JPH09503097A - Ptc抵抗素子を有する電気的なアッセンブリ - Google Patents
Ptc抵抗素子を有する電気的なアッセンブリInfo
- Publication number
- JPH09503097A JPH09503097A JP7509252A JP50925295A JPH09503097A JP H09503097 A JPH09503097 A JP H09503097A JP 7509252 A JP7509252 A JP 7509252A JP 50925295 A JP50925295 A JP 50925295A JP H09503097 A JPH09503097 A JP H09503097A
- Authority
- JP
- Japan
- Prior art keywords
- layered
- ptc
- conductive member
- electrode
- ptc element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/1406—Terminals or electrodes formed on resistive elements having positive temperature coefficient
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
- H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
- H01C17/06573—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the permanent binder
- H01C17/06586—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the permanent binder composed of organic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
- H01C7/027—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient consisting of conducting or semi-conducting material dispersed in a non-conductive organic material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/09181—Notches in edge pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10469—Asymmetrically mounted component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10666—Plated through-hole for surface mounting on PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Thermistors And Varistors (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1. (1)(a)PTC特性を示す抵抗材料から成り、(b)第1面及び第2面を有し 、(c)第1面と第2面との間に通る開口を規定するPTC抵抗素子と; (2)(a)上記PTC素子により規定された開口の内部に位置し、(b)PTC 素子の第1面と第2面との間に通り、(c)上記PTC素子に固定される横方向の 導電部材と; (3)(a)上記PTC素子の第1面に固定され、(b)上記横方向の導電部材へ 物理的に且つ電気的に接続される第1層状導電部材とを有することを特徴とする 電気的なアッセンブリ。 2. 回路保護ディバイス(device)であるアッセンブリ(assembly)であって、(a )上記PTC素子が導電ポリマー(polymer)から成る層状素子であり、(b)上記デ ィバイスが、 (4)上記PTC素子の第2面に固定されており横方向の導電部材に電気的 に接続されていない第2層状導電部材を有することを特徴とする上記請求の範囲 第1項記載のアッセンブリ。 3. (5)(a)上記開口領域で上記PTC素子の第2面に固定され、(b)上記横方 向の導電部材に電気的に接続され、(c)上記第2層状導電部材から距離を隔てら れた第3層状導電部材を有している上記請求の範囲第2項記載のアッセンブリ。 4. 上記横方向の導電部材が、 (a)上記開口を規定する上記PTC素子の表面上の金属鍍金と、 (b)はんだと、 (c)予め成形された金属のロッド(rod)又はチューブの内の少なくとも1つ を有することを特徴とする上記請求の範囲第1項〜請求の範囲第3項のいずれか 一に記載のアッセンブリ。 5. 複数の回路保護ディバイスに分割されることが可能であり、 (a)PTC抵抗素子が、上記PTC素子の第1及び第2面の間に通る複数 の開口を規定し、 (b)複数の横方向の部材が存在し、各横方向の部材が上記開口の1つの内 部に位置し、 (c)上記開口と横方向の部材とが規則的なパターンで配列されていること を特徴とする請求の範囲第1項記載のアッセンブリ。 6. 上記PTC素子が導電ポリマーから成る層状素子であり、上記第1層状導 電部材が、(a)上記PTC素子の第1面に固定され、(b)あらゆる横方向の部材に 物理的に且つ電気的に接続され;上記アッセンブリが、更に、 (3)上記PTC素子の第2面に固定される第2層状導電部材を有すること を特徴とする請求の範囲第5項記載のアッセンブリ。 7. 上記第1及び第2層状導電部材の各々が、複数の平行なストリップ(strip )から成ることを特徴とする請求の範囲第6項記載のアッセンブリ。 8. (A)表面上に第1及び第2導電トレース(traces)を有するプリント回路基 板と、 (B)(1)(a)PTC特性を示す抵抗材料から成り、(b)第1面と第2面とを 有する層状PTC抵抗素子と; (2)上記PTC素子の第1面に固定される第1層状電極と; (3)上記PTC素子の第2面に固定される第2層状電極と; (4)(a)上記PTC素子の第2面に固定され、(b)第2電極から距離を 隔てられた付加的な層状導電部材と; (4)(a)上記開口の内部に位置し、 (b)上記第1電極及び上記付加的な導電部材へ物理的に且つ電気 的に接続される横方向の部材とを備えた電気ディバイスと を有する電気的なアッセンブリであって、 上記PTC素子と第1電極及び付加的な層状導電部材とが、該PTC素子を通 じて上記第1電極と上記付加的な層状導電部材との間に通る開口を規定しており 、 上記電気的なディバイスが、プリント回路基板上に取り付けられ、その上で、 上記付加的な導電部材へ物理的に且つ電気的に接続される第1導電トレースと、 上記第2電極へ物理的に且つ電気的に接続される第2導電トレースとに平行であ ることを特徴とする電気的なアッセンブリ。 9. (A)(1)(i)PTC特性を示す抵抗材料から成り、(ii)第1面及び第2面 を有する、層状PTC抵抗素子と、 (2)上記PTC素子の第1面に固定される第1層状導電部材と、 (3)上記PTC素子の第1面に固定される第2層状導電部材と を有するアッセンブリを作製し、 (B)ステップ(A)で作製されたアッセンブリの厚さを通じて、規則的なパ ターンで配列される複数の開口を作り、 (C)ステップ(B)と同時に、又は、ステップ(B)の後に、上記第1層状導 電部材と電気的に接触した状態にして、複数の横方向の導電部材を開口の内部に 配置し、 (D)第1及び第2導電部材の内の予め決められた少なくとも一部分を取り 除き、 (E)ステップ(A)から(D)の後に、上記アッセンブリを複数の電気ディバ イスに分割することを有しており、各ディバイスが、 (1)PTC抵抗素子の一部と、 (2)幾つかのディバイスで第1電極を、その他のディバイスで第2電極 を備える第1層状導電部材の一部と、 (3)幾つかのディバイスで第2電極を、その他のディバイスで第1電極 を備える第2層状導電部材の一部と、 (4)第2層状導電部材の残余の部分と、 (5)上記残余の部分と第1電極とに電気的に接続する少なくとも1つの 横方向の導電部材と を有していることを特徴とする電気ディバイスを作る方法。 10. (1)(i)PTC特性を示す導電ポリマーから成り、(ii)第1面及び第2 面を有する、層状PTC抵抗素子と、 (2)PTC素子の第1面に固定される第1層状導電部材と、 (3)PTC素子の第2面に固定される第2層状導電部材とを有しており 、 上記PTC素子と上記第1及び第2層状導電部材が、アッセンブリ厚を 通過する複数の開口を規定し、該開口が規則的なパターンで配列されていること を特徴とするアッセンブリ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12171793A | 1993-09-15 | 1993-09-15 | |
US08/121,717 | 1993-09-15 | ||
PCT/US1994/010137 WO1995008176A1 (en) | 1993-09-15 | 1994-09-13 | Electrical assembly comprising a ptc resistive element |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005253276A Division JP4339295B2 (ja) | 1993-09-15 | 2005-09-01 | 電気的なアッセンブリ |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH09503097A true JPH09503097A (ja) | 1997-03-25 |
Family
ID=22398385
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7509252A Pending JPH09503097A (ja) | 1993-09-15 | 1994-09-13 | Ptc抵抗素子を有する電気的なアッセンブリ |
JP2005253276A Expired - Fee Related JP4339295B2 (ja) | 1993-09-15 | 2005-09-01 | 電気的なアッセンブリ |
JP2008173527A Expired - Fee Related JP4511614B2 (ja) | 1993-09-15 | 2008-07-02 | 電気的なアッセンブリ |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005253276A Expired - Fee Related JP4339295B2 (ja) | 1993-09-15 | 2005-09-01 | 電気的なアッセンブリ |
JP2008173527A Expired - Fee Related JP4511614B2 (ja) | 1993-09-15 | 2008-07-02 | 電気的なアッセンブリ |
Country Status (10)
Country | Link |
---|---|
EP (2) | EP1235233B1 (ja) |
JP (3) | JPH09503097A (ja) |
KR (1) | KR100327876B1 (ja) |
CN (3) | CN1045134C (ja) |
AU (1) | AU692471B2 (ja) |
BR (1) | BR9407542A (ja) |
CA (1) | CA2171749C (ja) |
DE (2) | DE69431757T2 (ja) |
TW (1) | TW359862B (ja) |
WO (1) | WO1995008176A1 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6481094B1 (en) | 1998-07-08 | 2002-11-19 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing chip PTC thermistor |
US6556123B1 (en) | 1999-03-08 | 2003-04-29 | Matsushita Electric Industrial Co., Ltd. | Polymer chip PTC thermistor |
US6593844B1 (en) | 1998-10-16 | 2003-07-15 | Matsushita Electric Industrial Co., Ltd. | PTC chip thermistor |
US6782604B2 (en) | 1997-07-07 | 2004-08-31 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing a chip PTC thermistor |
JP2005513763A (ja) * | 2001-12-12 | 2005-05-12 | タイコ・エレクトロニクス・コーポレイション | 電気デバイス及びそのデバイスを製造する方法 |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5852397A (en) * | 1992-07-09 | 1998-12-22 | Raychem Corporation | Electrical devices |
JPH09503097A (ja) * | 1993-09-15 | 1997-03-25 | レイケム・コーポレイション | Ptc抵抗素子を有する電気的なアッセンブリ |
EP0760157B1 (en) * | 1994-05-16 | 1998-08-26 | Raychem Corporation | Electrical devices comprising a ptc resistive element |
CA2192369A1 (en) | 1994-06-09 | 1995-12-14 | Michael Zhang | Electrical devices |
US6157289A (en) * | 1995-09-20 | 2000-12-05 | Mitsushita Electric Industrial Co., Ltd. | PTC thermistor |
US5699607A (en) * | 1996-01-22 | 1997-12-23 | Littelfuse, Inc. | Process for manufacturing an electrical device comprising a PTC element |
US5900800A (en) * | 1996-01-22 | 1999-05-04 | Littelfuse, Inc. | Surface mountable electrical device comprising a PTC element |
US5884391A (en) * | 1996-01-22 | 1999-03-23 | Littelfuse, Inc. | Process for manufacturing an electrical device comprising a PTC element |
US5907272A (en) * | 1996-01-22 | 1999-05-25 | Littelfuse, Inc. | Surface mountable electrical device comprising a PTC element and a fusible link |
JP3594974B2 (ja) | 1996-12-26 | 2004-12-02 | 松下電器産業株式会社 | Ptcサーミスタおよびその製造方法 |
AU7712098A (en) | 1997-06-04 | 1998-12-21 | Tyco Electronics Corporation | Circuit protection devices |
US6020808A (en) * | 1997-09-03 | 2000-02-01 | Bourns Multifuse (Hong Kong) Ltd. | Multilayer conductive polymer positive temperature coefficent device |
US6172591B1 (en) * | 1998-03-05 | 2001-01-09 | Bourns, Inc. | Multilayer conductive polymer device and method of manufacturing same |
US6124781A (en) * | 1998-10-06 | 2000-09-26 | Bourns, Inc. | Conductive polymer PTC battery protection device and method of making same |
US6300859B1 (en) | 1999-08-24 | 2001-10-09 | Tyco Electronics Corporation | Circuit protection devices |
KR100485890B1 (ko) * | 2002-10-22 | 2005-04-29 | 엘에스전선 주식회사 | 표면실장형 정온계수 전기 장치 및 그 제조 방법 |
CN100382204C (zh) * | 2002-10-23 | 2008-04-16 | 深圳市固派电子有限公司 | 表面贴装式高分子正温度系数自恢复保险丝及其制造方法 |
JP5201137B2 (ja) * | 2007-01-22 | 2013-06-05 | パナソニック株式会社 | 高分子抵抗体 |
KR100922471B1 (ko) | 2007-09-27 | 2009-10-21 | 삼성에스디아이 주식회사 | 이차전지용 보호회로기판 및 이를 이용한 이차 전지 |
WO2017056988A1 (ja) * | 2015-09-28 | 2017-04-06 | Littelfuseジャパン合同会社 | 保護素子 |
TWI702617B (zh) * | 2017-11-24 | 2020-08-21 | 富致科技股份有限公司 | 正溫度係數電路保護裝置及其製備方法 |
CN109065769A (zh) * | 2018-09-25 | 2018-12-21 | 华霆(合肥)动力技术有限公司 | 软包电池及电池模组 |
CN110223811A (zh) * | 2019-04-23 | 2019-09-10 | 深圳市金瑞电子材料有限公司 | 二次安全保护元件的制造方法、芯片及设备 |
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JPS6242402A (ja) * | 1986-08-11 | 1987-02-24 | 日東電工株式会社 | 電流制限素子 |
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DE8716103U1 (de) * | 1987-12-05 | 1988-01-21 | Degussa Ag, 6000 Frankfurt | Meßwiderstand für Temperaturmessungen |
JPH0616442B2 (ja) * | 1988-04-06 | 1994-03-02 | 株式会社村田製作所 | 有機正特性サーミスタ |
JP2898336B2 (ja) * | 1989-05-18 | 1999-05-31 | 株式会社フジクラ | Ptcサーミスタの製造方法 |
JPH03138994A (ja) * | 1989-10-24 | 1991-06-13 | Matsushita Electric Ind Co Ltd | スルーホールを有する回路基板 |
CN2110908U (zh) * | 1991-11-06 | 1992-07-22 | 曾宪富 | 柔性导电高分子复合材料热敏电阻器 |
JPH09503097A (ja) * | 1993-09-15 | 1997-03-25 | レイケム・コーポレイション | Ptc抵抗素子を有する電気的なアッセンブリ |
-
1994
- 1994-09-13 JP JP7509252A patent/JPH09503097A/ja active Pending
- 1994-09-13 EP EP02076768A patent/EP1235233B1/en not_active Expired - Lifetime
- 1994-09-13 CN CN94193355A patent/CN1045134C/zh not_active Expired - Lifetime
- 1994-09-13 WO PCT/US1994/010137 patent/WO1995008176A1/en active IP Right Grant
- 1994-09-13 EP EP94928052A patent/EP0719442B1/en not_active Expired - Lifetime
- 1994-09-13 DE DE69431757T patent/DE69431757T2/de not_active Expired - Lifetime
- 1994-09-13 BR BR9407542A patent/BR9407542A/pt not_active IP Right Cessation
- 1994-09-13 AU AU77236/94A patent/AU692471B2/en not_active Ceased
- 1994-09-13 CN CN2004100942659A patent/CN1722315B/zh not_active Expired - Lifetime
- 1994-09-13 DE DE69434557T patent/DE69434557T2/de not_active Expired - Lifetime
- 1994-09-13 CA CA002171749A patent/CA2171749C/en not_active Expired - Fee Related
- 1994-09-13 KR KR1019960701245A patent/KR100327876B1/ko not_active IP Right Cessation
- 1994-09-13 CN CNB981079482A patent/CN1145979C/zh not_active Expired - Lifetime
- 1994-09-27 TW TW083108950A patent/TW359862B/zh not_active IP Right Cessation
-
2005
- 2005-09-01 JP JP2005253276A patent/JP4339295B2/ja not_active Expired - Fee Related
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2008
- 2008-07-02 JP JP2008173527A patent/JP4511614B2/ja not_active Expired - Fee Related
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6782604B2 (en) | 1997-07-07 | 2004-08-31 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing a chip PTC thermistor |
US7183892B2 (en) | 1997-07-07 | 2007-02-27 | Matsushita Electric Industrial Co., Ltd. | Chip PTC thermistor and method for manufacturing the same |
US6481094B1 (en) | 1998-07-08 | 2002-11-19 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing chip PTC thermistor |
US6593844B1 (en) | 1998-10-16 | 2003-07-15 | Matsushita Electric Industrial Co., Ltd. | PTC chip thermistor |
US6556123B1 (en) | 1999-03-08 | 2003-04-29 | Matsushita Electric Industrial Co., Ltd. | Polymer chip PTC thermistor |
JP2005513763A (ja) * | 2001-12-12 | 2005-05-12 | タイコ・エレクトロニクス・コーポレイション | 電気デバイス及びそのデバイスを製造する方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2006005377A (ja) | 2006-01-05 |
EP0719442B1 (en) | 2002-11-20 |
AU7723694A (en) | 1995-04-03 |
JP4511614B2 (ja) | 2010-07-28 |
EP1235233A3 (en) | 2004-01-14 |
CN1045134C (zh) | 1999-09-15 |
EP0719442A1 (en) | 1996-07-03 |
DE69434557T2 (de) | 2006-08-10 |
CA2171749C (en) | 2005-11-08 |
CN1130955A (zh) | 1996-09-11 |
CN1215896A (zh) | 1999-05-05 |
KR100327876B1 (ko) | 2002-10-12 |
JP2008235943A (ja) | 2008-10-02 |
CN1722315A (zh) | 2006-01-18 |
KR960705328A (ko) | 1996-10-09 |
CN1722315B (zh) | 2010-06-16 |
CN1145979C (zh) | 2004-04-14 |
AU692471B2 (en) | 1998-06-11 |
DE69431757D1 (de) | 2003-01-02 |
WO1995008176A1 (en) | 1995-03-23 |
DE69434557D1 (de) | 2005-12-29 |
JP4339295B2 (ja) | 2009-10-07 |
TW359862B (en) | 1999-06-01 |
DE69431757T2 (de) | 2003-08-14 |
BR9407542A (pt) | 1996-12-31 |
EP1235233B1 (en) | 2005-11-23 |
CA2171749A1 (en) | 1995-03-23 |
EP1235233A2 (en) | 2002-08-28 |
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