JPH0855723A - Laminated electronic parts - Google Patents
Laminated electronic partsInfo
- Publication number
- JPH0855723A JPH0855723A JP18811994A JP18811994A JPH0855723A JP H0855723 A JPH0855723 A JP H0855723A JP 18811994 A JP18811994 A JP 18811994A JP 18811994 A JP18811994 A JP 18811994A JP H0855723 A JPH0855723 A JP H0855723A
- Authority
- JP
- Japan
- Prior art keywords
- core
- substrate
- shaped portion
- plate
- insertion hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、１乃至複数のコイルを
内蔵した積層型電子部品に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated electronic component containing one to a plurality of coils.
【０００２】[0002]
【従来の技術】この種の積層型電子部品に係り、図１７
及び図１８にはその一例として閉磁路型の積層トランス
を示してある。この積層トランスは、２つのコイルを内
蔵した積層構造の基板１０１と、これに挿着される上・
下側コア１０２，１０３とから構成されている。2. Description of the Related Art FIG. 17 shows a laminated electronic component of this type.
Further, FIG. 18 shows a closed magnetic circuit type laminated transformer as an example thereof. This laminated transformer includes a substrate 101 having a laminated structure having two coils built therein and an upper substrate to be attached to the substrate 101.
It is composed of lower cores 102 and 103.
【０００３】基板１０１は非磁性体材料（絶縁体材料）
から直方体形状に形成され、長手方向一端面に１対の１
次側電極（図示省略）を、またこれと対向する端面に１
対の２次側電極（図示省略）を夫々有し、また上下に貫
通する断面円形のコア挿入孔１０１ａを基板長手方向に
間隔をおいて２個有している。更に、１次側電極にその
上下端を接続された１次コイル１０１ｂと２次側電極に
その上下端を接続された２次コイル１０１ｃとを各コア
挿入孔１０１ａの周囲に備えている。The substrate 101 is a non-magnetic material (insulator material)
Is formed into a rectangular parallelepiped shape and has a pair of 1s on one end face in the longitudinal direction.
A secondary electrode (not shown) is attached to the end face opposite to this electrode 1
Each has a pair of secondary side electrodes (not shown), and two core insertion holes 101a having a circular cross-section that penetrate vertically and are spaced apart in the substrate longitudinal direction. Further, a primary coil 101b whose upper and lower ends are connected to the primary side electrode and a secondary coil 101c whose upper and lower ends are connected to the secondary side electrode are provided around each core insertion hole 101a.
【０００４】下側コア１０２は磁性体材料から形成さ
れ、略矩形状の板状部１０２ａの上面両端に、上記コア
挿入孔１０１ａと同一の径及び長さの２つの棒状部１０
２ｂをコア挿入孔１０１ａと同一間隔で一体に備えてい
る。上側コア１０３は下側コア１０２と同一材料から下
側コア１０２の板状部１０２ａと同一形に形成されてい
る。The lower core 102 is made of a magnetic material, and has two rod-shaped portions 10 having the same diameter and length as the core insertion hole 101a at both ends of the upper surface of a substantially rectangular plate-shaped portion 102a.
2b is integrally provided with the core insertion hole 101a at the same interval. The upper core 103 is formed of the same material as the lower core 102 and has the same shape as the plate-shaped portion 102 a of the lower core 102.
【０００５】積層トランスを組み立てるには、まず基板
１０１の下方から下側コア１０２の各棒状部１０２ｂを
コア挿入孔１０１ａに挿入する。次いで、基板１０１の
上面に露出する各棒状部１０２ｂの上面に接着剤を塗布
し、この上に上側コア１０３を載置して両コア１０２，
１０３を接着剤を介して結合する。To assemble the laminated transformer, first, the rod-shaped portions 102b of the lower core 102 are inserted into the core insertion holes 101a from below the substrate 101. Next, an adhesive is applied to the upper surface of each rod-shaped portion 102b exposed on the upper surface of the substrate 101, the upper core 103 is placed on the adhesive, and both cores 102,
103 is bonded via an adhesive.
【０００６】[0006]
【発明が解決しようとする課題】上記従来の積層トラン
スは、基板１０１に挿着された下側コア１０２が該基板
１０１の下面から板状部１０２ａの厚み分だけ突出して
いるため、トランス自体の高さ寸法がその分高くなり、
これを配線基板等に搭載すると積層トランスが浮き上が
って実装高さの増加を招く問題点がある。また、実装時
に下側コアの突出部分が配線基板等に当接するため実装
が不安定になるると共に、突出部分が受ける外力によっ
てコアに位置ずれ等を生じる問題点がある。In the above conventional laminated transformer, the lower core 102 inserted into the substrate 101 protrudes from the lower surface of the substrate 101 by the thickness of the plate-shaped portion 102a, so that the transformer itself is The height dimension is correspondingly higher,
If this is mounted on a wiring board or the like, there is a problem that the laminated transformer is lifted and the mounting height is increased. In addition, there is a problem that the protruding portion of the lower core comes into contact with the wiring board or the like during mounting, which makes the mounting unstable and causes the core to be displaced due to an external force received by the protruding portion.
【０００７】本発明は上記問題点に鑑みてなされたもの
で、その目的とするところは、高さ寸法が小さく、しか
も実装性を向上させた積層トランス等の積層型電子部品
を提供することにある。The present invention has been made in view of the above problems, and an object thereof is to provide a laminated electronic component such as a laminated transformer having a small height and improved mountability. is there.
【０００８】[0008]
【課題を解決するための手段】上記目的を達成するた
め、請求項１の発明は、１乃至複数のコイルを内蔵しコ
イル軸芯部分にコア挿入孔を貫通形成された積層構造の
基板と、板状部にコア挿入孔数に対応する棒状部を突設
して形成されたコアとを具備し、コアの棒状部を基板の
コア挿入孔に挿着して構成された積層型電子部品におい
て、基板のコア挿入孔開口面にコアの板状部と同一形及
び厚みのコア収容溝を形成し、コア挿着時にコアの板状
部をコア挿入溝に収容させたことを特徴としている。In order to achieve the above-mentioned object, the invention of claim 1 is a substrate having a laminated structure in which one or a plurality of coils are built in and a core insertion hole is formed through the coil shaft core portion. A laminated electronic component comprising a core formed by projecting a rod-shaped portion corresponding to the number of core insertion holes in a plate-shaped portion, and inserting the rod-shaped portion of the core into the core insertion hole of the substrate. A core accommodating groove having the same shape and thickness as the plate-shaped portion of the core is formed on the opening surface of the core insertion hole of the substrate, and the plate-shaped portion of the core is accommodated in the core insertion groove when the core is inserted.
【０００９】請求項２の発明は、１乃至複数のコイルを
内蔵しコイル軸芯部分にコア挿入孔を貫通形成された積
層構造の基板と、板状部にコア挿入孔数に対応する棒状
部を突設して形成された下側コアと、板状の上側コアと
を具備し、下側コアの棒状部を基板のコア挿入孔に挿着
し該棒状部と上側コアを結合して構成された積層型電子
部品において、基板のコア挿入孔開口面に下側コアの板
状部と同一形及び厚みのコア収容溝を形成し、コア挿着
時に下側コアの板状部をコア挿入溝に収容させたことを
特徴としている。According to a second aspect of the present invention, there is provided a substrate having a laminated structure in which one or a plurality of coils are built in and a core insertion hole is formed through the coil shaft core portion, and a bar-shaped portion corresponding to the number of core insertion holes in the plate portion. And a plate-shaped upper core, the rod-shaped portion of the lower core is inserted into the core insertion hole of the substrate, and the rod-shaped portion and the upper core are connected to each other. In the laminated electronic component, a core accommodating groove with the same shape and thickness as the plate-shaped part of the lower core is formed on the opening surface of the core insertion hole of the board, and the plate-shaped part of the lower core is inserted when the core is inserted. It is characterized by being housed in a groove.
【００１０】請求項３の発明は、１乃至複数のコイルを
内蔵しコイル軸芯部分にコア挿入孔を貫通形成された積
層構造の基板と、板状部にコア挿入孔数に対応する棒状
部を突設して形成された下側コアと、板状の上側コアと
を具備し、下側コアの棒状部を基板のコア挿入孔に挿着
し該棒状部と上側コアを結合して構成された積層型電子
部品において、基板の一方のコア挿入孔開口面に下側コ
アの板状部と同一形及び厚みのコア収容溝を、また他方
のコア挿入孔開口面に上側コアと同一形及び厚みの第２
のコア収容溝を夫々形成し、コア挿着時に下側コアの板
状部と上側コアを各々に対応するコア挿入溝に収容させ
たことを特徴としている。According to a third aspect of the present invention, there is provided a substrate having a laminated structure in which one or a plurality of coils are built in and a core insertion hole is formed through the coil shaft core portion, and a bar-shaped portion corresponding to the number of core insertion holes in the plate portion. And a plate-shaped upper core, the rod-shaped portion of the lower core is inserted into the core insertion hole of the substrate, and the rod-shaped portion and the upper core are connected to each other. In the laminated electronic component, a core accommodating groove having the same shape and thickness as the plate portion of the lower core is formed on one opening surface of the core insertion hole of the substrate, and the same shape as the upper core is formed on the opening surface of the other core insertion hole. And the second of the thickness
Each of the core accommodation grooves is formed, and the plate-shaped portion of the lower core and the upper core are accommodated in the corresponding core insertion grooves when the core is inserted.
【００１１】請求項４の発明は、請求項２又は３記載の
積層型電子部品において、下側コアと上側コアとを凹凸
の嵌合構造をもって結合したことを特徴としている。According to a fourth aspect of the present invention, in the multilayer electronic component according to the second or third aspect, the lower core and the upper core are coupled with a concavo-convex fitting structure.
【００１２】[0012]
【作用】請求項１の発明では、コアの棒状部を基板のコ
ア挿入孔に挿入する際に、該コアの板状部をコア収容溝
に収容することで、基板のコア収容溝側の面とコアの板
状部とを面一にできる。According to the first aspect of the present invention, when the rod-shaped portion of the core is inserted into the core insertion hole of the substrate, the plate-shaped portion of the core is accommodated in the core accommodating groove. And the plate-shaped portion of the core can be flush with each other.
【００１３】請求項２の発明では、下側コアの棒状部を
基板のコア挿入孔に挿入する際に、該コアの板状部をコ
ア収容溝に収容することで、基板のコア収容溝側の面と
下側コアの板状部とを面一にできる。According to the second aspect of the present invention, when the rod-shaped portion of the lower core is inserted into the core insertion hole of the substrate, the plate-shaped portion of the core is accommodated in the core accommodating groove. And the plate-shaped portion of the lower core can be flush with each other.
【００１４】請求項３の発明では、下側コアの棒状部を
基板のコア挿入孔に挿入する際に、該コアの板状部をコ
ア収容溝に完全に収容し、また上側コアを第２の収容溝
に完全に収容することで、基板のコア収容溝側の面と下
側コアの板状部及び上側コアを面一にできる。According to the third aspect of the invention, when the rod-shaped portion of the lower core is inserted into the core insertion hole of the substrate, the plate-shaped portion of the core is completely accommodated in the core accommodating groove, and the upper core is the second core. By completely accommodating in the accommodating groove, the surface of the substrate on the core accommodating groove side can be flush with the plate-like portion of the lower core and the upper core.
【００１５】請求項４の発明では、上・下側コアの結合
を凹凸嵌合によって行うことができる。他の作用は請求
項２及び３と同様である。According to the fourth aspect of the present invention, the upper and lower cores can be joined together by concavo-convex fitting. Other functions are similar to those of claims 2 and 3.
【００１６】[0016]
【実施例】図１乃至図４は本発明を適用した閉磁路型の
積層トランスを示すもので、図１は分解斜視図、図２は
分解断面図、図３は組立断面図、図４は基板製造方法の
説明図である。1 to 4 show a closed magnetic circuit type laminated transformer to which the present invention is applied. FIG. 1 is an exploded perspective view, FIG. 2 is an exploded sectional view, FIG. 3 is an assembled sectional view, and FIG. It is explanatory drawing of a board | substrate manufacturing method.
【００１７】本実施例の積層トランスは、２つのコイル
を内蔵した積層構造の基板１と、これに挿着される上・
下側コア２，３とから構成されている。基板１は非磁性
体材料（絶縁体材料）から直方体形状に形成され、長手
方向一端面に１対の１次側電極１ａを、またこれと対向
する端面に１対の２次側電極１ｂを夫々有している。ま
た、上下に貫通する断面円形のコア挿入孔１ｃを基板長
手方向に間隔をおいて２個有し、両方のコア挿入孔１ｃ
の下端開口部をコア挿入孔１ｃの直径と同一幅をもって
基板長手方向に結ぶ所定深さのコア収容溝１ｄをその下
面に有している。更に、１次側電極１ａにその上下端を
接続された１次コイル１ｅと２次側電極１ｂにその上下
端を接続された２次コイル１ｆとを各コア挿入孔１ｃの
周囲に備えている。The laminated transformer of the present embodiment has a laminated structure substrate 1 having two coils built therein and an upper substrate to be attached thereto.
It is composed of lower cores 2 and 3. The substrate 1 is formed from a non-magnetic material (insulator material) into a rectangular parallelepiped shape, and has a pair of primary side electrodes 1a on one end face in the longitudinal direction and a pair of secondary side electrodes 1b on the end face opposite to this. Each has it. Further, two core insertion holes 1c having a circular cross section that penetrate vertically are provided at intervals in the substrate longitudinal direction, and both core insertion holes 1c are provided.
Has a core accommodating groove 1d of a predetermined depth connecting the lower end opening of the same in the longitudinal direction of the substrate with the same width as the diameter of the core insertion hole 1c. Furthermore, a primary coil 1e having upper and lower ends connected to the primary electrode 1a and a secondary coil 1f having upper and lower ends connected to the secondary electrode 1b are provided around each core insertion hole 1c. .
【００１８】ここで図４を参照して上記基板１の製造手
順について説明する。基板１の製造に際しては、まず上
層用シートＵと複数種のコイル層用シートＣ１〜Ｃｎと
下層用シートＤを夫々用意する。同図には一部品に対応
するものを示してあるが、実際の各シートは多数個取り
が可能な大きさを有しており、積層，圧着後に部品寸法
に切断される。Now, the procedure for manufacturing the substrate 1 will be described with reference to FIG. When manufacturing the substrate 1, first, an upper layer sheet U, a plurality of types of coil layer sheets C1 to Cn, and a lower layer sheet D are prepared. In the figure, one corresponding to one component is shown, but each actual sheet has a size capable of being taken in large numbers, and is cut to the component size after lamination and pressure bonding.
【００１９】上層用シートＵは、酸化チタン等のセラミ
ック粉末を主成分とする絶縁体グリーンシートｋ（以下
シート基材ｋという）に、コア挿入孔１ｃの一部となる
２つの円形孔ｈ１をレーザ光照射や金型打ち抜き等の方
法によって設け、１次・２次側電極１ａ，１ｂの一部と
なる導体層ｄをスクリーン印刷等の方法によってその上
面両端に設けることで形成されている。また、所定位置
の導体層ｄの下側部分には、該導体層ｄとこれと隣接す
るコイル用導体層ｃｄの端部との導通を図るマイクロビ
アｓが導体層形成前段階で設けられている。The upper layer sheet U has two circular holes h1 which are a part of the core insertion holes 1c in an insulator green sheet k (hereinafter referred to as a sheet base material k) containing ceramic powder such as titanium oxide as a main component. It is provided by a method such as laser light irradiation or die punching, and is formed by providing a conductor layer d, which is a part of the primary / secondary side electrodes 1a and 1b, at both ends of the upper surface by a method such as screen printing. In addition, a micro via s for electrically connecting the conductor layer d and an end of the coil conductor layer cd adjacent to the conductor layer d is provided in a lower portion of the conductor layer d at a predetermined position before the conductor layer is formed. There is.
【００２０】コイル層用シートＣ１〜Ｃｎは、上記同様
のシート基材ｋに、コア挿入孔１ｃの一部となる２つの
円形孔ｈ１をレーザ光照射や金型打ち抜き等の方法によ
って設け、１次・２次コイル１ｅ，１ｆの一部となるコ
字形或いはＬ字形のコイル用導体層ｃｄをスクリーン印
刷等の方法によってその上面に設けることで形成されて
いる。また、各導体層ｃｄの端部の下側部分には、該導
体層ｃｄと下側のコイル用導体層ｃｄとの導通を図るマ
イクロビアｓが導体層形成前段階で設けられている。In the coil layer sheets C1 to Cn, two circular holes h1 to be a part of the core insertion hole 1c are provided in a sheet base material k similar to the above by a method such as laser light irradiation or die punching. It is formed by providing a U-shaped or L-shaped coil conductor layer cd, which is a part of the secondary / secondary coils 1e and 1f, on the upper surface thereof by a method such as screen printing. In addition, micro vias s for establishing electrical continuity between the conductor layer cd and the lower coil conductor layer cd are provided in the lower portion of the end of each conductor layer cd before the conductor layer is formed.
【００２１】下層用シートＤは、上記同様のシート基材
ｋに、コア収容溝１ｄの一部となる縦長孔ｈ２をレーザ
光照射や金型打ち抜き等の方法によって設け、これをコ
ア収容溝１ｄの厚み分だけ複数枚積み重ねることで形成
されている。この下層用シートｄには、１次・２次側電
極１ａ，１ｂの一部となる導体層（図示省略）がスクリ
ーン印刷等の方法によってその下面両端に設けられてお
り、また所定位置の導体層の上側部分には該導体層とこ
れと隣接するコイル用導体層ｃｄの端部との導通を図る
マイクロビアｓが導体層形成前段階で設けられている。In the lower layer sheet D, a vertically elongated hole h2 which is a part of the core accommodating groove 1d is provided in the same sheet base material k as described above by a method such as laser light irradiation or die punching, and the core accommodating groove 1d is formed. It is formed by stacking multiple sheets by the thickness of. The lower layer sheet d is provided with conductor layers (not shown), which are parts of the primary and secondary electrodes 1a and 1b, on both ends of the lower surface by a method such as screen printing, and conductors at predetermined positions. Micro vias s are provided in the upper part of the layer to establish electrical connection between the conductor layer and the end of the coil conductor layer cd adjacent to the conductor layer before the formation of the conductor layer.
【００２２】次いで、用意された上記各シートＵ，Ｃ１
〜Ｃｎ及びＤを図４に示す順番で積層，圧着し、これを
導体層ｃ，ｃｄに含まれる金属成分に応じた温度で焼成
する。これによりシートを介して隣接するコイル用導体
層ｃｄがマイクロビアｓを通じてコイル状に接続され、
上下端のコイル用導体層ｃｄの端部が上下の導体層ｄに
夫々接続される。最後に、積層チップの端面に上下の導
体層ｄを結ぶように導電ペーストを塗布しこれを焼き付
ける。以上で基板１の製造が完了するが、コア挿入孔１
ｃ及びコア収容溝１ｄは焼成後にレーザ光照射等の方法
によって一括で形成することも可能である。Next, each of the prepared sheets U and C1
Cn and D are laminated and pressure-bonded in the order shown in FIG. 4, and this is fired at a temperature according to the metal components contained in the conductor layers c and cd. As a result, the adjacent coil conductor layers cd via the sheet are connected in a coil shape through the microvias s,
The ends of the upper and lower coil conductor layers cd are connected to the upper and lower conductor layers d, respectively. Finally, a conductive paste is applied to the end face of the laminated chip so as to connect the upper and lower conductor layers d, and this is baked. Although the manufacturing of the substrate 1 is completed as described above, the core insertion hole 1
It is also possible to collectively form c and the core accommodating groove 1d by a method such as laser light irradiation after firing.
【００２３】下側コア２は磁性体材料から形成され、上
記コア収容溝１ｄと同一の厚み及び形状（両端にコア挿
入孔１ｃと同一の曲率を有しコア挿入孔１ｃの直径と同
一幅を有する形状）を有する板状部２ａの上面両端に、
上記コア挿入孔１ｃと同一の径及び長さ（基板１の厚み
からコア収容溝１ｄの厚みを引いた寸法）の２つの棒状
部２ｂをコア挿入孔１ａと同一間隔で一体に備えてい
る。上側コア３は下側コア２と同一材料から下側コア２
の板状部２ａと同一形（コア収容溝１ｄと同一形）に形
成されている。ちなみに上・下側コア２，３の形成材料
としてはＮｉ−Ｚｎ，Ｍｎ−Ｚｎ，Ｍｇ−Ｍｎフェライ
トが用いられる。The lower core 2 is made of a magnetic material and has the same thickness and shape as the core accommodating groove 1d (having the same curvature as the core insertion hole 1c at both ends and the same width as the diameter of the core insertion hole 1c). On both ends of the upper surface of the plate-shaped portion 2a having
Two rod-shaped portions 2b having the same diameter and length as the core insertion hole 1c (the thickness of the substrate 1 minus the thickness of the core accommodating groove 1d) are integrally provided at the same intervals as the core insertion hole 1a. The upper core 3 is made of the same material as the lower core 2
Is formed in the same shape as the plate-shaped portion 2a (the same shape as the core accommodating groove 1d). By the way, Ni-Zn, Mn-Zn, and Mg-Mn ferrites are used as materials for forming the upper and lower cores 2 and 3.
【００２４】積層トランスを組み立てるには、まず基板
１の下方から下側コア２の各棒状部２ｂをコア挿入孔１
ｃに挿入し、続いて板状部２ａをコア収容溝１ｄに挿入
する。下側コア２の板状部２ａ及び棒状部２ｂの寸法が
コア挿入孔１ｃ及びコア収容溝１ｄに夫々合致している
ので、下側コア２の各棒状部２ｂの上面は基板１の上面
と面一に、また板状部２ａの下面は基板１の下面と面一
になる。次いで、基板１の上面に露出する各棒状部２ｂ
の上面に接着剤、好ましくは磁性体分を混入した接着剤
を塗布し、この上に上側コア３を載置して両コア２，３
を接着剤を介して結合する。コア結合の方法は上記の
他、コア挿入孔１ｃ及びコア収容溝１ｄの少なくとも一
方の内面に接着剤を塗布してから下側コア２を挿着した
後、基板１の上面に露出する各棒状部２ｂの上面に直接
上側コア３を載置して接触させ、該上側コア３を基板１
とを接着する方法等が採用できる。組立後の積層トラン
スは、１次側，２次側電極１ａ，１ｂを夫々半田付けさ
れて配線基板等に搭載される。In order to assemble the laminated transformer, first, the rod-shaped portions 2b of the lower core 2 are inserted into the core insertion hole 1 from below the substrate 1.
Then, the plate portion 2a is inserted into the core accommodating groove 1d. Since the dimensions of the plate-shaped portion 2a and the rod-shaped portion 2b of the lower core 2 match the core insertion hole 1c and the core accommodating groove 1d, the upper surface of each rod-shaped portion 2b of the lower core 2 corresponds to the upper surface of the substrate 1. The lower surface of the plate-shaped portion 2a is flush with the lower surface of the substrate 1. Next, each rod-shaped portion 2b exposed on the upper surface of the substrate 1
An adhesive agent, preferably an adhesive agent containing a magnetic substance, is applied to the upper surface of each core, and the upper core 3 is placed on the upper surface of both cores 2, 3
Are bonded via an adhesive. In addition to the methods described above, the cores may be joined to each other by applying an adhesive to the inner surface of at least one of the core insertion hole 1c and the core accommodating groove 1d and then inserting the lower core 2 into each rod-shaped member exposed on the upper surface of the substrate 1. The upper core 3 is placed directly on the upper surface of the portion 2b and brought into contact therewith, and the upper core 3 is attached to the substrate 1
A method of bonding and can be adopted. The assembled laminated transformer is mounted on a wiring board or the like by soldering the primary side and secondary side electrodes 1a and 1b, respectively.
【００２５】本実施例の積層トランスでは、基材１自体
が絶縁体材料から形成されているため、上・下側コア
２，３によって図３に実線矢印で示すような磁路が形成
され、両コイル１ｅ，１ｆで生じた磁束はその全てが上
・下側コア２，３を通ることになり、磁束漏れを原因と
した結合係数の低下を防止することができる。また、基
板１に挿着された下側コア２の板状部２ａの下面が基板
１の下面と面一になることから、コア挿着によって部品
自体の高さ寸法が増すようなことがなく、また段差のな
いフラットな面を利用した面実装が可能となって実装が
容易且つに安定に行えると共に、下側コア２への外力付
加を防止してその位置ずれ等を解消することができる。In the laminated transformer of this embodiment, since the base material 1 itself is made of an insulating material, the upper and lower cores 2 and 3 form a magnetic path shown by a solid arrow in FIG. All of the magnetic fluxes generated in the coils 1e and 1f pass through the upper and lower cores 2 and 3, so that the reduction of the coupling coefficient due to the magnetic flux leakage can be prevented. Further, since the lower surface of the plate-shaped portion 2a of the lower core 2 inserted into the board 1 is flush with the lower surface of the board 1, the core insertion does not increase the height of the component itself. In addition, surface mounting using a flat surface without steps is possible, and mounting can be performed easily and stably, and external force applied to the lower core 2 can be prevented to eliminate the positional deviation and the like. .
【００２６】図５及び図６は本発明を適用した閉磁路型
の積層トランスの他の例を示すもので、図５は分解断面
図、図６は組立断面図である。5 and 6 show another example of a closed magnetic circuit type laminated transformer to which the present invention is applied. FIG. 5 is an exploded sectional view and FIG. 6 is an assembled sectional view.
【００２７】本実施例の積層トランスは、前実施例の積
層トランスの基板１に両方のコア挿入孔１ｃの上端開口
部をコア挿入孔１ｃの直径と同一幅を持って基板長手方
向に結ぶ所定深さのコア収容溝１ｇを設け、該コア収容
溝１ｇの厚み分だけ下側コア２の棒状部２ｂの長さを短
くしたものであり、他の構成は同様であるための同一符
号を用いその説明を省略する。In the laminated transformer of this embodiment, the upper end openings of both core insertion holes 1c are connected to the substrate 1 of the laminated transformer of the previous embodiment in the longitudinal direction of the substrate with the same width as the diameter of the core insertion hole 1c. A core accommodating groove 1g having a depth is provided, and the length of the rod-like portion 2b of the lower core 2 is shortened by the thickness of the core accommodating groove 1g. The description is omitted.
【００２８】上記基板１の製造に際しては、まず上層用
シートと複数種のコイル層用シートと下層用シートを夫
々用意する。ここで用意するコイル層用シートと下層用
シートは前実施例の積層トランスと同じであるが、上層
用シートとしては下層用シートと同様のもの、即ちシー
ト基材にコア収容溝１ｇの一部となる縦長孔をレーザ光
照射や金型打ち抜き等の方法によって設け、これをコア
収容溝１ｇの厚み分だけ複数枚積み重ねたものを用意す
る。上層用シートには、１次・２次側電極１ａ，１ｂの
一部となる導体層がスクリーン印刷等の方法によってそ
の上面両端に設けられ、また所定位置の導体層の下側部
分には該導体層とこれと隣接するコイル用導体層ｃｄの
端部との導通を図るマイクロビアｓが導体層形成前段階
で設けられる。In manufacturing the substrate 1, first, an upper layer sheet, a plurality of types of coil layer sheets, and a lower layer sheet are prepared. The coil layer sheet and the lower layer sheet prepared here are the same as the laminated transformer of the previous embodiment, but the upper layer sheet is the same as the lower layer sheet, that is, a part of the core accommodating groove 1g in the sheet base material. A vertical hole to be formed is provided by a method such as laser light irradiation or die punching, and a plurality of these are stacked by the thickness of the core accommodating groove 1g. The upper layer sheet is provided with conductor layers, which are a part of the primary and secondary electrodes 1a and 1b, on both ends of the upper surface thereof by a method such as screen printing, and the conductor layer at a predetermined position is below the conductor layer. Micro vias s for establishing electrical continuity between the conductor layer and the end of the coil conductor layer cd adjacent thereto are provided in the stage before the conductor layer is formed.
【００２９】積層トランスを組み立てるには、まず基板
１の下方から下側コア２の各棒状部２ｂをコア挿入孔１
ｃに挿入し、続いて板状部２ａをコア収容溝１ｄに挿入
する。下側コア２の板状部２ａ及び棒状部２ｂの寸法が
コア挿入孔１ｃ及びコア収容溝１ｄに夫々合致している
ので、下側コア２の各棒状部２ｂの上面はコア収容溝１
ｇの底面と面一に、また板状部２ａの下面は基板１の下
面と面一になる。次いで、コア収容溝１ｇの底面に露出
する各棒状部２ｂの上面に接着剤、好ましくは磁性体分
を混入した接着剤を塗布し、コア収容溝１ａに上側コア
３を挿入し両コア２，３を接着剤を介して結合する。上
側コア３の寸法がコア収容溝１ｇに合致しているので、
上側コア３の上面も基板１の上面と面一となる。コア結
合の方法は上記の他、コア挿入孔１ｃ及びコア収容溝１
ｄの少なくとも一方の内面に接着剤を塗布してから下側
コア２を挿着した後、コア収容溝１ｇに上側コア３を挿
入して下側コア２の各棒状部２ｂに接触させ、該上側コ
ア３を基板１と接着する方法等が採用できる。組立後の
積層トランスは、１次側，２次側電極１ａ，１ｂを夫々
半田付けされ配線基板１上に搭載される。In order to assemble the laminated transformer, first, the rod-shaped portions 2b of the lower core 2 are inserted into the core insertion hole 1 from below the substrate 1.
Then, the plate portion 2a is inserted into the core accommodating groove 1d. Since the dimensions of the plate-shaped portion 2a and the rod-shaped portion 2b of the lower core 2 match the core insertion hole 1c and the core accommodating groove 1d, respectively, the upper surface of each rod-shaped portion 2b of the lower core 2 has the core accommodating groove 1c.
The bottom surface of g is flush with the bottom surface of the plate-shaped portion 2a, and the bottom surface of the plate-shaped portion 2a is flush with the bottom surface of the substrate 1. Next, an adhesive, preferably an adhesive containing a magnetic substance, is applied to the upper surface of each rod-shaped portion 2b exposed on the bottom surface of the core accommodating groove 1g, and the upper core 3 is inserted into the core accommodating groove 1a so that both cores 2, 3 are bonded via an adhesive. Since the size of the upper core 3 matches the core receiving groove 1g,
The upper surface of the upper core 3 is also flush with the upper surface of the substrate 1. In addition to the above-mentioned methods of core coupling, the core insertion hole 1c and the core housing groove 1
After applying the adhesive to at least one inner surface of d, the lower core 2 is inserted and inserted, the upper core 3 is inserted into the core accommodating groove 1g and brought into contact with each rod-shaped portion 2b of the lower core 2. A method of adhering the upper core 3 to the substrate 1 or the like can be adopted. The laminated transformer after assembly is mounted on the wiring board 1 by soldering the primary side and secondary side electrodes 1a and 1b, respectively.
【００３０】本実施例の積層トランスでは、基板１に挿
着された上側コア３の上面も基板１の上面と面一になる
ことから、前実施例のものに比べて部品高さ寸法をより
低減させて低背実装に貢献できる。他の効果は前実施例
と同様である。In the laminated transformer of the present embodiment, the upper surface of the upper core 3 inserted into the substrate 1 is also flush with the upper surface of the substrate 1. It can be reduced to contribute to low profile mounting. Other effects are similar to those of the previous embodiment.
【００３１】図７乃至図１１には先に述べた上・下側コ
アの変形例を幾つか示してある。図７に示したものは、
下側コア１１の棒状部１１ｂを断面矩形状にし、これに
合わせて下側コア１１の板状部１１ａの端部形状と上側
コア１２の端部形状を夫々角形にしたものである。同図
の上・下側コア１１，１２を用いる場合、基板には棒状
部１１ｂに合致した断面形状のコア挿入孔を形成する。7 to 11 show some modifications of the above-described upper and lower cores. The one shown in FIG. 7 is
The rod-shaped portion 11b of the lower core 11 has a rectangular cross-section, and the end portions of the plate-shaped portion 11a of the lower core 11 and the end portion of the upper core 12 are each shaped into a rectangular shape. When using the upper and lower cores 11 and 12 in the same figure, a core insertion hole having a cross-sectional shape that matches the rod-shaped portion 11b is formed in the substrate.
【００３２】図８に示したものは、下側コア１３の板状
部１３ａと棒状部１３ｂを別体に形成して結合したもの
である。また、各棒状部１３ｂを半円と矩形を組み合わ
せた形状にしてある。同図の上・下側コア１３，１４を
用いる場合、基板には棒状部１３ｂに合致した断面形状
のコア挿入孔を形成する。In FIG. 8, the plate-like portion 13a and the rod-like portion 13b of the lower core 13 are separately formed and joined together. Further, each rod-shaped portion 13b has a shape in which a semicircle and a rectangle are combined. When using the upper and lower cores 13 and 14 in the figure, a core insertion hole having a cross-sectional shape that matches the rod portion 13b is formed in the substrate.
【００３３】図９に示したものは、下側コア１５の各棒
状部１５ｂ上面に所定深さの嵌合孔１５ｃを夫々形成
し、嵌合孔１５ｃに対向する上側コア１６の下面部分に
該嵌合孔１５ｃに嵌合する所定長さの嵌合突起１６ａを
形成してある。同図の上・下側コア１５，１６では、嵌
合孔１５ｃと嵌合突起１６ａとの嵌合部分に接着剤を塗
布するだけでコア相互の結合が可能であり、面接着に比
べて高い結合力を確保できる。In the structure shown in FIG. 9, a fitting hole 15c having a predetermined depth is formed on the upper surface of each bar 15b of the lower core 15, and the lower surface of the upper core 16 facing the fitting hole 15c is formed. A fitting protrusion 16a having a predetermined length that fits in the fitting hole 15c is formed. In the upper and lower cores 15 and 16 of the same figure, the cores can be connected to each other only by applying an adhesive to the fitting portion between the fitting hole 15c and the fitting protrusion 16a, which is higher than surface bonding. The binding strength can be secured.
【００３４】図１０に示したものは、図９における嵌合
突起と嵌合孔との位置関係を逆転したもので、下側コア
１７の各棒状部１７ｂ上面に所定長さの嵌合突起１７ｃ
を夫々形成し、嵌合突起１７ｃに対向する上側コア１８
部分に該嵌合突起１７ｃが嵌合する嵌合孔１８ａを形成
してある。同図の上・下側コア１７，１８でも、図９に
示したものと同様に、嵌合突起１７ｃと嵌合孔１８ａと
の嵌合部分に接着剤を塗布するだけでコア相互の結合が
可能であり、面接着に比べて高い結合力を確保できる。In FIG. 10, the positional relationship between the fitting projections and the fitting holes in FIG. 9 is reversed, and the fitting projections 17c having a predetermined length are formed on the upper surfaces of the rod portions 17b of the lower core 17.
And the upper core 18 facing the fitting protrusion 17c.
A fitting hole 18a into which the fitting protrusion 17c is fitted is formed in the portion. In the upper and lower cores 17 and 18 of the same figure, as in the case shown in FIG. 9, the cores can be connected to each other only by applying an adhesive to the fitting portion between the fitting protrusion 17c and the fitting hole 18a. It is possible and can secure higher bonding strength than surface bonding.
【００３５】図１１（Ａ），（Ｂ）に示したものは、下
側コア１９の各棒状部１９ｂに該棒状部１９ｂ及び板状
部１９ａを貫通する２段径の嵌合孔１９ｃを形成し、嵌
合孔１９ｃに対向する上側コア２０の下面部分に該嵌合
孔１９ｃの小径部分に嵌合する嵌合突起２０ａを形成し
てある。同図の上・下側コア１９，２０では、嵌合突起
２０ａを嵌合孔１９ｃに嵌合した後、該嵌合孔１９ｃの
大径部分にゴム，プラスチック等から成る係止リングＲ
を嵌め込んでこれを嵌合突起２０ａの下端に嵌着するこ
とによりコア相互の結合が可能であり、接着剤が不要で
あることからコア相互の結合作業、即ち組立作業が簡略
化できる。In the structure shown in FIGS. 11 (A) and 11 (B), each rod-shaped portion 19b of the lower core 19 is formed with a two-step diameter fitting hole 19c penetrating the rod-shaped portion 19b and the plate-shaped portion 19a. The lower surface of the upper core 20 facing the fitting hole 19c is provided with a fitting projection 20a that fits into the small diameter portion of the fitting hole 19c. In the upper and lower cores 19 and 20 of the same drawing, after the fitting protrusion 20a is fitted into the fitting hole 19c, a locking ring R made of rubber, plastic or the like is provided on the large diameter portion of the fitting hole 19c.
The cores can be connected to each other by fitting and fitting them to the lower ends of the fitting protrusions 20a. Since no adhesive is required, the work of connecting the cores, that is, the assembling work can be simplified.
【００３６】図１２及び図１３は本発明を適用した開磁
路型の積層トランスを示すもので、図１２は分解斜視
図、図１３は分解断面図である。12 and 13 show an open magnetic circuit type laminated transformer to which the present invention is applied. FIG. 12 is an exploded perspective view and FIG. 13 is an exploded sectional view.
【００３７】本実施例の積層トランスは、２つのコイル
を内蔵した積層構造の基板２１と、これに挿着される上
・下側コア２２，２３とから構成されている。基板１は
非磁性体材料（絶縁体材料）から直方体形状に形成さ
れ、長手方向一端面に１対の１次側電極２１ａを、また
これと対向する端面に１対の２次側電極２１ｂを夫々有
している。また、上下に貫通する断面円形のコア挿入孔
２１ｃを中央に１個有し、下側コア２２の板状部２２ａ
を収容する矩形状のコア収容溝２１ｄをその下面中央に
コア挿入孔２１ｃの下端開口部と重なるように有してい
る。更に、１次側電極２１ａにその上下端を接続された
１次コイル２１ｅと２次側電極２１ｂにその上下端を接
続された２次コイル２１ｆとを、互いが非接触状態で交
錯するようコア挿入孔２１ｃの周囲に備えている。The laminated transformer of this embodiment comprises a substrate 21 having a laminated structure containing two coils, and upper and lower cores 22 and 23 inserted and attached thereto. The substrate 1 is formed of a non-magnetic material (insulator material) into a rectangular parallelepiped shape, and has a pair of primary side electrodes 21a on one end face in the longitudinal direction and a pair of secondary side electrodes 21b on the end face opposite to this. Each has it. Further, there is one core insertion hole 21c having a circular cross-section that penetrates vertically, and the plate-shaped portion 22a of the lower core 22 has
A rectangular core accommodation groove 21d for accommodating the core is formed at the center of the lower surface thereof so as to overlap the lower end opening of the core insertion hole 21c. Further, the primary coil 21e whose upper and lower ends are connected to the primary side electrode 21a and the secondary coil 21f whose upper and lower ends are connected to the secondary side electrode 21b are cores so as to intersect with each other in a non-contact state. It is provided around the insertion hole 21c.
【００３８】上記基板２１の製造に際しては、閉磁路型
の積層トランスと同様、まず上層用シートと複数種のコ
イル層用シートと下層用シートを夫々用意する。When manufacturing the substrate 21, as in the closed magnetic circuit type laminated transformer, first, an upper layer sheet, a plurality of types of coil layer sheets, and a lower layer sheet are prepared.
【００３９】上層用シートは、酸化チタン等のセラミッ
ク粉末を主成分とする絶縁体グリーンシート（以下シー
ト基材という）に、コア挿入孔２１ｃの一部となる円形
孔をレーザ光照射や金型打ち抜き等の方法によって設
け、１次・２次側電極２１ａ，２１ｂの一部となる導体
層をスクリーン印刷等の方法によってその上面両端に設
けることで形成されている。また、所定位置の導体層の
下側部分には、該導体層とこれと隣接するコイル用導体
層の端部との導通を図るマイクロビアが導体層形成前段
階で設けられている。As the upper layer sheet, an insulating green sheet containing ceramic powder such as titanium oxide as a main component (hereinafter referred to as a sheet base material) is provided with a circular hole as a part of the core insertion hole 21c by laser light irradiation or a die. It is formed by a method such as punching, and is formed by providing a conductor layer that is a part of the primary / secondary side electrodes 21a and 21b on both ends of the upper surface by a method such as screen printing. In addition, a micro via for establishing electrical connection between the conductor layer and an end of the coil conductor layer adjacent to the conductor layer is provided in a lower portion of the conductor layer at a predetermined position before the conductor layer is formed.
【００４０】コイル層用シートは、上記同様のシート基
材に、コア挿入孔２１ｃの一部となる円形孔をレーザ光
照射や金型打ち抜き等の方法によって設け、１次・２次
コイル２１ｅ，２１ｆの一部となるコ字形或いはＬ字形
のコイル用導体層をスクリーン印刷等の方法によってそ
の上面に設けることで形成されている。また、各導体層
の端部の下側部分には、該導体層と下側のコイル用導体
層との導通を図るマイクロビアが導体層形成前段階で設
けられている。In the coil layer sheet, a circular hole which is a part of the core insertion hole 21c is provided in the same sheet base material as described above by a method such as laser light irradiation or die punching, and the primary and secondary coils 21e, It is formed by providing a U-shaped or L-shaped coil conductor layer that is a part of 21f on the upper surface by a method such as screen printing. In addition, a micro via for establishing electrical connection between the conductor layer and the lower coil conductor layer is provided in the lower portion of the end portion of each conductor layer before the conductor layer is formed.
【００４１】下層用シートは、上記同様のシート基材
に、コア収容溝２１ｄの一部となる矩形孔をレーザ光照
射や金型打ち抜き等の方法によって設け、これをコア収
容溝２１ｄの厚み分だけ複数枚積み重ねることで形成さ
れている。この下層用シートには、１次・２次側電極２
１ａ，２１ｂの一部となる導体層（図示省略）がスクリ
ーン印刷等の方法によってその下面両端に設けられてお
り、また所定位置の導体層の上側部分には該導体層とこ
れと隣接するコイル用導体層の端部との導通を図るマイ
クロビアが導体層形成前段階で設けられている。The lower layer sheet is provided with a rectangular hole, which is a part of the core accommodating groove 21d, in the same sheet base material as described above by a method such as laser light irradiation or die punching, and this is formed by the thickness of the core accommodating groove 21d. It is formed by only stacking multiple sheets. This lower layer sheet has primary and secondary side electrodes 2
Conductor layers (not shown) to be a part of 1a, 21b are provided on both ends of the lower surface by a method such as screen printing, and the conductor layer and a coil adjacent to the conductor layer are provided on the upper side of the conductor layer at a predetermined position. Micro vias for establishing electrical connection with the end of the conductor layer are provided before the conductor layer is formed.
【００４２】次いで、用意された上記各シートを図４と
同様の順番で積層，圧着し、これを導体層に含まれる金
属成分に応じた温度で焼成する。これによりシートを介
して隣接するコイル用導体層がマイクロビアを通じてコ
イル状に接続され、上下端のコイル用導体層の端部が上
下の導体層に夫々接続される。最後に、積層チップの端
面に上下の導体層を結ぶように導電ペーストを塗布しこ
れを焼き付ける。以上で基板２１の製造が完了するが、
コア挿入孔２１ｃ及びコア収容溝２１ｄは焼成後にレー
ザ光照射等の方法によって一括で形成することも可能で
ある。Next, the prepared sheets are laminated and pressure-bonded in the same order as in FIG. 4, and the sheets are fired at a temperature according to the metal component contained in the conductor layer. As a result, the conductor layers for coils adjacent to each other via the sheet are connected in a coil shape through the microvias, and the ends of the coil conductor layers at the upper and lower ends are connected to the upper and lower conductor layers, respectively. Finally, a conductive paste is applied to the end face of the laminated chip so as to connect the upper and lower conductor layers, and this is baked. With the above, the manufacturing of the substrate 21 is completed,
The core insertion hole 21c and the core accommodating groove 21d can be collectively formed by a method such as laser light irradiation after firing.
【００４３】下側コア２２は磁性体材料から形成され、
上記コア収容溝２１ｄと同一の厚み及び形状を有する板
状部２２ａの上面中央に、上記コア挿入孔２１ｃと同一
の径及び長さ（基板２１の厚みからコア収容溝２１ｄの
厚みを引いた寸法）の２つの棒状部２２ｂをコア挿入孔
２１ｃと同一間隔で一体に備えている。上側コア２３は
下側コア２２と同一材料から下側コア２２の板状部２２
ａと同一形（コア収容溝２１ｄと同一形）に形成されて
いる。ちなみに上・下側コア２２，２３の形成材料とし
てはＮｉ−Ｚｎ，Ｍｎ−Ｚｎ，Ｍｇ−Ｍｎフェライトが
用いられる。The lower core 22 is made of a magnetic material,
At the center of the upper surface of the plate-like portion 22a having the same thickness and shape as the core receiving groove 21d, the same diameter and length as the core inserting hole 21c (the thickness of the substrate 21 minus the thickness of the core receiving groove 21d) ) Two rod-shaped portions 22b are integrally provided at the same intervals as the core insertion hole 21c. The upper core 23 is made of the same material as that of the lower core 22, and the plate-shaped portion 22
It is formed in the same shape as a (the same shape as the core housing groove 21d). By the way, Ni-Zn, Mn-Zn, and Mg-Mn ferrites are used as the material for forming the upper and lower cores 22 and 23.
【００４４】積層トランスを組み立てるには、まず基板
２１の下方から下側コア２２の棒状部２２ｂをコア挿入
孔２１ｃに挿入し、続いて板状部２２ａをコア収容溝２
１ｄに挿入する。下側コア２２の板状部２２ａ及び棒状
部２２ｂの寸法がコア挿入孔２１ｃ及びコア収容溝２１
ｄに夫々合致しているので、下側コア２２の棒状部２２
ｂの上面は基板２１の上面と面一に、また板状部２２ａ
の下面は基板２１の下面と面一になる。次いで、基板２
１の上面に露出する棒状部２２ｂの上面に接着剤、好ま
しくは磁性体分を混入した接着剤を塗布し、この上に上
側コア２３を載置して両コア２２，２３を接着剤を介し
て結合する。コア結合の方法は上記の他、コア挿入孔２
１ｃ及びコア収容溝２１ｄの少なくとも一方の内面に接
着剤を塗布してから下側コア２２を挿着した後、基板２
１の上面に露出する棒状部２２ｂの上面に直接上側コア
２３を載置して接触させ、該上側コア２３を基板２１と
を接着する方法等が採用できる。組立後の積層トランス
は、１次側，２次側電極２１ａ，２１ｂを夫々半田付け
されて配線基板等に搭載される。To assemble the laminated transformer, first, the rod-shaped portion 22b of the lower core 22 is inserted into the core insertion hole 21c from below the substrate 21, and then the plate-shaped portion 22a is inserted into the core accommodating groove 2.
Insert into 1d. The dimensions of the plate-shaped portion 22a and the rod-shaped portion 22b of the lower core 22 are determined by the core insertion hole 21c and the core accommodating groove 21.
Since they respectively match d, the rod-shaped portion 22 of the lower core 22
The upper surface of b is flush with the upper surface of the substrate 21, and the plate-shaped portion 22a
The lower surface of the substrate is flush with the lower surface of the substrate 21. Then the substrate 2
An adhesive, preferably an adhesive mixed with a magnetic substance, is applied to the upper surface of the rod-shaped portion 22b exposed on the upper surface of 1, and the upper core 23 is placed on this, and both cores 22 and 23 are interposed with the adhesive. Join together. In addition to the above, the method of core coupling is the core insertion hole 2
1c and an inner surface of at least one of the core accommodating grooves 21d are coated with an adhesive and then the lower core 22 is inserted, and then the substrate 2
It is possible to adopt a method in which the upper core 23 is directly placed on and brought into contact with the upper surface of the rod-shaped portion 22b exposed on the upper surface of the substrate 1, and the upper core 23 is bonded to the substrate 21. The assembled laminated transformer is mounted on a wiring board or the like by soldering the primary side and secondary side electrodes 21a and 21b, respectively.
【００４５】本実施例の積層トランスでも、基板２１に
挿着された下側コア２２の板状部２２ａの下面が基板２
１の下面と面一になることから、コア挿着によって部品
自体の高さ寸法が増すようなことがなく、段差のないフ
ラットな面を利用した面実装が可能となって実装が安定
すると共に、下側コア２への外力付加を防止して位置ず
れ等を解消することができる。また、図５及び図６に示
した積層トランスと同様に、基板２１の上面に上側コア
２３を収容するコア収容溝を形成すれば、部品高さ寸法
をより低減させて低背実装に貢献できる。更に、本実施
例の積層トランスの上・下側コアには閉磁路型の積層ト
ランスと同様種々形状のものが採用でき、特に図９乃至
図１１に示した嵌合構造を採用すればコア相互に高い結
合力を確保でき、また接着剤が不要となる。Also in the laminated transformer of this embodiment, the lower surface of the plate-like portion 22a of the lower core 22 inserted into the substrate 21 is the substrate 2
Since the surface is flush with the lower surface of 1, the height of the component itself does not increase due to the core insertion, and surface mounting using a flat surface without steps is possible and the mounting is stable. Thus, it is possible to prevent an external force from being applied to the lower core 2 and eliminate misalignment or the like. Further, similarly to the laminated transformer shown in FIGS. 5 and 6, by forming a core accommodating groove for accommodating the upper core 23 on the upper surface of the substrate 21, it is possible to further reduce the component height dimension and contribute to low profile mounting. . Further, the upper and lower cores of the laminated transformer of this embodiment may have various shapes similar to those of the closed magnetic circuit type laminated transformer. Especially, if the fitting structure shown in FIGS. High bonding strength can be secured and no adhesive is required.
【００４６】図１４及び図１５は本発明を適用した開磁
路型の積層トランスの他の例を示すもので、図１３は分
解斜視図、図１４は組立斜視図である。14 and 15 show another example of the open magnetic circuit type laminated transformer to which the present invention is applied. FIG. 13 is an exploded perspective view and FIG. 14 is an assembled perspective view.
【００４７】本実施例の積層トランスは、２つのコイル
を内蔵した積層構造の基板３１と、これに挿着される上
・下側コア３２，３３とから構成されている。基板３１
は非磁性体材料（絶縁体材料）から直方体形状に形成さ
れ、長手方向一端面に１対の１次側電極３１ａを、また
これと対向する端面に１対の２次側電極３１ｂを夫々有
している。また、上下に貫通する断面円形のコア挿入孔
３１ｃを中央に１個有し、下側コア３２の板状部３２ａ
を収容する矩形状のコア収容溝３１ｄをその下面幅方向
にコア挿入孔３１ｃの下端開口部と重なるように有して
いる。更に、１次側電極３１ａにその上下端を接続され
た１次コイル（図示省略）と２次側電極３１ｂにその上
下端を接続された２次コイル（図示省略）とを、前実施
例の積層コンデンサと同様に互いが非接触状態で交錯す
るようコア挿入孔３１ｃの周囲に備えている。The laminated transformer of this embodiment comprises a substrate 31 having a laminated structure having two coils built therein, and upper and lower cores 32 and 33 inserted and attached thereto. Board 31
Is formed in a rectangular parallelepiped shape from a non-magnetic material (insulator material), and has a pair of primary side electrodes 31a on one end face in the longitudinal direction and a pair of secondary side electrodes 31b on the end face opposite to this. are doing. Further, there is one core insertion hole 31c having a circular cross-section that penetrates vertically, and a plate-shaped portion 32a of the lower core 32.
A rectangular core accommodating groove 31d for accommodating the above is formed so as to overlap the lower end opening of the core insertion hole 31c in the lower surface width direction. Further, a primary coil (not shown) whose upper and lower ends are connected to the primary side electrode 31a and a secondary coil (not shown) whose upper and lower ends are connected to the secondary side electrode 31b are provided in the previous embodiment. Like the multilayer capacitor, it is provided around the core insertion hole 31c so as to intersect with each other in a non-contact state.
【００４８】上記基板３１の製造に際しては、前実施例
の積層トランスと同様、まず上層用シートと複数種のコ
イル層用シートと下層用シートを夫々用意する。When manufacturing the substrate 31, first, as in the laminated transformer of the previous embodiment, an upper layer sheet, a plurality of types of coil layer sheets, and a lower layer sheet are prepared.
【００４９】上層用シートは、酸化チタン等のセラミッ
ク粉末を主成分とする絶縁体グリーンシート（以下シー
ト基材という）に、コア挿入孔３１ｃの一部となる円形
孔をレーザ光照射や金型打ち抜き等の方法によって設
け、１次・２次側電極３１ａ，３１ｂの一部となる導体
層をスクリーン印刷等の方法によってその上面両端に設
けることで形成されている。また、所定位置の導体層の
下側部分には、該導体層とこれと隣接するコイル用導体
層の端部との導通を図るマイクロビアが導体層形成前段
階で設けられている。As the upper layer sheet, an insulating green sheet containing ceramic powder such as titanium oxide as a main component (hereinafter referred to as a sheet base material) is provided with a circular hole as a part of the core insertion hole 31c by laser light irradiation or a mold. It is formed by punching or the like, and is formed by providing a conductor layer that is a part of the primary / secondary side electrodes 31a and 31b on both ends of the upper surface by a method such as screen printing. In addition, a micro via for establishing electrical connection between the conductor layer and an end of the coil conductor layer adjacent to the conductor layer is provided in a lower portion of the conductor layer at a predetermined position before the conductor layer is formed.
【００５０】コイル層用シートは、上記同様のシート基
材に、コア挿入孔３１ｃの一部となる円形孔をレーザ光
照射や金型打ち抜き等の方法によって設け、１次・２次
コイルの一部となるコ字形或いはＬ字形のコイル用導体
層をスクリーン印刷等の方法によってその上面に設ける
ことで形成されている。また、各導体層の端部の下側部
分には、該導体層と下側のコイル用導体層との導通を図
るマイクロビアが導体層形成前段階で設けられている。In the coil layer sheet, a circular hole which is a part of the core insertion hole 31c is provided in a sheet base material similar to the above by a method such as laser light irradiation or die punching, and one of the primary and secondary coils is formed. It is formed by providing a U-shaped or L-shaped coil conductor layer as a portion on the upper surface thereof by a method such as screen printing. In addition, a micro via for establishing electrical connection between the conductor layer and the lower coil conductor layer is provided in the lower portion of the end portion of each conductor layer before the conductor layer is formed.
【００５１】下層用シートは、上記同様のシート基材
に、コア収容溝３１ｄの一部となる横長の矩形孔をレー
ザ光照射や金型打ち抜き等の方法によって設け、これを
コア収容溝３１ｄの厚み分だけ複数枚積み重ねることで
形成されている。この下層用シートには、１次・２次側
電極３１ａ，３１ｂの一部となる導体層（図示省略）が
スクリーン印刷等の方法によってその下面両端に設けら
れており、また所定位置の導体層の上側部分には該導体
層とこれと隣接するコイル用導体層の端部との導通を図
るマイクロビアが導体層形成前段階で設けられている。In the lower layer sheet, a sheet base material similar to the above is provided with a horizontally long rectangular hole which is a part of the core accommodating groove 31d by a method such as laser light irradiation or die punching, and the core accommodating groove 31d is formed. It is formed by stacking multiple sheets by the thickness. The lower layer sheet is provided with conductor layers (not shown) that are parts of the primary / secondary electrodes 31a and 31b on both ends of the lower surface by a method such as screen printing, and the conductor layers at predetermined positions. A micro via for establishing electrical continuity between the conductor layer and the end of the coil conductor layer adjacent to the conductor layer is provided in the upper part of the element before the formation of the conductor layer.
【００５２】次いで、用意された上記各シートを図４と
同様の順番で積層，圧着し、これを導体層に含まれる金
属成分に応じた温度で焼成する。これによりシートを介
して隣接するコイル用導体層がマイクロビアを通じてコ
イル状に接続され、上下端のコイル用導体層の端部が上
下の導体層に夫々接続される。最後に、積層チップの端
面に上下の導体層を結ぶように導電ペーストを塗布しこ
れを焼き付ける。以上で基板３１の製造が完了するが、
コア挿入孔３１ｃ及びコア収容溝３１ｄは焼成後に一括
で形成することも可能である。Next, the prepared sheets are laminated and pressure-bonded in the same order as in FIG. 4, and the sheets are fired at a temperature according to the metal component contained in the conductor layer. As a result, the conductor layers for coils adjacent to each other via the sheet are connected in a coil shape through the microvias, and the ends of the coil conductor layers at the upper and lower ends are connected to the upper and lower conductor layers, respectively. Finally, a conductive paste is applied to the end face of the laminated chip so as to connect the upper and lower conductor layers, and this is baked. With the above, the manufacturing of the substrate 31 is completed,
The core insertion hole 31c and the core accommodating groove 31d can be collectively formed after firing.
【００５３】下側コア３２は磁性体材料から形成され、
上記コア収容溝３１ｄと同一の厚み及び形状を有する板
状部３２ａの上面中央に、上記コア挿入孔３１ｃと同一
の径及び長さ（基板３１の厚みからコア収容溝３１ｄの
厚みを引いた寸法）の２つの棒状部３２ｂをコア挿入孔
３１ｃと同一間隔で一体に備えると共に、板状部３２a
の両端に該板状部３２aと同一幅で且つ棒状部３２ｂと
同一高さの囲み片３２ｃを基板３１の幅間隔で一体に備
えている。上側コア３３は下側コア３２と同一材料から
下側コア３２の板状部３２ａと同一幅で且つそれよりも
僅かに長い矩形状に形成されている。ちなみに上・下側
コア３２，３３の形成材料としてはＮｉ−Ｚｎ，Ｍｎ−
Ｚｎ，Ｍｇ−Ｍｎフェライトが用いられている。The lower core 32 is made of a magnetic material,
At the center of the upper surface of the plate-shaped portion 32a having the same thickness and shape as the core receiving groove 31d, the same diameter and length as the core inserting hole 31c (the thickness of the substrate 31 minus the thickness of the core receiving groove 31d) Two rod-shaped parts 32b are integrally provided at the same intervals as the core insertion hole 31c, and the plate-shaped part 32a
Enclosing pieces 32c having the same width as the plate-shaped portion 32a and the same height as the rod-shaped portion 32b are integrally provided at both ends of the substrate 31 at a width interval of the substrate 31. The upper core 33 is made of the same material as the lower core 32 and is formed in a rectangular shape having the same width as the plate-shaped portion 32a of the lower core 32 and slightly longer than that. By the way, as a material for forming the upper and lower cores 32, 33, Ni-Zn, Mn-
Zn, Mg-Mn ferrite is used.
【００５４】積層トランスを組み立てるには、まず基板
３１の下方から下側コア３２の棒状部３２ｂをコア挿入
孔３１ｃに挿入し、両囲み片３２ｃを基板３１の側面に
沿わせながら続いて板状部２２ａをコア収容溝３１ｄに
挿入する。下側コア３２の板状部３２ａ及び棒状部３２
ｂの寸法がコア挿入孔３１ｃ及びコア収容溝３１ｄに夫
々合致しているので、下側コア３２の棒状部３２ｂの上
面は基板３１の上面と面一に、また板状部３２ａの下面
は基板３１の下面と面一になる。次いで、基板３１の上
面に露出する棒状部３２ｂの上面に接着剤、好ましくは
磁性体分を混入した接着剤を塗布し、この上に上側コア
３３を載置して両コア３２，３３を接着剤を介して結合
する。コア結合の方法は上記の他、コア挿入孔３１ｃ及
びコア収容溝３１ｄの少なくとも一方の内面に接着剤を
塗布してから下側コア３２を挿着した後、基板３１の上
面に露出する棒状部３２ｂの上面に直接上側コア３３を
載置して接触させ、該上側コア３３を基板３１とを接着
する方法等が採用できる。組立後の積層トランスは、１
次側，２次側電極３１ａ，３１ｂを夫々半田付けされて
配線基板等に搭載される。In order to assemble the laminated transformer, first, the bar-shaped portion 32b of the lower core 32 is inserted into the core insertion hole 31c from below the substrate 31, and the surrounding pieces 32c are placed along the side surface of the substrate 31 to form a plate-like shape. The portion 22a is inserted into the core housing groove 31d. The plate-shaped portion 32a and the rod-shaped portion 32 of the lower core 32
Since the dimensions of b match the core insertion hole 31c and the core accommodating groove 31d, the upper surface of the rod-shaped portion 32b of the lower core 32 is flush with the upper surface of the substrate 31, and the lower surface of the plate-shaped portion 32a is the substrate. It is flush with the lower surface of 31. Next, an adhesive, preferably an adhesive mixed with a magnetic substance, is applied to the upper surface of the rod-shaped portion 32b exposed on the upper surface of the substrate 31, and the upper core 33 is placed on this to bond the two cores 32, 33 together. Bind through the agent. In addition to the above, the core coupling method is a bar-shaped portion exposed on the upper surface of the substrate 31 after the adhesive is applied to the inner surface of at least one of the core insertion hole 31c and the core accommodating groove 31d and then the lower core 32 is inserted and attached. It is possible to adopt a method in which the upper core 33 is directly placed on and brought into contact with the upper surface of 32b, and the upper core 33 is bonded to the substrate 31. The laminated transformer after assembly is 1
The secondary and secondary electrodes 31a and 31b are soldered and mounted on a wiring board or the like.
【００５５】本実施例の積層トランスでも、基板３１に
挿着された下側コア３２の板状部３２ａの下面が基板３
１の下面と面一になることから、コア挿着によって部品
自体の高さ寸法が増すようなことがなく、段差のないフ
ラットな面を利用した面実装が可能となって実装が容易
且つ安定に行えると共に、下側コア３２への外力付加を
防止してその位置ずれ等を解消することができる。ま
た、図５及び図６に示した積層トランスと同様に、基板
３１の上面に上側コア３３を収容するコア収容溝を形成
すれば、部品高さ寸法をより低減させて低背実装に貢献
できる。更に、本実施例の積層トランスの上・下側コア
には閉磁路型の積層トランスと同様種々形状のものが採
用でき、特に図９乃至図１１に示した嵌合構造を採用す
ればコア相互に高い結合力を確保でき、また接着剤が不
要となる。Also in the laminated transformer of this embodiment, the lower surface of the plate-shaped portion 32a of the lower core 32 inserted into the substrate 31 is the substrate 3
Since it is flush with the lower surface of 1, the height dimension of the component itself does not increase due to the core insertion, and surface mounting using a flat surface without steps is possible and mounting is easy and stable. In addition to the above, it is possible to prevent the external force from being applied to the lower core 32 and to eliminate the positional deviation. Further, similarly to the laminated transformer shown in FIGS. 5 and 6, if the core accommodating groove for accommodating the upper core 33 is formed on the upper surface of the substrate 31, the height dimension of the component can be further reduced to contribute to low-profile mounting. . Further, the upper and lower cores of the laminated transformer of this embodiment may have various shapes similar to those of the closed magnetic circuit type laminated transformer. Especially, if the fitting structure shown in FIGS. High bonding strength can be secured and no adhesive is required.
【００５６】図１６には本発明を適用した積層回路基板
（ハイブリッドＩＣ）の外観斜視図を示してある。この
積層回路基板４１は上面に電子部品を搭載され、図１乃
至図４に示した積層トランスと同構造のトランス部４１
ａをその一部に有している。この積層回路基板４１では
基板全体を非磁性体材料から形成することができ、先に
述べた積層トランスと同様に段差のないフラットな面を
利用した面実装が可能となる。また、図５及び図６に示
した積層トランスと同様に、基板４１の上面に上側コア
３を収容するコア収容溝を形成すれば、基板高さ寸法を
より低減させて低背実装に貢献できる。FIG. 16 is an external perspective view of a laminated circuit board (hybrid IC) to which the present invention is applied. An electronic component is mounted on the upper surface of the laminated circuit board 41, and a transformer section 41 having the same structure as the laminated transformer shown in FIGS. 1 to 4 is formed.
It has a as a part thereof. In this laminated circuit board 41, the entire board can be formed of a non-magnetic material, and surface mounting using a flat surface without steps is possible like the laminated transformer described above. Further, similarly to the laminated transformer shown in FIGS. 5 and 6, by forming a core accommodating groove for accommodating the upper core 3 on the upper surface of the substrate 41, it is possible to further reduce the height of the substrate and contribute to low-profile mounting. .
【００５７】以上、本発明を閉磁路型及び開磁路型の積
層トランスとトランス内蔵の多層回路基板に適用した例
を示したが、本発明は上記以外の積層型電子部品、即ち
単一コイルを内蔵した積層インダクタや、コイルとコン
デンサ等を一体化した積層複合部品等に幅広く適用で
き、同様の効果を発揮することができる。The example of applying the present invention to the closed magnetic circuit type and open magnetic circuit type multi-layer transformers and the multi-layer circuit board with a built-in transformer has been described above. However, the present invention is a multi-layer electronic component other than the above, that is, a single coil. It can be widely applied to a laminated inductor having a built-in capacitor, a laminated composite component in which a coil and a capacitor are integrated, and the like effect can be exhibited.
【００５８】[0058]
【発明の効果】請求項１の発明によれば、コア挿着状態
で基板のコア収容溝側の面とコアの板状部とが面一にな
ることから、コア挿着によって部品自体の高さ寸法が増
すようなことがなく、段差のないフラットな面を利用し
た面実装が可能となって実装が容易且つ安定に行えると
共に、コアへの外力付加を防止してその位置ずれ等を解
消することができる。According to the first aspect of the present invention, since the surface of the substrate on the core accommodating groove side and the plate-shaped portion of the core are flush with each other when the core is inserted, the height of the component itself is increased by the core insertion. The surface size does not increase, and surface mounting using a flat surface without steps is possible and mounting is easy and stable, and external force is not applied to the core to eliminate its misalignment. can do.
【００５９】請求項２の発明によれば、コア挿着状態で
基板のコア収容溝側の面と下側コアの板状部とが面一に
なることから、コア挿着によって部品自体の高さ寸法が
増すようなことがなく、段差のないフラットな面を利用
した面実装が可能となって実装が容易且つ安定に行える
と共に、下側コアへの外力付加を防止してその位置ずれ
等を解消することができる。According to the second aspect of the present invention, since the surface of the board on the core accommodating groove side and the plate portion of the lower core are flush with each other when the core is inserted, the height of the component itself is increased by inserting the core. The surface dimensions do not increase, and surface mounting using a flat surface without steps is possible, so that mounting is easy and stable, and external force is not applied to the lower core to prevent misalignment. Can be resolved.
【００６０】請求項３の発明によれば、コア挿着状態で
基板のコア収容溝側の面と下側コアの板状部及び上側コ
アとが面一になることから、コア挿着によって部品自体
の高さ寸法が増すようなことがなく、段差のないフラッ
トな面を利用した面実装が可能となって実装が容易且つ
安定に行えると共に、上・下側コアへの外力付加を防止
してその位置ずれ等を解消することができる。また、請
求項２の発明に比べて部品高さ寸法をより低減させて低
背実装に大きく貢献できる。。According to the third aspect of the invention, since the surface of the substrate on the core accommodating groove side and the plate-like portion of the lower core and the upper core are flush with each other in the core-inserted state, the component is inserted by core insertion. The height of itself does not increase, and surface mounting using a flat surface without steps is possible, making mounting easy and stable, and preventing external force from being applied to the upper and lower cores. It is possible to eliminate the positional deviation and the like. Further, compared with the invention of claim 2, the height dimension of the component can be further reduced, which can greatly contribute to low-profile mounting. .
【００６１】請求項４の発明によれば、上・下側コアの
結合を凹凸嵌合によって行うことにより、コア相互に高
い結合力を確保できる。According to the fourth aspect of the present invention, the upper and lower cores are coupled by the concave and convex fitting, so that a high coupling force can be secured between the cores.
【図１】本発明を適用した閉磁路型の積層トランスの分
解斜視図FIG. 1 is an exploded perspective view of a closed magnetic circuit type laminated transformer to which the present invention is applied.
【図２】同積層トランスの分解断面図FIG. 2 is an exploded sectional view of the same laminated transformer.
【図３】同積層トランスの組立断面図FIG. 3 is an assembled sectional view of the same laminated transformer.
【図４】同積層トランスにおける基板製造方法の説明図FIG. 4 is an explanatory diagram of a board manufacturing method in the same laminated transformer.
【図５】本発明を適用した閉磁路型の積層トランスの分
解断面図FIG. 5 is an exploded sectional view of a closed magnetic circuit type laminated transformer to which the present invention is applied.
【図６】同積層トランスの組立断面図FIG. 6 is an assembled sectional view of the same laminated transformer.
【図７】上・下側コアの変形例を示す斜視図FIG. 7 is a perspective view showing a modified example of the upper and lower cores.
【図８】上・下側コアの変形例を示す斜視図FIG. 8 is a perspective view showing a modified example of the upper and lower cores.
【図９】上・下側コアの変形例を示す斜視図FIG. 9 is a perspective view showing a modified example of the upper and lower cores.
【図１０】上・下側コアの変形例を示す斜視図FIG. 10 is a perspective view showing a modified example of the upper and lower cores.
【図１１】上・下側コアの変形例を示す断面図FIG. 11 is a sectional view showing a modified example of the upper and lower cores.
【図１２】本発明を適用した開磁路型の積層トランスの
分解斜視図FIG. 12 is an exploded perspective view of an open magnetic circuit type laminated transformer to which the present invention is applied.
【図１３】同積層トランスの分解断面図FIG. 13 is an exploded sectional view of the same laminated transformer.
【図１４】本発明を適用した開磁路型の積層トランスの
分解斜視図FIG. 14 is an exploded perspective view of an open magnetic circuit type laminated transformer to which the present invention is applied.
【図１５】同積層トランスの組立斜視図FIG. 15 is an assembled perspective view of the same laminated transformer.
【図１６】本発明を適用した積層回路基板の外観斜視図FIG. 16 is an external perspective view of a laminated circuit board to which the present invention has been applied.
【図１７】従来例を示す積層トランスの分解断面図FIG. 17 is an exploded sectional view of a conventional laminated transformer.
【図１８】同積層トランスの組立断面図FIG. 18 is an assembled sectional view of the same laminated transformer.
１…基板、１ｃ…コア挿入孔、１ｄ，１ｇ…コア収容
溝、２…下側コア、２ａ…板状部、２ｂ…棒状部、３…
上側コア、１１…下側コア、１１ａ…板状部、１１ｂ…
棒状部、１２…上側コア、１３…下側コア、１３ａ…板
状部、１３ｂ…棒状部、１４…上側コア、１５…下側コ
ア、１５ａ…板状部、１５ｂ…棒状部、１５ｃ…嵌合
孔、１６…上側コア、１６ａ…嵌合突起、１７…下側コ
ア、１７ａ…板状部、１７ｂ…棒状部、１７ｃ…嵌合突
起、１８…上側コア、１８ａ…嵌合孔、１９…下側コ
ア、１９ａ…板状部、１９ｂ…棒状部、１９ｃ…嵌合
孔、２０…上側コア、２０ａ…嵌合突起、２１…基板、
２１ｃ…コア挿入孔、２１ｄ…コア収容溝、２２…下側
コア、２２ａ…板状部、２２ｂ…棒状部、２３…上側コ
ア、３１…基板、３１ｃ…コア挿入孔、３１ｄ…コア収
容溝、３２…下側コア、３２ａ…板状部、３２ｂ…棒状
部、４１…積層回路基板、４１ａ…トランス部。DESCRIPTION OF SYMBOLS 1 ... Substrate, 1c ... Core insertion hole, 1d, 1g ... Core accommodation groove, 2 ... Lower core, 2a ... Plate-shaped part, 2b ... Rod-shaped part, 3 ...
Upper core, 11 ... Lower core, 11a ... Plate portion, 11b ...
Rod-shaped portion, 12 ... Upper core, 13 ... Lower core, 13a ... Plate-shaped portion, 13b ... Rod-shaped portion, 14 ... Upper core, 15 ... Lower core, 15a ... Plate-shaped portion, 15b ... Rod-shaped portion, 15c ... Fitting Fitting hole, 16 ... Upper core, 16a ... Fitting protrusion, 17 ... Lower core, 17a ... Plate portion, 17b ... Rod portion, 17c ... Fitting protrusion, 18 ... Upper core, 18a ... Fitting hole, 19 ... Lower core, 19a ... Plate-shaped portion, 19b ... Rod-shaped portion, 19c ... Fitting hole, 20 ... Upper core, 20a ... Fitting protrusion, 21 ... Substrate,
21c ... Core insertion hole, 21d ... Core accommodation groove, 22 ... Lower core, 22a ... Plate portion, 22b ... Rod portion, 23 ... Upper core, 31 ... Substrate, 31c ... Core insertion hole, 31d ... Core accommodation groove, 32 ... Lower core, 32a ... Plate-shaped part, 32b ... Rod-shaped part, 41 ... Laminated circuit board, 41a ... Transformer part.
Claims (4)
部分にコア挿入孔を貫通形成された積層構造の基板と、
板状部にコア挿入孔数に対応する棒状部を突設して形成
されたコアとを具備し、コアの棒状部を基板のコア挿入
孔に挿着して構成された積層型電子部品において、 基板のコア挿入孔開口面にコアの板状部と同一形及び厚
みのコア収容溝を形成し、コア挿着時にコアの板状部を
コア挿入溝に収容させた、 ことを特徴とする積層型電子部品。1. A substrate having a laminated structure in which one or a plurality of coils are built-in, and a core insertion hole is formed through a coil shaft core portion.
A laminated electronic component comprising a core formed by projecting a rod-shaped portion corresponding to the number of core insertion holes in a plate-shaped portion, and inserting the rod-shaped portion of the core into the core insertion hole of the substrate. A core accommodating groove having the same shape and thickness as the plate-shaped portion of the core is formed on the opening surface of the core insertion hole of the substrate, and the plate-shaped portion of the core is accommodated in the core insertion groove when the core is inserted. Multi-layer electronic component.
部分にコア挿入孔を貫通形成された積層構造の基板と、
板状部にコア挿入孔数に対応する棒状部を突設して形成
された下側コアと、板状の上側コアとを具備し、下側コ
アの棒状部を基板のコア挿入孔に挿着し該棒状部と上側
コアを結合して構成された積層型電子部品において、 基板のコア挿入孔開口面に下側コアの板状部と同一形及
び厚みのコア収容溝を形成し、コア挿着時に下側コアの
板状部をコア挿入溝に収容させた、 ことを特徴とする積層型電子部品。2. A substrate having a laminated structure in which one or a plurality of coils are built in, and a core insertion hole is formed through the coil shaft core portion.
The plate-shaped part includes a lower core formed by projecting rod-shaped parts corresponding to the number of core insertion holes and a plate-shaped upper core, and the rod-shaped part of the lower core is inserted into the core insertion hole of the substrate. In the laminated electronic component formed by joining the rod-shaped portion and the upper core together, a core accommodating groove having the same shape and thickness as the plate-shaped portion of the lower core is formed on the opening surface of the core insertion hole of the substrate, A laminated electronic component characterized in that the plate-shaped portion of the lower core is housed in the core insertion groove at the time of insertion.
部分にコア挿入孔を貫通形成された積層構造の基板と、
板状部にコア挿入孔数に対応する棒状部を突設して形成
された下側コアと、板状の上側コアとを具備し、下側コ
アの棒状部を基板のコア挿入孔に挿着し該棒状部と上側
コアを結合して構成された積層型電子部品において、 基板の一方のコア挿入孔開口面に下側コアの板状部と同
一形及び厚みのコア収容溝を、また他方のコア挿入孔開
口面に上側コアと同一形及び厚みの第２のコア収容溝を
夫々形成し、コア挿着時に下側コアの板状部と上側コア
を各々に対応するコア挿入溝に収容させた、 ことを特徴とする積層型電子部品。3. A substrate having a laminated structure in which one or a plurality of coils are built-in, and a core insertion hole is formed through a coil shaft core portion.
The plate-shaped part includes a lower core formed by projecting rod-shaped parts corresponding to the number of core insertion holes and a plate-shaped upper core, and the rod-shaped part of the lower core is inserted into the core insertion hole of the substrate. In the laminated electronic component formed by joining the rod-shaped portion and the upper core together, a core accommodating groove having the same shape and thickness as the plate-shaped portion of the lower core is formed on one core insertion hole opening surface of the substrate, A second core accommodating groove having the same shape and thickness as the upper core is formed on the opening surface of the other core insertion hole, and when the core is inserted, the plate-like portion of the lower core and the upper core are formed into the corresponding core insertion grooves. A laminated electronic component characterized by being housed.
をもって結合した、 ことを特徴とする請求項２又は３記載の積層型電子部
品。4. The laminated electronic component according to claim 2 or 3, wherein the lower core and the upper core are joined together with a concave and convex fitting structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18811994A JPH0855723A (en) | 1994-08-10 | 1994-08-10 | Laminated electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18811994A JPH0855723A (en) | 1994-08-10 | 1994-08-10 | Laminated electronic parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0855723A true JPH0855723A (en) | 1996-02-27 |
Family
ID=16218047
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18811994A Withdrawn JPH0855723A (en) | 1994-08-10 | 1994-08-10 | Laminated electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0855723A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005340586A (en) * | 2004-05-28 | 2005-12-08 | Murata Mfg Co Ltd | Laminate electronic component |
| JP2009088082A (en) * | 2007-09-28 | 2009-04-23 | Toko Inc | Laminated electronic component manufacturing method |
| JP2009213214A (en) * | 2008-03-03 | 2009-09-17 | Mitsubishi Electric Corp | Power drive power supply |
| JP2010503988A (en) * | 2006-09-12 | 2010-02-04 | クーパー テクノロジーズ カンパニー | Thin layer coil and core for magnetic components |
| JP2013175657A (en) * | 2012-02-27 | 2013-09-05 | Shindengen Electric Mfg Co Ltd | Low-profile core coil and low-profile transformer |
| WO2014142233A1 (en) * | 2013-03-14 | 2014-09-18 | 矢崎総業株式会社 | Coil unit and non-contact power supply apparatus |
| WO2018147398A1 (en) * | 2017-02-10 | 2018-08-16 | パナソニックＩｐマネジメント株式会社 | Inductor built into substrate |
-
1994
- 1994-08-10 JP JP18811994A patent/JPH0855723A/en not_active Withdrawn
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005340586A (en) * | 2004-05-28 | 2005-12-08 | Murata Mfg Co Ltd | Laminate electronic component |
| JP2010503988A (en) * | 2006-09-12 | 2010-02-04 | クーパー テクノロジーズ カンパニー | Thin layer coil and core for magnetic components |
| JP2009088082A (en) * | 2007-09-28 | 2009-04-23 | Toko Inc | Laminated electronic component manufacturing method |
| JP2009213214A (en) * | 2008-03-03 | 2009-09-17 | Mitsubishi Electric Corp | Power drive power supply |
| JP2013175657A (en) * | 2012-02-27 | 2013-09-05 | Shindengen Electric Mfg Co Ltd | Low-profile core coil and low-profile transformer |
| WO2014142233A1 (en) * | 2013-03-14 | 2014-09-18 | 矢崎総業株式会社 | Coil unit and non-contact power supply apparatus |
| JP2014179438A (en) * | 2013-03-14 | 2014-09-25 | Yazaki Corp | Coil unit and noncontact power feeding device |
| US9620279B2 (en) | 2013-03-14 | 2017-04-11 | Yazaki Corporation | Coil unit and contactless power supplying apparatus |
| WO2018147398A1 (en) * | 2017-02-10 | 2018-08-16 | パナソニックＩｐマネジメント株式会社 | Inductor built into substrate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20011106 |