JPH09315488A - Electronic parts carrying body - Google Patents
Electronic parts carrying bodyInfo
- Publication number
- JPH09315488A JPH09315488A JP8156002A JP15600296A JPH09315488A JP H09315488 A JPH09315488 A JP H09315488A JP 8156002 A JP8156002 A JP 8156002A JP 15600296 A JP15600296 A JP 15600296A JP H09315488 A JPH09315488 A JP H09315488A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- component carrier
- storage container
- peripheral side
- embossed portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Packages (AREA)
- Packaging Frangible Articles (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は電子部品搬送体に関
し、例えば半導体チツプを収納する凹部形状でなる収納
容器をテープ状のシート又はフイルムに複数形成してな
る搬送体に適用して好適なものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component carrier, and is suitable for application to, for example, a carrier formed by forming a plurality of recessed storage containers for storing semiconductor chips on a tape-shaped sheet or film. Is.
【０００２】[0002]
【従来の技術】従来、基板上に実装される電子部品は、
昨今、その部品点数及び種別が多いために人手によつて
装着することが困難であり、大部分の部品がインサート
マシン等の機械的手段によつて基板上に装着されてい
る。このため、電子部品はテープ状の搬送体（いわゆる
搬送トレイ）に載せられた状態で部品メーカから出荷及
び搬送されており、この状態のままでインサートマシン
の供給装置に取り付けることができるようになつてい
る。このように搬送体は、電子部品を載せた状態でイン
サートマシンの供給装置に取り付けられることによりイ
ンサートマシンに遅滞無く電子部品を供給することがで
き、基板上への電子部品の装着効率を向上させることが
できる。2. Description of the Related Art Conventionally, electronic components mounted on a board are
Due to the large number of parts and the number of types, it is difficult to mount them manually, and most of the parts are mounted on a substrate by mechanical means such as an insert machine. For this reason, the electronic components are shipped and transported from the component manufacturer while being mounted on a tape-shaped carrier (so-called carrier tray), and can be attached to the supply device of the insert machine in this state. ing. As described above, the carrier is attached to the supply device of the insert machine with the electronic parts placed thereon, so that the electronic parts can be supplied to the insert machine without delay, and the mounting efficiency of the electronic parts on the substrate is improved. be able to.
【０００３】図６において、１は全体として電子部品搬
送体を示し、テープ状のシート又はフイルムの幅方向の
中央部に、収納対象となる電子部品の大きさに応じて形
成された凹部形状でなる収納容器（以下、これをエンボ
ス部と呼ぶ）２を所定間隔をもつて複数有している。ま
た電子部品搬送体１の幅方向の両側端には側端に沿つて
送り穴３が所定のピツチ間隔でそれぞれ形成されてい
る。In FIG. 6, reference numeral 1 denotes an electronic component carrier as a whole, which is a concave shape formed in the widthwise central portion of a tape-shaped sheet or film in accordance with the size of an electronic component to be stored. A plurality of storage containers 2 (hereinafter, referred to as embossed portions) 2 are provided at predetermined intervals. In addition, feed holes 3 are formed at predetermined pitch intervals along both side edges of the electronic component carrier 1 in the width direction.
【０００４】さらに図７に示すように、エンボス部２の
周側面は所定の角度でなる傾斜を有しており、底面２Ａ
に比して開口部２Ｂが幅広になつている。電子部品搬送
体１は金型を用いた加熱成形により形成されるため、こ
のようにエンボス部２の周側面に傾斜をつけて形成する
ことにより金型から容易に取り外し得る。Further, as shown in FIG. 7, the peripheral side surface of the embossed portion 2 is inclined at a predetermined angle, and the bottom surface 2A is formed.
The opening 2B is wider than that of the above. Since the electronic component carrier 1 is formed by heat molding using a mold, it can be easily removed from the mold by thus forming the peripheral side surface of the embossed portion 2 with an inclination.
【０００５】このようにして製造された電子部品搬送体
１は、渦巻き形状に巻回された状態で搬出され、まず電
子部品メーカに納入される。電子部品メーカでは、テー
ピングマシンと呼ばれる装置を用いて電子部品搬送体１
に各電子部品を封入する。具体的には、まず巻回された
状態の電子部品搬送体１を解いた後、各エンボス部２内
に電子部品を挿入する。こうしてエンボス部２に電子部
品を収納した状態で、エンボス部２の開口部２Ｂを有す
る面にカバーテープを貼付することによつて、電子部品
搬送体１に電子部品を封入する。こうして電子部品を収
納した電子部品搬送体１は、これらの電子部品を使用す
る各製造メーカに搬出される。The electronic component carrier 1 manufactured in this manner is unwound in a spirally wound state and first delivered to an electronic component maker. Electronic component makers use a device called a taping machine to transport the electronic component carrier 1.
Enclose each electronic component in. Specifically, after first unwinding the rolled electronic component carrier 1, the electronic component is inserted into each embossed portion 2. In this way, with the electronic component housed in the embossed portion 2, by attaching a cover tape to the surface of the embossed portion 2 having the opening 2B, the electronic component is sealed in the electronic component carrier 1. The electronic component carrier 1 containing the electronic components in this way is carried out to each manufacturer who uses these electronic components.
【０００６】図８に示すように、このように電子部品を
収納した電子部品搬送体１は、リールで渦巻き形状に巻
き取られた状態で各製造メーカに搬送された後に、イン
サートマシンの供給装置に取り付けられる。供給装置に
取り付けられた電子部品搬送体１は、送り穴３をインサ
ートマシン内のスプロケツトに嵌合させる。送り穴３を
スプロケツトに嵌合させた電子部品搬送体１は、スプロ
ケツトの回転駆動により解かれながら引き出されると共
にカバーテープを剥がされる。インサートマシンは、こ
うして引き出された部分から収納された電子部品を取り
出すことができる。As shown in FIG. 8, the electronic component carrier 1 in which the electronic components are housed in this way is transported to each manufacturer in a state where it is wound in a spiral shape on a reel, and then is supplied to an insert machine supply device. Attached to. The electronic component carrier 1 attached to the supply device fits the feed hole 3 into a sprocket in the insert machine. The electronic component carrier 1 having the feed hole 3 fitted in the sprocket is pulled out while being unwound by the rotational drive of the sprocket and the cover tape is peeled off. The insert machine can take out the stored electronic component from the part thus pulled out.
【０００７】電子部品搬送体１は、このように巻回され
た形状で搬送されるために、多くの部品を収納した状態
でも、より小さい空間に効率的に収納することができ
る。また同様の理由により、供給装置及びテーピングマ
シン内の電子部品搬送体１を収納する空間を小型化する
ことができる。Since the electronic component carrier 1 is transported in such a wound shape, it can be efficiently accommodated in a smaller space even when many components are accommodated. For the same reason, the space for housing the electronic component carrier 1 in the feeder and the taping machine can be downsized.
【０００８】[0008]
【発明が解決しようとする課題】ところでかかる構成の
電子部品搬送体１においては、各エンボス部２が同一形
状で形成されており、巻き取つた形状で搬送及びテーピ
ングマシンへの取り付けがなされているため、搬送時等
の振動の影響によりエンボス部２が互いに嵌まり込んで
しまう場合がある。By the way, in the electronic component carrier 1 having such a structure, each embossed portion 2 is formed in the same shape, and the embossed portion 2 is carried in a wound shape and attached to a taping machine. Therefore, the embossed portions 2 may be fitted into each other due to the influence of vibration during transportation.
【０００９】すなわち図９に示すように、巻き取つた状
態の電子部品搬送体１において、内周部分のエンボス部
２に外周部分のエンボス部２が嵌まり込んでしまう。こ
こでエンボス部２の周側面には傾斜角がつけられてお
り、底面２Ａに比して開口部２Ｂが幅広となつているた
め（図７）、より一層嵌まり込み易くなつている。この
ため電子部品搬送体１を巻き取る際及び巻き取られた電
子部品搬送体１を解く際にエンボス部２が潰れたり、変
形したりしてしまうという問題がある。このように潰れ
たり変形してしまつた場合、上述したテーピングマシン
によつてエンボス部２に部品を挿入することが困難とな
る。またこのようなエンボス部２に電子部品を挿入して
しまつた場合、製造メーカでインサートマシンに取り付
けた際にエンボス部２から電子部品を取り出すことが困
難となる。That is, as shown in FIG. 9, in the wound electronic component carrier 1, the embossed portion 2 of the outer peripheral portion is fitted into the embossed portion 2 of the inner peripheral portion. Here, the peripheral side surface of the embossed portion 2 is provided with an inclination angle, and the opening 2B is wider than the bottom surface 2A (FIG. 7), so that it is easier to fit. Therefore, there is a problem that the embossed portion 2 is crushed or deformed when the electronic component carrier 1 is wound and when the rolled electronic component carrier 1 is unwound. If it is crushed or deformed in this way, it becomes difficult to insert the component into the embossed portion 2 by the taping machine described above. Further, if the electronic component is inserted into such an embossed portion 2, it becomes difficult for the manufacturer to take out the electronic component from the embossed portion 2 when the electronic component is attached to the insert machine.
【００１０】このような問題を回避するために、エンボ
ス部２の周側面につけられている傾斜角を無くす方法が
考えられる。ところが、このように傾斜角を無くした場
合、金型から電子部品搬送体１を取り外すことが困難に
なる。また、傾斜角を無くしても完全に嵌まり込まない
ようにすることは困難であり、嵌まり込む深さを浅くす
る程度に止まる。この場合、エンボス部２の底面の角部
分だけが嵌まり込んだ相手方のエンボス部２の内壁と接
触して、この部分だけに力が加わることになる。エンボ
ス部２の底面の角部分は、その構造上、厚みが薄くなつ
ており他の部分に比して強度的に弱くなつているため、
この部分だけに力が加わることによつて、より一層潰れ
易くなつてしまう。In order to avoid such a problem, a method of eliminating the inclination angle provided on the peripheral side surface of the embossed portion 2 can be considered. However, if the inclination angle is eliminated in this way, it becomes difficult to remove the electronic component carrier 1 from the mold. Further, even if the inclination angle is eliminated, it is difficult to prevent the fitting from completely fitting, and the fitting depth is limited to a shallow depth. In this case, only the corner portion of the bottom surface of the embossed portion 2 comes into contact with the inner wall of the embossed portion 2 of the opponent, and the force is applied only to this portion. Since the corner portion of the bottom surface of the embossed portion 2 is thin due to its structure and is weaker in strength than other portions,
By applying a force only to this portion, it becomes easier to be crushed.
【００１１】本発明は以上の点を考慮してなされたもの
で、収納容器同士の嵌合による潰れを回避し得る電子部
品搬送体を提案しようとするものである。The present invention has been made in consideration of the above points, and an object thereof is to propose an electronic component carrier capable of avoiding crushing due to fitting of storage containers.
【００１２】[0012]
【課題を解決するための手段】かかる課題を解決するた
め本発明においては、テープ状のシート又はフイルムに
所定間隔をもつて複数形成された収納対象の電子部品に
対応する大きさの凹部でなるそれぞれの収納容器の周側
面又は収納容器の開口部を形成する側辺近傍に嵌合防止
手段を設ける。In order to solve such a problem, the present invention comprises a plurality of tape-shaped sheets or films having a plurality of recesses formed at predetermined intervals and having a size corresponding to an electronic component to be stored. Fitting prevention means is provided on the peripheral side surface of each storage container or in the vicinity of the side forming the opening of the storage container.
【００１３】巻き取られた状態で内周側の収納容器と外
周側の収納容器との位置が対向する位置になつた際、内
周側のテープ状部分に外周側の嵌合防止手段が当接し
て、内周側の収納容器に外周側の収納容器を嵌合させな
い。When the inner peripheral storage container and the outer peripheral storage container come to a position where they face each other in the wound state, the inner peripheral tape-like portion is contacted with the outer peripheral fitting preventing means. Do not fit the outer peripheral storage container to the inner peripheral storage container.
【００１４】[0014]
【発明の実施の形態】以下図面について、本発明の一実
施例を詳述する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below in detail with reference to the drawings.
【００１５】図６との対応部分に同一符号を付して示す
図１において、１０は全体として電子部品搬送体を示
し、各収納容器２に窪み部１１を不規則的に設ける点を
除いて、電子部品搬送体１と同様に形成されている。電
子部品搬送体１０は、幅方向におけるエンボス部２の側
面に窪み部１１を形成してなる。エンボス部２は幅方向
の一方又は他方の側面中央に、外側へ突出した凹部形状
でなる窪み部１１を設けている。エンボス部２は窪み部
１１によつて、各エンボス部２が互いに嵌まり込むこと
を防止している。In FIG. 1 in which parts corresponding to those in FIG. 6 are designated by the same reference numerals, 10 indicates an electronic component carrier as a whole, except that recesses 11 are irregularly provided in each container 2. It is formed similarly to the electronic component carrier 1. The electronic component carrier 10 has a recess 11 formed on the side surface of the embossed portion 2 in the width direction. The embossed portion 2 is provided with a recessed portion 11 having a recessed shape protruding outward at the center of one or the other side surface in the width direction. The embossed portions 2 prevent the embossed portions 2 from fitting into each other by the recessed portions 11.
【００１６】すなわち図２に示すように、電子部品搬送
体１０を巻き取つて内周側のエンボス部２と外周側のエ
ンボス部２とが重なり合う位置に来た際に、外周側のエ
ンボス部２が内周側のエンボス部２に接触する。ここで
内周側のエンボス部２には、外周側のエンボス部２に設
けられている窪み部１１と対応する位置に窪み部１１が
設けられておらず、平面となつている。このため、この
平面に外周側のエンボス部２に設けられている窪み部１
１が当接して、外周側のエンボス部２が内周側のエンボ
ス部２内に嵌まり込まないようになつている。That is, as shown in FIG. 2, when the electronic component carrier 10 is wound up to reach the position where the inner peripheral side embossed portion 2 and the outer peripheral side embossed portion 2 overlap with each other, the outer peripheral side embossed portion 2 is reached. Contacts the embossed portion 2 on the inner peripheral side. Here, the embossed portion 2 on the inner peripheral side is not provided with the recessed portion 11 at a position corresponding to the recessed portion 11 provided on the embossed portion 2 on the outer peripheral side, and is formed into a flat surface. Therefore, the recessed portion 1 provided in the embossed portion 2 on the outer peripheral side on this plane
The outer peripheral side embossed portion 2 is prevented from being fitted into the inner peripheral side embossed portion 2 by contacting the outer peripheral side embossed portion 1.
【００１７】また窪み部１１は、電子部品搬送体１０上
のエンボス部２に交互にかつ不規則に設けられている。
具体的には、図３に示すようなエンボス部２において、
電子部品搬送体１０の幅方向に対して一方の側に形成さ
れているものを窪み部１１Ａとし、他方の側に形成され
ているものを窪み部１１Ｂとした場合、まずエンボス部
２１に窪み部１１Ａを設け、またエンボス部２２に窪み
部１１Ｂを設ける。The depressions 11 are provided alternately and irregularly on the embossed portions 2 on the electronic component carrier 10.
Specifically, in the embossed portion 2 as shown in FIG.
When the one formed on one side in the width direction of the electronic component carrier 10 is the recessed portion 11A and the one formed on the other side is the recessed portion 11B, the recessed portion is first formed in the embossed portion 21. 11A is provided, and the embossed portion 22 is provided with a recessed portion 11B.
【００１８】次に、エンボス部２１から２つ置いたエン
ボス部２４に窪み部１１Ａを設け、エンボス部２２から
３つ置いた収納容器２６に窪み部１１Ｂを設ける。エン
ボス部２３及び２５には窪み部１１Ａ及び１１Ｂを設け
ない。ここでは、２つ置きに窪み部１１Ａを、また３つ
置きに窪み部１１Ｂを設けているが、実際上は２つ置き
で設けたら次は３つ置きで設け、その次には１つ置きに
設けると言うようにエンボス部２の一方又は他方の側辺
に交互にかつ不規則的に形成する。Next, the recesses 11A are provided in the two embossed portions 24 placed from the embossed portion 21, and the recessed portions 11B are provided in the storage container 26 placed three from the embossed portions 22. The embossed portions 23 and 25 are not provided with the recessed portions 11A and 11B. Here, the recessed portions 11A are provided every two, and the recessed portions 11B are provided every three, but in practice, once every two are provided, next three are provided, and next one is provided. The embossed portions 2 are alternately and irregularly formed on one side or the other side of the embossed portions 2.
【００１９】このように、エンボス部２の一方又は他方
の側面に交互にかつ不規則に窪み部１１Ａ及び１１Ｂを
設けるようにしたことにより、例えば巻き取られた状態
の電子部品搬送体１０で内周側のエンボス部２と外周側
のエンボス部２にそれぞれ設けられている窪み部１１Ａ
又は１１Ｂの形成位置が一致してしまい、窪み部１１Ａ
及び１１Ｂを設けたにもかかわらず、内周側のエンボス
部２と外周側のエンボス部２が嵌まり込んでしまうこと
を防止することができる。As described above, the recesses 11A and 11B are provided alternately and irregularly on one side surface or the other side surface of the embossed portion 2, so that, for example, in the rolled electronic component carrier 10. Recessed portions 11A provided on the embossed portion 2 on the peripheral side and the embossed portion 2 on the outer peripheral side, respectively.
Or, the formation positions of 11B coincide with each other, and the recessed portion 11A is formed.
And 11B, it is possible to prevent the embossed portion 2 on the inner peripheral side and the embossed portion 2 on the outer peripheral side from being fitted into each other.
【００２０】以上の構成において、電子部品搬送体１０
は、幅方向におけるエンボス部２の側面に外側へ突出し
た凹形形状でなる窪み部１１を設けることにより、各エ
ンボス部２の嵌合を防止している。すなわち従来の電子
部品搬送体１（図６）では、搬送及びテーピングマシン
への取り付けのために渦巻き形状に巻き取られた場合、
各エンボス部２が同一形状であるために、内周側と外周
側とでエンボス部２の位置が一致した際にエンボス部２
が互いに嵌合してしまつていた。この際、エンボス部２
の開口部２Ｂが底面２Ａに比して幅広に形成されている
ために一層嵌合し易くなつていた。In the above structure, the electronic component carrier 10
In order to prevent the embossed portions 2 from being fitted to each other, a recessed portion 11 having a concave shape protruding outward is provided on a side surface of the embossed portion 2 in the width direction. That is, in the conventional electronic component carrier 1 (FIG. 6), when it is wound in a spiral shape for carrying and mounting on a taping machine,
Since the embossed portions 2 have the same shape, when the positions of the embossed portions 2 on the inner peripheral side and the outer peripheral side match, the embossed portions 2
Had been fitted together. At this time, the embossed part 2
Since the opening 2B is formed wider than the bottom surface 2A, the fitting is easier.
【００２１】電子部品搬送体１０は窪み部１１を設ける
ことにより、電子部品搬送体１０を巻き取つて内周側の
エンボス部２と外周側のエンボス部２とが対向する位置
に来た際に、内周側の平面状のテープ部分に外周側のエ
ンボス部２に設けられている窪み部１１が当接して、内
周側のエンボス部２と外周側のエンボス部２とが嵌合す
ることを防止することができる。The electronic component carrier 10 is provided with the recess 11 so that when the electronic component carrier 10 is wound up and the embossed portion 2 on the inner peripheral side and the embossed portion 2 on the outer peripheral side come to face each other. The inner peripheral flat tape portion is in contact with the recess 11 provided in the outer peripheral embossed portion 2 so that the inner peripheral embossed portion 2 and the outer peripheral embossed portion 2 are fitted together. Can be prevented.
【００２２】また窪み部１１は、電子部品搬送体１０上
のエンボス部２に交互にかつ不規則に設けられており、
例えば巻き取られた状態の電子部品搬送体１０で内周側
のエンボス部２と外周側のエンボス部２にそれぞれ設け
られている窪み部１１Ａ又は１１Ｂの形成位置が一致し
てしまい、窪み部１１Ａ及び１１Ｂを設けたにもかかわ
らず、内周側のエンボス部２と外周側のエンボス部２が
嵌まり込んでしまうことを防止することができる。The recesses 11 are provided alternately and irregularly on the embossed portions 2 on the electronic component carrier 10.
For example, in the rolled-up electronic component carrier 10, the formation positions of the recessed portions 11A or 11B provided on the inner peripheral side embossed portion 2 and the outer peripheral side embossed portion 2 respectively coincide, and the recessed portion 11A is formed. And 11B, it is possible to prevent the embossed portion 2 on the inner peripheral side and the embossed portion 2 on the outer peripheral side from being fitted into each other.
【００２３】以上の構成によれば、エンボス部２の周側
面に不規則的に窪み部１１を設けることにより、巻き取
られた状態で内周側のエンボス部２と外周側のエンボス
部２とが対向する位置になつた際、内周側のエンボス部
２のテープ状部分に外周側のエンボス部２に設けられた
窪み部１１が当接して、内周側のエンボス部２に外周側
のエンボス部２が嵌まり込まないようにすることがで
き、かくするにつきエンボス２の潰れを回避し得る電子
部品搬送体１０を実現することができる。According to the above construction, the recesses 11 are irregularly provided on the peripheral side surface of the embossed portion 2, so that the embossed portion 2 on the inner peripheral side and the embossed portion 2 on the outer peripheral side are wound in a wound state. When they come to a position facing each other, the recessed portion 11 provided in the embossed portion 2 on the outer peripheral side comes into contact with the tape-shaped portion of the embossed portion 2 on the inner peripheral side, and the embossed portion 2 on the inner peripheral side contacts the outer peripheral side. It is possible to prevent the embossed portion 2 from being fitted, and thus it is possible to realize the electronic component carrier 10 that can prevent the embossed portion 2 from being crushed.
【００２４】なお上述の実施例においては、電子部品搬
送体１０の幅方向に、収納容器２の周側面の一方又はこ
れに対向する他方の中心部を外側へ突出させた形状でな
る窪み部１１を設けた場合について述べたが、本発明は
これに限らず、電子部品搬送体の幅方向における収納容
器の外側へ突出した形状でなる窪み部を、収納容器の一
方又は他方の側面におけるどのような位置で設けるよう
にしてもよい。In the above-described embodiment, the recessed portion 11 having a shape in which one of the peripheral side surfaces of the storage container 2 or the other central portion facing the peripheral side surface of the storage container 2 is protruded outward in the width direction of the electronic component carrier 10. Although the present invention is not limited to this, the present invention is not limited to this. It may be provided at any position.
【００２５】すなわち図４に示すように、収納容器２７
の開口面を形成する一方の側辺に沿つた一方の端部に窪
み部１１Ｃを設け、また窪み部１１Ｃと対角線をなす位
置で他方の側辺に沿つた他方の端部に窪み部１１Ｄを設
けるようにしてもよい。この場合も実施例と同様の効果
が得られる。That is, as shown in FIG.
The recessed portion 11C is provided at one end along one side forming the opening surface of, and the recessed portion 11D is formed at the other end along the other side at a position diagonal to the recessed portion 11C. It may be provided. Also in this case, the same effect as that of the embodiment can be obtained.
【００２６】また上述の実施例においては、収納容器２
の幅方向の一方又は他方の周側面に、外側へ突出した形
状でなる窪み部１１を設けた場合について述べたが、本
発明はこれに限らず、図５に示すような、収納容器の開
口部を形成する一方の側辺近傍又はこれに対向する他方
の側辺近傍に、開口面に対して鉛直方向に突出した凸部
又は凹部形状のリブを設けるようにしてもよい。この場
合も実施例と同様の効果が得られる。Further, in the above embodiment, the storage container 2
The case where the recessed portion 11 having a shape protruding to the outside is provided on one or the other side surface in the width direction of the above, but the present invention is not limited to this, and the opening of the storage container as shown in FIG. A rib having a convex or concave shape protruding in the vertical direction with respect to the opening surface may be provided in the vicinity of one side forming the part or in the vicinity of the other side opposite thereto. Also in this case, the same effect as that of the embodiment can be obtained.
【００２７】さらに上述の実施例においては、収納容器
２の周側面を突出させた形状でなる窪み部１１を幅方向
の一方又は他方に設けた場合について述べたが、本発明
はこれに限らず、電子部品搬送体の長手方向に窪み部又
はリブを設けてもよい。Further, in the above-mentioned embodiment, the case where the recessed portion 11 having the shape in which the peripheral side surface of the storage container 2 is projected is provided on one side or the other side in the width direction, but the present invention is not limited to this. A recess or a rib may be provided in the longitudinal direction of the electronic component carrier.
【００２８】また上述の実施例においては、渦巻き形状
に巻き取られた状態で搬送される電子部品搬送体１０に
ついて述べたが、本発明はこれに限らず、上下に重ねら
れて搬送される電子部品搬送体においても適用し得る。
このように重ねられた場合でも上下の収納容器が嵌合し
てしまうことが予想し得るので、本発明を適用すること
により実施例と同様の効果が得られる。Further, in the above-mentioned embodiment, the electronic component carrier 10 conveyed in a spirally wound state has been described, but the present invention is not limited to this, and the electronic components are vertically stacked and conveyed. It can also be applied to a component carrier.
Since it is possible to expect the upper and lower storage containers to be fitted to each other even when they are stacked in this manner, the same effect as that of the embodiment can be obtained by applying the present invention.
【００２９】[0029]
【発明の効果】上述のように本発明によれば、テープ状
のシート又はフイルムに所定間隔をもつて複数形成され
た収納対象の電子部品に対応する大きさの凹部でなるそ
れぞれの収納容器の周側面及び又は収納容器の開口部を
形成する側辺近傍に嵌合防止手段を設け、巻き取られた
状態で内周側の収納容器と外周側の収納容器との位置が
対向する位置になつた際、内周側の収納容器のテープ状
部分に外周側の収納容器に設けられた嵌合防止手段が当
接して、内周側の収納容器に外周側の収納容器が嵌まり
込まないようにすることにより、収納容器の潰れを回避
し得る電子部品搬送体を実現することができる。As described above, according to the present invention, each storage container is formed of a plurality of recesses each having a size corresponding to the electronic component to be stored, which is formed on the tape-shaped sheet or film at a predetermined interval. Fitting prevention means is provided on the peripheral side surface and / or in the vicinity of the side forming the opening of the storage container so that the inner storage container and the outer storage container face each other in a wound state. In this case, the tape-shaped portion of the inner storage container does not come into contact with the fitting prevention means provided on the outer storage container so that the outer storage container does not fit into the inner storage container. By doing so, it is possible to realize an electronic component carrier that can avoid the collapse of the storage container.
【図１】実施例による電子部品搬送体の形状を示す平面
図である。FIG. 1 is a plan view showing the shape of an electronic component carrier according to an embodiment.
【図２】窪み部によるエンボス部の嵌合防止を説明する
ために供する略線図である。FIG. 2 is a schematic diagram provided for explaining prevention of fitting of an embossed portion by a recessed portion.
【図３】窪み部を交互にかつ不規則に設けた状態を示す
平面図である。FIG. 3 is a plan view showing a state in which recesses are provided alternately and irregularly.
【図４】他の実施例による電子部品搬送体を示す平面図
である。FIG. 4 is a plan view showing an electronic component carrier according to another embodiment.
【図５】他の実施例による電子部品搬送体を示す平面図
である。FIG. 5 is a plan view showing an electronic component carrier according to another embodiment.
【図６】従来の電子部品搬送体の形状を示す斜視図であ
る。FIG. 6 is a perspective view showing the shape of a conventional electronic component carrier.
【図７】収納容器の形状を示す側面図である。FIG. 7 is a side view showing the shape of a storage container.
【図８】部品の取り出しを説明するために供する略線図
である。FIG. 8 is a schematic diagram provided for explaining the removal of parts.
【図９】エンボス部の嵌合状態を説明するために供する
側面図である。FIG. 9 is a side view provided for explaining a fitted state of the embossed portion.
１、１０……電子部品搬送体、２、２１〜２６……収納
容器（エンボス部）、２Ａ……底面、２Ｂ……開口部、
３……送り穴、１１、１１Ａ、１１Ｂ、１１Ｃ、１１Ｄ
……窪み部。1, 10 ... Electronic component carrier, 2, 21-26 ... Storage container (embossing portion), 2A ... Bottom surface, 2B ... Opening portion,
3 ... Feed hole, 11, 11A, 11B, 11C, 11D
...... Dimples.
Claims (4)
部形状でなる収納容器をテープ状のシート又はフイルム
に所定間隔をもつて複数形成してなる電子部品搬送体に
おいて、 上記収納容器の周側面又は上記収納容器の開口部を形成
する側辺近傍に形成され、上記テープ状のシート又はフ
イルムを巻き回した際に上記収納容器同士が嵌合するこ
とを防止する嵌合防止手段を具えることを特徴とする電
子部品搬送体。1. An electronic component carrier in which a plurality of storage containers each having a recessed shape having a size corresponding to an electronic component to be stored are formed on a tape-shaped sheet or film at predetermined intervals. A fitting preventing means is provided which is formed on the peripheral side surface or in the vicinity of the side forming the opening of the storage container and prevents the storage containers from being fitted to each other when the tape-shaped sheet or film is wound. An electronic component carrier characterized by being obtained.
段の有無及び又は上記嵌合防止手段を形成する位置及び
又は上記嵌合防止手段の形状を不規則的に設定すること
を特徴とする請求項１に記載の電子部品搬送体。2. The presence or absence of the fitting prevention means and / or the position where the fitting prevention means is formed and / or the shape of the fitting prevention means is irregularly set for each of the storage containers. The electronic component carrier according to claim 1.
向する上記周側面の一方又は他方に交互に形成されるこ
とを特徴とする請求項１に記載の電子部品搬送体。3. The fitting preventing means is a convex part in which a part of the peripheral side surface of the storage container is projected, and is alternately formed on one or the other of the facing peripheral side surfaces. Item 1. The electronic component carrier according to Item 1.
は凹部形状のリブでなり、対向する上記側辺近傍の一方
又は他方に交互に形成されることを特徴とする請求項１
に記載の電子部品搬送体。4. The fitting preventing means is a rib having a convex portion or a concave portion formed on the tape-shaped sheet or film, and is alternately formed on one or the other in the vicinity of the opposing side edges. Claim 1 characterized by the above-mentioned.
The electronic component carrier described in.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8156002A JPH09315488A (en) | 1996-05-28 | 1996-05-28 | Electronic parts carrying body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8156002A JPH09315488A (en) | 1996-05-28 | 1996-05-28 | Electronic parts carrying body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09315488A true JPH09315488A (en) | 1997-12-09 |
Family
ID=15618192
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8156002A Pending JPH09315488A (en) | 1996-05-28 | 1996-05-28 | Electronic parts carrying body |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09315488A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7654392B2 (en) | 2002-04-19 | 2010-02-02 | Ricoh Company, Ltd. | Carrier tape containing good therein, and container using the carrier tape |
-
1996
- 1996-05-28 JP JP8156002A patent/JPH09315488A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7654392B2 (en) | 2002-04-19 | 2010-02-02 | Ricoh Company, Ltd. | Carrier tape containing good therein, and container using the carrier tape |
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