JPH09326326A - Electronic parts and wiring board, and packaging structure of electronic parts on wiring board - Google Patents
Electronic parts and wiring board, and packaging structure of electronic parts on wiring boardInfo
- Publication number
- JPH09326326A JPH09326326A JP16536896A JP16536896A JPH09326326A JP H09326326 A JPH09326326 A JP H09326326A JP 16536896 A JP16536896 A JP 16536896A JP 16536896 A JP16536896 A JP 16536896A JP H09326326 A JPH09326326 A JP H09326326A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- conductive film
- wiring board
- anisotropic conductive
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Non-Insulated Conductors (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本願発明は、電子部品に関
し、詳しくは、表面実装型の電子部品、該電子部品が実
装される配線基板及び電子部品の配線基板への実装構造
に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component, and more particularly, to a surface mount type electronic component, a wiring board on which the electronic component is mounted, and a mounting structure of the electronic component on the wiring board.
【０００２】[0002]
【従来の技術】従来、チップ型積層セラミックコンデン
サなどの表面実装型の電子部品６１は通常、図７に示す
ように、プリント配線基板６２に搭載する実装形態がと
られている。そして、このような表面実装型の電子部品
６１の表面には、外部への電気的接続のための端子電極
６３が配設されている一方、プリント配線基板６２に
は、電子部品６１の端子電極６３と電気的に接続される
パターン電極（ランドパターン）６４が配設されてい
る。2. Description of the Related Art Conventionally, a surface mount type electronic component 61 such as a chip type multilayer ceramic capacitor is usually mounted on a printed wiring board 62 as shown in FIG. A terminal electrode 63 for electrical connection to the outside is provided on the surface of the surface-mounted electronic component 61, while the printed wiring board 62 has a terminal electrode for the electronic component 61. A pattern electrode (land pattern) 64 electrically connected to 63 is provided.
【０００３】なお、電子部品６１を実装するにあたって
は、電子部品６１の端子電極６３とプリント配線基板６
２のパターン電極６４をはんだ付けすることにより、電
子部品６１とプリント配線基板６２を電気的、機械的に
接続して実装することが行われている。そして、このは
んだ付けを行う場合、パターン電極（ランドパターン）
６４以外の部分にはんだが拡がらないようにソルダーレ
ジスト６５をプリント配線基板６２の表面に形成した
後、はんだクリームを供給してリフロー炉を通過させる
ことにより、電子部品６１とプリント配線基板６２をは
んだ６６で電気的、機械的に接続するようにしている。When mounting the electronic component 61, the terminal electrodes 63 of the electronic component 61 and the printed wiring board 6 are mounted.
By soldering the second pattern electrode 64, the electronic component 61 and the printed wiring board 62 are electrically and mechanically connected and mounted. When performing this soldering, pattern electrodes (land patterns)
After forming the solder resist 65 on the surface of the printed wiring board 62 so that the solder does not spread to the parts other than 64, the solder cream is supplied and passed through the reflow furnace to separate the electronic component 61 and the printed wiring board 62. The solder 66 is used for electrical and mechanical connection.
【０００４】[0004]
【発明が解決しようとする課題】しかし、上記のはんだ
付けによる電子部品６１の実装には、以下のような問題
点がある。However, the mounting of the electronic component 61 by soldering has the following problems.
【０００５】図８に示すように、電子部品６１がプリ
ント配線基板６２上で立ち上がってしまい、片側だけし
かはんだ付けされない状態になる、いわゆるツームスト
ーン現象が発生したり、図９に示すように、電子部品６
１がプリント配線基板６２上で横ずれを起こして片側だ
けしかはんだ付けされない状態になったり、あるいは、
図１０に示すように、電子部品６１の両端子電極６３，
６３の間がはんだ６６で短絡される、いわゆるはんだブ
リッジ現象が生じたりするというような取付状態不良が
発生する。なお、これらの取付状態不良は、電子部品６
１が小型化、軽量化するのに伴ってより発生しやすくな
るものである。 はんだ付けの際の熱ストレスで電子部品の信頼性が低
下する。 はんだ付けを行う場合、面倒な前処理工程であるはん
だクリームの印刷や大がかりな装置を必要とするリフロ
ー工程などが必要で、製造コストの増大を招く。 鉛を含むはんだを使用するため、環境汚染を引き起こ
す。As shown in FIG. 8, the electronic component 61 rises up on the printed wiring board 62 and a so-called tombstone phenomenon occurs in which only one side is soldered, or as shown in FIG. Electronic component 6
1 is laterally displaced on the printed wiring board 62 and is soldered only on one side, or
As shown in FIG. 10, both terminal electrodes 63 of the electronic component 61,
A defective mounting state such as a short circuit between 63 and a so-called solder bridge phenomenon may occur. It should be noted that these defective mounting states are caused by the electronic component 6
1 is more likely to occur as the size and weight are reduced. The thermal stress during soldering reduces the reliability of electronic components. When performing soldering, a solder cream printing, which is a troublesome pretreatment process, and a reflow process requiring a large-scale device are required, which leads to an increase in manufacturing cost. Uses lead-containing solder, causing environmental pollution.
【０００６】本願発明は、上記問題点を解決するもので
あり、実装時に、取付状態不良や部品信頼性の低下が発
生せず、しかも、経済性に優れ、かつ、環境汚染を引き
起こすことのない電子部品、配線基板及び電子部品の実
装構造を提供することを目的とする。The invention of the present application solves the above-mentioned problems, and does not cause a defective mounting state or deterioration of component reliability during mounting, and is excellent in economic efficiency and does not cause environmental pollution. An object is to provide an electronic component, a wiring board, and a mounting structure for the electronic component.
【０００７】[0007]
【課題を解決するための手段】上記目的を達成するた
め、本願発明の電子部品は、配線基板に設けられたパタ
ーン電極に電気的に接続される端子電極が電子部品素子
の表面に配設された構造を有する表面実装型の電子部品
において、前記端子電極の表面の少なくとも一部に異方
導電フィルムを配設し、前記異方導電フィルムを介して
前記配線基板上のパターン電極と前記端子電極とを電気
的に接続するようにしたことを特徴としている。In order to achieve the above object, in the electronic component of the present invention, a terminal electrode electrically connected to a pattern electrode provided on a wiring board is provided on the surface of the electronic component element. In a surface mount type electronic component having a different structure, an anisotropic conductive film is provided on at least a part of the surface of the terminal electrode, and the pattern electrode and the terminal electrode on the wiring board are interposed via the anisotropic conductive film. It is characterized in that and are electrically connected.
【０００８】なお、本願発明において、異方導電フィル
ムとは、加圧又は加熱のいずれか一方、あるいは加圧及
び加熱の両方を同時に行うことにより接着性を発揮する
絶縁性フィルム中に、微小な粒子径（例えば数μm〜数
十μm）の導電材料粒子を分散させたフィルムをいうも
のであり、異方導電フィルムを介して配線基板のパター
ン電極と端子電極とを圧着することにより、異方導電フ
ィルム中の導電材料粒子が互いに接触して導通するとと
もに、該導電材料粒子を介して電子部品の端子電極と配
線基板のパターン電極が電気的に確実に接続する。ま
た、従来の実装方法のように、はんだを用いていないの
で、取付状態不良や部品信頼性の低下を招いたり、コス
トの増大や環境汚染を引き起こしたりすることがない。In the invention of the present application, the anisotropic conductive film means a fine film in an insulating film which exhibits adhesiveness by applying either pressure or heating, or both pressurizing and heating at the same time. It refers to a film in which conductive material particles having a particle size (for example, several μm to several tens of μm) are dispersed. By anisotropically bonding the pattern electrode of the wiring board and the terminal electrode through the anisotropic conductive film, anisotropic The conductive material particles in the conductive film come into contact with each other to conduct electricity, and the terminal electrodes of the electronic component and the pattern electrodes of the wiring board are electrically and surely connected via the conductive material particles. In addition, unlike the conventional mounting method, since solder is not used, the mounting state is not deteriorated, the reliability of parts is not lowered, and the cost and the environment are not polluted.
【０００９】また、前記電子部品素子が直方体形状を有
しており、前記端子電極が前記電子部品素子の両端面及
び両端部の周囲を覆うよう配設されているとともに、異
方導電フィルムが前記両端面以外の面のうちの少なくと
も一面に配設されていることを特徴としている。Further, the electronic component element has a rectangular parallelepiped shape, the terminal electrodes are arranged so as to cover both end faces and the periphery of both end portions of the electronic component element, and the anisotropic conductive film is provided. It is characterized in that it is disposed on at least one of the surfaces other than both end surfaces.
【００１０】また、前記電子部品素子が直方体形状を有
しており、前記電子部品素子の一面に一対の端子電極が
配設されているとともに、前記端子電極の配設面に異方
導電フィルムが配設されていることを特徴としている。Further, the electronic component element has a rectangular parallelepiped shape, a pair of terminal electrodes are disposed on one surface of the electronic component element, and an anisotropic conductive film is disposed on the surface on which the terminal electrodes are disposed. It is characterized by being arranged.
【００１１】また、前記電子部品素子が直方体形状を有
しており、前記電子部品素子の一面に内部電極の端部が
端子電極として露出しているとともに、前記内部電極露
出面の少なくとも内部電極が露出している領域に異方導
電フィルムが配設されていることを特徴としている。Further, the electronic component element has a rectangular parallelepiped shape, the end of the internal electrode is exposed as a terminal electrode on one surface of the electronic component element, and at least the internal electrode on the internal electrode exposed surface is formed. An anisotropic conductive film is arranged in the exposed area.
【００１２】また、上記目的を達成するため、本願発明
の配線基板は、表面実装型の電子部品の端子電極が電気
的に接続されるパターン電極が表面に配設された配線基
板において、前記パターン電極の表面の少なくとも一部
に異方導電フィルムを配設し、前記異方導電フィルムを
介して前記電子部品の端子電極と前記パターン電極とを
電気的に接続するようにしたことを特徴としている。In order to achieve the above-mentioned object, the wiring board of the present invention is a wiring board in which pattern electrodes to which terminal electrodes of surface-mounted electronic components are electrically connected are arranged on the surface. An anisotropic conductive film is provided on at least a part of the surface of the electrode, and the terminal electrode of the electronic component and the pattern electrode are electrically connected via the anisotropic conductive film. .
【００１３】また、上記目的を達成するため、本願発明
の電子部品の実装構造は、配線基板上のパターン電極と
電子部品の端子電極とが電気的に接続するように、電子
部品を配線基板上に表面実装するための実装構造におい
て、前記電子部品の端子電極と前記配線基板のパターン
電極の間に異方導電フィルムを介在させた状態で、前記
電子部品を前記配線基板に圧着することにより、前記電
子部品の端子電極と前記配線基板のパターン電極を電気
的に接続したことを特徴としている。In order to achieve the above object, the mounting structure of the electronic component of the present invention is such that the electronic component is mounted on the wiring board so that the pattern electrode on the wiring board and the terminal electrode of the electronic component are electrically connected. In a mounting structure for surface mounting on, with the anisotropic conductive film interposed between the terminal electrode of the electronic component and the pattern electrode of the wiring board, by crimping the electronic component to the wiring board, The terminal electrode of the electronic component and the pattern electrode of the wiring board are electrically connected.
【００１４】[0014]
【作用】本願発明の電子部品においては、配線基板のパ
ターン電極への電気的接続用として電子部品素子の表面
に配設された端子電極の表面の少なくとも一部に異方導
電フィルムを配設し、この異方導電フィルムを介して配
線基板上のパターン電極と端子電極とを電気的に接続す
るように構成されており、配線基板に電子部品を実装す
るにあたって、異方導電フィルムが電子部品の端子電極
と配線基板のパターン電極の間に介在するように電子部
品の所定の位置に異方導電フィルムを配設しておき、電
子部品と配線基板の両方により異方導電フィルムが加
圧、圧着されるように押圧処理を行うことにより、異方
導電フィルムの接着作用によって端子電極とパターン電
極とが機械的に接続される一方、異方導電フィルムが加
圧に伴って偏平化し、異方導電フィルム中の導電材料粒
子が互いに接触して導通するとともに、導電材料粒子を
介して電子部品の端子電極と配線基板のパターン電極が
電気的に確実に接続される。したがって、はんだ付けを
行わなくても電子部品を確実に実装することができるよ
うになる。In the electronic component of the present invention, the anisotropic conductive film is provided on at least a part of the surface of the terminal electrode provided on the surface of the electronic component element for electrical connection to the pattern electrode of the wiring board. , Is configured to electrically connect the pattern electrode and the terminal electrode on the wiring board through the anisotropic conductive film, and when mounting the electronic component on the wiring substrate, the anisotropic conductive film An anisotropic conductive film is placed at a predetermined position on the electronic component so as to be interposed between the terminal electrode and the pattern electrode on the wiring board, and the anisotropic conductive film is pressed and pressed by both the electronic component and the wiring board. By performing the pressing process as described above, the terminal electrode and the pattern electrode are mechanically connected by the adhesive action of the anisotropic conductive film, while the anisotropic conductive film is flattened by the pressure. With conductive material particles in the anisotropic conductive film is rendered conductive in contact with each other, the pattern electrodes of the wiring board and the terminal electrodes of the electronic component via a conductive material particles are securely electrically connected. Therefore, the electronic component can be surely mounted without soldering.
【００１５】なお、異方導電フィルムは、厚み方向に対
しては導電性を発揮するが、面方向には導電粒子同士の
間に介在する電気絶縁性接着剤により導電性を発揮しな
いという導電異方性を有しているため、面方向に隣り合
う端子電極同士や面方向に隣り合うパターン電極同士が
電気的に接続して短絡するという異常事態は起こらな
い。また、異方導電フィルムの圧着は、電子部品が配線
基板へ押し付けられて動けない状態で行われることにな
るため、電子部品の取付不良が起こらず、圧着の際に必
要に応じて同時的に行われる加熱による熱ストレスもは
んだ付けに比べて小さいため、電子部品の信頼性低下を
防止することが可能になる。また、はんだ付けが不要な
ことから、はんだ付けを必要とする場合に発生するコス
トの増大及び鉛による環境汚染の問題も回避することが
可能になる。さらに、本願発明の電子部品では、異方導
電フィルムが予め配設されており、電子部品のユーザー
（セットメーカー）側が実装時に異方導電フィルムを用
意する必要がないため、実用上きわめて有意義である。
なお、本願発明において、異方導電フィルムは、必ずし
も電子部品に予め強固に取り付けられている必要はな
く、剥がすことができる程度に仮貼されていてもよい。The anisotropic conductive film exhibits conductivity in the thickness direction, but does not exhibit conductivity in the plane direction due to the electrically insulating adhesive interposed between the conductive particles. Since it has the directionality, the abnormal situation that the terminal electrodes adjacent to each other in the plane direction and the pattern electrodes adjacent to each other in the plane direction are electrically connected and short-circuit does not occur. In addition, the crimping of the anisotropic conductive film is performed in a state where the electronic component is pressed against the wiring board and cannot move. Since the thermal stress due to the heating performed is smaller than that of soldering, it is possible to prevent the reliability of the electronic component from lowering. In addition, since soldering is not necessary, it is possible to avoid the problem of increased cost and environmental pollution due to lead that occur when soldering is required. Further, in the electronic component of the present invention, the anisotropic conductive film is arranged in advance, and the user (set maker) side of the electronic component does not need to prepare the anisotropic conductive film at the time of mounting, which is extremely useful in practice. .
In the present invention, the anisotropic conductive film does not necessarily have to be firmly attached to the electronic component in advance, and may be temporarily attached so that it can be peeled off.
【００１６】また、電子部品素子が直方体形状を有し、
端子電極が電子部品素子の両端面及び両端部の周囲を覆
うように配設されているような電子部品の場合、異方導
電フィルムが端子電極が配設された両端面以外の面のう
ちの少なくとも一面に配設されていればよく、これによ
り電子部品の端子電極と配線基板のパターン電極とを電
気的、機械的に確実に接続することができる。The electronic component element has a rectangular parallelepiped shape,
In the case of an electronic component in which the terminal electrodes are arranged so as to cover both end surfaces of the electronic component element and the periphery of both end portions, the anisotropic conductive film is one of the surfaces other than the both end surfaces on which the terminal electrodes are arranged. It suffices that the terminal electrodes of the electronic component and the pattern electrodes of the wiring board are electrically and mechanically reliably connected to each other as long as they are arranged on at least one surface.
【００１７】また、電子部品素子が直方体形状を有し、
その一面に一対の端子電極が配設されているような電子
部品の場合には、異方導電フィルムを端子電極配設面だ
けに配設しておくことにより、上述の本願発明の作用を
確実に奏させることができる。Further, the electronic component element has a rectangular parallelepiped shape,
In the case of an electronic component in which a pair of terminal electrodes are arranged on one surface thereof, the anisotropic conductive film is arranged only on the terminal electrode arrangement surface to ensure the operation of the present invention described above. Can be played.
【００１８】また、電子部品素子が直方体形状を有し、
その一面に内部電極の端部が端子電極として露出してい
るような電子部品の場合、内部電極露出面の少なくとも
内部電極が露出している領域に異方導電フィルムを配設
しておくことにより、上述の本願発明の作用を確実に奏
させることができる。The electronic component element has a rectangular parallelepiped shape,
In the case of an electronic component in which the end of the internal electrode is exposed as a terminal electrode on one surface thereof, by disposing an anisotropic conductive film in at least the area of the internal electrode exposed surface where the internal electrode is exposed. The operation of the present invention described above can be reliably exhibited.
【００１９】本願発明の配線基板においては、電子部品
の端子電極への電気的接続用として基板表面に設けられ
たパターン電極の表面の少なくとも一部に異方導電フィ
ルムが配設され、この異方導電フィルムを介して電子部
品の端子電極とパターン電極とが電気的に接続されるよ
うに構成されており、配線基板に電子部品を実装するに
あたって、異方導電フィルムが電子部品の端子電極と配
線基板のパターン電極の間に介在するように配線基板の
所定の位置に異方導電フィルムを配設しておき、電子部
品と配線基板の両方により異方導電フィルムが加圧、圧
着されるように押圧処理を行うことにより、上記電子部
品の場合と同様の作用によって、電子部品の端子電極と
配線基板のパターン電極とが電気的、機械的に確実に接
続されることになる。In the wiring board of the present invention, an anisotropic conductive film is provided on at least a part of the surface of the pattern electrode provided on the surface of the board for electrical connection to the terminal electrode of the electronic component. The terminal electrode of the electronic component and the pattern electrode are configured to be electrically connected to each other through the conductive film, and when mounting the electronic component on the wiring board, the anisotropic conductive film is connected to the terminal electrode of the electronic component and the wiring. An anisotropic conductive film is placed at a predetermined position on the wiring board so as to be interposed between the pattern electrodes on the board, and the anisotropic conductive film is pressed and pressed by both the electronic component and the wiring board. By performing the pressing process, the terminal electrode of the electronic component and the pattern electrode of the wiring board are securely connected electrically and mechanically by the same action as in the case of the electronic component. .
【００２０】また、本願発明の電子部品の実装構造は、
電子部品の端子電極と配線基板のパターン電極の間に異
方導電フィルムを介在させた状態で、電子部品を配線基
板に圧着して、電子部品の端子電極と配線基板のパター
ン電極を電気的に接続させるようにしたものであって、
異方導電フィルムの圧着に伴う接着作用で端子電極の配
設領域とパターン電極の配設領域とが機械的に接続され
る一方、フィルムの中の導電粒子の導通作用で端子電極
とパターン電極とが電気的に接続されるため、はんだ付
けを使わずに電子部品の実装を行うことが可能になる。
なお、異方導電フィルムの圧着は、電子部品が配線基板
へ押し付けられて立ち上がったりすることのない状態で
行われるため、電子部品の取付不良が起こらず、圧着の
際に必要に応じて同時的に行われる加熱による熱ストレ
スもはんだ付けに比べて小さいため、電子部品の信頼性
低下を防止することが可能になる。また、はんだ付けが
不要なことから、コストの低減をはかることが可能にな
るとともに、環境汚染の原因となる鉛の使用も回避する
ことが可能になる。The mounting structure of the electronic component of the present invention is
With the anisotropic conductive film interposed between the terminal electrode of the electronic component and the pattern electrode of the wiring board, the electronic component is crimped to the wiring board to electrically connect the terminal electrode of the electronic component and the pattern electrode of the wiring board. It was made to connect,
The area where the terminal electrodes are arranged and the area where the pattern electrodes are arranged are mechanically connected to each other by the adhesive action that accompanies the pressure contact of the anisotropic conductive film, and the terminal electrodes and the pattern electrodes are formed by the conductive action of the conductive particles in the film. Are electrically connected, it is possible to mount electronic parts without using soldering.
Since the anisotropic conductive film is crimped when the electronic component is not pressed against the wiring board and does not stand up, the defective mounting of the electronic component does not occur. Since the thermal stress due to the heating that is performed is smaller than that of soldering, it is possible to prevent the reliability of the electronic component from decreasing. Further, since soldering is not necessary, it is possible to reduce the cost, and it is possible to avoid the use of lead, which causes environmental pollution.
【００２１】[0021]
【発明の実施の形態】以下、本願発明の実施の形態を示
してその特徴とするところをさらに詳しく説明する。な
お、ここでは、まず、電子部品として、積層セラミック
コンデンサを例にとって説明する。BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be shown and the features thereof will be described in more detail. Here, first, a multilayer ceramic capacitor will be described as an example of the electronic component.
【００２２】［実施形態１］図１(ａ)，図１(ｂ)はこの
実施形態の積層セラミックコンデンサ１を示す概略図で
ある。[Embodiment 1] FIGS. 1A and 1B are schematic views showing a monolithic ceramic capacitor 1 of this embodiment.
【００２３】図１（ａ）及び図１（ｂ）に示すように、
この実施形態の積層セラミックコンデンサ１は、容量形
成用の複数層の内部電極（図示せず）が配設され、その
一端側が一層ごとに交互に逆側の端面に引き出された直
方体形状を有する電子部品素子２の両端部２ａ，２ｂ
に、端子電極（外部電極）３，４を配設することにより
形成されており、端子電極３，４は端面全体及び両端部
２ａ，２ｂの周囲を覆っている。そして、この積層セラ
ミックコンデンサ１には、その上面（端面以外の面）全
体を覆うように、異方導電フィルム５が仮貼されてい
る。なお、積層セラミックコンデンサ１のサイズとして
は、例えば、横１．０ｍｍ×縦０．５ｍｍ×高さ０．５
ｍｍが例示される。As shown in FIGS. 1 (a) and 1 (b),
The multilayer ceramic capacitor 1 of this embodiment is provided with a plurality of layers of internal electrodes (not shown) for forming a capacitance, and one end side of each layer is formed into an alternating rectangular parallelepiped-shaped electronic shape. Both ends 2a, 2b of the component element 2
Are formed by disposing terminal electrodes (external electrodes) 3 and 4, and the terminal electrodes 3 and 4 cover the entire end face and both ends 2a and 2b. An anisotropic conductive film 5 is temporarily attached to the monolithic ceramic capacitor 1 so as to cover the entire upper surface (surfaces other than the end surfaces). The size of the monolithic ceramic capacitor 1 is, for example, 1.0 mm in width × 0.5 mm in length × 0.5 in height.
mm is illustrated.
【００２４】また、異方導電フィルム５としては、電気
絶縁性接着剤からなる厚み１５〜２５μｍ程度の絶縁フ
ィルム５ａの中に、粒径数μｍ〜数十μｍ程度の導電粒
子５ｂ，５ｂ，……を分散含有させたものであって、離
型性を有する厚み６０〜８０μｍのセパレータ（図示省
略）を介し、幅２〜３ｍｍ程度のテープとして供給され
たりするものを用いた。なお、電気絶縁性接着剤として
は、熱硬化性樹脂が例示されるが、これに限られるもの
ではない。また、導電粒子５ｂとしては、プラスチック
粒子の表面に、例えばアルミニウム層などの非鉛金属層
を形成したものが挙げられるが、これに限られるもので
はない。As the anisotropic conductive film 5, conductive particles 5b, 5b, ... Having a particle size of several μm to several tens of μm are contained in an insulating film 5a made of an electrically insulating adhesive and having a thickness of about 15 to 25 μm. Was dispersed and contained, and was supplied as a tape having a width of about 2 to 3 mm through a separator (not shown) having a releasability and a thickness of 60 to 80 μm. The electrically insulating adhesive is exemplified by a thermosetting resin, but is not limited to this. Examples of the conductive particles 5b include, but are not limited to, those obtained by forming a lead-free metal layer such as an aluminum layer on the surface of plastic particles.
【００２５】この異方導電フィルム５は、電子部品素子
２の上面の略全体に仮貼されているだけで、完全に固着
されてはいない。また、異方導電フィルム５は電子部品
素子２の上面全体を覆っているが、必ずしも上面全体を
覆い尽くしている必要はなく、必要な電気的、機械的接
続が得られる限りにおいて、端子電極３，４の少なくと
も一部を含んで、電子部品素子２の上面の一部を覆うよ
うにすることも可能である。さらに、異方導電フィルム
５は、、電子部品素子２の全面に被覆されてもよく、そ
うした場合、電子部品としての方向性をなくすことが可
能になる。The anisotropic conductive film 5 is only temporarily attached to the entire upper surface of the electronic component element 2 and is not completely fixed. Further, although the anisotropic conductive film 5 covers the entire upper surface of the electronic component element 2, it does not necessarily have to cover the entire upper surface, and as long as necessary electrical and mechanical connection is obtained, the terminal electrode 3 , 4 may be included to cover a part of the upper surface of the electronic component element 2. Further, the anisotropic conductive film 5 may be coated on the entire surface of the electronic component element 2, and in such a case, it becomes possible to eliminate the directivity of the electronic component.
【００２６】［実施形態２］図２は、本願発明の他の実
施形態にかかる積層セラミックコンデンサ８を示す概略
図である。図２（ａ）及び図２（ｂ）に示すように、こ
の積層セラミックコンデンサ８は、直方体形状の電子部
品素子２の上面（一面）に一対の（外部）端子電極９，
１０が配設された構造を有している。なお、この積層セ
ラミックコンデンサ８においては、内部電極が一層ごと
に電子部品素子２の上面の端子電極９又は１０が形成さ
れた領域に引き出されており、この引出部分（図示せ
ず）と接続するように端子電極９，１０が配設されてい
る。そして、電子部品素子２の端子電極９，１０の形成
面には、その全体を覆うように異方導電フィルム５が仮
貼されている。なお、積層セラミックコンデンサ８のサ
イズとしては、積層セラミックコンデンサ１のサイズよ
りも小さい横０．６ｍｍ×縦０．３ｍｍ×高さ０．３ｍ
ｍが例示される。これ以外の構成は、上記実施形態１の
積層セラミックコンデンサ１の場合と同様である。[Second Embodiment] FIG. 2 is a schematic view showing a monolithic ceramic capacitor 8 according to another embodiment of the present invention. As shown in FIGS. 2A and 2B, the multilayer ceramic capacitor 8 includes a pair of (external) terminal electrodes 9 on the upper surface (one surface) of the rectangular parallelepiped electronic component element 2.
It has a structure in which 10 is arranged. In the monolithic ceramic capacitor 8, the internal electrodes are drawn out layer by layer to the region where the terminal electrodes 9 or 10 are formed on the upper surface of the electronic component element 2 and are connected to the drawn parts (not shown). Thus, the terminal electrodes 9 and 10 are arranged. An anisotropic conductive film 5 is temporarily attached to the surface of the electronic component element 2 on which the terminal electrodes 9 and 10 are formed so as to cover the entire surface. The size of the monolithic ceramic capacitor 8 is smaller than the size of the monolithic ceramic capacitor 1 0.6 mm in width × 0.3 mm in length × 0.3 m in height.
m is illustrated. The other configuration is the same as that of the monolithic ceramic capacitor 1 of the first embodiment.
【００２７】［実施形態３］また、図３は、本願発明の
他の実施形態にかかる積層セラミックコンデンサ１２を
示す概略図である。図３（ａ）及び図３（ｂ）に示すよ
うに、この積層セラミックコンデンサ１２は、直方体形
状の電子部品素子２の一面に静電容量形成用の内部電極
の端部（端面）１３，１４が端子電極として引き出さ
れ、露出している。そして、電子部品素子２の、上記内
部電極の端部１３，１４の露出面全体には、異方導電フ
ィルム５が仮貼されている。これ以外の構成は、上記実
施形態１の積層セラミックコンデンサ１の場合と同様で
ある。[Third Embodiment] FIG. 3 is a schematic view showing a monolithic ceramic capacitor 12 according to another embodiment of the present invention. As shown in FIGS. 3A and 3B, the multilayer ceramic capacitor 12 includes end portions (end surfaces) 13 and 14 of internal electrodes for capacitance formation on one surface of the rectangular parallelepiped electronic component element 2. Is exposed as a terminal electrode. Then, the anisotropic conductive film 5 is temporarily attached to the entire exposed surfaces of the end portions 13 and 14 of the internal electrodes of the electronic component element 2. The other configuration is the same as that of the monolithic ceramic capacitor 1 of the first embodiment.
【００２８】［実施形態４］また、図４は、本願発明の
実施形態にかかる配線基板（プリント配線基板）２０を
示す概略断面図である。この配線基板２０は、絶縁基板
２１の表面（基板表面）に、電子部品の端子電極との電
気的接続のためのパターン電極２２，２２，……が配設
されているとともに、パターン電極２２の配設領域を覆
うように異方導電フィルム５が仮貼された構成を有して
いる。異方導電フィルム５は、上述のものと同じであ
る。なお、この配線基板２０において、異方導電フィル
ム５は、絶縁基板２１の表面全体を覆っている必要はな
く、絶縁基板２１の表面のパターン電極２２が配設され
た領域だけを部分的に覆うように配設してもよいが、全
体を覆うようにした場合、新たに絶縁膜などを設ける必
要がなくて有利である。また、この配線基板２０におい
ては、絶縁基板２１として、ガラスエポキシ基板、紙フ
ェノール基板などの有機系基板や、アルミナ基板などの
無機系基板などが例示されるが、絶縁基板２１の種類は
これらに限られるものではない。[Fourth Embodiment] FIG. 4 is a schematic sectional view showing a wiring board (printed wiring board) 20 according to an embodiment of the present invention. In this wiring board 20, pattern electrodes 22, 22, ... For electrical connection with terminal electrodes of electronic components are arranged on the surface of the insulating substrate 21 (substrate surface), and the pattern electrodes 22 The anisotropic conductive film 5 is temporarily attached so as to cover the disposition region. The anisotropic conductive film 5 is the same as that described above. In this wiring board 20, the anisotropic conductive film 5 does not need to cover the entire surface of the insulating substrate 21, but only partially covers the area of the surface of the insulating substrate 21 where the pattern electrodes 22 are arranged. Although it may be arranged as described above, it is advantageous to cover the whole because it is not necessary to newly provide an insulating film or the like. In the wiring board 20, the insulating substrate 21 may be an organic substrate such as a glass epoxy substrate or a paper phenol substrate, an inorganic substrate such as an alumina substrate, and the like. It is not limited.
【００２９】［実施形態５］次に、本願発明の電子部品
の実装構造の実施形態を説明する。図５は、本願発明の
一実施形態にかかる電子部品の実装構造を示す概略工程
図である。なお、この実施形態においては、電子部品と
して上記実施形態１の積層セラミックコンデンサ１を用
いている。この実施形態の実装構造においては、図５
（ａ）に示すように、配線基板２５として、絶縁基板２
１の表面にパターン電極２２，２２，……が配設された
ものが用いられている。なお、配線基板２５には、異方
導電フィルムは仮貼されていない。[Embodiment 5] Next, an embodiment of a mounting structure for electronic parts of the present invention will be described. FIG. 5 is a schematic process diagram showing a mounting structure of an electronic component according to an embodiment of the present invention. In this embodiment, the monolithic ceramic capacitor 1 according to the first embodiment is used as an electronic component. In the mounting structure of this embodiment, as shown in FIG.
As shown in (a), as the wiring substrate 25, the insulating substrate 2 is used.
One having pattern electrodes 22, 22, ... Arranged on the surface of 1 is used. The anisotropic conductive film is not temporarily attached to the wiring board 25.
【００３０】そして、この配線基板２５のパターン電極
２２の配設領域と、積層セラミックコンデンサ１の端子
電極３，４の配設領域の位置合わせを行いながら、積層
セラミックコンデンサ１の表面に仮貼された異方導電フ
ィルム５が配線基板２５の表面と対向するように（すな
わち下向きとなるように）、自動装着機により積層セラ
ミックコンデンサ１を所定の位置へ配置（装着）する
（図５（ｂ））。なお、各積層セラミックコンデンサ１
を配置（装着）する前に、異方導電フィルム５に対し
て、必要に応じて、例えば温度８０〜９０°Ｃ，圧力１
ＭＰａ，約５秒間の条件の予備加熱加圧処理を行った
り、異方導電フィルム５のセパレータ（図示省略）を剥
がすなどの前処置が行われたりする。Then, while arranging the area where the pattern electrodes 22 of the wiring board 25 are arranged and the area where the terminal electrodes 3 and 4 of the monolithic ceramic capacitor 1 are arranged, it is temporarily attached to the surface of the monolithic ceramic capacitor 1. The laminated ceramic capacitor 1 is arranged (mounted) at a predetermined position by an automatic mounting machine so that the anisotropic conductive film 5 faces the surface of the wiring board 25 (that is, faces downward) (FIG. 5B). ). Each monolithic ceramic capacitor 1
Before arranging (mounting), if necessary, for example, a temperature of 80 to 90 ° C., a pressure of 1
Pretreatment such as pre-heating and pressurizing under the condition of MPa for about 5 seconds or preparatory treatment such as peeling off the separator (not shown) of the anisotropic conductive film 5 is performed.
【００３１】次いで、図５（ｃ）に示すように、異方導
電フィルム５が積層セラミックコンデンサ１と配線基板
２５の両方で加圧されるよう熱プレス機などにより加熱
加圧処理を行う。加熱加圧処理の条件は、例えば温度１
７０〜１８０°Ｃ，圧力２ＭＰａ，約２０秒間であり、
はんだ付けの場合に比べると熱ストレスは小さい。これ
により、異方導電フィルム５を構成する接着剤が一旦流
動化して、端子電極３，４とパターン電極２２の間で扁
平化し、接着剤（絶縁フィルム）中に分散している導電
粒子５ｂが互いに接触して導通する。その結果、端子電
極３，４とパターン電極２２が導電粒子５ｂを介して電
気的に接続されるとともに、加熱加圧処理後に、異方導
電フィルム５を構成する接着剤（絶縁フィルム）５ａが
硬化することにより、積層セラミックコンデンサ１と配
線基板２５の機械的な接続が行われ、図５（ｃ）に示す
ような、電子部品の実装構造が得られる。なお、異方導
電フィルムの、端子電極３，４とパターン電極２２の間
に挟まれていない部分では、導電粒子５ｂが接着剤（絶
縁フィルム）５ａ中に不連続状態で分散しているため、
必要な絶縁状態が確保される。Next, as shown in FIG. 5 (c), heat and pressure treatment is performed by a heat press machine or the like so that the anisotropic conductive film 5 is pressed by both the laminated ceramic capacitor 1 and the wiring substrate 25. The condition of the heat and pressure treatment is, for example, temperature 1
70 to 180 ° C., pressure 2 MPa, about 20 seconds,
Thermal stress is small compared to the case of soldering. As a result, the adhesive forming the anisotropic conductive film 5 is fluidized once and flattened between the terminal electrodes 3 and 4 and the pattern electrode 22, and the conductive particles 5b dispersed in the adhesive (insulating film) are generated. They come into contact with each other and become conductive. As a result, the terminal electrodes 3 and 4 and the pattern electrode 22 are electrically connected via the conductive particles 5b, and the adhesive (insulating film) 5a constituting the anisotropic conductive film 5 is cured after the heat and pressure treatment. By doing so, the monolithic ceramic capacitor 1 and the wiring board 25 are mechanically connected to each other, and an electronic component mounting structure as shown in FIG. 5C is obtained. In the part of the anisotropic conductive film that is not sandwiched between the terminal electrodes 3 and 4 and the pattern electrode 22, the conductive particles 5b are dispersed in the adhesive (insulating film) 5a in a discontinuous state.
The required insulation is ensured.
【００３２】［実施形態６］なお、図６に、本願発明の
電子部品の実装構造の得るための他の方法を示す。な
お、ここでは、配線基板として、上記の実施形態４の配
線基板２０が用いられている。また、電子部品として
は、図６（ａ）に示すように、実施形態１の積層セラミ
ックコンデンサ１において異方導電フィルム５が仮貼さ
れていない他は同じ構成の積層セラミックコンデンサ２
７が用いられている。この方法の場合、まず、配線基板
２０に仮貼されている異方導電フィルム５に対して、温
度８０〜９０°Ｃ，圧力１ＭＰａ，約５秒間の条件の予
備加熱加圧処理を行った後、異方導電フィルム５からセ
パレータ（図示省略）を剥がし、自動装着機で積層セラ
ミックコンデンサ２７を配線基板２０の所定の位置に配
置する（図６(ｂ)）。[Sixth Embodiment] FIG. 6 shows another method for obtaining the mounting structure of the electronic component of the present invention. Here, the wiring board 20 of the above-described fourth embodiment is used as the wiring board. As an electronic component, as shown in FIG. 6A, a laminated ceramic capacitor 2 having the same configuration except that the anisotropic conductive film 5 is not temporarily attached to the laminated ceramic capacitor 1 of the first embodiment.
7 is used. In the case of this method, first, the anisotropic conductive film 5 temporarily attached to the wiring board 20 is preheated and pressed under the conditions of a temperature of 80 to 90 ° C., a pressure of 1 MPa and a time of about 5 seconds. Then, a separator (not shown) is peeled off from the anisotropic conductive film 5, and the laminated ceramic capacitor 27 is placed at a predetermined position on the wiring board 20 by an automatic mounting machine (FIG. 6 (b)).
【００３３】ついで、図６（ｃ）に示すように、異方導
電フィルム５が積層セラミックコンデンサ２７と配線基
板２０の両方で加圧されるように熱プレス機などで加熱
加圧処理を行う。加熱加圧処理の条件は上記実施形態５
と同じである。この実施形態の方法の場合にも、加熱加
圧処理により、積層セラミックコンデンサ２７と配線基
板２０とが、異方導電フィルム５を介して電気的及び機
械的に確実に接続され、図６（ｃ）に示すような電子部
品の実装構造が得られる。なお、この実施形態の方法に
より得られる実装構造は、上述の実施形態５の接続構造
（図５(ｃ)）と実質的に同じである。Next, as shown in FIG. 6 (c), heat and pressure treatment is performed by a heat press machine or the like so that the anisotropic conductive film 5 is pressed by both the laminated ceramic capacitor 27 and the wiring board 20. The conditions of the heating and pressurizing process are the same as those in the fifth embodiment
Is the same as Also in the case of the method of this embodiment, the laminated ceramic capacitor 27 and the wiring board 20 are reliably electrically and mechanically connected to each other through the anisotropic conductive film 5 by the heat and pressure treatment, as shown in FIG. The electronic component mounting structure as shown in FIG. The mounting structure obtained by the method of this embodiment is substantially the same as the connection structure (FIG. 5 (c)) of the fifth embodiment described above.
【００３４】なお、上記の実施形態では、電子部品が積
層セラミックコンデンサである場合を例にとって説明し
たが、本願発明は、電子部品が積層セラミックコンデン
サ以外の電子部品である場合にも適用することが可能で
ある。In the above embodiment, the case where the electronic component is a monolithic ceramic capacitor has been described as an example, but the present invention can be applied to the case where the electronic component is an electronic component other than the monolithic ceramic capacitor. It is possible.
【００３５】また、上記の実施の形態では、異方導電フ
ィルム５による圧着接続処理の際、圧力だけでなく熱も
加えるようにしたが、異方導電フィルム５による圧着接
続処理の際、熱を加える必要のない異方導電フィルム５
を用いる構成も他の実施の形態として挙げることができ
る。Further, in the above embodiment, not only the pressure but also the heat is applied in the pressure-bonding connection process by the anisotropic conductive film 5, but the heat is applied in the pressure-bonding connection process by the anisotropic conductive film 5. Anisotropic conductive film 5 that does not need to be added
The configuration using can be mentioned as another embodiment.
【００３６】また、上記実施形態５の電子部品の実装構
造では、実施形態１の積層セラミックコンデンサ１を用
いた場合について説明したが、実施形態２に示すような
積層セラミックコンデンサ８や実施形態３に示すような
積層セラミックコンデンサ１２を用いることも可能であ
る。In the mounting structure of the electronic component of the fifth embodiment, the case where the monolithic ceramic capacitor 1 of the first embodiment is used has been described. However, the monolithic ceramic capacitor 8 as shown in the second embodiment or the third embodiment is used. It is also possible to use the monolithic ceramic capacitor 12 as shown.
【００３７】本願発明は、さらにその他の点においても
上記実施形態に限定されるものではなく、発明の要旨の
範囲内において、種々の応用、変形を加えることが可能
である。The present invention is not limited to the above embodiment in other respects, and various applications and modifications can be added within the scope of the gist of the invention.
【００３８】[0038]
【発明の効果】本願発明の電子部品は、異方導電フィル
ムを利用して配線基板に実装するようにしているので、
はんだ付けによることなく、電子部品の端子電極と配線
基板のパターン電極を電気的に確実に接続することがで
きる。また、異方導電フィルムの圧着による実装は、電
子部品を配線基板に圧着することにより行われるため、
電子部品の取付不良を引き起こすことがなく、また、圧
着の際の熱ストレスもはんだ付けの場合に比べれば少な
く、電子部品の信頼性の低下を防止することができる。
また、はんだ付けが不要なことから、はんだ付けを必要
とする場合に発生するコストの増大及び鉛による環境汚
染の問題も回避することができる。さらに、異方導電フ
ィルムが予め配設されているため、ユーザー側が異方導
電フィルムを調達する必要がないという点でも、きわめ
て高い実用性を備えている。Since the electronic component of the present invention is mounted on the wiring board by utilizing the anisotropic conductive film,
The terminal electrode of the electronic component and the pattern electrode of the wiring board can be electrically and reliably connected without soldering. Further, since the mounting of the anisotropic conductive film by crimping is performed by crimping the electronic component to the wiring board,
It is possible to prevent the electronic component from being attached poorly, and to reduce the thermal stress at the time of crimping as compared with the case of soldering, so that the reliability of the electronic component can be prevented from lowering.
Further, since soldering is not required, it is possible to avoid the problem of increased cost and environmental pollution due to lead, which occurs when soldering is required. Further, since the anisotropic conductive film is arranged in advance, the user side does not need to procure the anisotropic conductive film, which is extremely high practicality.
【００３９】また、電子部品素子が直方体形状を有し、
端子電極が電子部品素子の両端面及び両端部の周囲を覆
うように配設されているような電子部品の場合にも、異
方導電フィルムが端子電極が配設された両端面以外の面
のうちの少なくとも一面に配設されていればよいため、
本願発明を適用することにより容易に実装することが可
能になる。The electronic component element has a rectangular parallelepiped shape,
Even in the case of an electronic component in which the terminal electrodes are arranged so as to cover both end faces of the electronic component element and the periphery of the both end portions, the anisotropic conductive film is formed on the surface other than the both end faces on which the terminal electrodes are disposed. As long as it is arranged on at least one surface of the
By applying the present invention, it becomes possible to easily implement the present invention.
【００４０】また、電子部品素子が直方体形状を有し、
その一面に一対の端子電極が配設されているような電子
部品の場合にも、異方導電フィルムを端子電極配設面だ
けに配設しておけばよく、本願発明を適用することによ
り容易に実装することが可能になる。The electronic component element has a rectangular parallelepiped shape,
Even in the case of an electronic component in which a pair of terminal electrodes are arranged on one surface thereof, it is sufficient to dispose the anisotropic conductive film only on the terminal electrode arrangement surface, which is easy by applying the present invention. Can be implemented in.
【００４１】また、電子部品素子が直方体形状を有し、
その一面に内部電極の端部が端子電極として露出してい
るような電子部品の場合にも、内部電極露出面の少なく
とも内部電極が露出している領域に異方導電フィルムを
配設しておくことにより、上述の本願発明の作用を確実
に奏させることができる。Further, the electronic component element has a rectangular parallelepiped shape,
Even in the case of an electronic component in which the end portion of the internal electrode is exposed as a terminal electrode on one surface thereof, the anisotropic conductive film is provided on at least the area of the internal electrode exposed surface where the internal electrode is exposed. As a result, the above-described operation of the present invention can be reliably achieved.
【００４２】本願発明の配線基板は、パターン電極の表
面の少なくとも一部に異方導電フィルムが配設され、こ
の異方導電フィルムを介して電子部品の端子電極とパタ
ーン電極とが電気的に接続されるように構成されている
ので、異方導電フィルムの圧着に伴う接着作用で端子電
極の配設領域とパターン電極の配設領域とが機械的に接
続される一方、フィルムの中の導電粒子の導通作用で端
子電極とパターン電極とが電気的に接続されるため、は
んだ付けを使わずに電子部品の実装を行うことが可能に
なる。In the wiring board of the present invention, the anisotropic conductive film is provided on at least a part of the surface of the pattern electrode, and the terminal electrode of the electronic component and the pattern electrode are electrically connected via the anisotropic conductive film. As a result, the area where the terminal electrodes are arranged and the area where the pattern electrodes are arranged are mechanically connected to each other by the adhesive action accompanying the pressure bonding of the anisotropic conductive film, while the conductive particles in the film are formed. Since the terminal electrode and the pattern electrode are electrically connected to each other by the conduction action of, the electronic component can be mounted without using soldering.
【００４３】また、本願発明の電子部品の実装構造は、
電子部品の端子電極と配線基板のパターン電極の間に異
方導電フィルムを介在させた状態で、電子部品を配線基
板に圧着して、電子部品の端子電極と配線基板のパター
ン電極を電気的、機械的に接続させるようにしたもので
あり、異方導電フィルムの圧着による実装は、電子部品
が配線基板へ押し付けられて動けない状態でなされるた
め、電子部品の取付不良が起こらず、しかも、圧着の際
の熱ストレスもはんだ付けの場合に比べて小さくなるた
め、電子部品の信頼性が低下することを防止できる。ま
た、はんだ付けが不要なことから、コストの低減をはか
ることができるようになるとともに、環境汚染の原因と
なる鉛の使用も回避することができる。The mounting structure of the electronic component of the present invention is as follows.
With the anisotropic conductive film interposed between the terminal electrode of the electronic component and the pattern electrode of the wiring board, the electronic component is pressure-bonded to the wiring board to electrically connect the terminal electrode of the electronic component and the pattern electrode of the wiring board. It is designed to be mechanically connected, and the mounting by pressure bonding of the anisotropic conductive film is performed in a state where the electronic component is pressed against the wiring board and cannot move, so that the mounting failure of the electronic component does not occur, and moreover, Since the thermal stress at the time of crimping is smaller than that at the time of soldering, it is possible to prevent the reliability of the electronic component from decreasing. Further, since soldering is unnecessary, it becomes possible to reduce the cost, and it is possible to avoid the use of lead, which causes environmental pollution.
【図１】本願発明の一実施形態にかかる積層セラミック
コンデンサを示す概略図である。FIG. 1 is a schematic diagram showing a monolithic ceramic capacitor according to an embodiment of the present invention.
【図２】本願発明の他の実施形態にかかる積層セラミッ
クコンデンサを示す概略図である。FIG. 2 is a schematic view showing a monolithic ceramic capacitor according to another embodiment of the present invention.
【図３】本願発明のさらに他の実施形態にかかる積層セ
ラミックコンデンサを示す概略図である。FIG. 3 is a schematic view showing a monolithic ceramic capacitor according to still another embodiment of the present invention.
【図４】本願発明の実施形態にかかる配線基板示す概略
断面図である。FIG. 4 is a schematic cross-sectional view showing a wiring board according to an embodiment of the present invention.
【図５】本願発明の実施形態にかかる電子部品の実装構
造を説明する概略工程図である。FIG. 5 is a schematic process diagram illustrating a mounting structure of an electronic component according to an embodiment of the present invention.
【図６】本願発明の他の実施形態にかかる電子部品の実
装構造を説明する概略工程図である。FIG. 6 is a schematic process diagram illustrating an electronic component mounting structure according to another embodiment of the present invention.
【図７】従来の電子部品の実装構造を示す概略図であ
る。FIG. 7 is a schematic diagram showing a conventional electronic component mounting structure.
【図８】従来の電子部品の取付不良例を示す説明図であ
る。FIG. 8 is an explanatory diagram showing an example of a defective mounting of a conventional electronic component.
【図９】従来の電子部品の他の取付不良例を示す説明図
である。FIG. 9 is an explanatory diagram showing another example of defective mounting of the conventional electronic component.
【図１０】従来の電子部品の他の取付不良例を示す説明
図である。FIG. 10 is an explanatory diagram showing another example of a defective mounting of a conventional electronic component.
１，８，１２，２７ 積層セラミックコン
デンサ ２ 電子部品素子 ３，４，９，１０ 端子電極 ５ 異方導電フィルム ５ａ 接着剤（絶縁フィル
ム） ５ｂ 導電粒子 １３，１４ 内部電極の端部 ２０，２５ 配線基板 ２１ 絶縁基板 ２２ パターン電極1, 8, 12, 27 Multilayer ceramic capacitor 2 Electronic component element 3, 4, 9, 10 Terminal electrode 5 Anisotropic conductive film 5a Adhesive (insulating film) 5b Conductive particle 13,14 End of internal electrode 20,25 Wiring Substrate 21 Insulating substrate 22 Pattern electrode
Claims (6)
的に接続される端子電極が電子部品素子の表面に配設さ
れた構造を有する表面実装型の電子部品において、 前記端子電極の表面の少なくとも一部に異方導電フィル
ムを配設し、前記異方導電フィルムを介して前記配線基
板上のパターン電極と前記端子電極とを電気的に接続す
るようにしたことを特徴とする電子部品。1. A surface mount electronic component having a structure in which a terminal electrode electrically connected to a pattern electrode provided on a wiring board is arranged on the surface of an electronic component element, wherein the surface of the terminal electrode is An electronic component, characterized in that an anisotropic conductive film is provided at least at a part, and a pattern electrode on the wiring board and the terminal electrode are electrically connected via the anisotropic conductive film.
り、前記端子電極が前記電子部品素子の両端面及び両端
部の周囲を覆うよう配設されているとともに、異方導電
フィルムが前記両端面以外の面のうちの少なくとも一面
に配設されていることを特徴とする請求項１記載の電子
部品。2. The electronic component element has a rectangular parallelepiped shape, the terminal electrodes are arranged so as to cover both end faces and the periphery of both end portions of the electronic component element, and the anisotropic conductive film is provided. The electronic component according to claim 1, wherein the electronic component is disposed on at least one of the surfaces other than both end surfaces.
り、前記電子部品素子の一面に一対の端子電極が配設さ
れているとともに、前記端子電極の配設面に異方導電フ
ィルムが配設されていることを特徴とする請求項１記載
の電子部品。3. The electronic component element has a rectangular parallelepiped shape, a pair of terminal electrodes are disposed on one surface of the electronic component element, and an anisotropic conductive film is disposed on the surface on which the terminal electrodes are disposed. The electronic component according to claim 1, wherein the electronic component is provided.
り、前記電子部品素子の一面に内部電極の端部が端子電
極として露出しているとともに、前記内部電極露出面の
少なくとも内部電極が露出している領域に異方導電フィ
ルムが配設されていることを特徴とする請求項１記載の
電子部品。4. The electronic component element has a rectangular parallelepiped shape, end portions of internal electrodes are exposed as terminal electrodes on one surface of the electronic component element, and at least internal electrodes on the internal electrode exposed surface are formed. The electronic component according to claim 1, wherein an anisotropic conductive film is provided in the exposed region.
に接続されるパターン電極が表面に配設された配線基板
において、 前記パターン電極の表面の少なくとも一部に異方導電フ
ィルムを配設し、前記異方導電フィルムを介して前記電
子部品の端子電極と前記パターン電極とを電気的に接続
するようにしたことを特徴とする配線基板。5. A wiring board having a pattern electrode on the surface thereof, to which a terminal electrode of a surface-mounted electronic component is electrically connected, wherein an anisotropic conductive film is provided on at least a part of the surface of the pattern electrode. The wiring board is provided so that the terminal electrode of the electronic component and the pattern electrode are electrically connected via the anisotropic conductive film.
子電極とが電気的に接続するように、電子部品を配線基
板上に表面実装するための実装構造において、 前記電子部品の端子電極と前記配線基板のパターン電極
の間に異方導電フィルムを介在させた状態で、前記電子
部品を前記配線基板に圧着することにより、前記電子部
品の端子電極と前記配線基板のパターン電極を電気的に
接続したことを特徴とする電子部品の実装構造。6. A mounting structure for surface-mounting an electronic component on a wiring board such that a pattern electrode on the wiring board and a terminal electrode of the electronic component are electrically connected to each other. By crimping the electronic component to the wiring substrate with the anisotropic conductive film interposed between the pattern electrodes of the wiring substrate, the terminal electrode of the electronic component and the pattern electrode of the wiring substrate are electrically connected. Electronic component mounting structure characterized by connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16536896A JPH09326326A (en) | 1996-06-04 | 1996-06-04 | Electronic parts and wiring board, and packaging structure of electronic parts on wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16536896A JPH09326326A (en) | 1996-06-04 | 1996-06-04 | Electronic parts and wiring board, and packaging structure of electronic parts on wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09326326A true JPH09326326A (en) | 1997-12-16 |
Family
ID=15811050
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16536896A Pending JPH09326326A (en) | 1996-06-04 | 1996-06-04 | Electronic parts and wiring board, and packaging structure of electronic parts on wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09326326A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006190799A (en) * | 2005-01-06 | 2006-07-20 | Sony Chem Corp | Manufacturing method for substrate with electrical component |
| WO2007083378A1 (en) * | 2006-01-20 | 2007-07-26 | Fujitsu Limited | Chip component mounting structure, chip component mounting method and electronic device |
| US7888182B2 (en) | 2006-03-30 | 2011-02-15 | Tdk Corporation | Electronic component, production method of electronic component, mounted structure of electronic component, and evaluation method of electronic component |
| JP2019041095A (en) * | 2017-08-28 | 2019-03-14 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | Composite electronic component and mounting board thereof |
-
1996
- 1996-06-04 JP JP16536896A patent/JPH09326326A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006190799A (en) * | 2005-01-06 | 2006-07-20 | Sony Chem Corp | Manufacturing method for substrate with electrical component |
| WO2007083378A1 (en) * | 2006-01-20 | 2007-07-26 | Fujitsu Limited | Chip component mounting structure, chip component mounting method and electronic device |
| JPWO2007083378A1 (en) * | 2006-01-20 | 2009-06-11 | 富士通株式会社 | Chip component mounting structure, mounting method, and electronic apparatus |
| US7888182B2 (en) | 2006-03-30 | 2011-02-15 | Tdk Corporation | Electronic component, production method of electronic component, mounted structure of electronic component, and evaluation method of electronic component |
| JP2019041095A (en) * | 2017-08-28 | 2019-03-14 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | Composite electronic component and mounting board thereof |
| US10699846B2 (en) | 2017-08-28 | 2020-06-30 | Samsung Electro-Mechanics Co., Ltd. | Composite electronic component and board having the same |
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