JPH0234829Y2 - - Google Patents
Info
- Publication number
- JPH0234829Y2 JPH0234829Y2 JP14503583U JP14503583U JPH0234829Y2 JP H0234829 Y2 JPH0234829 Y2 JP H0234829Y2 JP 14503583 U JP14503583 U JP 14503583U JP 14503583 U JP14503583 U JP 14503583U JP H0234829 Y2 JPH0234829 Y2 JP H0234829Y2
- Authority
- JP
- Japan
- Prior art keywords
- ethylene
- acid copolymer
- acrylic acid
- vinyl acetate
- resin layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 18
- 239000011347 resin Substances 0.000 claims description 18
- 229920006242 ethylene acrylic acid copolymer Polymers 0.000 claims description 12
- 239000005038 ethylene vinyl acetate Substances 0.000 claims description 10
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims description 10
- 238000004132 cross linking Methods 0.000 claims description 9
- 229920005648 ethylene methacrylic acid copolymer Polymers 0.000 claims description 9
- 239000011888 foil Substances 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 239000000203 mixture Substances 0.000 description 11
- 239000011889 copper foil Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 229920001225 polyester resin Polymers 0.000 description 3
- 239000004645 polyester resin Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 238000007334 copolymerization reaction Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229920006226 ethylene-acrylic acid Polymers 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 230000007062 hydrolysis Effects 0.000 description 2
- 238000006460 hydrolysis reaction Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 238000007127 saponification reaction Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 235000011121 sodium hydroxide Nutrition 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Description
【考案の詳細な説明】
本考案は、フレキシブル混合集積回路基板（プ
リント配線板）に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a flexible mixed integrated circuit board (printed wiring board).
最近の電子機器は小型化、軽量化、薄形化、高
密度実装化が急速に進められている。特に、プリ
ント配線板はラジオなどの民生機器用として商品
化されはじめ、現在では量産性、高信頼性に支え
られて電話機、電算機などの産業用機器用としし
て用途を拡大している。 Recent electronic devices are rapidly becoming smaller, lighter, thinner, and more densely packaged. In particular, printed wiring boards began to be commercialized for consumer equipment such as radios, and are now being used in industrial equipment such as telephones and computers, supported by mass production and high reliability.
フレキシブルプリント配線板は当初電線、ケー
ブルの代替として使用されてきたが、可撓性があ
るために狭い空間に立体的に高密度実装すること
ができるのみならず、繰り返し屈曲に耐え得るた
めに電子機器の可動部への配線、ケーブル、コネ
クター機能を付与した複合部品としてその用途が
拡大されつつある。 Flexible printed wiring boards were initially used as a substitute for electric wires and cables, but their flexibility not only allows for high-density three-dimensional mounting in narrow spaces, but also allows them to withstand repeated bending. Its use is expanding as a composite component that provides wiring, cable, and connector functions for moving parts of equipment.
現在、カメラ、電機卓上計算機、電話機、プリ
ンターなどの機器内立体配線材料として用いられ
ているものは、厚さが約25ミクロンのポリイミド
またはポリエステルのフイルムの両面または片面
に35ミクロンの電解銅箔を接着したフレキシブル
銅張板を使用した配線パターンを形成したもので
ある。この配線パターンにスルホールメツキを施
し、さらに両面および外層にカバーレイ被覆を行
なつたものも用いられている。 Currently, the material used for three-dimensional wiring inside devices such as cameras, desk calculators, telephones, and printers is a 35-micron electrolytic copper foil on both or one side of a polyimide or polyester film with a thickness of about 25 microns. A wiring pattern is formed using bonded flexible copper clad boards. There is also used a wiring pattern in which through-hole plating is applied and both surfaces and the outer layer are coated with a coverlay.
現在のフレキシブル混成集積回路基板は基材と
してポリイミドまたはポリエステル樹脂のフイル
ムが一般に使われているが、ポリイミドでは銅箔
との接着強度が弱く、ハンダリフローなどによつ
て銅箔浮きが発生するなどの欠点がある。一方、
ポリエステ樹脂では、吸水率が高く、20℃ないし
250℃における熱膨張係数も大きいため、スルホ
ール接続信頼性に欠ける。さらに、製造するさい
に170℃において蒸気プレスによる硬化を行なう
こともあり、多層化する場合に樹脂間の接着性が
低下するばかりでなく、可撓性も低下する傾向が
ある。 Current flexible hybrid integrated circuit boards generally use polyimide or polyester resin films as the base material, but polyimide has weak adhesive strength with copper foil, and problems such as copper foil lifting due to solder reflow etc. There are drawbacks. on the other hand,
Polyester resin has a high water absorption rate and can be heated to 20℃ or
The coefficient of thermal expansion at 250°C is also large, resulting in poor through-hole connection reliability. Furthermore, during production, curing is sometimes carried out by steam press at 170°C, which tends not only to reduce adhesiveness between resins but also to reduce flexibility when multi-layered.
本考案はこれらの問題を解決するものであり、
従来の耐熱性高分子化学の考え方とは全く異なる
発想をもとにして考案されたフレキシブルプリン
ト基板（混成集積回路基板）に関するものであ
り、さらにくわしくは、エチレン−アクリル酸共
重合体および／またはエチレン−メタクリル酸共
重合体とエチレン−酢酸ビニル共重合体のけん化
物を処理させることによつて得られる処理物のフ
イルム状物を基材としてなるフレキシブルプリン
ト基板であり、電解銅箔をはじめあらゆる導電性
金属箔とに接着力を有し、かつ高温加熱時に架橋
能力を有するために耐熱性にすぐれているばかり
か、可撓性についても良好なために多層基板にも
適したフレキシブルプリント基板である。 This invention solves these problems,
It relates to flexible printed circuit boards (hybrid integrated circuit boards) that were devised based on an idea completely different from that of conventional heat-resistant polymer chemistry, and more specifically, it concerns ethylene-acrylic acid copolymers and/or It is a flexible printed circuit board whose base material is a film-like product obtained by processing saponified products of ethylene-methacrylic acid copolymer and ethylene-vinyl acetate copolymer, and can be used with all kinds of materials including electrolytic copper foil. It is a flexible printed circuit board that not only has excellent heat resistance because it has adhesive strength with conductive metal foil and has crosslinking ability when heated to high temperatures, but also has good flexibility, making it suitable for multilayer boards. be.
とりわけ、本考案のフレキシブル基板の特長は
従来使用されているポリイミドおよびポリエステ
ル樹脂に比べて比較的高温（300℃以上）におい
て架橋処理を行なうため、寸法安定性がすぐれて
いるのみならず、表面保護用または多層積層した
場合に第３図に示されているごとく樹脂間の接着
性がすぐれ、さらに密着性も良く、積層間の残留
ボイドが極力少なくなる。 In particular, the flexible substrate of this invention is characterized by crosslinking at a relatively high temperature (over 300℃) compared to conventionally used polyimide and polyester resins, which not only provides excellent dimensional stability but also provides surface protection. When laminated in multiple layers, the adhesiveness between the resins is excellent as shown in FIG. 3, the adhesion is also good, and residual voids between the laminated layers are minimized.
また、サブトラクテイブ法に比べて最近使われ
ているアデイテイブ法においても、たとえば無電
解メツキ回路パターンとの接着性も良好であるた
めに有効である。 Furthermore, the additive method, which has been used recently, is more effective than the subtractive method because it has better adhesion to, for example, an electroless plating circuit pattern.
さらに、最近高密度回路パターン製造に用いら
れているスクリーン印刷法、導電塗料を使用して
回路パターンを形成する方法においても、本考案
において用いられる処理物は、接着性についても
良好であるために品質安定性があり、かつ工程が
簡単であり、また容易である。 Furthermore, since the processed material used in the present invention has good adhesive properties in the screen printing method and the method of forming circuit patterns using conductive paint, which have recently been used to produce high-density circuit patterns, The quality is stable and the process is simple and easy.
その上、前記の接着性を生かしてプリント配線
板の防湿、耐ガス、防塵などの耐環境性を得るた
めの保護被覆に用いることができる。 Furthermore, by taking advantage of the adhesive properties described above, it can be used as a protective coating for obtaining environmental resistance such as moisture resistance, gas resistance, and dust resistance for printed wiring boards.
以上のごとく、本考案の樹脂層はプリント基板
に要求される絶縁抵抗、誘電率などの電気的特性
はもちろんのこと、寸法安定性、耐熱性、耐薬品
性、耐湿性などが良好であるばかりか、フレキシ
ブル基板における耐折性は従来得られなかつたフ
レキシビリテイーを示す。また、金属薄箔との接
着については、接着剤を必要とせず、単に熱圧着
によつて比較的高温まで良い接着性を示すなどの
特徴を有する。 As described above, the resin layer of the present invention not only has good electrical properties such as insulation resistance and dielectric constant required for printed circuit boards, but also has good dimensional stability, heat resistance, chemical resistance, moisture resistance, etc. Furthermore, the bending durability of the flexible substrate exhibits flexibility that has not been previously available. In addition, with respect to adhesion to metal thin foil, it does not require an adhesive and has the characteristic of showing good adhesion even at relatively high temperatures simply by thermocompression bonding.
本考案の樹脂層はエチレン−アクリル酸共重合
体および／またはエチレン−メタクリル酸共重合
体とエチレン−酢酸ビニル共重合体のけん化物と
からなるものである。エチレン−アクリル酸共重
合体およびエチレン−メタクリル酸共重合体のア
クリル酸およびメタクリル酸の含有率は通常それ
ぞれ５〜50重量％である。また、エチレン−酢酸
ビニル共重合体の酢酸ビニルの含有率は一般には
５〜60重量％である。本考案において使われるけ
ん化物はこのエチレン−酢酸ビニル共重合体をけ
ん化（加水分解）させることによつて得られる。
加水分解率は90％以上が望ましい。加水分解は一
般にはメチルアルコール中で苛性ソーダを用いて
行なわれる。エチレン−アクリル酸共重合体およ
び／またはエチレン−メタクリル酸共重合体とエ
チレン−酢酸ビニル共重合体のけん化物との組成
割合は１／５ないし５／１が望ましい（１／２な
いし２／１が好適）。 The resin layer of the present invention is made of an ethylene-acrylic acid copolymer and/or an ethylene-methacrylic acid copolymer and a saponified product of an ethylene-vinyl acetate copolymer. The content of acrylic acid and methacrylic acid in the ethylene-acrylic acid copolymer and the ethylene-methacrylic acid copolymer is usually 5 to 50% by weight, respectively. Further, the vinyl acetate content of the ethylene-vinyl acetate copolymer is generally 5 to 60% by weight. The saponified product used in the present invention can be obtained by saponifying (hydrolyzing) this ethylene-vinyl acetate copolymer.
A hydrolysis rate of 90% or more is desirable. Hydrolysis is generally carried out using caustic soda in methyl alcohol. The composition ratio of ethylene-acrylic acid copolymer and/or ethylene-methacrylic acid copolymer and saponified product of ethylene-vinyl acetate copolymer is preferably 1/5 to 5/1 (1/2 to 2/1 is preferred).
以上のごときエチレン−アクリル酸共重合体お
よび／またはエチレンメタクリル酸共重合体とエ
チレン−酢酸ビニル共重合体のけん化物との組成
物を加熱処理させて得られる樹脂層は100℃以上
の温度で加熱するさいにアルミニウム板および銅
箔と接着能を有するものであり、しかも、100℃
以下の温度において熱可塑性を示すものである。
さらに、100℃以上に加熱することによつて架橋
反応を起し、耐熱性の向上した絶縁性を有するも
のである。 The resin layer obtained by heat-treating the composition of the above ethylene-acrylic acid copolymer and/or ethylene methacrylic acid copolymer and the saponified product of ethylene-vinyl acetate copolymer can be heated at a temperature of 100°C or higher. It has the ability to bond with aluminum plates and copper foils when heated, and it can be heated to 100°C.
It exhibits thermoplasticity at the following temperatures.
Furthermore, when heated to 100° C. or higher, a crosslinking reaction occurs, resulting in insulation with improved heat resistance.
以下、本考案を図面を用いて説明する。第１図
は片面に導電性金属箔を積層した構造の片面銅張
り混成集積回路用フレキシブル基板の代表例の一
部の断面図の拡大図である。また、第２図は片面
のみを導電性金属箔重層したものを積層した構造
の片面銅張り混成集積回路多層フレキシブル基板
の代表例の一部の断面図の拡大図である。第１図
および第２図において、いずれも１は電導性金属
箔である。また、２はエチレン−アクリル酸共重
合体および／またはエチレン−メタクリル酸共重
合体とエチレン−酢酸ビニル共重合体のけん化物
とを処理させてなる組成物からなる樹脂層（組成
割合は１／１）である。第１図は樹脂層２を導電
性金属箔１との間に加熱圧着によつて貼付けた構
造のものである。第２図は第１図と同様な構造を
多層積層した構造のものである。 The present invention will be explained below with reference to the drawings. FIG. 1 is an enlarged view of a cross-sectional view of a portion of a typical example of a flexible substrate for a single-sided copper-clad hybrid integrated circuit having a structure in which conductive metal foil is laminated on one side. Further, FIG. 2 is an enlarged view of a cross-sectional view of a part of a representative example of a single-sided copper-clad hybrid integrated circuit multilayer flexible board having a structure in which conductive metal foils are laminated on only one side. In both FIGS. 1 and 2, 1 is a conductive metal foil. In addition, 2 is a resin layer made of a composition obtained by treating an ethylene-acrylic acid copolymer and/or an ethylene-methacrylic acid copolymer with a saponified product of an ethylene-vinyl acetate copolymer (composition ratio is 1/2). 1). FIG. 1 shows a structure in which a resin layer 2 is attached to a conductive metal foil 1 by heat-pressing. FIG. 2 shows a structure in which the same structure as in FIG. 1 is laminated in multiple layers.
本考案は導電性金属箔と樹脂層との間に一般に
使用されている接着剤を用いる必要がないために
接着剤の塗布工程が省略されるばかりか、接着剤
中の揮発物質（たとえば、有機溶媒）のために加
熱時のフクレの発生を生じることがない。また、
樹脂層成形時および加熱圧着時において、熱可塑
性を示す絶縁性樹脂層がこれらの高温加熱処理に
よつて架橋反応され、架橋した樹脂層となるため
に可撓性を有し、しかも耐熱性が著しく向上する
などの利点を有するものである。 Since the present invention does not require the use of commonly used adhesives between the conductive metal foil and the resin layer, it not only omits the adhesive application process but also eliminates volatile substances in the adhesive (for example, organic (solvent) will not cause blistering during heating. Also,
During resin layer molding and thermocompression bonding, the thermoplastic insulating resin layer undergoes a crosslinking reaction through these high-temperature heat treatments, resulting in a crosslinked resin layer that is flexible and heat resistant. It has the advantage of being significantly improved.
第３図は回路形成後の樹脂層間の接着の様子を
示した代表例の一部である。 FIG. 3 is a part of a representative example showing the state of adhesion between resin layers after circuit formation.
さらに、該樹脂層内にアルミナ、窒化けい素な
どの絶縁性を有し、しかも熱伝導性の良好な無機
粉末状物を充填（添加）することによつて本考案
の機能を低下させることなく、熱伝導性を一層向
上することも可能である。その上、エチレン−ア
クリル酸共重合体およびエチレン−メタクリル酸
共重合体が有する−COOH基とけん化物が有す
る−OH基とが架橋反応をおこすための促進剤を
添加させることによつて架橋が一層完結した絶縁
性樹脂層を製造することもできる。 Furthermore, by filling (adding) an inorganic powder material such as alumina or silicon nitride with insulating properties and good thermal conductivity into the resin layer, the function of the present invention is not reduced. , it is also possible to further improve thermal conductivity. Furthermore, crosslinking can be achieved by adding a promoter to cause a crosslinking reaction between the -COOH group of the ethylene-acrylic acid copolymer and the ethylene-methacrylic acid copolymer and the -OH group of the saponified product. It is also possible to produce more complete insulating resin layers.
以下、実施例によつて本考案をさらにくわしく
説明する。 Hereinafter, the present invention will be explained in more detail with reference to Examples.
なお、実施例および比較例において、耐熱性テ
ストは得られたフイルムUL796（プリント配線板）
７，１図に示されたテストパターンをもつた基板
を300℃に保持された鉛／錫＝90／10（重量比）で
あるハンダ浴に180秒浮べて評価した。なお、第
１表に評価を下記のように示す。 In addition, in the examples and comparative examples, the heat resistance test was performed on the obtained film UL796 (printed wiring board).
A board with the test pattern shown in Figure 7.1 was floated for 180 seconds in a solder bath with lead/tin = 90/10 (weight ratio) maintained at 300°C for evaluation. The evaluation is shown in Table 1 as follows.
〇：原形のまま変化せず
×：導体回路と樹脂層との間において、剥離、
ひび割れ、***などの変化がみられた
実施例 １，２、比較例 １，２
メルトフローインデツクス（JIS Ｋ−7210にし
たがい、第１表の条件が４で測定、以下「M.I.」
と云う）が300ｇ／10分であるエチレン−アクリ
ル酸共重合体（密度0.954ｇ／cm3、アクリル酸共
重合割合20重量％）100重量部および酢酸ビニル
共重合割合が28重量％であるエチレン−酢酸ビニ
ル共重合体をけん化させることによつて得られる
けん化物（けん化度97.5％、M.I.75ｇ／10分、密
度0.951ｇ／cm3）100重量部をヘンシエルミキサー
を使つて５分間ドライブレンドを行なつた。得ら
れた混合物〔以下「混合物(A)」と云う〕をＴ−ダ
イを備えた押出機（径40mm、ダイス幅30cm、回転
数85回転／分）を用いてシリンダー温度がC1＝
100℃、C2＝120℃およびC3＝140℃およびダイス
温度が160℃の条件でフイルム（厚さ100μｍ）を
成形し、20℃に水冷されたロールに巻きつけた
（実施例１）。また、混合物(A)を製造するさいに用
いたエチレン−アクリル酸共重合体のかわりに、
M.I.が200ｇ／10分であるエチレン−メタクリル
酸共重合体（密度0.950ｇ／cm3、メタクリル酸共
重合割合25重量％）使つたほかは、混合物(A)と同
様に混合物〔以下「混合物(B)」と云う〕を製造し
た。得られた混合物を前記と同様にフイルムを製
造した（実施例２）。さらに、実施例１において
使用したエチレン−アクリル酸共重合体（以下
「EAA」と云う。比較例１）およびエチレン−酢
酸ビニル共重合体のけん化物（以下「けん化物」
と云う。比較例２）を前記と同様にフイルムを製
造した。 〇: No change in the original shape ×: Peeling, peeling between the conductor circuit and the resin layer
Examples 1 and 2 where changes such as cracking and splitting were observed, Comparative Examples 1 and 2 Melt flow index (measured under conditions 4 in Table 1 according to JIS K-7210, hereinafter referred to as "MI")
100 parts by weight of ethylene-acrylic acid copolymer (density 0.954 g/cm 3 , acrylic acid copolymerization ratio 20% by weight) with a yield rate of 300g/10 minutes and ethylene with a vinyl acetate copolymerization ratio of 28% by weight. - Dry blend 100 parts by weight of a saponified product obtained by saponifying vinyl acetate copolymer (degree of saponification 97.5%, MI 75 g/10 minutes, density 0.951 g/cm 3 ) for 5 minutes using a Henschel mixer. I did it. The obtained mixture [hereinafter referred to as "mixture (A)"] was heated to a cylinder temperature of C 1 =
A film (thickness: 100 μm) was formed under the conditions of 100° C., C 2 =120° C. and C 3 =140° C., and a die temperature of 160° C., and wound around a roll water-cooled to 20° C. (Example 1). Moreover, instead of the ethylene-acrylic acid copolymer used in producing the mixture (A),
A mixture ( hereinafter referred to as "mixture ( B)" was manufactured. A film was produced from the resulting mixture in the same manner as described above (Example 2). Furthermore, the saponified product of the ethylene-acrylic acid copolymer (hereinafter referred to as "EAA", Comparative Example 1) and the ethylene-vinyl acetate copolymer used in Example 1 (hereinafter referred to as "saponified product")
That's what I say. Comparative Example 2) A film was produced in the same manner as described above.
このようにして得られた各フイルム（厚さ
100μｍ）と厚さが35μｍの電解銅の箔を300℃で
それぞれ10分間熱プレス機を用いて20Kg／cm2（ゲ
ージ圧）の加圧下で架橋しながら積層（ラミネー
ト）を行ない、フレキシブル混成集積回路基板を
製造した。 Each film obtained in this way (thickness
100μm) and 35μm thick electrolytic copper foils were laminated at 300℃ for 10 minutes each using a heat press machine under a pressure of 20Kg/cm 2 (gauge pressure) while cross-linking to form a flexible hybrid assembly. A circuit board was manufactured.
得られた各基板の耐熱性テストおよび柔軟性テ
スト（直径が10mmの丸棒に巻きつけた後、銅箔と
各フイルムとの接着性を観察する）を行なつた。
得られた各フレキシブル混成集積回路基板は、耐
熱テストの前に行なつた柔軟性テストでは、すべ
て銅箔とフイルムとの剥離を認めることができな
かつた。さらに、実施例１および２によつて得ら
れた回路基板の耐熱性テストを行なつたところ、
フイルムが架橋され、なんら変化を認めることが
できなかつた。しかし、比較例１および２では、
フイルム（EAAまたはけん化物）が完全にほと
んどハンダ浴中に溶融・流出していた。 Each of the obtained substrates was subjected to a heat resistance test and a flexibility test (after winding it around a round bar with a diameter of 10 mm, the adhesion between the copper foil and each film was observed).
In all of the obtained flexible hybrid integrated circuit boards, no peeling between the copper foil and the film could be observed in the flexibility test conducted before the heat resistance test. Furthermore, when a heat resistance test was conducted on the circuit boards obtained in Examples 1 and 2,
The film was crosslinked and no changes could be observed. However, in Comparative Examples 1 and 2,
The film (EAA or saponified material) had almost completely melted and flowed into the solder bath.
以上の実施例および比較例の結果から、本発明
のフレキシブル混成集積回路基板は、柔軟性がす
ぐれているのみならず、前記共重合体とけん化物
が架橋され、耐熱性がきわめて良好であることは
明らかである。 From the results of the above Examples and Comparative Examples, the flexible hybrid integrated circuit board of the present invention not only has excellent flexibility, but also has extremely good heat resistance due to the crosslinking of the copolymer and saponified material. is clear.
第１図は片面銅箔張り混成集積回路フレキシブ
ル基板の代表例の一部の断面図の拡大図である。
第２図は片面銅箔張り混成集積回路用積層フレキ
シブル基板の代表例の一部の断面図である。第３
図は回路形成後の絶縁層（樹脂層）の間の接着の
様子を示した代表例の一部の断面図の拡大図であ
る。両図において、１は導電性金属箔であり、２
はエチレン−アクリル酸共重合体および／または
エチレン−メタクリル酸共重合体とエチレン−酢
酸ビニル共重合体のけん化物からなる樹脂層であ
る。
FIG. 1 is an enlarged cross-sectional view of a portion of a representative example of a single-sided copper foil-clad hybrid integrated circuit flexible board.
FIG. 2 is a cross-sectional view of a portion of a representative example of a laminated flexible substrate for a hybrid integrated circuit covered with copper foil on one side. Third
The figure is an enlarged view of a cross-sectional view of a part of a typical example showing the state of adhesion between insulating layers (resin layers) after circuit formation. In both figures, 1 is a conductive metal foil, 2
is a resin layer made of a saponified product of an ethylene-acrylic acid copolymer and/or an ethylene-methacrylic acid copolymer and an ethylene-vinyl acetate copolymer.
Claims (1)
はエチレン−メタクリル酸共重合体ならびにエチ
レン−酢酸ビニル共重合体のけん化物を100℃以
上に加熱して架橋させてなる厚さが10〜5000ミク
ロンの樹脂層ならびに(B)導電性金属箔を積層して
なるフレキシブル混成集積回路基板。 (A) Thickness of 10 to 5000 microns obtained by crosslinking saponified ethylene-acrylic acid copolymer and/or ethylene-methacrylic acid copolymer and ethylene-vinyl acetate copolymer by heating to 100°C or higher. A flexible hybrid integrated circuit board formed by laminating (B) a resin layer and (B) a conductive metal foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14503583U JPS6054365U (en) | 1983-09-21 | 1983-09-21 | Flexible hybrid integrated circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14503583U JPS6054365U (en) | 1983-09-21 | 1983-09-21 | Flexible hybrid integrated circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6054365U JPS6054365U (en) | 1985-04-16 |
| JPH0234829Y2 true JPH0234829Y2 (en) | 1990-09-19 |
Family
ID=30323265
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14503583U Granted JPS6054365U (en) | 1983-09-21 | 1983-09-21 | Flexible hybrid integrated circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6054365U (en) |
-
1983
- 1983-09-21 JP JP14503583U patent/JPS6054365U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6054365U (en) | 1985-04-16 |
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