ○ ○ ○ ○ − × × × × − Molded product void generation rate (%) 00 00 − 75 5 54 − Electric resistivity (Ω-cm) − 5x10 14 − − − − 3x10 13 − − − Overall judgment ○ ○ ○ ○ × × × × × ×
【００１２】 表 ２ 樹脂温度（℃） ６５ ７０ ９０ １２０ 125 樹脂製造工程での粉塵 ○ ○ ○ ○ ○ タブレット外観 × ○ ○ ○ ○ 成形性 × ○ ○ ○ × 成形品中のボイド発生率（％） × ０ ０ ０ ０ 総合判定 × ○ ○ ○ × 表 ３ ダイ温度（℃） ４５ ６０ ８０ ９０ 樹脂製造工程での粉塵 ○ ○ ○ ○ タブレット外観 × ○ ○ × 成形性 × ○ ○ × 成形品中のボイド発生率（％） − ０ ０ − 総合判定 × ○ ○ × Table 2 Resin temperature (° C) 65 70 90 120 125 Dust in resin manufacturing process ○ ○ ○ ○ ○ Tablet appearance × ○ ○ ○ ○ Moldability × ○ ○ ○ × Void generation rate in molded product (%) × 00 00 Overall judgment × ○ ○ ○ × Table 3 Die temperature (° C) 45 60 80 90 Dust in resin production process ○ ○ ○ ○ Tablet appearance × ○ ○ × Moldability × ○ ○ × Void generation rate in molded product (%)-00- Overall judgment × ○ ○ ×
【００１３】[0013]
【発明の効果】上記の実施例と比較例の対比より明らか
なように本発明によれば、比較法すなわち従来法の混
練、粉砕後に打錠工程を経て製造された樹脂組成物に較
べて樹脂封止体のボイドを減少させ製品の信頼性を大幅
に改善することができる。更に、樹脂組成物の製造工
程、成形工程での粉塵が改善でき、成形に際しても粉体
圧縮されたタブレットの様に金型に挿入する際の粉落ち
もなく封止された成形品は優れた水密性と電気絶縁性を
保有し、成形時の作業性も向上する優れた特徴を有して
いる。As is clear from the comparison between the above Examples and Comparative Examples, according to the present invention, the resin is compared with the resin composition produced by a conventional method, that is, kneading and pulverizing, followed by a tableting step. The void of the sealing body can be reduced, and the reliability of the product can be greatly improved. Furthermore, a molded product that can improve dust in the resin composition manufacturing process and the molding process, and has no powder drop when inserted into a mold like a powder compressed tablet even during molding, is excellent in sealing. It has excellent features that it has water tightness and electrical insulation, and also improves workability during molding.
【図面の簡単な説明】[Brief description of the drawings]
【図１】本発明で使用する装置の概略側面図FIG. 1 is a schematic side view of an apparatus used in the present invention.
【図２】本発明で使用する同方向回転二軸押出機のダイ
部分の拡大斜視図FIG. 2 is an enlarged perspective view of a die portion of the co-rotating twin-screw extruder used in the present invention.
【図３】本発明で使用するダイリップの拡大正面図FIG. 3 is an enlarged front view of a die lip used in the present invention.
【図４】本発明で得られる成形品の一部を示す斜視図FIG. 4 is a perspective view showing a part of a molded product obtained by the present invention.
１ 同方向回転二軸押出機 ２ 溶融樹脂押出用のダイ ３ 成形品 ４ 成形品形状が９個連結した状態のダイリップ ５ 成形品冷却用のスチールベルト式引き取り機 DESCRIPTION OF SYMBOLS 1 Co-rotating twin-screw extruder 2 Die for extruding molten resin 3 Molded product 4 Die lip with 9 molded product shapes connected 5 Steel belt type take-off machine for cooling molded product
フロントページの続き (51)Int.Cl.6 識別記号 ＦＩ // Ｂ２９Ｋ 61:04 63:00 503:04 Continued on the front page (51) Int.Cl. 6 Identification code FI // B29K 61:04 63:00 503: 04
Claims (1)
機充填材及び硬化促進剤を必須成分とし、該無機充填材
を全樹脂組成物中に６５〜９３重量％含有する半導体封
止用エポキシ樹脂組成物を押出機を用いて混練する際
に、樹脂温度が７０〜１２０℃で所望の断面を複数持ち
かつそれぞれが連結された賦形用ダイを用いてダイ温度
が５０〜８５℃で押出成形することを特徴とする半導体
封止用エポキシ樹脂組成物の製造方法。1. An epoxy resin composition for semiconductor encapsulation comprising an epoxy resin, a phenolic resin curing agent, an inorganic filler and a curing accelerator as essential components, and containing 65 to 93% by weight of the inorganic filler in the total resin composition. When the product is kneaded using an extruder, the resin is extruded at a die temperature of 50 to 85 ° C. using a shaping die having a plurality of desired cross sections and a plurality of desired cross sections each having a resin temperature of 70 to 120 ° C. A method for producing an epoxy resin composition for semiconductor encapsulation, comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29027296A JP3712302B2 (en) | 1996-10-31 | 1996-10-31 | Method for producing epoxy resin composition for semiconductor encapsulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29027296A JP3712302B2 (en) | 1996-10-31 | 1996-10-31 | Method for producing epoxy resin composition for semiconductor encapsulation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10128742A true JPH10128742A (en) | 1998-05-19 |
| JP3712302B2 JP3712302B2 (en) | 2005-11-02 |
Family
ID=17753997
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29027296A Expired - Fee Related JP3712302B2 (en) | 1996-10-31 | 1996-10-31 | Method for producing epoxy resin composition for semiconductor encapsulation |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3712302B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004050608A (en) * | 2002-07-19 | 2004-02-19 | Hitachi Chem Co Ltd | Method for manufacturing epoxy resin molded material tablet |
-
1996
- 1996-10-31 JP JP29027296A patent/JP3712302B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004050608A (en) * | 2002-07-19 | 2004-02-19 | Hitachi Chem Co Ltd | Method for manufacturing epoxy resin molded material tablet |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3712302B2 (en) | 2005-11-02 |
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