JPH08330712A - Method of fitting electronic chip part to substrate - Google Patents
Method of fitting electronic chip part to substrateInfo
- Publication number
- JPH08330712A JPH08330712A JP15991395A JP15991395A JPH08330712A JP H08330712 A JPH08330712 A JP H08330712A JP 15991395 A JP15991395 A JP 15991395A JP 15991395 A JP15991395 A JP 15991395A JP H08330712 A JPH08330712 A JP H08330712A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- substrate
- electronic component
- type electronic
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、基板上に設けたパター
ンにチップ型の電子部品を取り付けるのに好適な、基板
へのチップ型電子部品の取付方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for attaching a chip type electronic component to a substrate, which is suitable for attaching a chip type electronic component to a pattern provided on the substrate.
【０００２】[0002]
【従来技術】従来、回路パターンを印刷したフレキシブ
ル基板上には、多数のチップ型電子部品が取り付けられ
る。2. Description of the Related Art Conventionally, a large number of chip-type electronic components are mounted on a flexible substrate on which a circuit pattern is printed.
【０００３】図１０はフレキシブル基板２００上にチッ
プ型発光素子２２０を取り付ける従来の方法を示す図で
ある。FIG. 10 is a view showing a conventional method of mounting the chip type light emitting device 220 on the flexible substrate 200.
【０００４】同図に示すように従来は、まずフレキシブ
ル基板２００上に設けた一対の電極パターン２０１，２
０１上にそれぞれ導電性接着剤２０３，２０３を塗る。
この導電性接着剤２０３，２０３は、熱硬化性のエポキ
シ系樹脂に銀粉と溶剤を混ぜ合わせたものであり、塗布
したときはウエット状態である。As shown in FIG. 1, in the conventional case, first, a pair of electrode patterns 201 and 201 provided on a flexible substrate 200 is first formed.
01 is coated with conductive adhesives 203 and 203, respectively.
The conductive adhesives 203, 203 are thermosetting epoxy resin mixed with silver powder and a solvent, and are in a wet state when applied.
【０００５】次に該熱硬化型の導電性接着剤２０３，２
０３の上にチップ型発光素子２２０の電極部２２１，２
２１を接着し、これを乾燥炉に入れて導電性接着剤２０
３，２０３中の溶剤を揮発させて乾燥し、固化させる。Next, the thermosetting conductive adhesives 203, 2
03 on the chip type light emitting device 220.
21 is adhered, and the conductive adhesive 20 is put in a drying oven.
The solvent in 3,203 is volatilized, dried and solidified.
【０００６】その後該チップ型発光素子２２０の上に、
これを封止するように、ＵＶ硬化型（紫外線硬化型）の
絶縁接着剤２４０を塗布し、その後これをＵＶ炉に入れ
て紫外線を照射し、固化させる。After that, on the chip type light emitting device 220,
A UV-curable (ultraviolet-curable) insulating adhesive 240 is applied so as to seal it, and then this is placed in a UV furnace and irradiated with ultraviolet rays to be solidified.
【０００７】ここで絶縁性接着剤２４０としてＵＶ硬化
型のものを用いたのは、この従来例の場合、封止するの
がチップ型発光素子２２０であるため、この絶縁性接着
剤２４０を透明なものにする必要があるためである。In this conventional example, the insulating adhesive 240 used in the UV curing type is the chip type light emitting element 220 to be sealed. Therefore, the insulating adhesive 240 is transparent. This is because it needs to be
【０００８】[0008]
【発明が解決しようとする課題】しかしながら上記従来
例においては、チップ型発光素子２２０の電極部２２
１，２２１とフレキシブル基板２００の電極パターン２
０１，２０１間の電気的導通抵抗が、経時的に徐々に大
きくなり劣化していく。However, in the above-mentioned conventional example, the electrode portion 22 of the chip type light emitting device 220 is used.
1, 221 and the electrode pattern 2 of the flexible substrate 200
The electrical conduction resistance between 01 and 201 gradually increases with time and deteriorates.
【０００９】図６乃至図８はこの従来例及び下記する本
発明の実施例を用いてチップ型発光素子を基板へ取り付
けたときの該接続部分における導通抵抗値の経時的環境
試験の結果を示す図である。FIGS. 6 to 8 show the results of environmental tests over time of the conduction resistance value at the connecting portion when a chip type light emitting device is mounted on a substrate using this conventional example and the embodiment of the present invention described below. It is a figure.
【００１０】即ち図６は雰囲気温度８５℃としたときの
経時的な両導電性接着剤２０３，２０３間の導通抵抗値
（Ω）の変化を測定した耐熱試験の結果を示し、図７は
雰囲気温度６０℃で湿度９０〜９５％として導通抵抗値
の変化を測定した耐湿試験の結果を示し、図８は雰囲気
温度を３０分毎に−３０℃と＋８０℃に変化させて導通
抵抗値の変化を測定した温度ショック試験の結果を示し
たものである。なおいずれの図においても十字マークの
破線が従来例を示している。That is, FIG. 6 shows the result of a heat resistance test in which the change of the conduction resistance value (Ω) between the two conductive adhesives 203, 203 was measured with time when the atmospheric temperature was 85 ° C., and FIG. 7 shows the atmosphere. FIG. 8 shows the results of the humidity resistance test in which the change in the conduction resistance value was measured at a temperature of 60 ° C. and a humidity of 90 to 95%. FIG. 8 shows the change in the conduction resistance value by changing the ambient temperature to −30 ° C. and + 80 ° C. every 30 minutes. The result of the temperature shock test which measured is shown. In each of the figures, the broken line of the cross mark indicates the conventional example.
【００１１】上記各試験で分かるように、従来の方法を
用いてフレキシブル基板２００の電極パターン２０１，
２０１をチップ型発光素子２２０の電極部２２１，２２
１に接続した場合は、経時的に該接続部分の導通抵抗値
が上昇して行き、その電気的接続状態が劣化していくこ
とが分かる。As can be seen from the above tests, the electrode pattern 201 of the flexible substrate 200,
201 is an electrode part 221 or 22 of the chip type light emitting device 220.
It can be seen that when connected to No. 1, the conduction resistance value of the connection portion increases with time and the electrical connection state deteriorates.
【００１２】これは上記従来例に以下のような欠点があ
るためと考えられる。 上記従来例においては、電極パターン２０１，２０１
に電極部２２１，２２１を接続するのに熱硬化型の導電
性接着剤２０３，２０３を用いているが、この導電性接
着剤２０３，２０３は、上記説明からも分かるように、
ウエットな状態でその上にこれを覆うようにチップ型発
光素子２２０が載置され、その後これを加熱などするも
のであるため、該チップ型発光素子２２０が溶剤揮発の
邪魔をして、導電性接着剤２０３，２０３の表面の溶剤
は揮発して硬化してもその内部の溶剤まではなかなか揮
発しにくい。つまりこの従来例は構造的に導電性接着剤
２０３，２０３中の溶剤が揮発しにくい構造になってお
り、その接続信頼性が低い。It is considered that this is because the above conventional example has the following drawbacks. In the above conventional example, the electrode patterns 201, 201
The thermosetting conductive adhesives 203, 203 are used to connect the electrode portions 221 and 221 to the conductive adhesives 203, 203. As will be understood from the above description, the conductive adhesives 203, 203 are:
Since the chip-type light emitting element 220 is placed on top of it in a wet state so as to cover it, and then the chip-type light emitting element 220 is heated, the chip-type light emitting element 220 interferes with the volatilization of the solvent and becomes conductive. Even if the solvent on the surface of the adhesive 203, 203 is volatilized and hardened, even the solvent inside is hard to volatilize. That is, this conventional example has a structure in which the solvent in the conductive adhesives 203, 203 is less likely to volatilize, and its connection reliability is low.
【００１３】図１２はチップ型発光素子２２０の電極
部２２１の下端角部を拡大して示す図（図１１に示すＡ
部分の拡大図）である。同図に示すように、チップ型発
光素子２２０の電極部２２１の両側面下端辺２２１ａ，
２２１ａには、下方向に向かってバリ２２３，２２３が
突出していることが多い。FIG. 12 is an enlarged view showing a lower end corner portion of the electrode portion 221 of the chip type light emitting device 220 (A shown in FIG. 11).
It is an enlarged view of a portion). As shown in the figure, the lower end sides 221a of both side surfaces of the electrode portion 221 of the chip type light emitting device 220,
Burrs 223 and 223 often project downward from 221a.
【００１４】これはチップ型発光素子２２０（他のチッ
プ型電子部品も同様）は、通常図１１に示すように、棒
状の素材２３０をカッタ２３５によって切断してチップ
状に製造していくのであるが、この電極部２２１は例え
ば銅箔にニッケル下地の金メッキを施して形成されてお
り軟らかいものなので、該カッタ２３５による切断方向
にバリ２２３，２２３が突出し易いためである。This is because the chip type light emitting device 220 (similarly to other chip type electronic parts) is usually manufactured by cutting a rod-shaped material 230 by a cutter 235 as shown in FIG. This is because the electrode portion 221 is made of, for example, a copper foil plated with gold of nickel undercoat and is soft, so that the burrs 223 and 223 easily project in the cutting direction of the cutter 235.
【００１５】そしてこのチップ型発光素子２２０をフレ
キシブル基板２００上に載置したとき、このバリ２２
３，２２３の先端がフレキシブル基板２００の電極パタ
ーン２０１，２０１上に載置されるため、チップ型発光
素子２２０の電極部２２１，２２１の下面全体が電極パ
ターン２０１，２０１上に当接せず、一部離間してしま
う。When the chip type light emitting device 220 is placed on the flexible substrate 200, the burr 22
Since the tips of the electrodes 3, 223 are placed on the electrode patterns 201, 201 of the flexible substrate 200, the entire lower surfaces of the electrode portions 221, 221 of the chip-type light emitting device 220 do not contact the electrode patterns 201, 201, Partly separated.
【００１６】このため両者間の接続状態が確実とは言え
ず、そのためその電気的接続状態を経時的に悪化させる
ことを助長してしまう。For this reason, the connection state between the two cannot be said to be reliable, and therefore the deterioration of the electrical connection state over time is promoted.
【００１７】本発明は上述の点に鑑みてなされたもので
ありその目的は、基板上にチップ型電子部品を電気的に
確実に接続でき、その導通抵抗値が経時的にほとんど増
加することがない基板へのチップ型電子部品の取付方法
を提供することにある。The present invention has been made in view of the above points, and an object thereof is to be able to electrically and reliably connect a chip-type electronic component on a substrate and to increase its conduction resistance value with time. An object of the present invention is to provide a method for attaching a chip-type electronic component to an empty substrate.
【００１８】[0018]
【課題を解決するための手段】上記問題点を解決するた
め本発明は、表面に直接露出するように電極端子を設け
たチップ型電子部品と、上面に端子パターンを設けた基
板とを用意し、前記基板の端子パターン上に異方性のホ
ットメルトタイプの導電性接着剤を印刷して乾燥する第
１工程と、前記チップ型電子部品を基板上に載置して、
その電極端子を前記基板に印刷した端子パターンの真上
の導電性接着剤上に接続せしめる第２工程と、前記チッ
プ型電子部品と前記基板間をヒートプレスによって所定
の温度と圧力で加熱・加圧して前記導電性接着剤を溶か
して前記チップ型電子部品の電極端子と前記基板の端子
パターン間を接続せしめる第３工程とを具備して構成し
た。In order to solve the above problems, the present invention provides a chip type electronic component provided with electrode terminals so as to be directly exposed on the surface, and a substrate provided with a terminal pattern on the upper surface. A first step of printing an anisotropic hot-melt type conductive adhesive on the terminal pattern of the substrate and drying, and placing the chip-type electronic component on the substrate,
The second step of connecting the electrode terminals to a conductive adhesive directly above the terminal pattern printed on the substrate, and heating and applying a heat press between the chip type electronic component and the substrate at a predetermined temperature and pressure. A third step of applying pressure to melt the conductive adhesive to connect between the electrode terminals of the chip-type electronic component and the terminal patterns of the substrate is configured.
【００１９】[0019]
【作用】導電性接着剤はホットメルトタイプのため、そ
の上にチップ型電子部品を載置する前に乾燥できるの
で、その表面を何ものにも覆われておらず、溶剤の揮発
は容易で、導電性接着剤内部の溶剤も短時間で容易に完
全に揮発する。従って、基板上にチップ型電子部品を電
気的，機械的に確実に接続でき、経時的にもその良好な
接続状態を維持できる。[Function] Since the conductive adhesive is a hot melt type, it can be dried before mounting the chip type electronic parts on it, so the surface is not covered with anything and the solvent can be easily volatilized. The solvent inside the conductive adhesive can be easily volatilized completely in a short time. Therefore, the chip-type electronic component can be reliably electrically and mechanically connected to the substrate, and the good connection state can be maintained over time.
【００２０】[0020]
【実施例】以下、本発明の実施例を図面に基づいて詳細
に説明する。図１乃至図５は本発明にかかる基板へのチ
ップ型電子部品の取付方法を示す図である。以下その製
造手順を順に説明する。Embodiments of the present invention will now be described in detail with reference to the drawings. 1 to 5 are views showing a method of attaching a chip type electronic component to a substrate according to the present invention. The manufacturing procedure will be described below in order.
【００２１】〔第１工程〕まず図１に示すように、可撓
性を有する合成樹脂フイルム（例えばポリエチレンテレ
フタレートフイルム）１１上に、銀ペースト等をスクリ
ーン印刷することによって回路パターン１３，１３を形
成したフレキシブル基板１０を用意する。なお回路パタ
ーン１３，１３の端部には端子パターン１４，１４が形
成されている。[First Step] First, as shown in FIG. 1, circuit patterns 13 and 13 are formed by screen-printing a silver paste or the like on a flexible synthetic resin film (for example, polyethylene terephthalate film) 11. The flexible substrate 10 is prepared. Terminal patterns 14, 14 are formed at the ends of the circuit patterns 13, 13.
【００２２】そして図２に示すように、端子パターン１
４，１４上を覆うように、異方性のホットメルトタイプ
の導電性接着剤１５をスクリーン印刷する。この導電性
接着剤１５は、ポリエステル系熱可塑性樹脂（熱可塑性
の樹脂であれば他の樹脂でも良い）の中に金属粉（例え
ば銅粉，銀粉）と溶剤を混入したものを用いている。Then, as shown in FIG. 2, the terminal pattern 1
Anisotropic hot-melt type conductive adhesive 15 is screen-printed so as to cover 4,4 and 14. As the conductive adhesive 15, a polyester-based thermoplastic resin (other resin may be used as long as it is a thermoplastic resin) mixed with metal powder (for example, copper powder, silver powder) and a solvent is used.
【００２３】そしてこの導電性接着剤１５を１５０℃の
雰囲気中に５分間置き、該導電性接着剤１５中の溶剤を
揮発させ乾燥させる。このとき導電性接着剤１５は、そ
の表面を何ものにも覆われていないので、溶剤の揮発は
容易で、導電性接着剤１５内部の溶剤も短時間で容易に
完全に揮発する。Then, the conductive adhesive 15 is placed in an atmosphere of 150 ° C. for 5 minutes to evaporate the solvent in the conductive adhesive 15 and dry it. At this time, since the surface of the conductive adhesive 15 is not covered with anything, it is easy to volatilize the solvent, and the solvent inside the conductive adhesive 15 is also easily completely evaporated in a short time.
【００２４】〔第２工程〕次に図３に示すように、チッ
プ型発光素子５０をフレキシブル基板１０上に載置す
る。[Second Step] Next, as shown in FIG. 3, the chip type light emitting device 50 is mounted on the flexible substrate 10.
【００２５】ここでチップ型発光素子５０は、その両側
面から下面にかけてその表面に直接露出するように電極
端子５１，５１が設けられている。なおこの実施例に用
いているチップ型発光素子５０の縦×横×高さ寸法は、
１．６×０．８×０．８mmである。Here, the chip type light emitting device 50 is provided with electrode terminals 51, 51 so as to be exposed directly from the both side surfaces to the lower surface thereof. The length × width × height dimensions of the chip type light emitting device 50 used in this embodiment are
It is 1.6 × 0.8 × 0.8 mm.
【００２６】そしてこれら電極端子５１，５１は、それ
ぞれ前記フレキシブル基板１０に印刷した端子パターン
１４，１４の真上の導電性接着剤１５上に位置する。The electrode terminals 51, 51 are located on the conductive adhesive 15 just above the terminal patterns 14, 14 printed on the flexible substrate 10, respectively.
【００２７】〔第３工程〕次に図４に示すように、チッ
プ型発光素子５０の上面をゴム性の支持部材４１に当接
した上で、フレキシブル基板１０の下面にヒートプレス
４３を押し付け、矢印で示すように上方向に押し付ける
ことによって、異方性のホットメルトタイプの導電性接
着剤１５を溶かして加圧し、これによって電極端子５
１，５１と端子パターン１４，１４間を電気的、機械的
に強固に固定する。[Third Step] Next, as shown in FIG. 4, the upper surface of the chip-type light-emitting element 50 is brought into contact with the rubber supporting member 41, and the heat press 43 is pressed against the lower surface of the flexible substrate 10. By pressing upward as indicated by the arrow, the anisotropic hot-melt type conductive adhesive 15 is melted and pressed, whereby the electrode terminal 5 is pressed.
1, 51 and the terminal patterns 14, 14 are firmly fixed electrically and mechanically.
【００２８】ところでこの実施例においては、前記ヒー
トプレス４３によるプレス圧力を６００（ｇ／１チッ
プ）とした。このプレス圧力は、前記図１２に示すバリ
２２３，２２３を押し潰してしまうに充分な圧力であ
り、且つ、チップ型発光素子５０を破壊しない圧力であ
る。By the way, in this embodiment, the pressure applied by the heat press 43 was set to 600 (g / 1 chip). This pressing pressure is a pressure sufficient to crush the burrs 223 and 223 shown in FIG. 12 and is a pressure that does not destroy the chip-type light emitting element 50.
【００２９】なお例えば前記プレス圧力を２〜３００
（ｇ／１チップ）とした場合は、前記バリ２２３，２２
３は潰れなかった。For example, the pressing pressure is set to 2 to 300.
(G / 1 chip), the burrs 223, 22
3 did not collapse.
【００３０】このようにヒートプレス４３のプレス圧力
を、チップ型発光素子５０の電極端子５１，５１の下面
から突出するバリ２２３，２２３を押し潰してしまうに
充分な圧力とすることにより、該バリ２２３，２２３は
フレキシブル基板１０の端子パターン１４，１４上で潰
れてしまう。As described above, the pressing pressure of the heat press 43 is set to a pressure sufficient to crush the burrs 223 and 223 protruding from the lower surfaces of the electrode terminals 51 and 51 of the chip-type light emitting device 50, whereby the burrs are pressed. 223 and 223 are crushed on the terminal patterns 14 and 14 of the flexible substrate 10.
【００３１】これによって電極端子５１，５１の下面
は、端子パターン１４，１４の面に接触するか、または
極めて接近するので、その電気的接続は確実になる。As a result, the lower surfaces of the electrode terminals 51, 51 are brought into contact with or extremely close to the surfaces of the terminal patterns 14, 14 so that their electrical connection is ensured.
【００３２】〔第４工程〕そして図５に示すように、チ
ップ型発光素子５０の上に、これを封止するように、Ｕ
Ｖ硬化型（紫外線硬化型）の絶縁接着剤６０をたらして
封止し、その後これをＵＶ炉に入れて紫外線を照射し、
固化させる。[Fourth Step] Then, as shown in FIG. 5, U is formed on the chip type light emitting device 50 so as to seal it.
A V-curing (ultraviolet-curing) insulating adhesive 60 is poured and sealed, and then placed in a UV furnace and irradiated with ultraviolet rays,
Let it solidify.
【００３３】これによってチップ型発光素子５０のフレ
キシブル基板１０への取付が完了する。This completes the attachment of the chip type light emitting device 50 to the flexible substrate 10.
【００３４】なお上記実施例においては最後の工程にお
いてチップ型発光素子５０を絶縁接着剤６０によって封
止したが、チップ型発光素子５０の電気的、機械的接続
は第３工程までで充分であり、第４工程は必ずしも必要
ではない。Although the chip type light emitting device 50 is sealed with the insulating adhesive 60 in the last step in the above-described embodiment, the electrical and mechanical connection of the chip type light emitting device 50 is sufficient up to the third step. The fourth step is not always necessary.
【００３５】そしてこの実施例による環境試験の結果
が、前述の図６乃至図８に四角マークの実線で示されて
いる。これらの図に示すように、耐熱、耐湿、温度ショ
ックのいずれの試験においても、前記従来例と相違し、
経時的にほとんどその導通抵抗値が増加しないことが確
認できた。The results of the environmental test according to this embodiment are shown by solid lines of square marks in FIGS. 6 to 8 described above. As shown in these figures, in any of heat resistance, humidity resistance, and temperature shock tests, different from the conventional example,
It was confirmed that the conduction resistance value hardly increased with time.
【００３６】これは前述のように、接着剤として異方性
のホットメルトタイプの導電性接着剤１５を用いたの
で、導電性接着剤１５内の溶剤をその上にチップ型発光
素子５０を載置する前に揮発させることができその揮発
が完全に行なわれてその内部に溶剤が残らず、導電性接
着剤１５による電気的接続が溶剤に邪魔されず、確実に
行なわれるからであり、また上記実施例の場合は特に、
ヒートプレス４３のプレス圧力を、チップ型発光素子５
０の電極端子５１，５１の下面から突出するバリ２２
３，２２３を押し潰してしまうに充分な圧力としたの
で、該バリ２２３，２２３は潰れ、電極端子５１，５１
の下面が端子パターン１４，１４の面に接触、または極
めて接近し、これによってさらにその電気的接続が確実
になったためである。As described above, since the anisotropic hot melt type conductive adhesive 15 is used as the adhesive as described above, the solvent in the conductive adhesive 15 is placed on the chip type light emitting device 50. This is because it can be volatilized before being placed, and the volatilization is completely performed so that the solvent does not remain inside, and the electric connection by the conductive adhesive 15 is surely performed without being disturbed by the solvent. Particularly in the case of the above embodiment,
The press pressure of the heat press 43 is set to the chip type light emitting device 5.
Burr 22 protruding from the lower surface of the electrode terminals 51, 51 of 0
Since the pressure is set to be sufficient to crush the electrodes 3, 223, the burrs 223, 223 are crushed and the electrode terminals 51, 51 are crushed.
This is because the lower surface of the above contacts or comes very close to the surfaces of the terminal patterns 14 and 14, thereby further ensuring the electrical connection.
【００３７】また図９は、前記図１０に示す方法によっ
てフレキシブル基板２００上に取り付けたチップ型発光
素子２２０と、上記実施例の方法によってフレキシブル
基板１０上に取り付けたチップ型発光素子５０の接着強
度試験の結果を示す図である。この実験は、接着したチ
ップ型発光素子の側面から力を加えてチップ型発光素子
が基板から剥がれるときの力を測定したものである。FIG. 9 shows the adhesive strength between the chip type light emitting device 220 mounted on the flexible substrate 200 by the method shown in FIG. 10 and the chip type light emitting device 50 mounted on the flexible substrate 10 by the method of the above embodiment. It is a figure which shows the result of a test. In this experiment, a force was applied from the side surface of the bonded chip type light emitting element to measure the force when the chip type light emitting element was peeled from the substrate.
【００３８】同図に示すように両者の接着強度は略同一
で、本発明によって接着したチップ型発光素子の機械的
強度には何ら問題ないことが分かる。As shown in the figure, the adhesive strengths of the two are substantially the same, and it can be seen that there is no problem in the mechanical strength of the chip type light emitting device bonded according to the present invention.
【００３９】以上本発明の１実施例を説明したが、本発
明はこの実施例に限定されず、例えば以下のような変形
が可能である。 基板は硬質基板であっても良い。Although one embodiment of the present invention has been described above, the present invention is not limited to this embodiment and the following modifications are possible. The substrate may be a hard substrate.
【００４０】チップ型電子部品は発光素子に限定され
ず、チップ型であれば、抵抗，コンデンサなど他のいず
れの電子部品でもよい。The chip type electronic component is not limited to the light emitting element, and may be any other electronic component such as a resistor or a capacitor as long as it is a chip type.
【００４１】フレキシブル基板上に設けた端子パター
ンはどのような方法・材料によって形成されたものでも
良く、エッチングによって形成された銅貼り箔からなる
パターンでもよい。The terminal pattern provided on the flexible substrate may be formed by any method and material, or may be a pattern made of a copper-clad foil formed by etching.
【００４２】[0042]
【発明の効果】以上詳細に説明したように本発明によれ
ば、導電性接着剤を完全に乾燥させた上にチップ型発光
素子を取り付けるので、基板上にチップ型電子部品を電
気的，機械的に確実に接続でき、経時的にもその良好な
接続状態を維持できるという優れた効果を有する。特
に、ヒートプレスの加圧圧力を、チップ型電子部品の電
極端子の下面辺から下方向に突出するバリを押し潰して
しまうに充分な圧力とした場合は、電極端子の端子パタ
ーンへの接続がさらに確実となり、さらに良好な接続状
態が得られる。As described in detail above, according to the present invention, since the chip type light emitting device is mounted after the conductive adhesive is completely dried, the chip type electronic component is electrically and mechanically mounted on the substrate. It has an excellent effect that it can be surely connected and that the good connection state can be maintained over time. In particular, if the pressure applied by the heat press is sufficient to crush the burrs protruding downward from the lower surface of the electrode terminal of the chip-type electronic component, the connection of the electrode terminal to the terminal pattern It becomes more reliable, and a better connection state can be obtained.
【図１】図１（ａ），（ｂ）は本発明にかかる基板への
チップ型電子部品の取付方法を示す図である。1A and 1B are views showing a method of mounting a chip-type electronic component on a substrate according to the present invention.
【図２】図２（ａ），（ｂ）は本発明にかかる基板への
チップ型電子部品の取付方法を示す図である。2 (a) and 2 (b) are views showing a method for mounting a chip-type electronic component on a substrate according to the present invention.
【図３】図３（ａ），（ｂ）は本発明にかかる基板への
チップ型電子部品の取付方法を示す図である。3 (a) and 3 (b) are views showing a method for mounting a chip-type electronic component on a substrate according to the present invention.
【図４】図４は本発明にかかる基板へのチップ型電子部
品の取付方法を示す図である。FIG. 4 is a diagram showing a method of mounting a chip-type electronic component on a substrate according to the present invention.
【図５】図５（ａ），（ｂ）は本発明にかかる基板への
チップ型電子部品の取付方法を示す図である。5 (a) and 5 (b) are views showing a method of mounting a chip-type electronic component on a substrate according to the present invention.
【図６】従来例と本発明にかかる実施例の耐熱試験の結
果を示す図である。FIG. 6 is a diagram showing the results of heat resistance tests of a conventional example and an example according to the present invention.
【図７】従来例と本発明にかかる実施例の耐湿試験の結
果を示す図である。FIG. 7 is a diagram showing a result of a moisture resistance test of a conventional example and an example according to the present invention.
【図８】従来例と本発明にかかる実施例の温度ショック
試験の結果を示す図である。FIG. 8 is a diagram showing results of a temperature shock test of a conventional example and an example according to the present invention.
【図９】従来例と本発明の実施例にかかる接着強度試験
の結果を示す図である。FIG. 9 is a diagram showing a result of an adhesive strength test according to a conventional example and an example of the present invention.
【図１０】フレキシブル基板２００上にチップ型発光素
子２２０を取り付ける従来の方法を示す図である。FIG. 10 is a view showing a conventional method of mounting the chip type light emitting device 220 on the flexible substrate 200.
【図１１】チップ型発光素子２２０の製造方法を示す図
である。FIG. 11 is a diagram showing a method of manufacturing the chip-type light emitting device 220.
【図１２】電極部２２１の部分拡大図である。FIG. 12 is a partially enlarged view of an electrode portion 221.
１０ フレキシブル基板 １４，１４ 端子パターン １５ 導電性接着剤 ４３ ヒートプレス ５０ チップ型発光素子（チップ型電子部品） ５１，５１ 電極端子 10 flexible substrate 14, 14 terminal pattern 15 conductive adhesive 43 heat press 50 chip type light emitting element (chip type electronic component) 51, 51 electrode terminal
Claims (2)
けたチップ型電子部品と、上面に端子パターンを設けた
基板とを用意し、 前記基板の端子パターン上に異方性のホットメルトタイ
プの導電性接着剤を印刷して乾燥する第１工程と、 前記チップ型電子部品を基板上に載置して、その電極端
子を前記基板に印刷した端子パターンの真上の導電性接
着剤上に接続せしめる第２工程と、 前記チップ型電子部品と前記基板間をヒートプレスによ
って所定の温度と圧力で加熱・加圧して前記導電性接着
剤を溶かして前記チップ型電子部品の電極端子と前記基
板の端子パターン間を接続せしめる第３工程とを具備す
ることを特徴とする基板へのチップ型電子部品の取付方
法。1. A chip type electronic component provided with electrode terminals so as to be directly exposed on the surface and a substrate provided with a terminal pattern on the upper surface are prepared, and an anisotropic hot melt type is provided on the terminal pattern of the substrate. First step of printing and drying the conductive adhesive of, and placing the chip-type electronic component on a substrate and placing the electrode terminals on the conductive adhesive directly above the terminal pattern printed on the substrate. And a second step of connecting the chip-type electronic component and the substrate with a heat press at a predetermined temperature and pressure by a heat press to melt the conductive adhesive and the electrode terminal of the chip-type electronic component and the A third step of connecting between the terminal patterns of the board, the method for mounting the chip-type electronic component on the board.
品への加圧圧力は、該チップ型電子部品の電極端子の下
面辺から下方向に突出するバリを押し潰してしまうに充
分な圧力であることを特徴とする請求項１記載の基板へ
のチップ型電子部品の取付方法。2. The pressure applied to the chip-type electronic component by the heat press is sufficient to crush the burrs protruding downward from the lower surface sides of the electrode terminals of the chip-type electronic component. A method of mounting a chip-type electronic component on a substrate according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15991395A JPH08330712A (en) | 1995-06-01 | 1995-06-01 | Method of fitting electronic chip part to substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15991395A JPH08330712A (en) | 1995-06-01 | 1995-06-01 | Method of fitting electronic chip part to substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08330712A true JPH08330712A (en) | 1996-12-13 |
Family
ID=15703901
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15991395A Pending JPH08330712A (en) | 1995-06-01 | 1995-06-01 | Method of fitting electronic chip part to substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08330712A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016127052A (en) * | 2014-12-26 | 2016-07-11 | 日亜化学工業株式会社 | Light emission device and mounting method for the same, and method of manufacturing light source device |
| JP2017169791A (en) * | 2016-03-23 | 2017-09-28 | 旭化成株式会社 | Potential measuring device |
| JPWO2020012626A1 (en) * | 2018-07-13 | 2021-02-15 | 株式会社Ｆｕｊｉ | Circuit formation method and circuit formation device |
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|---|---|---|---|---|
| JPS61186061A (en) * | 1985-02-13 | 1986-08-19 | Fuji Xerox Co Ltd | Device for driving contact type image sensor or thermal head or the like |
| JPH01143291A (en) * | 1987-11-28 | 1989-06-05 | Toshiba Corp | Equipment for applying conductive paste to electronic parts |
| JPH03104297A (en) * | 1989-09-19 | 1991-05-01 | Omron Corp | Composite molding electronic circuit device and manufacture thereof |
| JPH0435000A (en) * | 1990-05-31 | 1992-02-05 | Minnesota Mining & Mfg Co <3M> | Mounting of chip parts on circuit board |
| JPH04184887A (en) * | 1990-11-16 | 1992-07-01 | Citizen Watch Co Ltd | Connecting method and its device |
| JPH06152113A (en) * | 1992-10-31 | 1994-05-31 | Taiyo Yuden Co Ltd | Mounting method for electronic component and conductive adhesive used therefor |
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1995
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Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61186061A (en) * | 1985-02-13 | 1986-08-19 | Fuji Xerox Co Ltd | Device for driving contact type image sensor or thermal head or the like |
| JPH01143291A (en) * | 1987-11-28 | 1989-06-05 | Toshiba Corp | Equipment for applying conductive paste to electronic parts |
| JPH03104297A (en) * | 1989-09-19 | 1991-05-01 | Omron Corp | Composite molding electronic circuit device and manufacture thereof |
| JPH0435000A (en) * | 1990-05-31 | 1992-02-05 | Minnesota Mining & Mfg Co <3M> | Mounting of chip parts on circuit board |
| JPH04184887A (en) * | 1990-11-16 | 1992-07-01 | Citizen Watch Co Ltd | Connecting method and its device |
| JPH06152113A (en) * | 1992-10-31 | 1994-05-31 | Taiyo Yuden Co Ltd | Mounting method for electronic component and conductive adhesive used therefor |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016127052A (en) * | 2014-12-26 | 2016-07-11 | 日亜化学工業株式会社 | Light emission device and mounting method for the same, and method of manufacturing light source device |
| JP2017169791A (en) * | 2016-03-23 | 2017-09-28 | 旭化成株式会社 | Potential measuring device |
| JPWO2020012626A1 (en) * | 2018-07-13 | 2021-02-15 | 株式会社Ｆｕｊｉ | Circuit formation method and circuit formation device |
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