JPH09143791A - Plated product with step and stepped plating method - Google Patents
Plated product with step and stepped plating methodInfo
- Publication number
- JPH09143791A JPH09143791A JP32500295A JP32500295A JPH09143791A JP H09143791 A JPH09143791 A JP H09143791A JP 32500295 A JP32500295 A JP 32500295A JP 32500295 A JP32500295 A JP 32500295A JP H09143791 A JPH09143791 A JP H09143791A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- partial
- area
- plated
- stepped
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は金属等の素材表面に
段を付けて模様付けを行う段付きめっきに関するもので
ある。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to stepped plating for forming a pattern by forming a step on the surface of a material such as metal.
【０００２】[0002]
【従来の技術】従来の素材表面に段を付ける手段として
は、 イ．素材を凹凸の付いた型でプレスする方法、 ロ．素材を切削加工する方法、 ハ．素材をマスキング手法を用いて化学薬品によって部
分的にエッチングする方法、等が知られている。2. Description of the Related Art Conventional means for forming a step on the surface of a material are: Method of pressing the material with a mold with irregularities, b. Method of cutting material, c. A method of partially etching a material with a chemical using a masking method is known.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら従来の機
械的な方法や化学的な方法では、素材の素材自体に凹凸
を付けるために、素材を元通りにすることが不可能であ
った。そのため、不良品がでたり、仕様が変更になる
と、廃棄しなければならなかった。However, in the conventional mechanical method or chemical method, it is impossible to restore the material because the material itself is uneven. Therefore, if a defective product was made or the specifications were changed, it had to be discarded.
【０００４】また、機械加工およびエッチングの加工で
は、模様を素材表面層のラインより盛り上げることが困
難で、加工面の光沢も悪い。さらに、段付きを深くする
と細いラインが出せなくなる。Further, in machining and etching, it is difficult to raise the pattern from the line of the material surface layer, and the gloss of the processed surface is poor. Furthermore, if the step is deepened, a thin line cannot be produced.
【０００５】また、素材をプレスしたり、削ったり、エ
ッチングするために、大がかりな機械設備が必要とな
る。Further, in order to press, scrape, or etch the material, large-scale mechanical equipment is required.
【０００６】本発明は上記した従来技術の課題を解決す
るためになされたもので、その目的とするところは、凹
凸模様をめっきで成形することにより、素材の再生利用
を可能とし得る段付きめっき製品および段付きめっき方
法を提供することにある。The present invention has been made to solve the above-mentioned problems of the prior art. The object of the present invention is to provide a stepped plating that allows the material to be reused by forming an uneven pattern by plating. To provide a product and a step plating method.
【０００７】[0007]
【課題を解決するための手段】上記目的を達成するため
に、本発明の段付きめっき製品は、素材のめっき対象領
域の一部に部分めっきを施し、該部分めっきを含むめっ
き対象領域全面に重ねて仕上げめっきを施すことによっ
て、仕上げめっき表面に部分めっきに対応する凸部を形
成したことを特徴とする。In order to achieve the above object, the stepped plated product of the present invention is such that a part of a plating target region of a material is partially plated and the entire plating target region including the partial plating is covered. It is characterized in that a convex portion corresponding to the partial plating is formed on the surface of the finish plating by applying the finish plating again.
【０００８】また、本発明の段付きめっき方法は、素材
のめっき対象領域の一部に部分めっきを施し、その後、
部分めっきを含むめっき対象領域全面に重ねて仕上げめ
っきを施すことを特徴とする。In the stepped plating method of the present invention, partial plating is applied to a part of the plating target region of the material, and then,
It is characterized in that finish plating is performed over the entire surface of a plating target area including partial plating.
【０００９】このように、素材表面にめっきにより段付
き形状を成形するので、不良品が発生したり仕様が変更
された場合には、めっきを除去することにより、素材を
再生利用することが可能となる。As described above, since the stepped shape is formed on the surface of the material by plating, the material can be reused by removing the plating when a defective product is generated or the specifications are changed. Becomes
【００１０】また、機械加工やエッチング処理のように
おおがかりな設備が不要である。Also, no large equipment such as machining or etching is required.
【００１１】さらに、めっきで凹凸をつけるので、素材
を削って模様付けしたものと異なり、細いラインまで緻
密な構造に成形することができる。また、独特の浮き彫
り調の質感を有する製品となり、深味のある高級感溢れ
る感触と味わいが得られる。Further, since the unevenness is formed by plating, it is possible to form a fine structure up to a fine line, unlike the case where the material is shaved and patterned. In addition, the product will have a unique relief-like texture, providing a deep and luxurious feel and taste.
【００１２】上記部分めっきは、素材のめっき対象領域
の内、部分めっき領域を第１のマスキング材によって覆
うと共に部分めっき領域以外の領域を第２のマスキング
材によって覆い、前記第１のマスキング材を除去して素
材の部分メッキ対象領域を露出させた後めっき処理を施
し、その後第２のマスキング材を除去することを特徴と
する。In the above-mentioned partial plating, in the area to be plated of the material, the partial plating area is covered with the first masking material, and the area other than the partial plating area is covered with the second masking material. It is characterized in that after the removal, the region to be partially plated of the material is exposed, a plating process is performed, and then the second masking material is removed.
【００１３】また、上記部分めっきの他の方法として
は、素材のめっき対象領域全面をマスキング材によって
覆い、該マスキング材の内部分めっき対象領域に対応す
る部分を除去して素材表面の部分めっき対象領域を露出
させてめっき処理を施し、その後、前記マスキング材を
除去することを特徴とする。As another method of the partial plating, the entire surface of the material to be plated is covered with a masking material, and a portion corresponding to the inner partial plating target area of the masking material is removed to partially coat the surface of the material. It is characterized in that the region is exposed, a plating process is performed, and then the masking material is removed.
【００１４】上記素材表面に部分めっきを施す前に、素
材表面に下地めっきを施すことが効果的である。Prior to the partial plating on the surface of the material, it is effective to apply the undercoat to the surface of the material.
【００１５】また、部分めっき後に部分めっき部分と該
部分めっき部分以外の領域の表面硬さの違いを利用して
砂打ちによって光沢に変化をつけた後に仕上げめっきを
施すことを特徴とする。Further, after the partial plating, the difference in surface hardness between the partially plated portion and the region other than the partially plated portion is utilized to change the gloss by sanding, and then the final plating is performed.
【００１６】たとえば、部分めっき側を素材表面よりも
硬い光沢めっきとしておいて、砂打ちのエアー圧を調整
することにより、素材表面側にのみ光沢の無い艶消しに
することができる。もちろん、逆に部分めっき側を素材
表面よりも軟らかいめっきとしておいて、部分めっき側
を艶消しにすることもできる。さらに、両方を艶消しと
し、その光沢度に差を設けるように構成することもでき
る。For example, by setting the partial plating side to a gloss plating that is harder than the surface of the material and adjusting the air pressure for sanding, it is possible to make the surface of the material matte without gloss. Of course, conversely, the partial plating side may be softer than the surface of the material, and the partial plating side may be matte. Further, it is possible to make both of them matte and to provide a difference in their glossiness.
【００１７】また、砂打ち加工を施すことなく、素材表
面と光沢の異なる部分めっきを施して素材のめっき対象
領域の光沢に変化をつけてもよい。Further, without performing sanding, partial plating having a gloss different from that of the surface of the material may be applied to change the gloss of the area to be plated of the material.
【００１８】たとえば、光沢のある素材表面に無光沢の
部分めっきを施して光沢に変化をつけてもよいし、逆に
無光沢の素材表面に光沢のある部分めっきを施して光沢
に変化をつけてもよい。For example, the glossy material surface may be subjected to matte partial plating to change the glossiness, or conversely, the matte material surface may be subjected to glossy partial plating to change the glossiness. May be.
【００１９】[0019]
【発明の実施の形態】以下に本発明を図示の実施の形態
に基づいて説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below based on the illustrated embodiment.
【００２０】［実施の形態１］図１(ａ)は本発明の段付
きめっき製品を示している。[First Embodiment] FIG. 1A shows a stepped plated product of the present invention.
【００２１】この製品は、素材１のめっき対象領域Ａ0
の一部Ａ1に部分めっき２が施され、この部分めっき２
を含むめっき対象領域Ａ0全面に重ねて仕上げめっき３
が施されている。こにより、仕上げめっき３表面に部分
めっき２に対応する凸部４が形成されている。This product has a target area A0 for plating of material 1.
Partial plating 2 is applied to part A1 of the
Finish plating 3 over the entire plating target area A0 including
Is given. Thereby, the convex portion 4 corresponding to the partial plating 2 is formed on the surface of the finish plating 3.
【００２２】この凸部４の高さは任意であるが、模様と
して形成するので、１０［μｍ］以上、好適には２０〜
３０［μｍ］程度以上に設定される。The height of the convex portion 4 is arbitrary, but since it is formed as a pattern, it is 10 [μm] or more, preferably 20 to
It is set to about 30 μm or more.
【００２３】図１(ｂ)，(ｃ)は、本発明の段付きめっき
方法の概念構成を示している。1 (b) and 1 (c) show the conceptual structure of the stepped plating method of the present invention.
【００２４】すなわち、素材１のめっき対象領域Ａ0の
一部Ａ1に部分めっき２を施す工程と（図１(ｂ)参
照）、この部分めっき２を含むめっき対象領域Ａ0全面
に重ねて仕上げめっき２を施す工程（図１(ｃ)参照）と
から構成されている。That is, the step of performing partial plating 2 on a part A1 of the plating target area A0 of the material 1 (see FIG. 1B), and the final plating 2 by overlapping the entire plating target area A0 including this partial plating 2 (See FIG. 1C).
【００２５】このように、素材１表面にめっきにより段
付き形状を成形するので、不良品が発生したり仕様が変
更された場合には、部分めっき２および仕上げめっき３
を除去することにより、素材１を再生利用することが可
能となる。As described above, since the stepped shape is formed on the surface of the raw material 1 by plating, when a defective product is generated or the specifications are changed, the partial plating 2 and the finish plating 3 are performed.
By removing the, the material 1 can be reused.
【００２６】また、機械加工やエッチング処理のように
大がかりな設備が不要である。Also, large-scale equipment such as machining and etching is not required.
【００２７】さらに、部分めっき２で凹凸をつけるの
で、素材１を削って模様付けしたものと異なり、細いラ
インまで緻密な構造に成形することができる。また、独
特の浮き彫り調の質感を有する製品となり、深味のある
高級感溢れる感触と味わいが得られる。Furthermore, since the unevenness is formed by the partial plating 2, it is possible to form a fine structure up to a fine line, unlike the case where the material 1 is shaved and patterned. In addition, the product will have a unique relief-like texture, providing a deep and luxurious feel and taste.
【００２８】上記部分めっき２は、素材１表面の部分め
っき対象領域Ａ1以外の領域をマスキングしてめっき
し、その後マスキング材を除去することによって行われ
る。The partial plating 2 is performed by masking and plating a region other than the partial plating target region A1 on the surface of the material 1, and then removing the masking material.
【００２９】このマスキングの方法としては、 マスキング材として、タール系のレジストと電着塗装
の組み合わせる方法、 厚いめっきを着けた後、部分めっき部分にタール系の
マスキングをし、他の部分のめっきを剥離する方法、 紫外線硬化型レジストによる方法、等種々の方法を適
用し得る。As the masking method, as a masking material, a method of combining a tar-based resist and electrodeposition coating is used, or after a thick plating is applied, a tar-based masking is applied to a partially plated portion and another portion is plated. Various methods such as a peeling method and a method using an ultraviolet curable resist can be applied.
【００３０】このうち、のタール系のレジストと電着
塗装の組み合わせにおいて、直接電着塗装する工程では
電着塗装が剥がれる場合があるので、注意を要する。そ
の対策としては、電着塗装前に僅かのＮiストライクで
活性化し、クロメートめっきすることにより、欠陥の少
ない電着塗装皮膜を得ることができる。Among these, in the combination of the tar-based resist and the electrodeposition coating, the electrodeposition coating may be peeled off in the step of direct electrodeposition coating, so caution is required. As a countermeasure against this, an electrodeposition coating film having few defects can be obtained by activating with a slight Ni strike and chromate plating before electrodeposition coating.
【００３１】上記段付きめっきの前処理として、下地め
っきを施しておくことが効果的である。As a pretreatment for the stepped plating, it is effective to apply a base plating.
【００３２】図２および図３には、本発明のより具体的
な実施の形態が示されている。2 and 3 show a more concrete embodiment of the present invention.
【００３３】［実施の形態２］図３には第２の実施の形
態が示されている。[Second Embodiment] FIG. 3 shows a second embodiment.
【００３４】この実施の形態２は、素材１のめっき対象
領域Ａ0表面に下地めっき５を施す工程と、この下地め
っき５の部分めっき対象領域Ａ1を第１のマスキング材
６によって覆う工程と、この部分めっき対象領域Ａ1以
外の領域を第２のマスキング材７によって覆う工程と、
前記第１のマスキング材６を除去して下地めっき５表面
の部分めっき対象領域Ａ1を露出させた後めっき処理を
施す工程と、めっき処理後、第２のマスキング材７を除
去する工程と、さらに部分めっき２部分を含むめっき対
象領域Ａ0全面に仕上げめっき３を施す工程とを備えて
いる。In the second embodiment, the step of applying the undercoating 5 to the surface of the plating target area A0 of the material 1, the step of covering the partial plating target area A1 of the undercoating 5 with the first masking material 6, A step of covering a region other than the partial plating target region A1 with the second masking material 7,
A step of removing the first masking material 6 to expose a partial plating target area A1 on the surface of the base plating 5 and then performing a plating treatment; and a step of removing the second masking material 7 after the plating treatment, And a step of applying finish plating 3 to the entire surface of the plating target area A0 including the partial plating 2 portion.
【００３５】第１，第２のマスキング材６，７の材料の
選択および組み合わせとしては、必ず、一方の第１のマ
スキング材６が簡単な方法により除去でき、他方の第２
のマスキング材７がめっき処理で剥離してはならないこ
とが条件となる。Regarding the selection and combination of the materials for the first and second masking materials 6 and 7, one first masking material 6 can be removed by a simple method, and the other second masking material 6 can be removed.
The condition is that the masking material 7 must not be peeled off by plating.
【００３６】第１マスキング材６の除去には、有機溶剤
により溶かす方法，電解液中で陰極電解して剥離する方
法等がある。電解液としては樹脂の性質に合ったものが
選択されるが、一般的な電解脱脂での陰極電解で目的を
達成できる。For removing the first masking material 6, there are a method of dissolving with an organic solvent, a method of stripping by cathodic electrolysis in an electrolytic solution, and the like. As the electrolytic solution, a solution suitable for the properties of the resin is selected, but the purpose can be achieved by cathodic electrolysis in general electrolytic degreasing.
【００３７】本発明の段付きめっきは一般的なめっき工
程を経てめっきを行うが、凸部４の段が、たとえば２０
［μｍ］以上のめっきを必要とする過酷な条件では、第
２のマスキング材７として、めっき条件に耐え得る材料
が要請される。The step plating of the present invention is carried out through a general plating process, but the step of the convex portion 4 has, for example, 20 steps.
Under severe conditions that require plating of [μm] or more, a material that can withstand the plating conditions is required as the second masking material 7.
【００３８】すなわち、通常のめっきは数［μｍ］単位
であり、マスキング材の材料やマスキング方法は、この
程度の厚みのめっきに耐えられる程度に設定されている
が、２０［μｍ］を越えるような厚いめっきをする条件
では、通常のマスキング材では電解脱脂や酸電解の処理
工程において剥れてやすい。また、この処理工程で剥離
しなくても、めっき処理の電流値と長い処理時間でマス
キング材が徐々に剥離し、細いラインは殆どなくなって
しまう。That is, the usual plating is in the unit of several [μm], and the material of the masking material and the masking method are set so as to be able to withstand the plating of this thickness, but it may exceed 20 [μm]. Under the condition of thick plating, a normal masking material is likely to be peeled off in the process of electrolytic degreasing or acid electrolysis. Further, even if it is not peeled off in this treatment step, the masking material is gradually peeled off due to the current value of the plating treatment and the long treatment time, and the thin line is almost eliminated.
【００３９】検討の結果、このような第２のマスキング
材７としては、次のような材料を使用することが好まし
い。As a result of examination, it is preferable to use the following materials as the second masking material 7.
【００４０】アクリル系，ウレタン系，エポキシ系，
シリコン系，ビニール系，メラミン系，フッ素系等の液
状塗料、 エポキシ系，ポリエステル系等の粉体塗料、 タール系のレジスト アクリル系，エポキシ系等の電着塗料。Acrylic, urethane, epoxy,
Liquid paints such as silicone-based, vinyl-based, melamine-based and fluorine-based, powder coatings such as epoxy-based and polyester-based, tar-based resist acrylic-based and epoxy-based electrodeposition coatings.
【００４１】また、マスキングの方法としては、たとえ
ば次の方法が好適である。As a masking method, for example, the following method is suitable.
【００４２】液状塗料のはけ塗り，ディッピング，ス
プレー塗装，印刷、 粉体塗料の静電塗装、 電着塗料の電着塗装。Brush coating, dipping, spray coating, printing of liquid paint, electrostatic coating of powder coating, electrodeposition coating of electrodeposition coating.
【００４３】具体例として、Ｎiめっきをする場合で実
験したところ、第１のマスキング材６としてタール系レ
ジスト、第２のマスキング材７としてクロメート（クロ
ムめっき）処理をいれた電着塗装の組み合わせにおい
て、問題なく２０［μｍ］以上の段付きめっきが得られ
た。As a specific example, an experiment was conducted in the case of performing Ni plating, and in a combination of electrodeposition coating in which a tar-based resist was used as the first masking material 6 and a chromate (chrome plating) treatment was used as the second masking material 7. However, step plating of 20 [μm] or more was obtained without any problem.
【００４４】［実施の形態３］図３には第４の実施の形
態が示されている。[Third Embodiment] FIG. 3 shows a fourth embodiment.
【００４５】この実施の形態３は、素材１のめっき対象
領域Ａ0表面に下地めっき５を施す工程と、素材１のめ
っき対象領域Ａ0全面をマスキング材８によって覆い、
このマスキング材８の部分めっき対象領域Ａ1に対応す
る部分を除去して素材１表面の部分めっき対象領域Ａ1
を露出させる工程と、露出した部分めっき対象領域Ａ1
にめっき処理を施す工程と、めっき処理後マスキング材
８を除去する工程と、さらに部分めっき２部分を含むめ
っき対象領域Ａ0全面に仕上げめっき３を施す工程とを
備えている。In the third embodiment, the step of applying the base plating 5 to the surface of the plating target area A0 of the material 1 and the entire surface of the plating target area A0 of the material 1 are covered with the masking material 8.
By removing a portion of the masking material 8 corresponding to the partial plating target area A1, the partial plating target area A1 on the surface of the material 1 is removed.
Exposing process and exposed area A1 for partial plating
Is subjected to a plating treatment, a step of removing the masking material 8 after the plating treatment, and a step of further applying a finish plating 3 to the entire surface of the plating target area A0 including the partial plating 2 portion.
【００４６】このマスキング材８の除去は、たとえば工
具やレーザ光線のエネルギで削りとるようにすればよ
い。The masking material 8 may be removed by, for example, cutting with the energy of a tool or a laser beam.
【００４７】この第４の実施の形態によれば、第３の実
施の形態に比較してマスキング工程が１工程分だけ削減
できる。According to the fourth embodiment, the masking step can be reduced by one step as compared with the third embodiment.
【００４８】［実施の形態４］図４には、本発明の実施
の形態４を示している。[Fourth Embodiment] FIG. 4 shows a fourth embodiment of the present invention.
【００４９】この実施の形態では、上記実施の形態１，
２または３等によって部分めっき表面と部分めっき処理
されない素材表面との間に光沢の差を持たせたものであ
る。In this embodiment, the above-mentioned first embodiment
The difference in gloss between the partially plated surface and the material surface not subjected to the partial plating is provided by 2 or 3 or the like.
【００５０】すなわち、図４(ａ)に示すように、部分め
っき後に部分めっき２部分と部分めっき２部分以外の領
域の表面硬さの違いを利用して砂打ちによって光沢に変
化をつけ、その後図４(ｂ)に示すように仕上げめっき３
を施すようにしたものである。That is, as shown in FIG. 4 (a), the gloss is changed by sanding by utilizing the difference in surface hardness between the partial plating 2 portion and the area other than the partial plating 2 portion after the partial plating, and then, Finish plating 3 as shown in Fig. 4 (b)
Is to be applied.
【００５１】図示例では、部分めっき２側を素材１表面
の下地めっき５よりも硬い光沢めっきとしておいて、砂
打ちのエアー圧を調整することにより、部分めっき２以
外の領域の下地めっき５表面のみを荒らして光沢の無い
艶消し状態にしたものである。この上に仕上げめっき３
が施されるが、部分めっき２及び艶消しされた下地めっ
き３表面状態がそのまま仕上げめっき３表面に浮き出て
光沢に変化が現れる。In the illustrated example, the partial plating 2 side is a bright plating that is harder than the underlying plating 5 on the surface of the raw material 1, and the air pressure of sanding is adjusted to adjust the surface of the underlying plating 5 outside the partial plating 2. It is a matte state with no luster by roughening only the chisel. Finish plating on this 3
However, the surface conditions of the partial plating 2 and the matte base plating 3 are raised as they are on the surface of the finish plating 3 and a change in gloss appears.
【００５２】また、部分めっき２側を素材表面の下地め
っき５よりも軟らかいめっきとしておいて、部分めっき
２側を艶消しにすることもできるし、さらに両方を艶消
しとし、その光沢度に差を設けるように構成することも
できる。Further, it is possible to make the partial plating 2 side softer than the base plating 5 on the surface of the material, and to make the partial plating 2 side matte, and also to make both matte so that the glossiness is different. Can be configured to be provided.
【００５３】もちろん、実施の形態１に示したような下
地めっき５をつけない場合にも適用できる。Of course, the present invention can also be applied to the case where the base plating 5 as shown in the first embodiment is not attached.
【００５４】さらに、図示はしないが、砂打ち加工を施
すことなく、素材表面と光沢の異なる部分めっきを施し
て素材のめっき対象領域の光沢に変化をつけてもよい。Further, although not shown, it is also possible to perform partial plating having a gloss different from that of the surface of the material to change the gloss of the area to be plated of the material without sanding.
【００５５】たとえば、部分めっきをする際、光沢のあ
る素材表面に無光沢の部分めっきを施して光沢に変化を
つけてもよいし、逆に無光沢の素材表面に光沢のある部
分めっきを施して光沢に変化をつけてもよい。その後、
仕上げめっきを施すことは砂打ちの場合と同様である。For example, when performing partial plating, the glossy material surface may be subjected to matte partial plating to change the gloss, or conversely, the matte material surface may be subjected to glossy partial plating. The gloss may be changed. afterwards,
Applying finish plating is similar to sanding.
【００５６】[0056]
【発明の効果】以上説明したように、本発明によれば、
部分めっきの上に重ねて仕上げめっきを施すことによっ
て、仕上げめっき表面に部分めっきに対応する凸部を形
成したので、不良品が発生したり仕様が変更された場合
には、めっきを除去することにより、素材を再生利用す
ることが可能となる。As described above, according to the present invention,
Since the convex portion corresponding to the partial plating is formed on the surface of the finish plating by applying the finish plating over the partial plating, remove the plating when a defective product is generated or the specifications are changed. This makes it possible to recycle the material.
【００５７】また、機械加工やエッチング処理のように
おおがかりな設備が不要である。Also, no major equipment such as machining or etching is required.
【００５８】さらに、めっきで凹凸をつけるので、素材
を削って模様付けしたものと異なり、細いラインまで緻
密な構造に成形することができる。また、独特の浮き彫
り調の質感を有する製品となり、深味のある高級感溢れ
る感触と味わいが得られる。Furthermore, since the unevenness is formed by plating, it is possible to form a fine structure up to a fine line, unlike the case where the material is shaved and patterned. In addition, the product will have a unique relief-like texture, providing a deep and luxurious feel and taste.
【００５９】上記素材表面に部分めっきを施す前に、素
材表面にＮiストライクめっきやクロメート処理等を施
しておけば、めっき層の密着性が向上する。If the surface of the material is subjected to Ni strike plating or chromate treatment before the surface of the material is partially plated, the adhesion of the plating layer is improved.
【００６０】さらに、部分めっき部分と隣接する素材表
面の光沢に変化をつければ、独特の凹凸模様との相乗的
作用によってデザイン性が向上する。Furthermore, if the gloss of the surface of the material adjacent to the partially plated portion is changed, the design is improved by the synergistic action with the unique uneven pattern.
【図１】図１は本発明の実施の形態１に係る段付きめっ
き製品および段付きめっき方法を示す概念図である。FIG. 1 is a conceptual diagram showing a step plating product and a step plating method according to a first embodiment of the present invention.
【図２】図２は本発明の実施の形態２に係る段付きめっ
き方法の概念図である。FIG. 2 is a conceptual diagram of a step plating method according to a second embodiment of the present invention.
【図３】図３は本発明の実施の形態３に係る段付きめっ
き方法の概念図である。FIG. 3 is a conceptual diagram of a step plating method according to a third embodiment of the present invention.
【図４】図４は本発明の実施の形態４に係る段付きめっ
き方法の概念図である。FIG. 4 is a conceptual diagram of a step plating method according to a fourth embodiment of the present invention.
１ 素材 ２ 部分めっき ３ 仕上げめっき ４ 凸部 Ａ0 めっき対象領域 Ａ1 部分めっき領域 1 Material 2 Partial plating 3 Finish plating 4 Convex area A0 Target area for plating A1 Partial plating area
Claims (7)
を施し、該部分めっきを含むめっき対象領域全面に重ね
て仕上げめっきを施すことによって、仕上げめっき表面
に部分めっきに対応する凸部を形成したことを特徴とす
る段付きめっき製品。1. A convex portion corresponding to partial plating is formed on the surface of the finish plating by partially plating a part of the target plating area of the material and performing finish plating over the entire plating target area including the partial plating. A stepped plated product characterized by being formed.
を施し、 その後、部分めっきを含むめっき対象領域全面に重ねて
仕上げめっきを施すことを特徴とする段付きめっき方
法。2. A stepped plating method, characterized in that a part of a plating target region of a material is partially plated, and then a final plating is performed over the entire plating target region including the partial plating.
内、部分めっき領域を第１のマスキング材によって覆う
と共に部分めっき領域以外の領域を第２のマスキング材
によって覆い、前記第１のマスキング材を除去して素材
の部分メッキ対象領域を露出させた後めっき処理を施
し、その後第２のマスキング材を除去することを特徴と
する請求項２に記載の段付きめっき方法。3. In the partial plating, in the area to be plated of the material, the partial plating area is covered with a first masking material, and the area other than the partial plating area is covered with a second masking material. 3. The stepped plating method according to claim 2, wherein the step of removing the second masking material is carried out after the step of removing the second masking material by exposing the area of the material to be partially plated, and then performing a plating process.
をマスキング材によって覆い、該マスキング材の内部分
めっき対象領域に対応する部分を除去して素材表面の部
分めっき対象領域を露出させてめっき処理を施し、その
後、前記マスキング材を除去することを特徴とする請求
項２に記載の段付きめっき方法。4. In the partial plating, the entire surface of the material to be plated is covered with a masking material, and a portion of the masking material corresponding to the area to be partially plated is removed to expose the surface of the material to be partially plated. The stepped plating method according to claim 2, wherein a treatment is performed and then the masking material is removed.
面に下地めっきを施すことを特徴とする請求項２，３ま
たは４に記載の段付きめっき方法。5. The stepped plating method according to claim 2, wherein the base material plating is applied to the raw material surface before the partial plating is applied to the raw material surface.
っき部分以外の領域の表面硬さの違いを利用して砂打ち
によって光沢に変化をつけた後に仕上げめっきを施すこ
とを特徴とする請求項２，３，４または５に記載の段付
きめっき方法。6. The final plating is performed after the partial plating is performed to change the gloss by sanding by utilizing the difference in surface hardness between the partially plated portion and the area other than the partially plated portion. The stepped plating method described in 2, 3, 4 or 5.
て素材のめっき対象領域の光沢に変化をつけた後に仕上
げめっきを施すことを特徴とする請求項２，３，４また
は５に記載の段付きめっき方法。7. The plating according to claim 2, 3, 4 or 5, wherein partial plating having a gloss different from that of the surface of the material is applied to change the gloss of an area to be plated of the material, and then final plating is applied. Step plating method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32500295A JPH09143791A (en) | 1995-11-20 | 1995-11-20 | Plated product with step and stepped plating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32500295A JPH09143791A (en) | 1995-11-20 | 1995-11-20 | Plated product with step and stepped plating method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09143791A true JPH09143791A (en) | 1997-06-03 |
Family
ID=18172043
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32500295A Withdrawn JPH09143791A (en) | 1995-11-20 | 1995-11-20 | Plated product with step and stepped plating method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09143791A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002180282A (en) * | 2000-12-20 | 2002-06-26 | Kyushu Hitachi Maxell Ltd | Electroformed metal and its manufacturing method |
| JP2013253306A (en) * | 2012-06-08 | 2013-12-19 | Dipsol Chemicals Co Ltd | Coated stainless steel member |
| WO2020085780A1 (en) * | 2018-10-24 | 2020-04-30 | 대산전자 주식회사 | Plating method and plating body |
-
1995
- 1995-11-20 JP JP32500295A patent/JPH09143791A/en not_active Withdrawn
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002180282A (en) * | 2000-12-20 | 2002-06-26 | Kyushu Hitachi Maxell Ltd | Electroformed metal and its manufacturing method |
| JP4674735B2 (en) * | 2000-12-20 | 2011-04-20 | 九州日立マクセル株式会社 | Method for producing electroformed metal |
| JP2013253306A (en) * | 2012-06-08 | 2013-12-19 | Dipsol Chemicals Co Ltd | Coated stainless steel member |
| US10081878B2 (en) | 2012-06-08 | 2018-09-25 | Honda Motor Co., Ltd. | Coated stainless steel member |
| WO2020085780A1 (en) * | 2018-10-24 | 2020-04-30 | 대산전자 주식회사 | Plating method and plating body |
| KR20200046378A (en) * | 2018-10-24 | 2020-05-07 | 대산전자(주) | Plating method and plated metal |
| CN111630209A (en) * | 2018-10-24 | 2020-09-04 | 大山电子株式会社 | Plating method and plated body |
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