JPH02137665A - Soldering device - Google Patents
Soldering deviceInfo
- Publication number
- JPH02137665A JPH02137665A JP29275288A JP29275288A JPH02137665A JP H02137665 A JPH02137665 A JP H02137665A JP 29275288 A JP29275288 A JP 29275288A JP 29275288 A JP29275288 A JP 29275288A JP H02137665 A JPH02137665 A JP H02137665A
- Authority
- JP
- Japan
- Prior art keywords
- soldering
- iron tip
- solder
- hole
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 71
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 66
- 229910052742 iron Inorganic materials 0.000 claims abstract description 33
- 229910000679 solder Inorganic materials 0.000 claims abstract description 26
- 239000002184 metal Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract description 11
- 230000007547 defect Effects 0.000 abstract description 4
- 230000001105 regulatory effect Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、各種の電子機器の半田付けに使用する半田付
装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a soldering device used for soldering various electronic devices.
従来の技術
電子機器の半田付工程における半田付不良は、直接製品
不良につながシ、製造工程における最重要課題であるに
もかかわらず以下に説明するようなコテ先を使って半田
付けを行っていた。Conventional technology Soldering defects in the soldering process of electronic devices directly lead to product defects, and despite being the most important issue in the manufacturing process, soldering is performed using iron tips such as those described below. Ta.
以下、図面に基づいて従来の技術を説明する。The conventional technology will be explained below based on the drawings.
従来、この種の半田付用コテ先は、第５図に示すような
形状であった。第６図および第７図において、６はコテ
先であシ、７は半田、８は半田付パターン、９はプリン
ト基板、１０はリード線である。Conventionally, this type of soldering iron tip has had a shape as shown in FIG. In FIGS. 6 and 7, 6 is a soldering iron tip, 7 is solder, 8 is a soldering pattern, 9 is a printed circuit board, and 10 is a lead wire.
第６図に示すように、プリント基板９上に半田付パター
ン８があり、この半田付パターン８とリード線１ｏに半
田７を近づけ、そこへ第５図で示すような従来のコテ先
６で半田７を溶かして半田付けを行っていた。As shown in FIG. 6, there is a soldering pattern 8 on the printed circuit board 9. Solder 7 is brought close to this soldering pattern 8 and the lead wire 1o, and a conventional soldering iron tip 6 as shown in FIG. Soldering was performed by melting solder 7.
発明が解決しようとする課題
このときの半田付状態は、第７図にその断面を示すよう
に半田付パターン日とリード線１０とを半田付けする際
コテ先６の形状が凸状になっているため、コテ先６の熱
が一点にしか加えられない。Problem to be Solved by the Invention The soldering state at this time is such that the shape of the soldering iron tip 6 becomes convex when soldering the soldering pattern and the lead wire 10, as shown in the cross section of FIG. Therefore, the heat from the iron tip 6 can only be applied to one point.
そのため、半田は半田付パターン８の全ての面に回らな
いで半田付パターン８とリード線１０この半田付けは片
面のみの場合も発生する可能性がある。又、半田量を制
限する設備もないため半田量のバラツキも生じやすく、
すぐれた半田付品質を保つことは困難であった。Therefore, the solder may not be applied to all sides of the soldering pattern 8, but the soldering pattern 8 and the lead wire 10 may be soldered only on one side. Also, since there is no equipment to limit the amount of solder, variations in the amount of solder are likely to occur.
It has been difficult to maintain excellent soldering quality.
本発明は、このような課題を解決するもので、半田付不
良（■半田量のバラツキ ■片目半田）３ 。The present invention is intended to solve these problems, such as soldering defects (■ variation in solder amount, ■ single-eyed soldering).
の改善を目的とするものである。The purpose is to improve
課題を解決するための手段
この課題を解決する為に、本発明はコテ先と、コテ先部
に供給される半田とを備え前記コテ先は、金属体よりな
υ、その先端側に半田が供給される孔を有するものであ
る。Means for Solving the Problems In order to solve this problem, the present invention includes a soldering iron tip and solder supplied to the soldering iron tip portion. It has holes that are supplied with it.
作用
この構成により、半田付はパターン全体を加熱し一定量
の半田を供給するため半田は完全に半田付部に囲シ込み
、かつ供給量は孔の大きさで規制される為、半田付量も
一定し、片目半田も発生しない確実な半田付けが可能と
なる。Effect With this configuration, the solder heats the entire pattern and supplies a certain amount of solder, so the solder is completely surrounded by the soldered area, and the amount of solder is regulated by the size of the hole, so the amount of solder is reduced. This makes it possible to perform reliable soldering without single-sided soldering.
実施例
以下、本発明の一実施例について図面を参照しながら説
明する。EXAMPLE Hereinafter, an example of the present invention will be described with reference to the drawings.
第１図は本発明のコテ先形状を示した斜視図である。第
１図に示すように今風製のコテ先１に孔ＩＩＬを有して
いるのがその特徴である。第２図。FIG. 1 is a perspective view showing the shape of the soldering iron tip of the present invention. As shown in FIG. 1, its feature is that the modern soldering iron tip 1 has a hole IIL. Figure 2.
第３図は本実施例によるコテ先１を使用しての半田付は
方法、および半田付は品質を説明するための図面である
。FIG. 3 is a drawing for explaining the soldering method and soldering quality using the soldering iron tip 1 according to this embodiment.
第２図に示すように、プリント基板４上に半田付パター
ン３があシ、この半田付パターン３とリード線６の所ヘ
コテ先１の孔１ａ部に半田２を満たしたコテ先を、リー
ド線５が孔１ａ内に貫通するように半田付パターン３に
向けて降下させる。As shown in FIG. 2, a soldering pattern 3 is formed on the printed circuit board 4, and the soldering pattern 3 and the lead wire 6 are connected to the soldering iron tip filled with solder 2 in the hole 1a of the soldering tip 1. The wire 5 is lowered toward the soldering pattern 3 so as to pass through the hole 1a.
その後第３図に示すようにコテ先１を上方へ弓き上げる
と、コテ先１の孔１ａ部内にあった半田が、半田付パタ
ーンａとリード線５に溶着する。Thereafter, when the soldering iron tip 1 is bent upward as shown in FIG. 3, the solder present in the hole 1a of the soldering iron tip 1 is welded to the soldering pattern a and the lead wire 5.
この場合、コテ先１の形状が半田付パターン３と接触す
る部分が面状であるｋめコテ先の熱がまんべんなく半田
付パターン３とリード線６に伝達されて加熱され半田付
部全面に半田付けがなされる。In this case, the heat of the soldering iron tip 1 whose part in contact with the soldering pattern 3 is planar is evenly transmitted to the soldering pattern 3 and the lead wire 6 and heated, and the entire surface of the soldering part is soldered. Attachment is made.
また、半田量は、コテ先１の孔１ａの形状によシ一定で
あるので半田量のバラツキはない。Further, since the amount of solder is constant depending on the shape of the hole 1a of the soldering iron tip 1, there is no variation in the amount of solder.
また、このコテ先１は第４図に示すように孔１ａは上部
の開口が広く、下方はそれよシ狭く、本実施例ではこの
下方部を直径３顧としている。Further, as shown in FIG. 4, in this soldering iron tip 1, the hole 1a has a wide opening at the top and a narrower opening at the bottom, and in this embodiment, the diameter of this lower part is three diameters.
発明の効果
以上のように本発明によれば、コテ先に孔を設は半田を
溜めることにより、半田量が一定となり、静止デイツプ
の効果によりイモ付半田及び、片目半田防止が可能とな
り、半田付品質の改善が可能となる。Effects of the Invention As described above, according to the present invention, by forming a hole in the soldering iron tip and storing solder, the amount of solder becomes constant, and the effect of the stationary dip makes it possible to prevent sticky soldering and one-sided soldering. It is possible to improve the attachment quality.
第１図は本発明の一実施例によるコテ先の形状を示した
斜視図、第２図はそのコテ先を使用しての半田付方法を
説明するための斜視図、第３図は前記第２図の断面図で
あり、第４図はそのコテ先の側面図である。
また、第６図は従来使用していたコテ先の形状を示す斜
視図であり、第６図は従来例によるコテ先を使用しての
半田付方法を説明するための斜視図であシ、第７図は前
記第６図の断面図である。
１・・・・・・コテ先、１ａ・・・・・・孔、２・・・
・・・半田。
代理人の氏名 弁理士 粟 野 重 孝ほか１名／−−
−コテ光
２−−一牟田
、３−’ｐ １）イず「 ノ＼°グー ン４− プソ
ン）基板
５− ソー）″沫
第
ツFIG. 1 is a perspective view showing the shape of a soldering iron tip according to an embodiment of the present invention, FIG. 2 is a perspective view illustrating a soldering method using the soldering iron tip, and FIG. 2 is a sectional view of FIG. 2, and FIG. 4 is a side view of the iron tip. Further, FIG. 6 is a perspective view showing the shape of a conventional soldering iron tip, and FIG. 6 is a perspective view for explaining a soldering method using a conventional soldering iron tip. FIG. 7 is a sectional view of FIG. 6. 1... Soldering tip, 1a... Hole, 2...
···solder. Name of agent: Patent attorney Shigetaka Awano and 1 other person/--
-Kote Hikari 2--Ichimuta, 3-'p 1) Izu ``ノ\°gun 4-Pson) Board 5-So)''
Claims (1)
記コテ先は金属体よりなり、その先端側に、半田が供給
される孔を有する半田付装置。A soldering device comprising a soldering iron tip and solder supplied to the soldering iron tip, the soldering iron tip made of a metal body, and having a hole on the tip side thereof through which the solder is supplied.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29275288A JPH02137665A (en) | 1988-11-18 | 1988-11-18 | Soldering device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29275288A JPH02137665A (en) | 1988-11-18 | 1988-11-18 | Soldering device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02137665A true JPH02137665A (en) | 1990-05-25 |
Family
ID=17785877
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29275288A Pending JPH02137665A (en) | 1988-11-18 | 1988-11-18 | Soldering device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02137665A (en) |
-
1988
- 1988-11-18 JP JP29275288A patent/JPH02137665A/en active Pending
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