JPH0919764A - Soldering iron for automatic soldering device - Google Patents

Soldering iron for automatic soldering device

Info

Publication number
JPH0919764A
JPH0919764A JP18855495A JP18855495A JPH0919764A JP H0919764 A JPH0919764 A JP H0919764A JP 18855495 A JP18855495 A JP 18855495A JP 18855495 A JP18855495 A JP 18855495A JP H0919764 A JPH0919764 A JP H0919764A
Authority
JP
Japan
Prior art keywords
soldering
solder
soldering iron
iron
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18855495A
Other languages
Japanese (ja)
Inventor
Taro Araki
太郎 荒木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kokusai Electric Corp
Original Assignee
Kokusai Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kokusai Electric Corp filed Critical Kokusai Electric Corp
Priority to JP18855495A priority Critical patent/JPH0919764A/en
Publication of JPH0919764A publication Critical patent/JPH0919764A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE: To enable satisfactory soldering, in an automatic soldering device, by applying solder plating to the entire circumferential face and the tip end face at the tip of a soldering iron and thereby infiltrating a molten solder to places other than the supplied position. CONSTITUTION: The soldering iron 1 of an automatic soldering device is supported by a holder 2 with a heater built in. A solder feeding nozzle 3 supplies a thread solder 4 to the soldering iron 1. Soldering is performed by placing a lead 9 of a mounting component 8 on the land 7 above a substrate 6, abutting the soldering iron 1 heated at a prescribed temperature on the lead 9, and also feeding the thread solder 4 to the tip end of the soldering iron 1. With the string solder 4 melted by the soldering iron 1, the land 7 of the substrate 6 and the lead 9 are soldered. Since the entire circumferential face and the tip end face at the tip of the soldering iron 1 are subjected to solder-plating 5, the molten solder enters places other than the supplied position, so that satisfactory soldering is performed.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は、電子機器の配線基板に
電子部品を実装する際の半田を行う為の自動半田付装置
の半田ゴテに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering iron for an automatic soldering device for soldering an electronic component on a wiring board of an electronic device.

【０００２】[0002]

【従来の技術】図７に於いて自動半田付装置を略述す
る。2. Description of the Related Art An automatic soldering apparatus will be briefly described with reference to FIG.

【０００３】図中、１は自動半田付装置の半田ゴテであ
り、該半田ゴテ１はヒータ（図示せず）を内蔵したホル
ダ２に支持されている。又３は前記半田ゴテ１に糸半田
４を供給する半田供給ノズルである。図４に従来の自動
半田付装置の半田ゴテ１を示す。In the figure, reference numeral 1 is a soldering iron of an automatic soldering apparatus, and the soldering iron 1 is supported by a holder 2 having a heater (not shown) built therein. Reference numeral 3 is a solder supply nozzle for supplying the thread solder 4 to the soldering iron 1. FIG. 4 shows a soldering iron 1 of a conventional automatic soldering device.

【０００４】従来の自動半田付装置の半田ゴテ１は、断
面が矩形の先細り形状の切頭４角錐形状をしており、先
端部の前記糸半田４が供給される側の側面、先端面の２
面に半田メッキ５が施されており、半田との馴染みがよ
くなる様になっている。A soldering iron 1 of a conventional automatic soldering device has a truncated quadrangular pyramid shape with a rectangular cross section, and has a side surface and a tip surface on the side where the thread solder 4 is supplied. Two
Solder plating 5 is applied to the surface, so that the familiarity with solder is improved.

【０００５】半田付けは基板６に形成されたランド７に
実装用部品８のリード９を乗せ、該リード９に所要温度
に加熱した前記半田ゴテ１を当接させ、更に半田ゴテ１
先端に糸半田４を供給する。該糸半田４が前記半田ゴテ
１に溶融されて基板６のランド７とリード９とを半田付
する。For soldering, a lead 9 of a mounting component 8 is placed on a land 7 formed on a substrate 6, the soldering iron 1 heated to a required temperature is brought into contact with the lead 9, and further the soldering iron 1
The thread solder 4 is supplied to the tip. The wire solder 4 is melted by the soldering iron 1 and the land 7 and the lead 9 of the substrate 6 are soldered.

【０００６】[0006]

【発明が解決しようとする課題】ところで従来の自動半
田付装置の半田ゴテでは上記した様に、半田メッキが施
されている部分が前記糸半田４が供給される側の側面、
先端面の２面であり、自動半田付装置の場合半田ゴテ１
には必然的に動きの制限が生じる。この為、前記半田ゴ
テ１の先端の姿勢は常に半田付けに最適となるとは限ら
ない。例えは、図５の様にシールド板１０を半田付けす
る場合、糸半田４の供給を考慮すると半田メッキ５が施
された面は前記シールド板１０の側壁と対峙していない
位置とならざるを得ず、その結果溶融した半田４′はシ
ールド板１０と半田ゴテ１との間には浸透して行かな
い。更に又、図６の様に、リード９がランド７より浮上
がった状態ではリード９とランド７との間には半田４′
が浸透せず半田付け不良となっていた。By the way, in the soldering iron of the conventional automatic soldering apparatus, as described above, the portion where the solder plating is applied is the side surface on the side where the thread solder 4 is supplied,
It is the front end surface, and in the case of an automatic soldering device, a soldering iron 1
Inevitably, there are movement restrictions. Therefore, the attitude of the tip of the soldering iron 1 is not always optimal for soldering. For example, when soldering the shield plate 10 as shown in FIG. 5, in consideration of the supply of the thread solder 4, the surface on which the solder plating 5 is applied must be in a position not facing the side wall of the shield plate 10. As a result, the melted solder 4'does not penetrate between the shield plate 10 and the soldering iron 1. Furthermore, as shown in FIG. 6, when the lead 9 is lifted from the land 7, the solder 4'is provided between the lead 9 and the land 7.
Did not penetrate, resulting in poor soldering.

【０００７】本発明は斯かる実情に鑑み、良質な半田付
けが行える様にし、信頼性の向上を図ろうとするもので
ある。In view of the above situation, the present invention intends to improve the reliability by enabling high quality soldering.

【０００８】[0008]

【課題を解決するための手段】本発明は、半田ゴテの先
端部の全周面及び先端面に半田メッキを施したことを特
徴ものである。SUMMARY OF THE INVENTION The present invention is characterized in that the entire peripheral surface and the tip surface of the tip portion of a soldering iron are plated with solder.

【０００９】[0009]

【作用】半田ゴテの先端部の全周面及び先端面に半田メ
ッキを施しているので、溶融した半田が供給位置以外の
場所に回込み良好な半田が行われる。Since the entire peripheral surface and the tip surface of the tip portion of the soldering iron are plated with the solder, the molten solder is spilled to a place other than the supply position and good soldering is performed.

【００１０】[0010]

【実施例】以下、図面を参照しつつ本発明の一実施例を
説明する。An embodiment of the present invention will be described below with reference to the drawings.

【００１１】図１は本発明に係る半田ゴテ１の先端部を
示しており、半田ゴテ１の先端部の全周面及び先端面に
半田メッキ５を施している。FIG. 1 shows a tip portion of a soldering iron 1 according to the present invention. Solder plating 5 is applied to the entire peripheral surface and the tip surface of the soldering iron 1 at the tip portion.

【００１２】而して、前記半田ゴテ１により半田付けを
行うと糸半田４を供給した面以外の面に溶融した半田
４′が容易に回込み、半田付けが確実に行える。Thus, when the soldering iron 1 is used for soldering, the melted solder 4'is easily drawn into the surface other than the surface to which the thread solder 4 is supplied, so that the soldering can be reliably performed.

【００１３】図２は前述した図５に対応する半田付けの
状態を示しており、半田４′がシールド板１０と半田ゴ
テ１との間隙に浸透し、前記シールド板１０とランド７
間の良好な半田付けが行える。又、図３は前述した図６
に対応する半田付けの状態を示しており、溶融した半田
４′が半田ゴテ１の反糸半田供給側迄回込み、その結果
ランド７とリード９間の間隙に半田４′が浸透して浮上
がったリード９とランド７との半田付けが行える。FIG. 2 shows a state of soldering corresponding to the above-mentioned FIG. 5, in which the solder 4'penetrates into the gap between the shield plate 10 and the soldering iron 1, and the shield plate 10 and the land 7 are penetrated.
Good soldering between can be done. In addition, FIG. 3 is the same as FIG.
In the state of soldering corresponding to the above, the molten solder 4'sucks up to the non-thread solder supply side of the soldering iron 1 and, as a result, the solder 4'permeates and floats in the gap between the land 7 and the lead 9. The raised lead 9 and the land 7 can be soldered.

【００１４】尚、上記半田ゴテ１のの断面形状は矩形に
限らず円形、矩形以外の角形状であってもよいことは言
う迄もない。Needless to say, the sectional shape of the soldering iron 1 is not limited to a rectangular shape, but may be a circular shape or an angular shape other than a rectangular shape.

【００１５】[0015]

【発明の効果】以上述べた如く本発明によれば、半田ゴ
テの先端部の全周面及び先端面に半田メッキを施してい
るので、半田ゴテの半田に対する濡れ性に方向性がな
く、従って半田ゴテの姿勢により半田付けの品質に差が
生じることなく、信頼性が向上すると共に半田の回込み
が向上することから良質な半田付けが可能となる等の優
れた効果を発揮する。As described above, according to the present invention, since solder plating is applied to the entire peripheral surface and the tip surface of the tip of the soldering iron, the wettability of the soldering iron with respect to the solder is not directional, and accordingly, There is no difference in the quality of soldering depending on the attitude of the soldering iron, the reliability is improved, and the turn-in of the solder is improved, so that excellent soldering can be achieved.

【図面の簡単な説明】[Brief description of the drawings]

【図１】本発明の一実施例を示す斜視図である。FIG. 1 is a perspective view showing an embodiment of the present invention.

【図２】該実施例の半田付けの具体例を示す説明図であ
る。FIG. 2 is an explanatory diagram showing a specific example of soldering of the embodiment.

【図３】該実施例の他の半田付けの具体例を示す説明図
である。FIG. 3 is an explanatory diagram showing another specific example of soldering of the embodiment.

【図４】従来例を示す斜視図である。FIG. 4 is a perspective view showing a conventional example.

【図５】該従来例による半田付けの具体例を示す説明図
である。FIG. 5 is an explanatory diagram showing a specific example of soldering according to the conventional example.

【図６】該従来例による他の半田付けの具体例を示す説
明図である。FIG. 6 is an explanatory diagram showing another specific example of soldering according to the conventional example.

【図７】自動半田付装置の要部説明図である。FIG. 7 is an explanatory view of a main part of the automatic soldering device.

【符号の説明】[Explanation of symbols]

１ 半田ゴテ ２ ホルダ ３ 半田供給ノズル ４ 糸半田 ５ 半田メッキ ６ 基板 ７ ランド ８ 実装用部品 ９ リード １０ シールド板 1 Soldering Iron 2 Holder 3 Solder Supply Nozzle 4 Thread Solder 5 Solder Plating 6 Board 7 Land 8 Mounting Components 9 Lead 10 Shield Plate

Claims (1)

【特許請求の範囲】[Claims] 【請求項１】 先端部の全周面及び先端面に半田メッキ
を施したことを特徴とする自動半田付装置の半田ゴテ。1. A soldering iron for an automatic soldering device, wherein the entire peripheral surface of the tip portion and the tip surface are plated with solder.
JP18855495A 1995-06-30 1995-06-30 Soldering iron for automatic soldering device Pending JPH0919764A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18855495A JPH0919764A (en) 1995-06-30 1995-06-30 Soldering iron for automatic soldering device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18855495A JPH0919764A (en) 1995-06-30 1995-06-30 Soldering iron for automatic soldering device

Publications (1)

Publication Number Publication Date
JPH0919764A true JPH0919764A (en) 1997-01-21

Family

ID=16225734

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18855495A Pending JPH0919764A (en) 1995-06-30 1995-06-30 Soldering iron for automatic soldering device

Country Status (1)

Country Link
JP (1) JPH0919764A (en)

Similar Documents

Publication Publication Date Title
JPH0919764A (en) Soldering iron for automatic soldering device
JPH0621110A (en) Assembling jig for semiconductor chip
JPH04314389A (en) Electric component soldering method
JPH0319241Y2 (en)
JPS61102089A (en) Mount structure of flat package ic
JPS6121170Y2 (en)
JPH1154901A (en) Soldering method and soldering jig
JPH05129753A (en) Discrete component and printed board mounting method thereof
JPH0312993A (en) Soldering method in electronic circuit package
JPS60163496A (en) Printed circuit board
JP2697987B2 (en) Electronic component with connection terminal and mounting method
JP3152230B2 (en) Manufacturing method of liquid crystal display device
JPH11145599A (en) Structure for soldering surface-mounting part
JP3267280B2 (en) Electronic printing device
JPS6419688A (en) Method of soldering lead to printed wiring board
JPH0447862U (en)
JPS6384766A (en) Soldering device
KR900002182Y1 (en) Printed circuit board for tow faces stiching
JPH01256190A (en) Conductive lead
JPH02137665A (en) Soldering device
GB2210818A (en) A process for soldering a component to a printed circuit board
JP2001053433A (en) Soldering device
JPH05136554A (en) Method of soldering printed wiring board
JPH0758432A (en) Printed wiring board
JPH088510A (en) Leadless chip carrier