JPH09129476A - Ceramic electronic part - Google Patents
Ceramic electronic partInfo
- Publication number
- JPH09129476A JPH09129476A JP7306873A JP30687395A JPH09129476A JP H09129476 A JPH09129476 A JP H09129476A JP 7306873 A JP7306873 A JP 7306873A JP 30687395 A JP30687395 A JP 30687395A JP H09129476 A JPH09129476 A JP H09129476A
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- electrode
- electrodes
- internal electrodes
- exposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電子部品に関し、
詳しくは、積層セラミックコンデンサや積層ＬＣ複合部
品などのような、セラミック中に内部電極が配設された
素子に、内部電極と導通する外部電極を配設してなるセ
ラミック電子部品に関する。TECHNICAL FIELD The present invention relates to an electronic component,
More specifically, the present invention relates to a ceramic electronic component such as a monolithic ceramic capacitor or a monolithic LC composite component in which an internal electrode is provided in a ceramic and an external electrode electrically connected to the internal electrode is disposed.
【０００２】[0002]
【従来の技術】例えば、代表的なセラミック電子部品の
一つである積層セラミックコンデンサは、図７に示すよ
うに、セラミック１中に複数の内部電極２が配設された
素子（積層コンデンサ素子）３の両端側に、内部電極２
と導通する外部電極４を配設することにより形成されて
いる。2. Description of the Related Art For example, a monolithic ceramic capacitor, which is one of typical ceramic electronic components, is an element (multilayer capacitor element) in which a plurality of internal electrodes 2 are arranged in a ceramic 1 as shown in FIG. Internal electrodes 2 on both ends of 3
It is formed by arranging an external electrode 4 that is electrically connected to the external electrode 4.
【０００３】そして、上記素子３に外部電極４を形成す
る方法としては、通常、内部電極２の端部が露出した素
子３の両端部に、Ａｇ、Ａｇ−Ｐｄ、Ｃｕなどの金属粉
末（導電成分）に、ガラスフリット、有機バインダー、
溶剤などを配合してなる導電ペーストを塗布し、焼き付
ける方法が用いられている。As a method for forming the external electrode 4 on the element 3, usually, metal powder such as Ag, Ag--Pd or Cu (conductive material) is applied to both ends of the element 3 where the end of the internal electrode 2 is exposed. Ingredients), glass frit, organic binder,
A method of applying a conductive paste prepared by mixing a solvent or the like and baking it is used.
【０００４】ところで、上記従来の方法により形成され
た外部電極４は、主として外部電極４に含まれるガラ
スフリットに由来するガラス成分と、素子３を構成する
セラミック１との結合力及び内部電極２を構成する金
属材料と、外部電極４を構成する金属材料との接続によ
る結合力、によって素子３に固着している。By the way, the external electrode 4 formed by the above-mentioned conventional method has a bonding force between the glass component mainly derived from the glass frit contained in the external electrode 4 and the ceramic 1 constituting the element 3 and the internal electrode 2. It is fixed to the element 3 by the bonding force of the connection between the metal material forming the external electrode 4 and the metal material forming the external electrode 4.
【０００５】[0005]
【発明が解決しようとする課題】そのため、素子３の寸
法が小さい場合などのように、外部電極４とセラミック
１の接合面積や、外部電極４と内部電極２の接合面積な
どが小さい場合、外部電極４の素子３への固着力が不十
分になり、信頼性が低下するという問題点がある。Therefore, when the bonding area between the external electrode 4 and the ceramic 1 or the bonding area between the external electrode 4 and the internal electrode 2 is small, such as when the size of the element 3 is small, the external There is a problem that the fixing force of the electrode 4 to the element 3 becomes insufficient and the reliability is lowered.
【０００６】本発明は、上記問題点を解決するものであ
り、外部電極の素子への固着強度が大きく、信頼性に優
れたセラミック電子部品を提供することを目的とする。The present invention has been made to solve the above problems, and an object of the present invention is to provide a ceramic electronic component which has a large fixing strength of an external electrode to an element and is excellent in reliability.
【０００７】[0007]
【課題を解決するための手段】上記目的を達成するため
に、本発明のセラミック電子部品は、セラミック中に内
部電極を配設し、その一部を表面に露出させた素子に、
前記露出部分を介して内部電極と接続する外部電極を配
設してなるセラミック電子部品であって、セラミック中
にダミー内部電極を配設し、その一部を素子表面の外部
電極が配設される位置に露出させることにより、外部電
極を、素子を構成するセラミック及び内部電極の露出部
分に接合させるとともに、ダミー内部電極の露出部分に
も接合させるようにしたことを特徴としている。In order to achieve the above object, a ceramic electronic component of the present invention is an element in which an internal electrode is disposed in a ceramic and a part of which is exposed on the surface,
A ceramic electronic component provided with an external electrode connected to an internal electrode via the exposed portion, wherein a dummy internal electrode is provided in ceramic, and a part of the dummy internal electrode is provided on the element surface. It is characterized in that the external electrode is joined to the exposed portion of the ceramic and the internal electrode that constitute the element and also to the exposed portion of the dummy internal electrode by exposing the exposed portion to a certain position.
【０００８】また、前記ダミー内部電極をセラミック中
に所定の間隔をおいて多数層配設し、かつ、各ダミー内
部電極の端部を素子表面の外部電極が配設される位置に
露出させたことを特徴としている。Further, a large number of the dummy internal electrodes are arranged in the ceramic at predetermined intervals, and the ends of the dummy internal electrodes are exposed on the surface of the element where the external electrodes are provided. It is characterized by that.
【０００９】また、前記ダミー内部電極が、前記素子の
内部電極が配設された層の上側及び下側の、内部電極が
配設されていない外層に主として配設されていることを
特徴としている。Further, the dummy internal electrodes are mainly disposed in outer layers above and below the layer in which the internal electrodes of the element are disposed, in which the internal electrodes are not disposed. .
【００１０】[0010]
【作用】本発明のセラミック電子部品においては、セラ
ミック中にダミー内部電極を配設し、その一部を素子表
面の外部電極が配設される位置に露出させることによ
り、外部電極を、素子を構成するセラミック及び内部電
極の露出部分に接合させるとともに、ダミー内部電極の
露出部分にも接合させるようにしているので、従来のよ
うに、外部電極を、素子を構成するセラミック及び内部
電極の露出部分にのみ接合させるようにしたセラミック
電子部品に比べて、外部電極の素子への固着強度を大幅
に向上させることが可能になる。In the ceramic electronic component of the present invention, the dummy internal electrode is provided in the ceramic, and a part of the dummy internal electrode is exposed at the position where the external electrode is provided on the surface of the element, so that the external electrode is exposed to the element. Since it is bonded to the exposed parts of the constituent ceramics and internal electrodes as well as to the exposed parts of the dummy internal electrodes, the external electrodes are exposed to the exposed parts of the ceramics and internal electrodes forming the element as in the conventional case. As compared with a ceramic electronic component which is bonded only to the external electrode, it is possible to significantly improve the fixing strength of the external electrode to the element.
【００１１】また、前記ダミー内部電極をセラミック中
に所定の間隔をおいて多数層配設し、その端部を素子表
面の外部電極が配設される位置に露出させ、外部電極を
セラミック及び内部電極の露出部分に接合させるととも
に、多数層のダミー内部電極の露出部分にも接合させる
ことにより、さらに外部電極の素子への固着強度を向上
させ、本発明をより実効あらしめることが可能になる。A plurality of dummy internal electrodes are arranged in the ceramic at predetermined intervals, and end portions of the dummy internal electrodes are exposed at positions on the surface of the element where the external electrodes are arranged. By bonding not only the exposed part of the electrode but also the exposed part of the dummy internal electrodes of a large number of layers, it is possible to further improve the fixing strength of the external electrode to the element, and to make the present invention more effective. .
【００１２】また、前記ダミー内部電極を、前記素子の
内部電極が配設された層の上側及び下側の、内部電極が
配設されていない外層に主として配設することにより、
容易にダミー内部電極を備えた素子を形成することが可
能になり、効率よく素子への外部電極の固着強度を向上
させることができるようになる。Further, by arranging the dummy internal electrodes mainly in outer layers above and below the layer in which the internal electrodes of the element are arranged, in which the internal electrodes are not arranged,
It is possible to easily form an element provided with a dummy internal electrode, and it is possible to efficiently improve the fixing strength of the external electrode to the element.
【００１３】[0013]
【発明の実施の形態】以下、本発明の実施の形態を図を
参照しつつ説明する。なお、ここでは、誘電体セラミッ
ク中に内部電極を配設してなる素子に、内部電極と導通
する外部電極を配設してなる積層セラミックコンデンサ
を例にとって説明する。Embodiments of the present invention will be described below with reference to the drawings. Here, a monolithic ceramic capacitor in which an external electrode that is electrically connected to the internal electrode is provided in an element in which an internal electrode is provided in a dielectric ceramic will be described as an example.
【００１４】図１に示すように、この積層セラミックコ
ンデンサは、誘電体であるセラミック１中に複数層の内
部電極２を配設してなる素子（積層コンデンサ素子）３
の両端側に、内部電極２と導通する外部電極（銀電極）
４を配設することにより形成されている。As shown in FIG. 1, this monolithic ceramic capacitor is an element (multilayer capacitor element) 3 in which a plurality of layers of internal electrodes 2 are arranged in a ceramic 1 which is a dielectric.
External electrodes (silver electrodes) that are electrically connected to the internal electrodes 2 on both ends of the
4 is formed.
【００１５】そして、この積層セラミックコンデンサに
おいては、素子３の両端側に、容量形成に寄与しないダ
ミー内部電極５が多数層配設されており、各ダミー内部
電極５の端部は、素子３の両端面の外部電極４が配設さ
れる位置に露出している。そのため、外部電極４は、セ
ラミック１及び内部電極２の露出部分（端部）と接合す
るとともに、ダミー内部電極５の露出部分（端部）とも
接合しており、素子３に強固に固定されている。In this laminated ceramic capacitor, a large number of dummy internal electrodes 5 that do not contribute to capacitance formation are arranged on both ends of the element 3, and the ends of the dummy internal electrodes 5 are arranged at the ends of the element 3. It is exposed at the positions where the external electrodes 4 are provided on both end surfaces. Therefore, the external electrode 4 is joined to the exposed portion (end portion) of the ceramic 1 and the internal electrode 2 and also to the exposed portion (end portion) of the dummy internal electrode 5 and is firmly fixed to the element 3. There is.
【００１６】次に、本発明の積層セラミックコンデンサ
の製造方法について説明する。Next, a method for manufacturing the monolithic ceramic capacitor of the present invention will be described.
【００１７】まず、図２に示すように、ダミー内部電極
５（図１）となる電極パターン５ａが所定の位置に配設
（印刷）された第１のセラミックグリーンシート１ａ
と、図３(ａ)，(ｂ)に示すように、内部電極２（図１）
となる電極パターン２ａ及びダミー内部電極５となる電
極パターン５ａが配設（印刷）された第２のセラミック
グリーンシート１ｂ，１ｃを作製する。第２のセラミッ
クグリーンシート１ｂ，１ｃは、内部電極となる電極パ
ターン２ａの引出し方向が異なっている。なお、図２及
び図３(ａ)，(ｂ)は、理解を容易にするために、個々の
素子３を切り出したときに形成される電極パターンを備
えた第１及び第２のセラミックグリーンシート１ａ，１
ｂ，１ｃを示しているが、実際には、第１及び第２のセ
ラミックグリーンシート１ａ，１ｂ，１ｃは、複数の素
子３を一度に形成するためのユニット用のセラミックグ
リーンシートであり、複数の素子３を切り出したとき
に、各素子３に所定のパターンの内部電極及びダミー内
部電極が形成されるように、所定の形状の電極パターン
が配設されている。First, as shown in FIG. 2, a first ceramic green sheet 1a having electrode patterns 5a to be dummy internal electrodes 5 (FIG. 1) arranged (printed) at predetermined positions.
And as shown in FIGS. 3 (a) and 3 (b), the internal electrode 2 (FIG. 1)
The second ceramic green sheets 1b and 1c on which the electrode patterns 2a to be the electrodes and the electrode patterns 5a to be the dummy internal electrodes 5 are arranged (printed) are manufactured. The second ceramic green sheets 1b and 1c are different in the extraction direction of the electrode pattern 2a serving as an internal electrode. 2 and 3 (a) and 3 (b) are first and second ceramic green sheets provided with electrode patterns formed when the individual elements 3 are cut out, for easy understanding. 1a, 1
However, in practice, the first and second ceramic green sheets 1a, 1b, 1c are ceramic green sheets for a unit for forming a plurality of elements 3 at a time. An electrode pattern having a predetermined shape is arranged so that when the element 3 is cut out, an internal electrode and a dummy internal electrode having a predetermined pattern are formed in each element 3.
【００１８】なお、第１のセラミックグリーンシート１
ａのダミー内部電極５用の電極パターン５ａは、個々の
素子３を切り出したときに、両端側にコ字状のダミー内
部電極５が配設されるようなパターンに形成されてお
り、また、第２のセラミックグリーンシート１ｂ，１ｃ
のダミー内部電極５用の電極パターン５ａは、一端側が
コ字状に、他端側は、端部にまで引き出された内部電極
２用の電極パターン２ａを挟むように長方形の形状に構
成されている。The first ceramic green sheet 1
The electrode pattern 5a for the dummy internal electrode 5 of a is formed in a pattern in which the U-shaped dummy internal electrodes 5 are arranged on both end sides when the individual elements 3 are cut out. Second ceramic green sheets 1b, 1c
The electrode pattern 5a for the dummy internal electrode 5 is formed in a U-shape on one end side and has a rectangular shape on the other end side so as to sandwich the electrode pattern 2a for the internal electrode 2 extended to the end portion. There is.
【００１９】そして、外層６（図４）用に第１のセラミ
ックグリーンシート１ａ（図２）を所定の枚数積層す
る。それから、その上に、第２のセラミックグリーンシ
ート１ｂ（図３（ａ））、第２のセラミックグリーンシ
ート１ｃ（図３(ｂ)）、第２のセラミックグリーンシー
ト１ｂ、第２のセラミックグリーンシート１ｃの順で所
定の回数だけ繰り返して積層する。そして、さらにその
上に、外層６用に第１のセラミックグリーンシート１ａ
を所定枚数積層した後、これを圧着することにより積層
ブロックを形成し、これを所定の位置でカットして、個
々の積層体（未焼成の素子）３ａ（図４）を切り出す。
そして、この積層体３ａを、所定の条件で焼成すること
により、図４に示すような素子（積層セラミックコンデ
ンサ素子）３を得る。Then, a predetermined number of the first ceramic green sheets 1a (FIG. 2) are laminated for the outer layer 6 (FIG. 4). Then, a second ceramic green sheet 1b (FIG. 3 (a)), a second ceramic green sheet 1c (FIG. 3 (b)), a second ceramic green sheet 1b, and a second ceramic green sheet are formed on top of it. Lamination is repeated a predetermined number of times in the order of 1c. And on top of that, the first ceramic green sheet 1a for the outer layer 6 is formed.
After laminating a predetermined number of sheets, a pressure is applied to form a laminated block, which is cut at a predetermined position to cut out individual laminated bodies (unfired elements) 3a (FIG. 4).
Then, the laminated body 3a is fired under predetermined conditions to obtain an element (multilayer ceramic capacitor element) 3 as shown in FIG.
【００２０】その後、外部電極ペーストを素子３の両端
部に塗布、乾燥した後、焼き付けることにより、外部電
極４（図１）を形成することにより、図１に示すような
積層セラミックコンデンサを得る。なお、図１の積層体
３は、図４に示した積層体３を研磨して稜部をアール形
状としたものである。After that, the external electrode paste is applied to both ends of the element 3, dried, and baked to form the external electrodes 4 (FIG. 1), thereby obtaining a monolithic ceramic capacitor as shown in FIG. The laminated body 3 of FIG. 1 is obtained by polishing the laminated body 3 shown in FIG.
【００２１】この積層セラミックコンデンサにおいて
は、外部電極４が、セラミック１及び内部電極２の露出
部分と接合するとともに、ダミー内部電極５の露出部分
とも接合しており、ダミー内部電極５が外部電極４のア
ンカーとして機能するため、外部電極４の素子３への固
着力が確実に向上する。In this monolithic ceramic capacitor, the external electrode 4 is joined to the exposed portions of the ceramic 1 and the internal electrode 2 and also to the exposed portion of the dummy internal electrode 5, and the dummy internal electrode 5 is connected to the external electrode 4. Since it functions as an anchor of, the fixing force of the external electrode 4 to the element 3 is surely improved.
【００２２】［実施例１］第１及び第２のセラミックグ
リーンシートとして、焼成後の厚みが１９μmのセラミ
ックグリーンシートに所定の電極パターンを配設したも
のを用い、これらを積層、圧着し、カットして焼成した
後、外部電極を形成することにより、下記仕様の積層セ
ラミックコンデンサ（図５）を得た。なお、図５におい
て、図１と同一符号を付した部分は、図１と同一の部分
を示している。[Embodiment 1] As the first and second ceramic green sheets, a ceramic green sheet having a thickness of 19 μm after firing and provided with a predetermined electrode pattern was used, and these were laminated, pressure-bonded, and cut. After firing and firing, external electrodes were formed to obtain a monolithic ceramic capacitor (FIG. 5) having the following specifications. Note that, in FIG. 5, the portions denoted by the same reference numerals as those in FIG. 1 indicate the same portions as those in FIG.
【００２３】 素子厚（内部電極間のセラミック層の厚み）：３８μ
m 素子数（セラミック層とそれを挟んで対向する内部電
極により形成されるコンデンサ部の数（層数））：３７
枚 外層厚（上下両面側のセラミック層の厚み）：１９０
μm 完成寸法：５．７mm（Ｌ）×２．８mm（Ｗ）×２．０
mm（Ｔ） ダミー内部電極の幅Ａ（図２）：３００μmElement thickness (thickness of ceramic layer between internal electrodes): 38 μ
Number of m elements (number of capacitor parts (number of layers) formed by ceramic layers and internal electrodes facing each other with the ceramic layer sandwiched therebetween): 37
Outer layer thickness (thickness of upper and lower ceramic layers): 190
μm Finished size: 5.7mm (L) × 2.8mm (W) × 2.0
mm (T) Width A of dummy internal electrode (Fig. 2): 300 μm
【００２４】この積層セラミックコンデンサについて、
外部電極固着強度を評価するため、端子引張り試験を行
った。その結果、従来のダミー内部電極を設けていない
積層セラミックコンデンサの場合には端子引張り強度が
２２Ｎであるのに対して、上記実施例の積層セラミック
コンデンサの場合には２９Ｎと固着強度が約３０％向上
することが確認された。Regarding this multilayer ceramic capacitor,
A terminal tensile test was conducted to evaluate the external electrode fixing strength. As a result, the terminal tensile strength is 22 N in the case of the conventional monolithic ceramic capacitor having no dummy internal electrode, whereas it is 29 N and the fixing strength is approximately 30% in the case of the monolithic ceramic capacitor of the above embodiment. It was confirmed to improve.
【００２５】［実施例２］第１及び第２のセラミックグ
リーンシートとして、焼成後の厚みが１９μmのセラミ
ックグリーンシートに所定の電極パターンを配設したも
のを用い、これらを積層、圧着し、カットして焼成した
後、外部電極を形成することにより、下記仕様の積層セ
ラミックコンデンサ（図６）を得た。なお、図６におい
て、図１と同一符号を付した部分は、図１と同一の部分
を示している。[Embodiment 2] As the first and second ceramic green sheets, a ceramic green sheet having a thickness of 19 μm after firing and provided with a predetermined electrode pattern is used, and these are laminated, pressure-bonded, and cut. After firing and firing, an external electrode was formed to obtain a monolithic ceramic capacitor (FIG. 6) having the following specifications. Note that, in FIG. 6, the portions denoted by the same reference numerals as those in FIG. 1 indicate the same portions as those in FIG.
【００２６】この実施例２の積層セラミックコンデンサ
は、実施例１の積層セラミックコンデンサとチップサイ
ズを同一とし、高さ方向寸法と、幅方向寸法を置き換え
たものである。The monolithic ceramic capacitor of the second embodiment has the same chip size as the monolithic ceramic capacitor of the first embodiment except that the height and width dimensions are replaced.
【００２７】 素子厚（内部電極間のセラミック層の厚み）：３８μ
m 素子数（セラミック層とそれを挟んで対向する内部電
極により形成されるコンデンサ部の数（層数））：６３
枚 外層厚（上下両面側のセラミック層の厚み）：１９０
μm 完成寸法：５．７mm（Ｌ）×２．０mm（Ｗ）×２．８
mm（Ｔ） ダミー内部電極の幅：３００μmElement thickness (thickness of ceramic layer between internal electrodes): 38 μ
Number of m elements (number of capacitor parts (number of layers) formed by ceramic layers and internal electrodes facing each other with the ceramic layers sandwiched therebetween): 63
Outer layer thickness (thickness of upper and lower ceramic layers): 190
μm Finished dimensions: 5.7 mm (L) x 2.0 mm (W) x 2.8
mm (T) Width of dummy internal electrode: 300 μm
【００２８】この積層セラミックコンデンサについて、
基板実装状態での外部電極固着強度の評価方法である端
子固着力試験（せん断強度試験）を行った結果、ダミー
内部電極を設けていない従来の積層セラミックコンデン
サでは２００Ｎであるのに対して、上記実施例の積層セ
ラミックコンデンサの場合には、２４５Ｎと外部電極固
着強度が約２３％向上することが確認された。Regarding this multilayer ceramic capacitor,
As a result of a terminal fixing force test (shear strength test), which is an evaluation method of the external electrode fixing strength in a board mounted state, the result is 200 N in the conventional multilayer ceramic capacitor not provided with the dummy internal electrode, whereas In the case of the multilayer ceramic capacitor of the example, it was confirmed that the external electrode fixing strength was 245 N, which was improved by about 23%.
【００２９】なお、上記実施例では、積層セラミックコ
ンデンサを例にとって説明したが、本発明は積層セラミ
ックコンデンサに限られるものではなく、セラミック中
に内部電極が配設された素子に外部電極を形成してなる
積層ＬＣ複合部品などの種々のセラミック電子部品に適
用することが可能である。In the above embodiments, the monolithic ceramic capacitor has been described as an example, but the present invention is not limited to the monolithic ceramic capacitor, and external electrodes are formed on an element in which internal electrodes are provided in the ceramic. It can be applied to various ceramic electronic parts such as a laminated LC composite part.
【００３０】なお、本発明においては、ダミー内部電極
の積層数を多くするほど外部電極の固着強度を向上させ
ることが可能になるが、特に、外層部分のダミー層の積
層数を多くするほど外部電極の固着強度を向上させる効
果が大きくなる。In the present invention, as the number of stacked dummy internal electrodes is increased, the fixing strength of the external electrodes can be improved. In particular, as the number of stacked dummy layers in the outer layer is increased, The effect of improving the adhesion strength of the electrodes is increased.
【００３１】また、本発明は、上記実施例に限定される
ものではなく、内部電極やダミー内部電極の具体的なパ
ターンや構成材料、あるいはそれらの形成方法や積層
数、素子を構成するセラミックの種類などに関し、発明
の要旨の範囲内において、種々の応用、変形を加えるこ
とが可能である。Further, the present invention is not limited to the above-mentioned embodiments, but specific patterns and constituent materials of the internal electrodes and the dummy internal electrodes, their forming methods, the number of laminated layers, and the ceramic constituting the element. With respect to the type and the like, various applications and modifications can be made within the scope of the invention.
【００３２】[0032]
【発明の効果】上述のように、本発明のセラミック電子
部品は、セラミック中にダミー内部電極を配設し、その
一部を素子表面の外部電極が配設される位置に露出させ
ることにより、外部電極を、素子を構成するセラミック
及び内部電極の露出部分に接合させるとともに、ダミー
内部電極の露出部分にも接合させるようにしているの
で、従来のように、外部電極を、素子を構成するセラミ
ック及び内部電極にのみ接合させるようにしたセラミッ
ク電子部品に比べて、外部電極の素子への固着強度を大
幅に向上させることができる。As described above, in the ceramic electronic component of the present invention, the dummy internal electrode is provided in the ceramic, and a part of the dummy internal electrode is exposed at the position where the external electrode is provided on the element surface. Since the external electrodes are bonded to the exposed parts of the ceramic and the internal electrodes that form the device and also to the exposed parts of the dummy internal electrodes, the external electrodes are connected to the ceramic that forms the device as in the conventional case. Also, as compared with the ceramic electronic component that is bonded only to the internal electrode, the strength of fixing the external electrode to the element can be significantly improved.
【００３３】また、前記ダミー内部電極をセラミック中
に所定の間隔をおいて多数層配設し、その端部を素子表
面の外部電極が配設される位置に露出させ、外部電極を
セラミック及び内部電極の露出部分に接合させるととも
に、多数層のダミー内部電極の露出部分にも接合させる
ことにより、さらに外部電極の素子への固着強度を向上
させ、本発明をより実効あらしめることができる。A large number of dummy internal electrodes are arranged in the ceramic at predetermined intervals, and the ends of the dummy internal electrodes are exposed at the positions on the surface of the element where the external electrodes are arranged. By bonding to the exposed part of the electrode and also to the exposed part of the multiple layers of dummy internal electrodes, the fixing strength of the external electrode to the element can be further improved, and the present invention can be more effectively realized.
【００３４】また、前記ダミー内部電極を、前記素子の
内部電極が配設された層の上側及び下側の、内部電極が
配設されていない外層に主として配設することにより、
容易にダミー内部電極を備えた素子を形成することが可
能になり、効率よく素子への外部電極の固着強度を向上
させることができる。Further, by arranging the dummy internal electrodes mainly on the upper and lower sides of the layer on which the internal electrodes of the element are disposed, on the outer layers on which the internal electrodes are not disposed,
It is possible to easily form an element provided with a dummy internal electrode, and it is possible to efficiently improve the fixing strength of the external electrode to the element.
【図１】本発明の一実施形態にかかるセラミック電子部
品を示す断面図である。FIG. 1 is a sectional view showing a ceramic electronic component according to an embodiment of the present invention.
【図２】ダミー内部電極となる電極パターンが配設され
た第１のセラミックグリーンシートを示す平面図であ
る。FIG. 2 is a plan view showing a first ceramic green sheet provided with an electrode pattern to be a dummy internal electrode.
【図３】(ａ)，(ｂ)は内部電極となる電極パターン及び
ダミー内部電極となる電極パターンが配設された第２の
セラミックグリーンシートを示す平面図である。3A and 3B are plan views showing a second ceramic green sheet on which an electrode pattern to be an internal electrode and an electrode pattern to be a dummy internal electrode are arranged.
【図４】本発明のセラミック電子部品の製造工程におい
て形成された素子の構造を示す断面図である。FIG. 4 is a cross-sectional view showing the structure of an element formed in the manufacturing process of the ceramic electronic component of the present invention.
【図５】本発明の一実施例にかかるセラミック電子部品
の構造（内部電極の配設方向など）を模式的に示す斜視
図である。FIG. 5 is a perspective view schematically showing a structure of a ceramic electronic component according to an embodiment of the present invention (eg, the arrangement direction of internal electrodes).
【図６】本発明の他の実施例にかかるセラミック電子部
品の構造（内部電極の配設方向など）を模式的に示す斜
視図である。FIG. 6 is a perspective view schematically showing the structure of the ceramic electronic component according to another embodiment of the present invention (eg, the arrangement direction of internal electrodes).
【図７】従来のセラミック電子部品（積層セラミックコ
ンデンサ）を示す断面図である。FIG. 7 is a sectional view showing a conventional ceramic electronic component (multilayer ceramic capacitor).
１ セラミック １ａ 第１のセラミックグリーンシート １ｂ，１ｃ 第２のセラミックグリーンシート ２ 内部電極 ２ａ 内部電極用電極パターン ３ 素子（積層コンデンサ素子） ４ 外部電極 ５ ダミー内部電極 ５ａ ダミー内部電極用電極パターン ６ 外層 DESCRIPTION OF SYMBOLS 1 ceramic 1a 1st ceramic green sheet 1b, 1c 2nd ceramic green sheet 2 internal electrode 2a internal electrode electrode pattern 3 element (multilayer capacitor element) 4 external electrode 5 dummy internal electrode 5a dummy internal electrode electrode pattern 6 outer layer
Claims (3)
一部を表面に露出させた素子に、前記露出部分を介して
内部電極と接続する外部電極を配設してなるセラミック
電子部品であって、 セラミック中にダミー内部電極を配設し、その一部を素
子表面の外部電極が配設される位置に露出させることに
より、外部電極を、素子を構成するセラミック及び内部
電極の露出部分に接合させるとともに、ダミー内部電極
の露出部分にも接合させるようにしたことを特徴とする
セラミック電子部品。1. A ceramic electronic component in which an internal electrode is provided in a ceramic, and an external electrode connected to the internal electrode through the exposed portion is provided in an element whose part is exposed on the surface. By placing a dummy internal electrode in the ceramic and exposing a part of it at the position where the external electrode is provided on the surface of the element, the external electrode is exposed to the exposed part of the ceramic and the internal electrode that make up the element. A ceramic electronic component characterized by being bonded to the exposed part of the dummy internal electrode as well as being bonded to the.
定の間隔をおいて多数層配設し、かつ、各ダミー内部電
極の端部を素子表面の外部電極が配設される位置に露出
させたことを特徴とする請求項１記載のセラミック電子
部品。2. A plurality of layers of the dummy internal electrodes are arranged in a ceramic at a predetermined interval, and an end of each dummy internal electrode is exposed at a position on the element surface where the external electrode is provided. The ceramic electronic component according to claim 1, wherein:
電極が配設された層の上側及び下側の、内部電極が配設
されていない外層に主として配設されていることを特徴
とする請求項１又は２記載のセラミック電子部品。3. The dummy internal electrodes are mainly provided in outer layers, on which the internal electrodes are not provided, above and below the layer where the internal electrodes of the element are provided. The ceramic electronic component according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7306873A JPH09129476A (en) | 1995-10-30 | 1995-10-30 | Ceramic electronic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7306873A JPH09129476A (en) | 1995-10-30 | 1995-10-30 | Ceramic electronic part |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09129476A true JPH09129476A (en) | 1997-05-16 |
Family
ID=17962280
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7306873A Withdrawn JPH09129476A (en) | 1995-10-30 | 1995-10-30 | Ceramic electronic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09129476A (en) |
Cited By (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004040085A (en) * | 2002-04-15 | 2004-02-05 | Avx Corp | Component formation by plating technique |
| JP2004040084A (en) * | 2002-04-15 | 2004-02-05 | Avx Corp | Plated terminal |
| JP2004312023A (en) * | 2003-04-08 | 2004-11-04 | Avx Corp | Plated termination |
| JP2006060148A (en) * | 2004-08-23 | 2006-03-02 | Kyocera Corp | Ceramic electronic component and capacitor |
| JP2006060147A (en) * | 2004-08-23 | 2006-03-02 | Kyocera Corp | Ceramic electronic component and capacitor |
| JP2008091521A (en) * | 2006-09-29 | 2008-04-17 | Tdk Corp | Stacked capacitor and manufacturing method of stacked capacitor |
| JP2008091520A (en) * | 2006-09-29 | 2008-04-17 | Tdk Corp | Stacked capacitor |
| JP2009224802A (en) * | 2003-04-08 | 2009-10-01 | Avx Corp | Method for forming electroless plating termination |
| JP2010045372A (en) * | 2008-08-18 | 2010-02-25 | Avx Corp | Ultra broadband capacitor |
| US8064187B2 (en) | 2008-07-02 | 2011-11-22 | Murata Manufacturing Co., Ltd. | Monolithic ceramic electronic component |
| JP2012142596A (en) * | 2006-02-22 | 2012-07-26 | Vishay Sprague Inc | Improved high voltage capacitors |
| JP2012231078A (en) * | 2011-04-27 | 2012-11-22 | Kyocera Corp | Capacitor |
| JP2013084871A (en) * | 2011-10-12 | 2013-05-09 | Samsung Electro-Mechanics Co Ltd | Multilayered ceramic electronic component and fabrication method thereof |
| US20130341082A1 (en) * | 2012-06-22 | 2013-12-26 | Murata Manufacturing Co., Ltd. | Ceramic electronic component and ceramic electronic apparatus |
| US20150041197A1 (en) * | 2013-08-08 | 2015-02-12 | Samsung Electro-Mechanics Co., Ltd. | Embedded multilayer ceramic electronic component and printed circuit board having the same |
| JP2016021437A (en) * | 2014-07-11 | 2016-02-04 | 太陽誘電株式会社 | Multilayer capacitor and method for manufacturing the same |
| US20160111216A1 (en) * | 2014-10-15 | 2016-04-21 | Samsung Electro-Mechanics Co., Ltd. | Chip component |
| US20160118187A1 (en) * | 2014-10-22 | 2016-04-28 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic capacitor |
| US20160240317A1 (en) * | 2015-02-16 | 2016-08-18 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic electronic component |
| US9543076B2 (en) | 2012-12-31 | 2017-01-10 | Samsung Electro-Mechanics Co., Ltd. | Electronic component and method of manufacturing the same |
| JP2018056543A (en) * | 2016-09-29 | 2018-04-05 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | Multilayer capacitor and manufacturing method thereof |
| KR20180073083A (en) * | 2016-12-22 | 2018-07-02 | 삼성전기주식회사 | Capacitor Component |
| US10079103B2 (en) | 2015-10-30 | 2018-09-18 | Murata Manufacturing Co., Ltd. | Multilayer electronic component and manufacturing method therefor |
| JP2018198326A (en) * | 2018-08-21 | 2018-12-13 | 太陽誘電株式会社 | Multilayer capacitor |
| US20200043656A1 (en) * | 2018-08-02 | 2020-02-06 | Samsung Electro-Mechanics Co., Ltd. | Multilayer Capacitor |
| JP2021158258A (en) * | 2020-03-27 | 2021-10-07 | 株式会社村田製作所 | Multilayer ceramic electronic component |
-
1995
- 1995-10-30 JP JP7306873A patent/JPH09129476A/en not_active Withdrawn
Cited By (45)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004040084A (en) * | 2002-04-15 | 2004-02-05 | Avx Corp | Plated terminal |
| US9666366B2 (en) | 2002-04-15 | 2017-05-30 | Avx Corporation | Method of making multi-layer electronic components with plated terminations |
| US10020116B2 (en) | 2002-04-15 | 2018-07-10 | Avx Corporation | Plated terminations |
| US10366835B2 (en) | 2002-04-15 | 2019-07-30 | Avx Corporation | Plated terminations |
| JP2004040085A (en) * | 2002-04-15 | 2004-02-05 | Avx Corp | Component formation by plating technique |
| US11195659B2 (en) | 2002-04-15 | 2021-12-07 | Avx Corporation | Plated terminations |
| JP2004312023A (en) * | 2003-04-08 | 2004-11-04 | Avx Corp | Plated termination |
| JP2004327983A (en) * | 2003-04-08 | 2004-11-18 | Avx Corp | Plated termination |
| JP2009224802A (en) * | 2003-04-08 | 2009-10-01 | Avx Corp | Method for forming electroless plating termination |
| JP2006060148A (en) * | 2004-08-23 | 2006-03-02 | Kyocera Corp | Ceramic electronic component and capacitor |
| JP2006060147A (en) * | 2004-08-23 | 2006-03-02 | Kyocera Corp | Ceramic electronic component and capacitor |
| JP2012142596A (en) * | 2006-02-22 | 2012-07-26 | Vishay Sprague Inc | Improved high voltage capacitors |
| JP2008091521A (en) * | 2006-09-29 | 2008-04-17 | Tdk Corp | Stacked capacitor and manufacturing method of stacked capacitor |
| JP2008091520A (en) * | 2006-09-29 | 2008-04-17 | Tdk Corp | Stacked capacitor |
| KR101386541B1 (en) * | 2006-09-29 | 2014-04-17 | 티디케이가부시기가이샤 | Multilayer condenser, manufacturing method thereof |
| KR101401636B1 (en) * | 2006-09-29 | 2014-06-02 | 티디케이가부시기가이샤 | Multilayer condenser |
| US7551422B2 (en) | 2006-09-29 | 2009-06-23 | Tdk Corporation | Multilayer capacitor, manufacturing method thereof |
| US8064187B2 (en) | 2008-07-02 | 2011-11-22 | Murata Manufacturing Co., Ltd. | Monolithic ceramic electronic component |
| JP2010045372A (en) * | 2008-08-18 | 2010-02-25 | Avx Corp | Ultra broadband capacitor |
| JP2012231078A (en) * | 2011-04-27 | 2012-11-22 | Kyocera Corp | Capacitor |
| JP2013084871A (en) * | 2011-10-12 | 2013-05-09 | Samsung Electro-Mechanics Co Ltd | Multilayered ceramic electronic component and fabrication method thereof |
| JP2014027255A (en) * | 2012-06-22 | 2014-02-06 | Murata Mfg Co Ltd | Ceramic electronic component and ceramic electronic device |
| US20130341082A1 (en) * | 2012-06-22 | 2013-12-26 | Murata Manufacturing Co., Ltd. | Ceramic electronic component and ceramic electronic apparatus |
| US9646767B2 (en) * | 2012-06-22 | 2017-05-09 | Murata Manufacturing Co., Ltd. | Ceramic electronic component and ceramic electronic apparatus including a split inner electrode |
| US9543076B2 (en) | 2012-12-31 | 2017-01-10 | Samsung Electro-Mechanics Co., Ltd. | Electronic component and method of manufacturing the same |
| US20150041197A1 (en) * | 2013-08-08 | 2015-02-12 | Samsung Electro-Mechanics Co., Ltd. | Embedded multilayer ceramic electronic component and printed circuit board having the same |
| JP2016021437A (en) * | 2014-07-11 | 2016-02-04 | 太陽誘電株式会社 | Multilayer capacitor and method for manufacturing the same |
| KR20160044338A (en) * | 2014-10-15 | 2016-04-25 | 삼성전기주식회사 | Chip component |
| US9646768B2 (en) * | 2014-10-15 | 2017-05-09 | Samsung Electro-Mechanics Co., Ltd. | Chip component |
| US20160111216A1 (en) * | 2014-10-15 | 2016-04-21 | Samsung Electro-Mechanics Co., Ltd. | Chip component |
| US9627131B2 (en) * | 2014-10-22 | 2017-04-18 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic capacitor having an intermitting part |
| JP2016086150A (en) * | 2014-10-22 | 2016-05-19 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | Multilayer ceramic capacitor |
| KR20160047350A (en) * | 2014-10-22 | 2016-05-02 | 삼성전기주식회사 | Multi layer ceramic capacitor |
| US20160118187A1 (en) * | 2014-10-22 | 2016-04-28 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic capacitor |
| US20160240317A1 (en) * | 2015-02-16 | 2016-08-18 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic electronic component |
| US10079103B2 (en) | 2015-10-30 | 2018-09-18 | Murata Manufacturing Co., Ltd. | Multilayer electronic component and manufacturing method therefor |
| JP2018056543A (en) * | 2016-09-29 | 2018-04-05 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | Multilayer capacitor and manufacturing method thereof |
| US10304628B2 (en) | 2016-09-29 | 2019-05-28 | Samsung Electro-Mechanics Co., Ltd. | Multilayer capacitor and manufacturing method thereof |
| KR20180073083A (en) * | 2016-12-22 | 2018-07-02 | 삼성전기주식회사 | Capacitor Component |
| US10170246B2 (en) | 2016-12-22 | 2019-01-01 | Samsung Electro-Mechanics Co., Ltd. | Capacitor component with metallic protection pattern for improved mechanical strength and moisture proof reliability |
| US20200043656A1 (en) * | 2018-08-02 | 2020-02-06 | Samsung Electro-Mechanics Co., Ltd. | Multilayer Capacitor |
| US10984951B2 (en) * | 2018-08-02 | 2021-04-20 | Samsung Electro-Mechanics Co., Ltd. | Multilayer capacitor having dummy electrodes on corners of dielectric layers |
| JP2018198326A (en) * | 2018-08-21 | 2018-12-13 | 太陽誘電株式会社 | Multilayer capacitor |
| JP2021158258A (en) * | 2020-03-27 | 2021-10-07 | 株式会社村田製作所 | Multilayer ceramic electronic component |
| US11501920B2 (en) | 2020-03-27 | 2022-11-15 | Murata Manufacturing Co., Ltd. | Multilayer ceramic electronic component |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH09129476A (en) | Ceramic electronic part | |
| US20050067086A1 (en) | Method of producing multi-terminal type laminated ceramic electronic component | |
| US5614044A (en) | Method of manufacturing a laminated ceramic device | |
| JPH11340106A (en) | Laminated ceramic electronic parts and their sorting method | |
| JPH09260187A (en) | Manufacture of ceramic electronic part | |
| JP2857552B2 (en) | Multilayer electronic component and method of manufacturing the same | |
| JP2001076952A (en) | Laminated ceramic electronic component and manufacture thereof | |
| JPH0737757A (en) | Capacitor array | |
| JP2000277381A (en) | Multi-laminated ceramic capacitor | |
| JP2946261B2 (en) | Manufacturing method of laminated electronic components | |
| JP2993247B2 (en) | Manufacturing method of multilayer ceramic capacitor | |
| JP2002246752A (en) | Via hole structure of ceramic multilayer board | |
| JPS6210986Y2 (en) | ||
| JPH11214235A (en) | Laminated ceramic electronic component and their manufacture | |
| JP2002057036A (en) | Laminated composite electronic part and its manufacturing method | |
| JPH06252558A (en) | Multilayered glass ceramic cavity substrate | |
| WO2024075427A1 (en) | Multilayer ceramic capacitor | |
| JP2766085B2 (en) | Manufacturing method of laminate | |
| KR102665983B1 (en) | Multilayer Ceramic Electronic Component | |
| JPH03191596A (en) | Manufacture of multilayer ceramic board with built-in capacitor | |
| JPS62199075A (en) | Manufacture of laminated type piezoelectric element | |
| JPH0750462A (en) | Electronic circuit board | |
| JP4383141B2 (en) | Manufacturing method of multilayer ceramic parts | |
| JPH09134840A (en) | Laminated ceramic capacitor | |
| JPH0945830A (en) | Chip electronic component |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20030107 |