JPH11286013A - Manufacture of granular epoxy resin composition for sealing semiconductor and semiconductor device - Google Patents
Manufacture of granular epoxy resin composition for sealing semiconductor and semiconductor deviceInfo
- Publication number
- JPH11286013A JPH11286013A JP8866798A JP8866798A JPH11286013A JP H11286013 A JPH11286013 A JP H11286013A JP 8866798 A JP8866798 A JP 8866798A JP 8866798 A JP8866798 A JP 8866798A JP H11286013 A JPH11286013 A JP H11286013A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin composition
- granules
- semiconductor
- granular
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、顆粒状半導体封止
用エポキシ樹脂組成物の製造方法、及び該エポキシ樹脂
組成物で封止成形された半導体装置に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing an epoxy resin composition for encapsulating a granular semiconductor, and a semiconductor device encapsulated with the epoxy resin composition.
【０００２】[0002]
【従来の技術】一般に、半導体封止用エポキシ樹脂組成
物（以下樹脂組成物という）は、電気特性、耐熱性等に
優れるエポキシ樹脂とフェノール樹脂硬化剤，硬化促進
剤、離型剤、難燃剤、着色剤等の添加剤及び無機充填材
を５０〜９０重量％含む構成からなっている。樹脂組成
物の製造方法としては、樹脂組成物を構成する各成分を
混練機で予備混合後、ロール、単軸押出機とロールの組
合せ、又は２軸押出機により混練を行い、混練物をシー
ト状に圧延、冷却後に溶融粉砕機、パルベライザー、ナ
イフミル、ハンマーミル等の粉砕機を用いて粉砕した
後、タブレットに成形する工程が一般的である。このよ
うな工程では容易に樹脂組成物が吸湿し成形品に空隙が
発生し易くなり製品の信頼性を損なうことになる。ま
た、タブレットの変形や粉塵による設備トラブル、作業
環境の悪化を招いている。また作業性等を悪化させる微
粉を篩分工程を通過させることにより除去することが行
われているが篩分顆粒品の外観は角があり、表面は充填
材がむき出しの状態であるため顆粒間の摩擦、顆粒と設
備との摩擦で容易に粉落ち現象を生じて微粉が発生する
という問題があった。2. Description of the Related Art In general, an epoxy resin composition for encapsulating a semiconductor (hereinafter referred to as a resin composition) is composed of an epoxy resin having excellent electric properties and heat resistance, a phenol resin curing agent, a curing accelerator, a release agent, a flame retardant. And an additive such as a coloring agent and an inorganic filler in an amount of 50 to 90% by weight. As a method for producing the resin composition, the components constituting the resin composition are preliminarily mixed with a kneader, and then kneaded with a roll, a combination of a single-screw extruder and a roll, or a twin-screw extruder, and the kneaded material is formed into a sheet. In general, a step of rolling into a shape, cooling, pulverizing using a pulverizer such as a melt pulverizer, a pulverizer, a knife mill, and a hammer mill, and then forming a tablet. In such a process, the resin composition easily absorbs moisture, so that voids are easily generated in the molded product, which impairs the reliability of the product. In addition, tablet trouble and equipment trouble due to dust and deterioration of work environment are caused. In addition, fine powder that deteriorates workability etc. is removed by passing it through the sieving process, but the appearance of the sieved granules has corners, and the surface is in a state where the filler is exposed. There is a problem that a powder falling phenomenon easily occurs due to the friction between the particles and the friction between the granules and the equipment, and fine powder is generated.
【０００３】[0003]
【発明が解決しようとする課題】本発明は、タブレット
や粉砕顆粒状物を篩分した顆粒に代わる顆粒状半導体封
止用エポキシ樹脂組成物の製造方法に関するものであ
り、タブレット化する前の粉砕顆粒の表面を二次加工
（以下、表面改質という）することによって外観が平滑
で顆粒間の擦れ等による微粉の発生が少ない顆粒状半導
体封止用エポキシ樹脂組成物及びこれにより封止された
半導体装置を提供するものである。SUMMARY OF THE INVENTION The present invention relates to a method for producing a granular semiconductor encapsulating epoxy resin composition in place of granules obtained by sieving tablets or pulverized granules. An epoxy resin composition for encapsulating a granular semiconductor having a smooth appearance by secondary processing (hereinafter, referred to as surface modification) of the granules and less generation of fine powder due to rubbing between the granules, and sealed by the same A semiconductor device is provided.
【０００４】[0004]
【課題を解決するための手段】本発明は、エポキシ樹脂
組成物を溶融混練後粉砕して得られる顆粒状樹脂組成物
の顆粒の角取りや顆粒破断面からの微粉落下を防止した
り、あるいは粉砕の際付着する微粉を除去するものであ
る。即ち本発明は、エポキシ樹脂、フェノール樹脂硬化
剤、無機充填材及び硬化促進剤を必須成分とし、無機充
填材を全樹脂組成物中に７０〜９３重量％含有する半導
体封止用エポキシ樹脂組成物を、溶融混練後粉砕し粉砕
顆粒状物にした後、遠心回転装置に投入し、該遠心回転
装置の槽内の温度が、７０℃以下になるように槽内に冷
風投入口から冷却空気を連続的に導入すると共に、熱風
投入口から１００〜１８０℃の熱風を顆粒状物に吹き付
け、顆粒状物の表面を溶融し、回転させながら顆粒間の
摩擦衝撃で表面を滑らかにした後、顆粒状物を遠心回転
装置外に排出し、急冷することを特徴とする顆粒状半導
体封止用エポキシ樹脂組成物の製造方法であり、好まし
くは熱風投入口の形状が、フィッシュテール形状であ
り、更に好ましくは、遠心回転装置に投入される粉砕顆
粒状物が、３２メッシュの篩分機で通過する微粒を除去
する工程を有し、該粉砕顆粒状物の１５０μｍ以下の微
粒の含有量が1重量％のものを使用する上記記載の顆粒
状半導体封止用エポキシ樹脂組成物の製造方法である。
更に、また上記記載の製造方法により得られた顆粒状半
導体封止用エポキシ樹脂組成物、好ましくは粒径２１２
μｍ以下の微粒の含有量が１重量％以下のものを使用し
て封止成形された半導体装置である。Means for Solving the Problems The present invention is intended to prevent the cornering of granules of a granular resin composition obtained by melt-kneading an epoxy resin composition and then pulverizing the granules or to prevent fine powder from falling from the fracture surface of the granules. It removes fine powder adhering during pulverization. That is, the present invention provides an epoxy resin composition for semiconductor encapsulation containing an epoxy resin, a phenol resin curing agent, an inorganic filler and a curing accelerator as essential components, and containing 70 to 93% by weight of the inorganic filler in the total resin composition. After melt-kneading and pulverizing into pulverized granules, the mixture is charged into a centrifugal rotation device, and cooling air is supplied from a cool air inlet into the tank so that the temperature in the tank of the centrifugal rotation device becomes 70 ° C. or less. Along with continuous introduction, hot air of 100 to 180 ° C. is blown from the hot air inlet to the granules to melt the surface of the granules, and the surface is smoothed by frictional impact between the granules while rotating. The method for producing a granular semiconductor encapsulating epoxy resin composition, characterized by discharging the substance out of the centrifugal rotation device and quenching, preferably the shape of the hot air inlet is a fish tail shape, Preferably far The pulverized granules to be put into the rotating device have a step of removing fine particles passing through a 32 mesh sieve, and the pulverized granules having a content of fine particles of 150 μm or less of 1% by weight are used. A method for producing an epoxy resin composition for encapsulating a granular semiconductor as described above.
Furthermore, an epoxy resin composition for encapsulating a granular semiconductor obtained by the above-mentioned production method, preferably having a particle size of 212
This is a semiconductor device which is encapsulated and formed using fine particles having a content of 1 μm or less of μm or less.
【０００５】[0005]
【発明の実施の形態】本発明は、エポキシ樹脂、フェノ
ール樹脂硬化剤、無機充填材及び硬化促進剤を必須成分
とし、無機充填材を全樹脂組成物中に７０〜９３重量％
含有する半導体封止用エポキシ樹脂組成物を二軸押出
機、あるいはロール、バンバリー等の混練機で混合溶融
した後、シート状に冷却引き延ばし粉砕機にて所定の粒
度以下に粉砕する。この粉砕品あるいは粉砕品を特定の
目開きの篩分機で微粉を除去した樹脂組成物を遠心回転
装置に投入し回転させながら、顆粒表面に１００〜１８
０℃の熱風を吹き付けながら、かつ回転装置内部の雰囲
気温度を７０℃以下となるよう空気を外部から導入した
状態下で縄目状の模様を描きながら回転している顆粒表
面を溶融させ、顆粒間の摩擦衝撃で表面を滑らかにした
後遠心装置外に排出し急冷することを特徴とする顆粒状
樹脂組成物の製造方法である。BEST MODE FOR CARRYING OUT THE INVENTION The present invention comprises an epoxy resin, a phenol resin curing agent, an inorganic filler and a curing accelerator as essential components, and comprises 70 to 93% by weight of the inorganic filler in the total resin composition.
The epoxy resin composition for semiconductor encapsulation to be contained is mixed and melted by a twin-screw extruder or a kneader such as a roll or a Banbury, then cooled and drawn into a sheet, and pulverized to a predetermined particle size or smaller by a pulverizer. This pulverized product or a resin composition from which fine powder has been removed from the pulverized product using a sieve having a specific mesh size is charged into a centrifugal rotation device and rotated, and the surface of the granules is coated with 100 to 18 particles.
The surface of the rotating granules is melted while drawing a rope-like pattern while blowing hot air at 0 ° C. and introducing air from the outside so that the ambient temperature inside the rotating device is 70 ° C. or less. A method of producing a granular resin composition, wherein the surface is smoothed by frictional impact of the above, and then discharged out of the centrifugal device and rapidly cooled.
【０００６】本発明は、既知の樹脂組成物を混合後二軸
押出機等の連続混練機、バンバリー等のバッチ式混練機
にて溶融混練した後粉砕し易い板状に冷却引き延ばし、
粉砕機により粉砕する工程で得られた粉砕顆粒状物と、
この粉砕顆粒状物を遠心回転装置内で顆粒表面を二次加
工する工程で構成されるものである。According to the present invention, a known resin composition is mixed, melted and kneaded by a continuous kneader such as a twin screw extruder or a batch kneader such as a Banbury, and then cooled and drawn into a plate shape which is easily pulverized.
Pulverized granules obtained in the step of pulverizing with a pulverizer,
This pulverized granule is constituted by a step of subjecting the granule surface to secondary processing in a centrifugal rotation device.
【０００７】粉砕工程を経た粉砕顆粒状物の破断面は充
填材等の添加物が露出し、角が立ち、破断屑も含まれて
いるため粉塵の原因となっている。粉砕された顆粒状物
を遠心回転装置の中に投入し遠心力で遠心回転装置のタ
ーンテーブル上で運動させ縄目状に回転している顆粒表
面に１００〜１８０℃の熱風を吹き付け、顆粒表面を軟
化溶融させ顆粒間の摩擦衝撃によって粒の角が取れ、顆
粒表面も平滑化する。熱風を回転している槽内全体の顆
粒表面に吹き付け加熱すると早期に硬化が進み顆粒樹脂
組成物の流動性が阻害されるので好ましくない。このた
め熱風の吹き付け方としてはフィッシュテール形状を有
する熱風投入口にし、顆粒全体に熱風が広がらないよう
することが好ましい。槽内温度は７０℃以下、望ましく
は６０℃以下となるように槽内に冷風を導入する方が好
ましい。所定の時間熱風を吹き付けて顆粒間の衝突によ
って顆粒表面が改質されたら槽外に排出し冷却する。熱
風温度が１００℃未満だと処理時間が掛かり生産性が悪
く、１８０℃を越えると顆粒表面での硬化が促進し顆粒
内外の品質差が生じる不具合があり、製造時の処理時間
管理も極めて困難となる。[0007] The fracture surface of the pulverized granular material after the pulverization step is exposed to additives such as fillers, becomes sharp, and contains crushed debris, which causes dust. The pulverized granules are put into a centrifugal rotating device, moved on a turntable of the centrifugal rotating device by centrifugal force, and hot air of 100 to 180 ° C. is blown on the surface of the granules rotating in a rope shape, and the granule surface is cleaned. The particles are softened and melted, the corners of the granules are removed by the frictional impact between the granules, and the surface of the granules is smoothed. If hot air is sprayed on the entire surface of the rotating granules and heated, it is not preferable because the curing proceeds early and the fluidity of the granular resin composition is impaired. For this reason, it is preferable that the hot air is blown into a hot air inlet having a fish tail shape so that the hot air does not spread to the whole granules. It is preferable to introduce cold air into the tank so that the temperature in the tank is 70 ° C. or lower, preferably 60 ° C. or lower. When the surface of the granules is reformed by blowing hot air for a predetermined time and colliding between the granules, the granules are discharged out of the tank and cooled. If the hot air temperature is lower than 100 ° C., processing time is long and productivity is poor. If it exceeds 180 ° C., curing on the granule surface is accelerated, and there is a problem that quality difference between the inside and outside of the granule occurs, and it is extremely difficult to control the processing time during production. Becomes
【０００８】本発明に用いるエポキシ樹脂、フェノール
樹脂硬化剤、無機充填材及び硬化促進剤は、通常半導体
封止用エポキシ樹脂組成物に用いるものならば、特に限
定しない。エポキシ樹脂としては、例えばクレゾールノ
ボラック型エポキシ樹脂、ビフエニル型エポキシ樹脂、
ジシクロペンタジエン変性フェノール型エポキシ樹脂等
が挙げられる。フェノール樹脂としては、フェノールノ
ボラック樹脂、フェノールアラルキル樹脂、ジシクロペ
ンタジエン変性フェノール樹脂等が挙げられる。The epoxy resin, phenolic resin curing agent, inorganic filler and curing accelerator used in the present invention are not particularly limited as long as they are usually used in an epoxy resin composition for semiconductor encapsulation. As the epoxy resin, for example, cresol novolak type epoxy resin, biphenyl type epoxy resin,
Dicyclopentadiene-modified phenolic epoxy resin and the like. Examples of the phenol resin include a phenol novolak resin, a phenol aralkyl resin, and a dicyclopentadiene-modified phenol resin.
【０００９】本発明に用いる無機充填材としては、シリ
カ、アルミナ等が挙げられ、全樹脂組成物中の無機充填
材の量は、７０〜９３重量％が好ましい。無機充填材が
７０重量％未満であると、樹脂組成物の吸水率が高くな
り、耐湿信頼性が充分でなく、また、９３重量％を越え
ると流動性が損なわれるため、成形性に不具合を生じ、
好ましくない。硬化促進剤には、イミダゾール、有機リ
ン化合物、１，８−ジアザビシクロ（５，４，０）ウン
デセン−７等が使用できる。これら以外に必要に応じ
て、シランカップリング剤、三酸化アンチモン等の難燃
剤、着色剤、ワツクス等の離型剤、シリコーンオイル、
ゴム等の低応力剤を適宜添加してもよい。Examples of the inorganic filler used in the present invention include silica and alumina. The amount of the inorganic filler in the whole resin composition is preferably 70 to 93% by weight. When the amount of the inorganic filler is less than 70% by weight, the water absorption of the resin composition is increased, and the moisture resistance reliability is not sufficient. When the amount exceeds 93% by weight, the fluidity is impaired, and the moldability is deteriorated. Arises
Not preferred. As the curing accelerator, imidazole, an organic phosphorus compound, 1,8-diazabicyclo (5,4,0) undecene-7 or the like can be used. In addition to these, if necessary, a silane coupling agent, a flame retardant such as antimony trioxide, a coloring agent, a release agent such as wax, a silicone oil,
A low stress agent such as rubber may be appropriately added.
【００１０】[0010]
【実施例】以下，実施例を用いて本発明を具体的に説明
するが、本実施例に限定されるものではない。下記の配
合割合で、各原材料をヘンシェルミキサーで予備混合し
た後、二軸混練機にて溶融混練し、押出機から排出後直
ちにシーティングロールにて２ｍｍ以下の肉厚に引き延
ばし冷却する。このシートを直径４ｍｍの複数の穴の空
いたスクリーンを有する粉砕機で粉砕し、３２メッシュ
の篩分機で通過する微粒を除去し、該粉砕顆粒状物の１
５０μｍ以下の微粒の含有量が１重量％のものを使用し
た。Hereinafter, the present invention will be described in detail with reference to examples, but the present invention is not limited to these examples. After the raw materials are premixed in a Henschel mixer at the following mixing ratio, they are melt-kneaded by a twin-screw kneader, and immediately after being discharged from the extruder, stretched to a thickness of 2 mm or less by a sheeting roll and cooled. This sheet is pulverized with a pulverizer having a screen having a plurality of holes with a diameter of 4 mm and fine particles passing therethrough are removed with a 32 mesh sieve.
Fine particles having a content of fine particles of 50 μm or less of 1% by weight were used.
【００１１】《配合処方（重量部）》 ・クレゾールノボラック型エポキシ樹脂 ８９ ・フェノールノボラック樹脂 ４４ ・２−メチルイミダゾール １ ・カルナバワックス ２ ・カーボンブラック １ ・シランカップリング剤 ３ ・溶融シリカ粉末 ３６０<< Blending formulation (parts by weight) >> Cresol novolak epoxy resin 89 Phenol novolak resin 44 2-Methylimidazole 1 Carnauba wax 2 Carbon black 1 Silane coupling agent 3 Fused silica powder 360
【００１２】次に、図１に示すモータ５により１５０ｒ
ｐｍで回転している遠心回転装置のターンテーブル３上
に粉砕顆粒状物７を所定量投入する。投入された粉砕顆
粒状物７は遠心力で縄目状の模様を呈して槽内を回転す
る。縄目状を呈して運動している粉砕顆粒状物７面上で
１２０℃となるようフィッシュテール形状の熱風投入口
２から熱風を４分間吹き付けた後、表面改質品排出口６
から表面改質された表面が平滑で粉落ちのない顆粒状に
変化した顆粒品８を得た。ここで、熱風吹き付け時間４
分でも槽内温度が７０℃以下となるように、槽内に冷風
投入口１から２０℃の空気を強制的に導入し槽内温度を
５５℃以下に維持した。粉砕顆粒状物７の回転によって
生じる縄目状表面が改質に必要な温度になるまでは粉砕
顆粒状物７間の摩擦により微粉が発生しこの微粉は装置
内面とターンテーブルとのクリアランスを通り微粉排出
口４から排出される。このような工程で得られた表面改
質された顆粒（以下、表面改質顆粒）を実施例１、従来
からの粉砕顆粒状物をタブレット（以下、粉砕圧縮タ
ブ）にしたもの比較例１、粉砕顆粒状物を３２メッシュ
の篩で篩分し微粉を除去した顆粒（以下、篩分顆粒）を
比較例２とした。Next, the motor 5 shown in FIG.
A predetermined amount of the pulverized granules 7 is put on a turntable 3 of a centrifugal rotation device rotating at pm. The introduced pulverized granules 7 rotate in the tank in a rope-like pattern due to centrifugal force. Hot air is blown from the fish tail shaped hot air inlet 2 for 4 minutes to 120 ° C. on the surface of the pulverized granular material 7 moving in a rope shape, and then the surface modified product outlet 6
From the above, granulated product 8 having a surface-modified surface changed to a granular shape with no powder dropping was obtained. Here, hot air blowing time 4
The air at 20 ° C. was forcibly introduced from the cold air inlet 1 into the tank so that the temperature in the tank was 70 ° C. or less even in minutes, and the temperature in the tank was maintained at 55 ° C. or less. Until the temperature of the rope-like surface generated by the rotation of the pulverized granules 7 reaches the temperature required for reforming, fine powder is generated due to friction between the pulverized granules 7, and the fine powder passes through the clearance between the inner surface of the apparatus and the turntable. It is discharged from the discharge port 4. The surface-modified granules obtained in such a step (hereinafter, surface-modified granules) were prepared in Example 1, and the conventional pulverized granules were converted into tablets (hereinafter, pulverized compression tabs), and Comparative Example 1, The granules obtained by sieving the pulverized granules with a 32 mesh sieve to remove fine powder (hereinafter, sieved granules) were used as Comparative Example 2.
【００１３】得られた粉砕圧縮タブ、顆粒品の特性を比
較した評価結果を表１に、実施例１において熱風温度を
変化した場合の評価結果を表２に示した。明らかに、表
面改質することによって粉落ちがなく、嵩密度が向上す
ることにより嵩高さを低くすることができ、粒自体にも
丸みができ顆粒自体の流動性が改善されるため安息角が
低い方に改善されていることが判明した。Table 1 shows the evaluation results comparing the properties of the obtained crushed and compressed tabs and granules, and Table 2 shows the evaluation results when the hot air temperature was changed in Example 1. Obviously, the surface modification does not cause powder dropping, and the bulk density can be improved to reduce the bulkiness, the grains themselves can be rounded and the fluidity of the granules themselves can be improved, so that the angle of repose is reduced. It turned out that it was improved to a lower one.
【００１４】ここで粉砕顆粒状物を予め３２メッシュの
篩で篩分した顆粒を用いることにより表面改質時の歩留
まりが向上する。装置内のターンテーブル外径と装置内
壁には０．５ｍｍ以下の間隙があり回転運動の初期に顆
粒中の微細なものがこの間隙から落下してしまい歩留ま
りの悪化を引き起こすことによる。一方、表面改質され
た顆粒は表面改質前と粒径を比較すると小径の方に分布
が移動しており、０．５ｍｍ以下の表面改質された微小
顆粒は半導体封止成形の際に静電気による帯電で封止金
型内の樹脂投入ポット内への供給、計量等に悪影響を与
えることがあるため篩分して微粒分を除去しておくこと
が望ましい。Here, by using granules obtained by sieving the pulverized granules through a 32 mesh sieve in advance, the yield at the time of surface modification is improved. This is because there is a gap of 0.5 mm or less between the outer diameter of the turntable in the apparatus and the inner wall of the apparatus, and fine particles in the granules fall from this gap in the early stage of the rotational movement, causing deterioration in yield. On the other hand, the distribution of the surface-modified granules is shifted toward the smaller diameter when comparing the particle size before the surface modification with that before the surface modification. It is desirable to remove fine particles by sieving, because charging by static electricity may adversely affect supply, measurement, and the like into the resin charging pot in the sealing mold.
【００１５】《評価方法》 ・スパイラルフロー ＥＭＭＩ−Ｉ−６６に準じた金型を用い、前記樹脂組成
物を低圧トランスファー成形機にて１７５℃、射出圧７
０kgf／cm2、保圧時間１２０秒の条件で成形し、スパイ
ラルフローを測定。 ・アセトン不溶分 前記樹脂組成物１００ｇとアセトン５００ｍｌを容器に
入れ２０分間浸漬し、液を１００メッシュの篩に通し、
篩上に残った重量を％で表示。 ・その他の評価 評価値： × 劣る、 ○ 優れる、 △ 良<< Evaluation Method >> A resin mold was used at 175 ° C. and an injection pressure of 7 using a mold conforming to Spiral Flow EMMI-I-66 with a low-pressure transfer molding machine.
Molded under the conditions of 0 kgf / cm 2 and dwell time of 120 seconds, and measured the spiral flow. Acetone-insoluble content 100 g of the resin composition and 500 ml of acetone were put in a container, immersed for 20 minutes, and the solution was passed through a 100-mesh sieve.
The weight remaining on the sieve is expressed in%. -Other evaluations Evaluation values: × poor, ○ excellent, △ good
【００１６】 表 １ 比較例１ 比較例２ 実施例１ 粉体圧縮タブ 篩分顆粒 表面改質顆粒 嵩高さ(φ18ｘ13g) 18 36 33 嵩密度 − 0.87 0.80 成形性 △ ○ ○ 成形品中のボイド × × ○ 安息角（度） − 36 32 粉落ち(PE袋への微粉付着) × △ ○ 尚、嵩高さ(φ18ｘ13g)とは、径が１８ｍｍの容器に１
３ｇ入れた時の高さを表している。Table 1 Comparative Example 1 Comparative Example 2 Example 1 Powder compression tab Sieving granules Surface modified granules Bulk height (φ18 × 13g) 18 36 33 Bulk density − 0.87 0.80 Moldability △ ○ ○ Void in molded article × × ○ Angle of repose (degree )-36 32 Powder drop (fine powder adhered to PE bag) × △ ○ Bulk height (φ18 x 13g) means 1 in a container with a diameter of 18mm.
It represents the height when 3 g is inserted.
【００１７】 表 ２ 熱風温度（℃） ９５ １０５ １２０ １７５ １９０ スパイラルフロー(cm) ８８ ８８ ８６ ７５ ５０ アセトン不溶分（％） ０ ０ ０ 0.005 0.01 粉落ち × ○ ○ ○ ○ 粒外観 角あり 丸み 丸み 丸み 丸み 顆粒間の付着 ○ ○ ○ △ × 平滑性 × ○ ○ ○ ○ 総合判定 × ○ ○ △ × Table 2 Hot air temperature (° C) 95 105 120 175 190 Spiral flow (cm) 88 88 86 75 50 Acetone insoluble matter (%) 0 0 0.005 0.01 Powder drop × ○ ○ ○ ○ Particle appearance Cornered Rounded Rounded Rounded Rounded Adhesion between granules ○ ○ ○ △ × Smoothness × ○ ○ ○ ○ Overall judgment × ○ ○ △ ×
【００１８】[0018]
【発明の効果】本発明によると粉砕顆粒状物を表面改質
することによって粉落ちがなく、嵩密度が高くなること
により嵩高さを低くすることができ、顆粒自体にも丸み
ができ流動性が改善されため安息角が低い方に改善され
た優れた顆粒品を得ることができる。According to the present invention, the surface modification of the pulverized granules does not cause the powder to fall off, the bulk density increases, the bulkiness can be reduced, the granules themselves can be rounded, and the fluidity can be improved. Is improved, so that an excellent granule having an improved angle of repose can be obtained.
【図１】本発明で使用する遠心回転装置の概略図FIG. 1 is a schematic diagram of a centrifugal rotation device used in the present invention.
【符号の説明】 １ 冷風投入口 ２ 熱風投入口 ３ ターンテーブル ４ 微粉排出口 ５ モータ ６ 表面改質品排出口 ７ 粉砕顆粒状物 ８ 顆粒品[Description of Signs] 1 Cold air inlet 2 Hot air inlet 3 Turntable 4 Fine powder outlet 5 Motor 6 Surface modified product outlet 7 Pulverized granules 8 Granules
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 ＦＩ Ｈ０１Ｌ 23/31 // Ｂ２９Ｋ 63:00 105:16 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 6 Identification code FI H01L 23/31 // B29K 63:00 105: 16
Claims (5)
無機充填材及び硬化促進剤を必須成分とし、無機充填材
を全樹脂組成物中に７０〜９３重量％含有する半導体封
止用エポキシ樹脂組成物を、溶融混練後粉砕し粉砕顆粒
状物にした後、遠心回転装置に投入し、該遠心回転装置
の槽内の温度が、７０℃以下になるように槽内に冷風投
入口から冷却空気を連続的に導入すると共に、熱風投入
口から１００〜１８０℃の熱風を顆粒状物に吹き付け、
顆粒状物の表面を溶融し、回転させながら顆粒間の摩擦
衝撃で表面を滑らかにした後、顆粒状物を遠心回転装置
外に排出し、急冷することを特徴とする顆粒状半導体封
止用エポキシ樹脂組成物の製造方法。An epoxy resin, a phenol resin curing agent,
An epoxy resin composition for semiconductor encapsulation containing an inorganic filler and a curing accelerator as essential components and containing 70 to 93% by weight of the inorganic filler in the entire resin composition was melt-kneaded and then pulverized into pulverized granules. Thereafter, the mixture is charged into a centrifugal rotation device, and cooling air is continuously introduced from a cool air injection port into the tank so that the temperature in the tank of the centrifugal rotation device becomes 70 ° C. or lower, and 100 to 100 ° C. 180 ° C hot air is sprayed on the granules,
Melting the surface of the granular material, smoothing the surface by frictional impact between the granules while rotating, discharging the granular material out of the centrifugal rotation device, and quenching it. A method for producing an epoxy resin composition.
形状である請求項１記載の顆粒状半導体封止用エポキシ
樹脂組成物の製造方法。2. The method according to claim 1, wherein the shape of the hot air inlet is a fishtail shape.
粒の含有量が１重量％以下である請求項１又は２記載の
顆粒状半導体封止用エポキシ樹脂組成物の製造方法。3. The process for producing a granular semiconductor encapsulating epoxy resin composition according to claim 1, wherein the content of the fine particles having a particle size of 150 μm or less is 1% by weight or less.
組成物の粒径２１２μｍ以下の微粒の含有量が、１重量
％以下である請求項１、２又は３記載の顆粒状半導体封
止用エポキシ樹脂組成物の製造方法。4. The granular semiconductor sealing epoxy resin composition according to claim 1, wherein the content of fine particles having a particle size of 212 μm or less is 1% by weight or less in the obtained granular semiconductor sealing epoxy resin composition. A method for producing an epoxy resin composition.
で得られた顆粒状半導体封止用エポキシ樹脂組成物を用
いて封止成形された半導体装置。5. A semiconductor device encapsulated and molded using the granular semiconductor encapsulating epoxy resin composition obtained by the production method according to claim 1, 2, 3 or 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8866798A JP3888767B2 (en) | 1998-04-01 | 1998-04-01 | Method for producing epoxy resin composition for encapsulating granular semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8866798A JP3888767B2 (en) | 1998-04-01 | 1998-04-01 | Method for producing epoxy resin composition for encapsulating granular semiconductor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11286013A true JPH11286013A (en) | 1999-10-19 |
| JP3888767B2 JP3888767B2 (en) | 2007-03-07 |
Family
ID=13949182
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8866798A Expired - Fee Related JP3888767B2 (en) | 1998-04-01 | 1998-04-01 | Method for producing epoxy resin composition for encapsulating granular semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3888767B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG119150A1 (en) * | 2001-05-02 | 2006-02-28 | Sumitomo Bakelite Co | Process for production of epoxy resin composition for semiconductor encapsulation epoxy resin composition for semiconductor encapsulation and semiconductor device |
| JP2011009394A (en) * | 2009-06-25 | 2011-01-13 | Nitto Denko Corp | Method of manufacturing resin tablet for sealing optical semiconductor, resin tablet for sealing optical semiconductor provided by the same, and optical semiconductor device using the same |
-
1998
- 1998-04-01 JP JP8866798A patent/JP3888767B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG119150A1 (en) * | 2001-05-02 | 2006-02-28 | Sumitomo Bakelite Co | Process for production of epoxy resin composition for semiconductor encapsulation epoxy resin composition for semiconductor encapsulation and semiconductor device |
| JP2011009394A (en) * | 2009-06-25 | 2011-01-13 | Nitto Denko Corp | Method of manufacturing resin tablet for sealing optical semiconductor, resin tablet for sealing optical semiconductor provided by the same, and optical semiconductor device using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3888767B2 (en) | 2007-03-07 |
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