JP2606580Y2 - Magnetic parts - Google Patents

Magnetic parts

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Publication number
JP2606580Y2
JP2606580Y2 JP1991014196U JP1419691U JP2606580Y2 JP 2606580 Y2 JP2606580 Y2 JP 2606580Y2 JP 1991014196 U JP1991014196 U JP 1991014196U JP 1419691 U JP1419691 U JP 1419691U JP 2606580 Y2 JP2606580 Y2 JP 2606580Y2
Authority
JP
Japan
Prior art keywords
resin molded
conductors
conductor
molded product
magnetic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1991014196U
Other languages
Japanese (ja)
Other versions
JPH04105513U (en
Inventor
正 三井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Priority to JP1991014196U priority Critical patent/JP2606580Y2/en
Publication of JPH04105513U publication Critical patent/JPH04105513U/en
Application granted granted Critical
Publication of JP2606580Y2 publication Critical patent/JP2606580Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

【考案の詳細な説明】[Detailed description of the invention]

【０００１】[0001]

【産業上の利用分野】本考案は、スイッチング電源用等
の高周波トランスや高周波コイルの構成部品として使用
可能な磁性部品に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a magnetic component usable as a component of a high-frequency transformer or a high-frequency coil for a switching power supply or the like.

【０００２】[0002]

【従来の技術】従来のこの種の磁性部品としては、米国
特許第４,４５５,５４５号がある。この米国特許の磁性
部品はＵ−Ｕ型磁気コアの貫通穴部に複数本の導体を貫
通させ、該導体の両端をプリント基板に差し込み、プリ
ント基板側の導体パターンにより前記貫通導体相互を接
続してコイルを構成するようにしたものである。2. Description of the Related Art A conventional magnetic component of this type is disclosed in U.S. Pat. No. 4,455,545. In the magnetic component of this U.S. patent, a plurality of conductors are passed through through holes of a U-U type magnetic core, both ends of the conductors are inserted into a printed circuit board, and the through conductors are connected to each other by a conductor pattern on the printed circuit board side. To form a coil.

【０００３】[0003]

【考案が解決しようとする課題】ところで、上記従来技
術の磁性部品は、複数本の貫通導体が磁気コア穴部内の
空間中を露出状態で通過して磁気コア両端部から引き出
されており、貫通導体相互間の寸法がばらついたり、貫
通導体と磁気コア間の耐圧を取りにくく、また、自動組
立が不可能な欠点があった。By the way, in the above-mentioned conventional magnetic component, a plurality of through conductors are exposed from the both ends of the magnetic core by passing through the space in the magnetic core hole in an exposed state. There have been disadvantages in that the dimensions between the conductors vary, the withstand voltage between the through conductor and the magnetic core is hardly obtained, and automatic assembly is impossible.

【０００４】本考案は、上記の点に鑑み、磁気コアの貫
通穴部を貫通する複数本の貫通導体を絶縁部材で相互に
絶縁、位置決めすることにより、導体相互間の寸法を機
械的に決めてリーケージインダクタンスや分布容量のば
らつきを極力小さくでき、高周波トランスや高周波コイ
ルの構成部品として最適な磁性部品を提供することを目
的とする。In view of the above points, the present invention mechanically determines dimensions between conductors by insulating and positioning a plurality of through conductors penetrating through holes of a magnetic core with an insulating member. It is an object of the present invention to provide a magnetic component that can minimize variations in leakage inductance and distributed capacitance as much as possible, and is optimal as a component of a high-frequency transformer or a high-frequency coil.

【０００５】[0005]

【課題を解決するための手段】上記目的を達成するため
に、本考案は、複数本の貫通導体を樹脂成形品で絶縁し
かつ位置決めし、複数のコア部品を突き合わせて閉磁路
を成す磁気コアを構成し、前記複数本の貫通導体を保持
した前記樹脂成形品を前記磁気コアの貫通穴部に配置し
て前記樹脂成形品の両端部を前記貫通穴部から突出さ
せ、前記樹脂成形品の両端面より前記貫通導体の端部を
引き出してなる磁性部品において、 前記磁気コアの前記
貫通穴部を設けた両方の端面にそれぞれ係合する係合用
凸部を前記樹脂成形品にそれぞれ形成し、各係合用凸部
を前記磁気コアの底面より下方に突出させたことを特徴
としている。前記磁性部品において、前記樹脂成形品が
複数個重ねられて前記貫通穴部に配置された構成として
もよい。前記樹脂成形品からの前記複数本の貫通導体の
突出長さを交互に違えた構造としてもよい。SUMMARY OF THE INVENTION In order to achieve the above object, the present invention provides a magnetic core in which a plurality of through conductors are insulated and positioned by a resin molded product, and a plurality of core parts are abutted to form a closed magnetic circuit. The resin molded product holding the plurality of through conductors is arranged in the through hole of the magnetic core, and both ends of the resin molded product are projected from the through hole, and the resin molded product in the magnetic component formed by leaving <br/> pulling an end portion of said through conductors from both end faces, wherein said magnetic core
For engagement with both end faces provided with through holes
A convex portion is formed on each of the resin molded products, and each engaging convex portion is formed.
Are projected below the bottom surface of the magnetic core.
And In the magnetic component, a plurality of the resin molded products may be stacked and arranged in the through hole. A structure in which the projecting lengths of the plurality of through conductors from the resin molded product are alternately changed may be adopted.

【０００６】[0006]

【作用】本考案の磁性部品においては、通常のトランス
やコイルの巻線部に相当する部分が両端解放の複数本の
貫通導体を樹脂モールド等により相互に絶縁位置決めし
て一体化した樹脂成形品となっている。そして、磁性部
品は該樹脂成形品の周囲に複数のコア部品を突き合わせ
て成るＵ−Ｕ型、Ｕ−Ｉ型等の磁気コアを装着したもの
であり、プリント基板上に実装したときに、当該プリン
ト基板側配線(導体パターン等)にてトランスやコイルを
構成できる。この場合、貫通導体相互間の寸法を常に一
定に保持でき、リーケージインダクタンスや分布容量の
ばらつきを極めて小さくすることができ、また、複数本
の貫通導体が樹脂成形品で一体化されているので、取り
扱いが容易となり、自動組立及びプリント基板に対する
自動装着が可能である。さらに、複数本の貫通導体を樹
脂モールドで封止成形する構造の場合には薬品による洗
浄も可能である。また、貫通導体を多層に配置した構造
も採用でき、結合の良いトランスの作成も容易である。
さらに、前記磁気コアの貫通穴部を設けた両方の端面に
それぞれ係合する係合用凸部を前記樹脂成形品にそれぞ
れ形成し、各係合用凸部を前記磁気コアの底面より下方
に突出させたことで、組立時において、前記樹脂成形品
と磁気コアとの間の位置決めが確実に行えるため、自動
組立を容易に実現することができ、そのうえ磁気コアを
基板面より浮かせて基板上の導体パターンとコア間の絶
縁を確保することができる。 In the magnetic component according to the present invention, a plurality of through conductors having a winding portion of an ordinary transformer or a coil, both ends of which are open at both ends, are mutually insulated and positioned by a resin mold or the like and integrated. It is a molded resin product . The magnetic component is provided with a magnetic core such as a UU type or a UI type obtained by abutting a plurality of core components around the resin molded product. Transformers and coils can be configured with printed circuit board-side wiring (such as conductor patterns). In this case, the dimensions between the through conductors can always be kept constant, the variation in leakage inductance and distribution capacitance can be extremely reduced , and a plurality of through conductors are integrated with a resin molded product. Therefore, handling becomes easy, and automatic assembly and automatic mounting on a printed circuit board are possible. Further, in the case of a structure in which a plurality of through conductors are sealed and molded with a resin mold, cleaning with a chemical is also possible. In addition, a structure in which through conductors are arranged in multiple layers can be adopted, and it is easy to create a transformer with good coupling.
Further, both end faces provided with the through holes of the magnetic core are provided.
The engaging projections to be engaged with each other are respectively formed on the resin molded product.
And each engaging projection is located below the bottom surface of the magnetic core.
At the time of assembly, the resin molded product
Position between the magnetic core and the magnetic core
Assembly can be easily realized, and the magnetic core
Float above the board surface and keep the gap between the conductor pattern and the core on the board.
An edge can be secured.

【０００７】[0007]

【実施例】以下、本考案に係る磁性部品の実施例を図面
に従って説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the magnetic component according to the present invention will be described below with reference to the drawings.

【０００８】図１乃至図３は本考案の元になる基本構成
の第１参考例を示す。これらの図において、１は両端が
垂直に折り曲げられた貫通導体であり、２は複数本の貫
通導体を相互に絶縁しかつ位置決めする絶縁部材として
の樹脂成形品である。この樹脂成形品２は樹脂モールド
により、複数本の貫通導体１と一体に成形（同時成形）
されているものである。そして、樹脂成形品２を上下か
ら挟むごとくフェライト等のＵ型コア(断面コ字状コア)
３Ａ,３Ｂが相互に突き合わせ状態で装着される。これ
らのフェライト等のＵ型コア３Ａ,３Ｂは突き合わせ状
態において貫通穴部４を持つＵ−Ｕ型磁気コア（閉磁路
コア）を構成するものであり、樹脂成形品２の両端部は
貫通穴部４から突出しており、樹脂成形品２の両端面よ
り各貫通導体１の端部が引き出されている。すなわち、
各貫通導体１は樹脂成形品２で絶縁された状態にて貫通
穴部４を貫通して穴部両側より引き出された配置とな
る。FIGS. 1 to 3 show the basic structure of the present invention .
A first reference example is shown. In these figures, 1 is a through conductor whose both ends are bent vertically, and 2 is a resin molded product as an insulating member for insulating and positioning a plurality of through conductors from each other. This resin molded product 2 is integrally molded with a plurality of through conductors 1 by resin molding (simultaneous molding).
Is what is being done. Then, a U-shaped core such as ferrite (a U-shaped cross section core) is sandwiched between the resin molded products 2 from above and below
3A and 3B are mounted in a mutually butted state. The U-shaped cores 3A and 3B made of ferrite or the like constitute a U-U-shaped magnetic core (closed magnetic path core) having a through hole 4 in abutting state, and both ends of the resin molded product 2 are formed with through hole portions. 4, the ends of the through conductors 1 are drawn out from both end surfaces of the resin molded product 2. That is,
Each of the through conductors 1 is arranged so as to pass through the through hole 4 and be drawn out from both sides of the hole while being insulated by the resin molded product 2.

【０００９】図４は上記第１参考例の磁性部品５が図３
の如く挿入されるプリント基板６上の配線パターン例を
示すものである。この場合、各貫通導体１の端部を挿入
するためのプリント基板側取付穴７の周囲には、それぞ
れはんだ用導体ランドa１〜a１６が設けられ、必要に応
じてはんだ用導体ランド間に接続導体９が導体膜で形成
されている。図４の場合、ランドa１、貫通導体１、ラ
ンドa２、接続導体９、ランドa３、貫通導体１、ランド
a４、接続導体９、ランドa５、貫通導体１及びランドa
６の経路で３ターンの第１の巻線が構成され、ランドa
７、貫通導体１、ランドa８、接続導体９、ランドa９、
…、ランドa１６で５ターンの第２の巻線が構成され
る。すなわち、図４の配線パターン例では３ターンの第
１の巻線と５ターンの第２の巻線とを有する高周波トラ
ンスが構成されることになる。FIG. 4 shows the magnetic component 5 of the first reference example shown in FIG.
5 shows an example of a wiring pattern on the printed circuit board 6 inserted as shown in FIG. In this case, solder conductor lands a 1 to a 16 are provided around the printed circuit board side mounting holes 7 for inserting the ends of the through conductors 1, respectively, and if necessary, between the solder conductor lands. The connection conductor 9 is formed of a conductor film. In FIG. 4, the land a 1, through conductors 1, lands a 2, connecting conductors 9, lands a 3, through conductor 1, lands
a 4 , connection conductor 9, land a 5 , through conductor 1 and land a
The first winding of three turns is constituted by six paths, and the land a
7, through conductors 1, lands a 8, the connecting conductors 9, lands a 9,
..., it is composed of a second winding of 5 turns the land a 16. That is, in the example of the wiring pattern shown in FIG. 4, a high-frequency transformer having a first winding having three turns and a second winding having five turns is configured.

【００１０】図５及び図６は第２参考例を示す。この場
合、樹脂成形品２を貫通している貫通導体１Ａの両端部
分は略垂直に折り曲げられた略垂直折り曲げ部となって
おり、略垂直折り曲げ部の先端がプリント基板６に平行
に折り曲げられた面装着用折り曲げ部１０となってい
て、面実装型の磁性部品を構成している。なお、その他
の構造は前述の図１乃至図３に示す第１参考例と同様で
ある。また、プリント基板６上の配線パターンも例えば
図４のごとき配線パターン例を採用可能である（但し、
プリント基板側取付穴は省略できる。）。FIGS. 5 and 6 show a second reference example . In this case, both end portions of the penetrating conductor 1A penetrating the resin molded product 2 are substantially vertical bent portions bent substantially vertically, and the ends of the substantially vertical bent portions are bent in parallel with the printed circuit board 6. The bent portion 10 for surface mounting is used to constitute a surface-mounted magnetic component. The other structure is the same as that of the first embodiment shown in FIGS. Further, as the wiring pattern on the printed circuit board 6, for example, an example of the wiring pattern as shown in FIG.
The mounting holes on the printed circuit board side can be omitted. ).

【００１１】図７及び図８は第３参考例を示す。この場
合、貫通導体１Ｂは樹脂成形品２を真っすぐに貫通し
て、折り曲げられることなく真っすぐに延びている。そ
の他の構成は前述の第１参考例と同様である。この構造
は、抜き穴１１を形成したプリント基板６Ａに落とし込
みにより装着するのに適した構造である。そして、抜き
穴１１の周囲に設けられたプリント基板側のはんだ用導
体ランド１２に貫通導体１Ｂの端部をそれぞれはんだ付
けすることにより取り付けられる。FIGS. 7 and 8 show a third reference example . In this case, the through conductor 1B penetrates the resin molded product 2 straight, and extends straight without being bent. Other configurations are the same as those of the first reference example . This structure is suitable for being mounted on the printed circuit board 6A in which the holes 11 are formed by dropping. Then, the ends of the through conductors 1B are attached to the soldering conductor lands 12 on the printed circuit board side provided around the punched holes 11 by soldering.

【００１２】図９は第４参考例を示す。この第４参考例
は２層に貫通導体を配置した面実装型の磁性部品であ
る。すなわち、第１層の複数本の貫通導体１Ｃは樹脂モ
ールドによりこれと一体に成形された樹脂成形品２Ａで
相互に絶縁一体化されかつ位置決めされており、第２層
の複数本の貫通導体１Ｄは同じく樹脂成形品２Ｂで相互
に絶縁一体化されかつ位置決めされている。そして、貫
通導体１Ｃを有する樹脂成形品２Ａと貫通導体１Ｄを有
する樹脂成形品２Ｂとは重ね合わされた状態でフェライ
ト等のＵ型コア３Ａ,３Ｂに装着される。各貫通導体１
Ｃ,１Ｄの両端部分は略垂直に折り曲げられた略垂直折
り曲げ部となっており、略垂直折り曲げ部の先端がプリ
ント基板６に平行に折り曲げられた面装着用折り曲げ部
１０となっている。なお、プリント基板６は両面パター
ンの例を示す。FIG. 9 shows a fourth reference example . The fourth reference example is a surface-mounted magnetic component in which through conductors are arranged in two layers. That is, the plurality of through conductors 1C of the first layer are mutually insulated and integrated and positioned by a resin molded product 2A integrally formed therewith by resin molding, and the plurality of through conductors 1D of the second layer are formed. Are similarly insulated and integrated with each other and positioned by a resin molded product 2B. Then, the resin molded product 2A having the penetrating conductor 1C and the resin molded product 2B having the penetrating conductor 1D are mounted on the U-shaped cores 3A and 3B such as ferrite in a state of being superposed. Each through conductor 1
Both end portions of C and 1D are substantially vertical bent portions bent substantially vertically, and the end of the substantially vertical bent portion is a surface mounting bent portion 10 bent in parallel with the printed circuit board 6. The printed circuit board 6 shows an example of a double-sided pattern.

【００１３】図１０は図９の第４参考例のごとき２層構
造の貫通導体を備えた磁性部品に対応したプリント基板
側の配線パターン例を示す。プリント基板の表側面に形
成されたはんだ用導体ランドc１,c２,c３…及び裏面に
形成された接続導体１５が第１層の貫通導体１Ｃに対応
し、プリント基板表側面に形成されたはんだ用導体ラン
ドd１,d２,d３…及び接続導体１６が第２層の貫通導体
１Ｄに対応している。なお、ランドc１,c２,c３…と接
続導体１５の接続はスルーホールで行う。この場合、第
１層の貫通導体１Ｃと接続導体１５とで構成される外側
の巻線のすぐ内側に第２層の貫通導体１Ｄ及び接続導体
１６からなる内側の巻線が近接して巻かれることにな
り、結合の密なトランスを得ることができる。FIG. 10 shows an example of a wiring pattern on the printed circuit board side corresponding to a magnetic component having a two-layered through conductor as in the fourth reference example of FIG. The solder conductor lands c 1 , c 2 , c 3 ... Formed on the front surface of the printed circuit board and the connection conductors 15 formed on the back surface correspond to the through conductors 1C of the first layer and are formed on the front surface of the printed circuit board. The solder conductor lands d 1 , d 2 , d 3 ... And the connection conductor 16 correspond to the through conductor 1D of the second layer. The lands c 1 , c 2 , c 3 ... And the connection conductors 15 are connected by through holes. In this case, the inner winding composed of the through conductor 1D of the second layer and the connection conductor 16 is wound close to the inner side of the outer winding composed of the through conductor 1C of the first layer and the connection conductor 15. In other words, it is possible to obtain a tightly coupled transformer.

【００１４】図１１は他の配線パターン例を示し、プリ
ント基板上のはんだ用導体ランドb１〜b６及び接続導体
１３にて磁性部品側の貫通導体とともに３ターンの第１
の巻線を構成し、はんだ用導体ランドb７〜b１６及び接
続導体１４にて貫通導体とともに５ターンの第２の巻線
を構成するようになっている。この配線パターン例で
は、b１〜b６に至る第１の巻線位置を外側に持ってくる
ことにより、ランドb５,b７間及びランドb６,b８間の絶
縁距離を十分大きく取ることができる利点がある。FIG. 11 shows another example of a wiring pattern, in which the first and third turns of the solder conductor lands b 1 to b 6 and the connection conductor 13 on the printed circuit board together with the through conductor on the magnetic component side are used.
Constitute windings, so as to constitute a second winding 5 turns a through conductor at a solder conductor lands b 7 ~b 16 and the connection conductor 14. In the wiring pattern example, by bringing the first winding position leading to b 1 ~b 6 outwardly, sufficiently large between the lands b 5, b 7, and the insulation distance between the lands b 6, b 8 There are advantages that can be.

【００１５】図１２は第５参考例を示す。この場合、貫
通導体１と一体の樹脂成形品２にＵ型コア３Ａの端面に
係合する係合用凸部２０が形成されている。その他は図
１乃至図３の第１参考例と同様である。この第５参考例
では、組立時において、樹脂成形品２とコア３Ａとの間
の位置決めが確実に行えるため、自動組立を容易に実現
することができる。FIG. 12 shows a fifth reference example . In this case, an engaging projection 20 that engages with the end surface of the U-shaped core 3A is formed on the resin molded product 2 integrated with the through conductor 1. Others are the same as the first reference example of FIGS. 1 to 3. In the fifth reference example , the positioning between the resin molded product 2 and the core 3A can be reliably performed at the time of assembly, so that automatic assembly can be easily realized.

【００１６】図１３は第６参考例を示す。この場合、貫
通導体１と一体の樹脂成形品２にＵ型コア３Ａ,３Ｂの
端面に係合する係合用凸部２０Ａが形成されている。そ
の他は図１乃至図３の第１参考例と同様である。この第
６参考例では、組立時において、樹脂成形品２と両コア
３Ａ,３Ｂとの間の位置決めが確実に行えるため、自動
組立をさらに容易に実現することができる。FIG. 13 shows a sixth reference example . In this case, an engaging protrusion 20A that engages with the end surfaces of the U-shaped cores 3A and 3B is formed on the resin molded product 2 integrated with the through conductor 1. Others are the same as the first reference example of FIGS. 1 to 3. In the sixth reference example , since the positioning between the resin molded product 2 and the cores 3A and 3B can be reliably performed at the time of assembling, automatic assembling can be more easily realized.

【００１７】図１４は本考案の実施例を示す。この場
合、貫通導体１と一体の樹脂成形品２にＵ型コア３Ｂの
端面に係合しかつコア３Ｂの底面より下方に突出した係
合用凸部２０Ｂが形成されている。その他は図１乃至図
３の第１参考例と同様である。この実施例では、係合用
凸部２０Ｂが形成されたことにより、組立時において、
樹脂成形品２とコア３Ｂとの間の位置決めが確実に行え
るため、自動組立を容易に実現することができ、さらに
コア３Ｂを基板面より浮かせて基板上の導体パターンと
コア間の絶縁を確保することができる。FIG. 14 shows an embodiment of the present invention . In this case, an engaging protrusion 20B that is engaged with the end surface of the U-shaped core 3B and protrudes downward from the bottom surface of the core 3B is formed on the resin molded product 2 integrated with the through conductor 1. Others are the same as the first reference example of FIGS. 1 to 3. In this embodiment , since the engaging projection 20B is formed,
Since the positioning between the resin molded product 2 and the core 3B can be reliably performed, automatic assembling can be easily realized, and furthermore, the core 3B is floated from the substrate surface to ensure insulation between the conductor pattern on the substrate and the core. can do.

【００１８】図１５は複数本の貫通導体を相互に絶縁し
一定間隔で支持する樹脂成形品の他の具体例を示す。こ
の場合、樹脂成形品２Ｃは２つの樹脂成形品３０,３１
の組み合わせ構造体である。すなわち、樹脂成形品３０
は貫通導体を位置決めする位置決め溝３２を有し、樹脂
成形品３１は貫通導体配置後に樹脂成形品３０上に載置
され接着等で一体化されるようになっている。FIG. 15 shows another specific example of a resin molded product in which a plurality of through conductors are mutually insulated and supported at a constant interval. In this case, the resin molded product 2C is composed of two resin molded products 30, 31.
Is a combination structure. That is, the resin molded product 30
Has a positioning groove 32 for positioning the through conductor, and the resin molded product 31 is placed on the resin molded product 30 after the through conductor is arranged, and is integrated by bonding or the like.

【００１９】図１６は絶縁部材としての樹脂成形品２で
支持される貫通導体の他の具体例である。この場合、貫
通導体１Ｅは丸棒状導体を折り曲げて先端部３３のみ幅
広板状に加工したものである。そして、樹脂成形品２か
らの突出長さを交互に違えることにより貫通導体間隔を
狭くした場合でも先端部３３の相互間隔を所定値以上確
保するようにしている。FIG. 16 shows another specific example of a through conductor supported by a resin molded product 2 as an insulating member. In this case, the through conductor 1E is formed by bending a round bar-shaped conductor and processing only the distal end portion 33 into a wide plate shape. Further, even when the distance between the through conductors is reduced by alternately changing the length of protrusion from the resin molded product 2, the mutual distance between the tip portions 33 is secured to a predetermined value or more.

【００２０】図１７は絶縁部材としての樹脂成形品２で
支持される貫通導体のさらにもう１つの具体例である。
この場合、貫通導体１Ｆは樹脂成形品２に対しては縦方
向に幅広で基板面に対接する先端部３４は横方向に幅広
に加工されている。そして、樹脂成形品２からの突出長
さを交互に違えることにより貫通導体間隔を狭くした場
合でも先端部３４の相互間隔を所定値以上確保するよう
にしている。FIG. 17 shows yet another specific example of a through conductor supported by a resin molded product 2 as an insulating member.
In this case, the through conductor 1 </ b> F is wider in the vertical direction than the resin molded product 2, and the distal end portion 34 in contact with the substrate surface is processed to be wider in the horizontal direction. Then, even when the distance between the penetrating conductors is narrowed by alternately changing the protruding length from the resin molded product 2, the mutual distance between the tip portions 34 is secured to a predetermined value or more.

【００２１】なお、本考案は図９の樹脂成形品が複数個
重ねられてコアの貫通穴部に配置された第４参考例の構
造にも適用可能であることは明らかである。 In the present invention, a plurality of resin molded products shown in FIG.
The structure of the fourth reference example, which is overlapped and arranged in the through hole of the core.
Obviously, it is also applicable to the structure.

【００２２】また、上記実施例では、２個のフェライト
等のＵ型コアを突き合わせたＵ−Ｕ型磁気コアを示した
が、図１８のようにフェライト等のＵ型コア２５とＩ型
コア２６を突き合わせたＵ−Ｉ型磁気コア構造を採用し
ても差し支えないし、貫通穴部が得られるものであれば
その他のコア構造を採用することもできる。また、コア
同士の突き合わせ一体化や、貫通導体を持つ樹脂成形品
とコアとの間の固定は接着剤等を使用して行うことがで
き、コア突き合わせ面にマイラー等のギャップスペーサ
を介在させてコア同士を一体化するようにしても差し支
えない。また、プリント基板上の配線パターンは適宜変
更可能であり、１個の巻線のみを有する高周波コイルや
３個以上の巻線を有する高周波トランスを構成すること
もできる。Further , in the above embodiment, the U-U type magnetic core in which two U-type cores such as ferrites are butted is shown. However, as shown in FIG. May be employed, and other core structures may be employed as long as a through hole can be obtained. In addition, butting integration of the cores and fixing between the resin molded product having a through conductor and the cores can be performed using an adhesive or the like, and a gap spacer such as mylar is interposed between the core butting surfaces. The cores may be integrated with each other. Further, the wiring pattern on the printed circuit board can be appropriately changed, and a high-frequency coil having only one winding or a high-frequency transformer having three or more windings can be configured.

【００２３】[0023]

【考案の効果】以上説明したように、本考案によれば、
複数本の貫通導体を相互に絶縁し位置決めする絶縁部材
としての樹脂成形品を、複数のコア部品を突き合わせて
成る閉磁路をなす磁気コアの貫通穴部に配置して該磁気
コア両端面より突出させており、貫通導体を磁気コアか
ら確実に絶縁するとともに貫通導体の相互の間隔を機械
的に決めて、リーケージインダクタンスや分布容量のば
らつきを極めて小さくすることができる。また、複数の
貫通導体が両端部を除き樹脂成形品で覆われることにな
るので取り扱いが容易となり、自動組立やプリント基板
に対する自動装着が可能となる。さらに、複数本の貫通
導体を樹脂モールドで封止成形をしたような場合には薬
品による洗浄が可能となる。さらに、複数の貫通導体を
多層に配置することができ、結合の良いトランスの作成
も容易である。[Effects of the Invention] As described above, according to the present invention,
A resin molded product as an insulating member for mutually insulating and positioning a plurality of through conductors is disposed in a through hole of a magnetic core forming a closed magnetic path formed by abutting a plurality of core components, and protruding from both end surfaces of the magnetic core. Thus, the through conductor is reliably insulated from the magnetic core, and the distance between the through conductors is determined mechanically, so that variations in leakage inductance and distributed capacitance can be extremely reduced. In addition, since a plurality of through conductors are covered with the resin molded product except for both ends, handling becomes easy, and automatic assembly and automatic mounting on a printed circuit board become possible. Further, in the case where a plurality of through conductors are sealed and molded with a resin mold, cleaning with a chemical becomes possible. Furthermore, a plurality of through conductors can be arranged in multiple layers, and it is easy to create a transformer with good coupling.

【００２４】さらに、前記磁気コアの貫通穴部を設けた
両方の端面にそれぞれ係合する係合用凸部を前記樹脂成
形品にそれぞれ形成し、各係合用凸部を前記磁気コアの
底面より下方に突出させたことで、組立時において、前
記樹脂成形品と磁気コアとの間の位置決めが確実に行え
るため、自動組立を容易に実現することができ、そのう
え磁気コアを基板面より浮かせて基板上の導体パターン
とコア間の絶縁を確保可能である。 Further, a through hole of the magnetic core is provided.
The engaging protrusions engaging with both end surfaces are respectively formed by the resin component.
Each of the projections for engagement is formed on the magnetic core.
By protruding below the bottom, the front
Reliable positioning between the resin molded product and the magnetic core
Therefore, automatic assembly can be easily realized,
The conductor pattern on the board with the magnetic core floating above the board surface
And insulation between the cores.

【図面の簡単な説明】[Brief description of the drawings]

【図１】本考案の元になる磁性部品の基本構成の第１参
考例を示す分解斜視図である。FIG. 1 is a first reference to the basic configuration of a magnetic component that is the basis of the present invention.
It is a disassembled perspective view which shows a consideration example.

【図２】同斜視図である。FIG. 2 is a perspective view of the same.

【図３】プリント基板に取り付けた状態の同側断面図で
ある。FIG. 3 is a cross-sectional view of the same side when attached to a printed circuit board.

【図４】前述の第１参考例の磁性部品に対応したプリン
ト基板側配線パターン例を示す平面図である。FIG. 4 is a plan view showing an example of a printed circuit board-side wiring pattern corresponding to the magnetic component of the first reference example .

【図５】第２参考例を示す側面図である。FIG. 5 is a side view showing a second reference example .

【図６】同正面図である。FIG. 6 is a front view of the same.

【図７】第３参考例を示す側断面図である。FIG. 7 is a side sectional view showing a third reference example .

【図８】同正面図である。FIG. 8 is a front view of the same.

【図９】第４参考例を示す側断面図である。FIG. 9 is a side sectional view showing a fourth reference example .

【図１０】図９の第４参考例の磁性部品に対応するプリ
ント基板側配線パターン例を示す平面図である。FIG. 10 is a plan view showing an example of a printed circuit board-side wiring pattern corresponding to the magnetic component of the fourth reference example of FIG. 9;

【図１１】他の配線パターン例を示す平面図である。FIG. 11 is a plan view showing another example of a wiring pattern.

【図１２】第５参考例を示す側面図である。FIG. 12 is a side view showing a fifth reference example .

【図１３】第６参考例を示す側面図である。FIG. 13 is a side view showing a sixth reference example .

【図１４】本考案の実施例を示す側面図である。FIG. 14 is a side view showing an embodiment of the present invention .

【図１５】絶縁部材の他の具体例を示す分解斜視図であ
る。FIG. 15 is an exploded perspective view showing another specific example of the insulating member.

【図１６】貫通導体の他の具体例を示す斜視図である。FIG. 16 is a perspective view showing another specific example of the through conductor.

【図１７】貫通導体のさらにもう１つの具体例を示す斜
視図である。FIG. 17 is a perspective view showing yet another specific example of the through conductor.

【図１８】磁気コアの他の具体例を示す正面図である。FIG. 18 is a front view showing another specific example of the magnetic core.

【符号の説明】[Explanation of symbols]

１,１Ａ〜１Ｄ 貫通導体 ２,２Ａ,２Ｂ,２Ｃ 樹脂成形品 ３Ａ,３Ｂ Ｕ型コア ４ 貫通穴部 ５ 磁性部品 ６,６Ａ プリント基板 ７ 取付穴 ２０,２０Ａ,２０Ｂ 係合用凸部1, 1A to 1D Through conductor 2, 2A, 2B , 2C Resin molded product 3A, 3B U-shaped core 4 Through hole 5 Magnetic component 6, 6A Printed circuit board 7 Mounting hole 20, 20A, 20B Engagement projection

───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) H01F 17/04 H01F 27/28 - 27/30 H01F 41/00 ──────────────────────────────────────────────────続 き Continued on the front page (58) Fields surveyed (Int. Cl. 7 , DB name) H01F 17/04 H01F 27/28-27/30 H01F 41/00

Claims (3)

(57)【実用新案登録請求の範囲】(57) [Scope of request for utility model registration] 【請求項１】 複数本の貫通導体を樹脂成形品で絶縁し
かつ位置決めし、複数のコア部品を突き合わせて閉磁路
を成す磁気コアを構成し、前記複数本の貫通導体を保持
した前記樹脂成形品を前記磁気コアの貫通穴部に配置し
て前記樹脂成形品の両端部を前記貫通穴部から突出さ
せ、前記樹脂成形品の両端面より前記貫通導体の端部を
引き出してなる磁性部品において、 前記磁気コアの前記貫通穴部を設けた両方の端面にそれ
ぞれ係合する係合用凸部を前記樹脂成形品にそれぞれ形
成し、各係合用凸部を前記磁気コアの底面より下方に突
出させたことを 特徴とする磁性部品。1. A resin molding in which a plurality of through conductors are insulated and positioned by a resin molded product, a plurality of core parts are abutted to form a magnetic core forming a closed magnetic circuit, and the plurality of through conductors are held. An article is disposed in a through hole of the magnetic core, and both ends of the resin molded article are projected from the through hole, and ends of the through conductor are pulled out from both end faces of the resin molded article. In the magnetic component formed as described above, the magnetic core has the through-holes on both end faces thereof.
The engaging projections to be engaged with each other are respectively formed on the resin molded product.
And projecting each engaging projection downward from the bottom surface of the magnetic core.
A magnetic component characterized by being put out . 【請求項２】 前記樹脂成形品が複数個重ねられて前記
貫通穴部に配置されてなる請求項１記載の磁性部品。2. The magnetic component according to claim 1, wherein a plurality of the resin molded products are stacked and arranged in the through hole. 【請求項３】 前記樹脂成形品からの前記複数本の貫通
導体の突出長さを交互に違えた請求項１又は２記載の磁
性部品。3. The magnetic component according to claim 1, wherein the projecting lengths of the plurality of through conductors from the resin molded product are alternately changed.
JP1991014196U 1991-02-21 1991-02-21 Magnetic parts Expired - Lifetime JP2606580Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1991014196U JP2606580Y2 (en) 1991-02-21 1991-02-21 Magnetic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1991014196U JP2606580Y2 (en) 1991-02-21 1991-02-21 Magnetic parts

Publications (2)

Publication Number Publication Date
JPH04105513U JPH04105513U (en) 1992-09-10
JP2606580Y2 true JP2606580Y2 (en) 2000-11-27

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ID=31901837

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1991014196U Expired - Lifetime JP2606580Y2 (en) 1991-02-21 1991-02-21 Magnetic parts

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Country Link
JP (1) JP2606580Y2 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6836222B2 (en) * 2017-06-19 2021-02-24 株式会社村田製作所 Coil module manufacturing method and coil module

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5144580Y2 (en) * 1972-03-10 1976-10-29
JPS6298216U (en) * 1985-12-11 1987-06-23
JPH02257605A (en) * 1989-03-30 1990-10-18 Taiyo Yuden Co Ltd Multilinkage impedance element and its manufacture
JPH088170B2 (en) * 1989-10-09 1996-01-29 株式会社トーキン Small choke coil and manufacturing method thereof

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Publication number Publication date
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