JP2002057423A - Circuit board using conductive paste, and its manufacturing method - Google Patents
Circuit board using conductive paste, and its manufacturing methodInfo
- Publication number
- JP2002057423A JP2002057423A JP2000238754A JP2000238754A JP2002057423A JP 2002057423 A JP2002057423 A JP 2002057423A JP 2000238754 A JP2000238754 A JP 2000238754A JP 2000238754 A JP2000238754 A JP 2000238754A JP 2002057423 A JP2002057423 A JP 2002057423A
- Authority
- JP
- Japan
- Prior art keywords
- conductive paste
- circuit pattern
- circuit board
- electronic component
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0248—Needles or elongated particles; Elongated cluster of chemically bonded particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、導電性ペーストに
より樹脂基板上に回路パターンを形成して回路基板を構
成する導電性ペーストを用いた回路基板に関するもので
ある。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board using a conductive paste for forming a circuit pattern on a resin substrate by using a conductive paste.
【０００２】[0002]
【従来の技術】回路基板は一般的に、絶縁性樹脂に銅箔
を貼着した基板からエッチングにより銅箔を所望の回路
パターンに形成し、回路パターンの所定位置に電子部品
をハンダ付けによって接続することにより製造される。
前記ハンダ付けはリフローハンダ付け等によりなされる
ため、基板や電子部品の耐熱性が要求され、回路基板の
コストアップとなる課題があった。2. Description of the Related Art In general, a circuit board is formed by etching a copper foil into a desired circuit pattern from a substrate having an insulating resin to which a copper foil is adhered, and connecting electronic parts to predetermined positions of the circuit pattern by soldering. It is manufactured by doing.
Since the soldering is performed by reflow soldering or the like, heat resistance of the substrate or the electronic component is required, and there is a problem that the cost of the circuit board increases.
【０００３】[0003]
【発明が解決しようとする課題】基板や電子部品に高温
を加えることなく回路基板を構成する手段として、導電
性ペーストにより回路パターンを形成することが試みら
れているが、従来の導電性ペーストは導電抵抗が高く、
長い距離のパターンを形成することができず、スルーホ
ールの導通や短い距離の接続などに限られたものであっ
た。As a means for forming a circuit board without applying a high temperature to a substrate or an electronic component, an attempt has been made to form a circuit pattern using a conductive paste. High conductive resistance,
A pattern over a long distance cannot be formed, and the method is limited to conduction of a through hole and connection at a short distance.
【０００４】本発明が目的とするところは、導電性ペー
ストを用いて基板上に回路パターンを形成すると共に電
子部品の接続固定を行い得る導電性ペーストを用いた回
路基板とその製造方法を提供することにある。An object of the present invention is to provide a circuit board using a conductive paste capable of forming a circuit pattern on the board using the conductive paste and connecting and fixing an electronic component, and a method of manufacturing the same. It is in.
【０００５】[0005]
【課題を解決するための手段】上記目的を達成するため
の本願の第１発明に係る導電性ペーストを用いた回路基
板は、導電体として針状銀を含有し、硬化温度が１３０
℃以下の熱硬化型の導電性ペーストを用いて絶縁性樹脂
基板上に回路パターンが形成され、回路パターン上の所
定位置に配置された電子部品が導電性ペーストの硬化に
より回路パターンに接続及び固定されてなることを特徴
とするもので、導電体として針状銀が含有されているこ
とにより導通抵抗が低く、長い距離の回路パターンを形
成することができる。また、硬化温度が低いため基板の
耐熱性を考慮することがなく安価な材質のものを適用す
ることができる。また、耐熱温度の低い電子部品を用い
ることができ、電子部品は導電性ペーストの硬化により
回路パターンに接続固定することができる。A circuit board using a conductive paste according to the first invention of the present application for achieving the above object contains acicular silver as a conductor and has a curing temperature of 130 ° C.
A circuit pattern is formed on an insulating resin substrate using a thermosetting conductive paste at a temperature of less than or equal to ℃, and electronic components arranged at predetermined positions on the circuit pattern are connected and fixed to the circuit pattern by curing the conductive paste. Since the conductive material contains needle-shaped silver, the conductive resistance is low and a long circuit pattern can be formed. In addition, since the curing temperature is low, it is possible to use an inexpensive material without considering the heat resistance of the substrate. Further, an electronic component having a low heat-resistant temperature can be used, and the electronic component can be connected and fixed to the circuit pattern by curing the conductive paste.
【０００６】また、本願の第２発明に係る導電性ペース
トを用いた回路基板は、導電体として針状銀を含有し、
蒸乾型の導電性ペーストを用いて絶縁性樹脂基板上に回
路パターンが形成され、回路パターン上の所定位置に配
置された電子部品が導電性ペーストの硬化により回路パ
ターンに接続及び固定されてなることを特徴とするもの
で、導電性ペーストとして蒸乾により硬化する蒸乾型を
用いることにより加熱工程を経ることなく回路パターン
の形成と電子部品の接続固定とを行うことができる。The circuit board using the conductive paste according to the second invention of the present application contains acicular silver as a conductor,
A circuit pattern is formed on an insulating resin substrate using a vapor-deposited conductive paste, and electronic components arranged at predetermined positions on the circuit pattern are connected and fixed to the circuit pattern by curing of the conductive paste. By using a steam-drying type which is hardened by steam-drying as the conductive paste, a circuit pattern can be formed and electronic components can be connected and fixed without a heating step.
【０００７】また、本願の第３発明に係る導電性ペース
トを用いた回路基板は、導電体として針状銀を含有し、
紫外線硬化型の導電性ペーストを用いて絶縁性樹脂基板
上に回路パターンが形成され、回路パターン上の所定位
置に配置された電子部品が導電性ペーストの硬化により
回路パターンに接続及び固定されてなることを特徴とす
るもので、紫外線硬化型の導電性ペーストを用いること
により、加熱工程を経ることなく回路パターンの形成と
電子部品の接続固定とを行うことができる。A circuit board using the conductive paste according to the third invention of the present application contains acicular silver as a conductor,
A circuit pattern is formed on an insulating resin substrate using an ultraviolet-curable conductive paste, and electronic components arranged at predetermined positions on the circuit pattern are connected and fixed to the circuit pattern by curing the conductive paste. By using an ultraviolet-curable conductive paste, formation of a circuit pattern and connection and fixing of electronic components can be performed without a heating step.
【０００８】上記各発明において、絶縁性樹脂基板は、
スチレン系樹脂もしくはポリエステル系樹脂のように耐
熱温度の低い材質で構成することが可能で、回路基板を
安価に製造することができる。In each of the above inventions, the insulating resin substrate is
It can be made of a material having a low heat-resistant temperature, such as a styrene-based resin or a polyester-based resin, and a circuit board can be manufactured at low cost.
【０００９】また、本願の第４発明に係る導電性ペース
トを用いた回路基板の製造方法は、絶縁性樹脂基板上に
導電性ペーストにより回路パターンを印刷し、回路パタ
ーンの所定位置に電子部品を配置し、導電性ペーストを
硬化させて回路パターンを固化させ、回路パターンに電
子部品を接続及び固定することを特徴とするもので、ス
クリーン印刷等の手段により基板上に導電性ペーストに
より回路パターンを描き、回路パターンの所定位置に電
子部品を配置して導電性ペーストを硬化させると、ハン
ダ付けすることなく電子部品は回路パターンに接続され
ると同時に基板に固定される。Further, according to a method of manufacturing a circuit board using a conductive paste according to a fourth aspect of the present invention, a circuit pattern is printed on an insulating resin substrate by a conductive paste, and an electronic component is placed at a predetermined position of the circuit pattern. It is characterized by placing, curing the conductive paste to solidify the circuit pattern, connecting and fixing electronic components to the circuit pattern, and forming the circuit pattern on the substrate by means of screen printing or the like using the conductive paste. When drawing and arranging the electronic component at a predetermined position of the circuit pattern and curing the conductive paste, the electronic component is connected to the circuit pattern and fixed to the substrate without soldering.
【００１０】また、本願の第５発明に係る導電性ペース
トを用いた回路基板の製造方法は、絶縁性樹脂基板上に
導電性ペーストにより回路パターンを印刷し、導電性ペ
ーストを硬化させて回路パターンを固化させ、回路パタ
ーン上の電子部品実装位置に導電性ペーストを印刷し、
この導電性ペースト上に電子部品を配置し、導電性ペー
ストを硬化させて回路パターンに電子部品を接続及び固
定することを特徴とするもので、先に回路パターンの形
状に印刷した導電性ペーストを硬化させて回路パターン
を形成し、その後に電子部品実装位置に導電性ペースト
を印刷する。最初の導電性ペーストにより従来の銅箔を
エッチングした基板と同様の回路パターンが形成され、
従来のハンダ付けに代わるものとして導電性ペーストに
よる電子部品の回路パターンへの接合がなされる。The method of manufacturing a circuit board using a conductive paste according to the fifth invention of the present application is a method of printing a circuit pattern on a insulating resin substrate using a conductive paste, and curing the conductive paste. Solidified, printed conductive paste on the electronic component mounting position on the circuit pattern,
An electronic component is placed on this conductive paste, and the conductive paste is cured to connect and fix the electronic component to the circuit pattern. After curing, a circuit pattern is formed, and thereafter, a conductive paste is printed on the electronic component mounting position. A circuit pattern similar to that of a conventional copper foil etched substrate is formed by the first conductive paste,
As an alternative to the conventional soldering, bonding of an electronic component to a circuit pattern by a conductive paste is performed.
【００１１】[0011]
【発明の実施の形態】以下、添付図面を参照して本発明
の実施形態について説明し、本発明の理解に供する。
尚、以下に示す実施形態は本発明を具体化した一例であ
って、本発明の技術的範囲を限定するものではない。Embodiments of the present invention will be described below with reference to the accompanying drawings to provide an understanding of the present invention.
The embodiment described below is an example embodying the present invention, and does not limit the technical scope of the present invention.
【００１２】本実施形態は、機器の少ないスペースに回
路基板を配置することができるように折り曲げ可能な回
路基板を構成するために、絶縁性樹脂フィルムを基板と
して、この表面に導電性ペーストにより回路パターンを
形成した例を示すものである。In this embodiment, in order to construct a bendable circuit board so that the circuit board can be arranged in a small space of equipment, an insulating resin film is used as a substrate, and a circuit is formed on the surface of the circuit board by a conductive paste. It shows an example in which a pattern is formed.
【００１３】図１は、第１の実施形態に係る回路基板の
製造手順を示すもので、（ａ）〜（ｅ）の順を追って説
明する。FIG. 1 shows a manufacturing procedure of the circuit board according to the first embodiment, which will be described in the order of (a) to (e).
【００１４】まず、図１（ａ）に示すように、樹脂フィ
ルム５の一面にスクリーン印刷により導電性ペースト４
を回路パターンの形状に印刷する。前記樹脂フィルム５
は、安価なスチレン系樹脂で構成されたもので、屈曲性
を重視する場合は１００μｍ以下のフィルムを用いる
が、屈曲の曲率を問わない場合は、可能な限り厚い方が
配線の信頼性を保つには好適である。通常は５０μｍか
ら１００μｍの厚さが望ましく、コシが要求される場合
にはＰＥＴフィルムを用いると好適である。本実施形態
においては、クラレプラスチック株式会社製のハイブラ
ーフィルムＰＶ−４０７を用いている。First, as shown in FIG. 1A, a conductive paste 4 is formed on one surface of a resin film 5 by screen printing.
Is printed in the shape of the circuit pattern. The resin film 5
Is made of an inexpensive styrene-based resin. A film having a thickness of 100 μm or less is used when importance is placed on the flexibility. Is preferred. Usually, a thickness of 50 μm to 100 μm is desirable, and when stiffness is required, it is preferable to use a PET film. In this embodiment, a high blur film PV-407 manufactured by Kuraray Plastics Co., Ltd. is used.
【００１５】また、導電性ペースト４は、導電体として
針状銀を含有し、比較的低温で硬化し、密着力の強い状
態に生成されたもので、具体的には東洋紡績株式会社製
のバイロンＤＷ−２５０Ｈ−５を用いることができる。The conductive paste 4 contains acicular silver as a conductor, is hardened at a relatively low temperature, and is formed in a state of strong adhesion. Specifically, the conductive paste 4 is manufactured by Toyobo Co., Ltd. Byron DW-250H-5 can be used.
【００１６】次いで、図１（ｂ）に示すように、導電性
ペースト４によって形成された回路パターン上の所定位
置に電子部品６を配置する。Next, as shown in FIG. 1B, the electronic component 6 is arranged at a predetermined position on the circuit pattern formed by the conductive paste 4.
【００１７】次に、図１（ｃ）に示すように、樹脂フィ
ルム５、電子部品６及び導電性ペースト４を一緒に、１
３０℃で２０分間加熱し、導電性ペースト４を熱硬化さ
せる。この導電性ペースト４の硬化により回路パターン
が形成されると同時に、電子部品６は硬化した導電性ペ
ースト４によって回路パターンに固定され、回路パター
ンの所定位置に接続された状態が得られる。Next, as shown in FIG. 1 (c), the resin film 5, the electronic component 6, and the conductive
Heating is performed at 30 ° C. for 20 minutes to thermally cure the conductive paste 4. At the same time as the circuit pattern is formed by the curing of the conductive paste 4, the electronic component 6 is fixed to the circuit pattern by the cured conductive paste 4, and a state where the electronic component 6 is connected to a predetermined position of the circuit pattern is obtained.
【００１８】次に、図１（ｄ）に示すように、必要に応
じて所望部位にカバーフィルム７（クラレプラスチック
株式会社製のセプトンフィルム）を施す。Next, as shown in FIG. 1 (d), a cover film 7 (Septon film manufactured by Kuraray Plastics Co., Ltd.) is applied to a desired portion as required.
【００１９】最後に、図１（ｅ）に示すように、回路基
板として所望の形状に打ち抜き、回路基板として完成さ
せる。Finally, as shown in FIG. 1E, the circuit board is punched into a desired shape to complete the circuit board.
【００２０】このように製造される回路基板は、導電性
ペースト４を用いて回路パターンを形成したものであっ
ても、導電体として含有された銀が針状であるため結合
性がよく、導通抵抗が少なく回路パターンは電気的接続
の配線としての機能が損なわれることがない。また、導
電性ペースト４の熱硬化温度が低いので、樹脂フィルム
５として耐熱温度の高いものを用いる必要はなく、安価
な材質のものを使用することができる。また、硬化温度
が低いので、耐熱性の低い電子部品６も安心して使用す
ることができる。The circuit board manufactured in this manner has a good bonding property even if a circuit pattern is formed using the conductive paste 4 because the silver contained as the conductor is needle-shaped. The circuit pattern has a small resistance and does not impair the function as a wiring for electrical connection. Further, since the thermosetting temperature of the conductive paste 4 is low, it is not necessary to use a resin film 5 having a high heat-resistant temperature, and an inexpensive material can be used. Further, since the curing temperature is low, the electronic component 6 having low heat resistance can be used with confidence.
【００２１】また、導電性ペースト４の硬化により、回
路パターンの形成と同時に電子部品の接合がなされるの
で、電子部品６の実装工程の直前に導電性ペースト４の
印刷を行うことができ、製造リードタイムを大幅に削減
することができる。また、回路パターンの変更修正も容
易に行うことができる。Since the electronic components are joined together with the formation of the circuit pattern by the hardening of the conductive paste 4, the conductive paste 4 can be printed immediately before the mounting process of the electronic component 6, so that the manufacturing is possible. Lead time can be greatly reduced. Further, the circuit pattern can be easily changed and corrected.
【００２２】次に、本発明の第２の実施形態に係る回路
基板の製造手順を、図２を参照して説明する。Next, a procedure for manufacturing a circuit board according to a second embodiment of the present invention will be described with reference to FIG.
【００２３】図２（ａ）に示すように、樹脂フィルム５
の一面に導電性ペースト４ａにより回路パターンを印刷
する。As shown in FIG. 2A, the resin film 5
Is printed with a conductive paste 4a on one side.
【００２４】次いで、図２（ｂ）に示すように、樹脂フ
ィルム５及び導電性ペースト４ａを、１３０℃で２０分
加熱して導電性ペースト４ａを熱硬化させ、回路パター
ンを形成する。Next, as shown in FIG. 2B, the resin film 5 and the conductive paste 4a are heated at 130 ° C. for 20 minutes to thermally cure the conductive paste 4a to form a circuit pattern.
【００２５】次に、図２（ｃ）に示すように、回路パタ
ーンの電子部品６を実装するランド上に導電性ペースト
４ｂを印刷する。Next, as shown in FIG. 2C, a conductive paste 4b is printed on the lands on which the electronic components 6 having a circuit pattern are to be mounted.
【００２６】次いで、図２（ｄ）に示すように、印刷さ
れた導電性ペースト４ｂ上に電子部品６を配置する。Next, as shown in FIG. 2D, the electronic component 6 is arranged on the printed conductive paste 4b.
【００２７】次に、図２（ｅ）に示すように、樹脂フィ
ルム５、電子部品６及び導電性ペースト４ｂを、１３０
℃で２０分加熱して導電性ペースト４ｂを硬化させ、電
子部品６を回路パターンに接続すると共に、樹脂フィル
ム５上に固定する。Next, as shown in FIG. 2E, the resin film 5, the electronic component 6, and the conductive paste 4b are
The conductive paste 4 b is cured by heating at 20 ° C. for 20 minutes, and the electronic component 6 is connected to the circuit pattern and fixed on the resin film 5.
【００２８】この回路基板の製造方法では、導電性ペー
スト４ａにより樹脂フィルム５上に回路パターンが形成
され、これを硬化させた後、電子部品を接合するための
導電性ペースト４ｂが印刷されるので、電子部品６の接
続固定がより確実になされる。In this method of manufacturing a circuit board, a circuit pattern is formed on the resin film 5 by the conductive paste 4a, and after curing, a conductive paste 4b for joining electronic components is printed. In addition, the connection and fixing of the electronic component 6 are more reliably performed.
【００２９】以上説明した第１及び第２の実施形態にお
いては、導電性ペースト４、４ａ、４ｂとして硬化温度
が低い熱硬化型のものを用いたが、蒸乾型（熱可塑型と
も言う）、具体的には東洋紡績株式会社製のバイロンＤ
Ｗ−１１４Ｌ−１を用いることもできる。この蒸乾型
は、硬化のための時間的な余裕があれば常温でも硬化す
るので、耐熱性に問題があるような電子部品を用いた回
路基板を構成するのに好適なものとなる。In the first and second embodiments described above, the conductive pastes 4, 4a, and 4b used are thermosetting types having a low curing temperature. However, the conductive pastes 4, 4a, and 4b are steam-dried types (also referred to as thermoplastic types). Specifically, Byron D manufactured by Toyobo Co., Ltd.
W-114L-1 can also be used. This steam-drying type cures at room temperature if there is enough time for curing, so that it is suitable for forming a circuit board using an electronic component having a problem with heat resistance.
【００３０】また、紫外線硬化型の導電性ペーストであ
れば、耐熱性に問題がある電子部品が用いられる回路基
板であっても、加熱しないので安心して使用することが
できる。In addition, a UV-curable conductive paste can be used safely even if it is a circuit board on which an electronic component having a problem with heat resistance is used, since it is not heated.
【００３１】[0031]
【発明の効果】以上の説明の通り本発明によれば、導通
抵抗の小さい導電性ペーストにより回路パターンを形成
することができるので、導電性ペーストを用いて回路基
板を構成することができ、導電性ペーストの硬化により
回路パターンの形成すると同時に電子部品を接続固定す
ることができる。As described above, according to the present invention, a circuit pattern can be formed with a conductive paste having a small conduction resistance, so that a circuit board can be formed using the conductive paste. The electronic component can be connected and fixed simultaneously with the formation of the circuit pattern by the hardening of the conductive paste.
【図１】第１の実施形態に係る回路基板の製造手順を示
す工程図。FIG. 1 is a process chart showing a procedure for manufacturing a circuit board according to a first embodiment.
【図２】第２の実施形態に係る回路基板の製造手順を示
す工程図。FIG. 2 is a process chart showing a procedure for manufacturing a circuit board according to a second embodiment.
４、４ａ、４ｂ 導電性ペースト ５ 樹脂フィルム ６ 電子部品 4, 4a, 4b Conductive paste 5 Resin film 6 Electronic component
───────────────────────────────────────────────────── フロントページの続き (72)発明者 冨田 和之 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 後川 和也 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 Ｆターム(参考） 4E351 AA02 BB01 BB24 BB31 CC11 CC22 CC31 DD05 DD53 GG01 5E319 AA03 AA07 AC03 BB11 BB16 CC58 CC61 CD29 5E343 AA02 AA12 BB25 BB72 BB76 DD02 ER33 ER39 GG11 5G301 DA03 DA42 DD01 ──────────────────────────────────────────────────の Continued on the front page (72) Inventor Kazuyuki Tomita 1006 Kazuma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. In-house F term (reference) 4E351 AA02 BB01 BB24 BB31 CC11 CC22 CC31 DD05 DD53 GG01 5E319 AA03 AA07 AC03 BB11 BB16 CC58 CC61 CD29 5E343 AA02 AA12 BB25 BB72 BB76 DD02 ER33 ER39 GG11 5G301 DA03 DA42 DD
Claims (6)
が１３０℃以下の熱硬化型の導電性ペーストを用いて絶
縁性樹脂基板上に回路パターンが形成され、回路パター
ン上の所定位置に配置された電子部品が導電性ペースト
の硬化により回路パターンに接続及び固定されてなるこ
とを特徴とする導電性ペーストを用いた回路基板。1. A circuit pattern is formed on an insulating resin substrate using a thermosetting conductive paste containing needle-like silver as a conductor and having a curing temperature of 130 ° C. or lower, and a predetermined position on the circuit pattern is formed. A circuit board using a conductive paste, wherein the electronic components arranged in the circuit board are connected and fixed to a circuit pattern by curing the conductive paste.
導電性ペーストを用いて絶縁性樹脂基板上に回路パター
ンが形成され、回路パターン上の所定位置に配置された
電子部品が導電性ペーストの硬化により回路パターンに
接続及び固定されてなることを特徴とする導電性ペース
トを用いた回路基板。2. An electronic component comprising needle-like silver as a conductor, a circuit pattern formed on an insulating resin substrate using a steam-dried conductive paste, and an electronic component arranged at a predetermined position on the circuit pattern. A circuit board using a conductive paste, wherein the circuit board is connected and fixed to a circuit pattern by curing of the conductive paste.
化型の導電性ペーストを用いて絶縁性樹脂基板上に回路
パターンが形成され、回路パターン上の所定位置に配置
された電子部品が導電性ペーストの硬化により回路パタ
ーンに接続及び固定されてなることを特徴とする導電性
ペーストを用いた回路基板。3. A circuit pattern is formed on an insulative resin substrate using an ultraviolet curable conductive paste containing acicular silver as a conductor, and an electronic component disposed at a predetermined position on the circuit pattern is formed. A circuit board using a conductive paste, wherein the circuit board is connected and fixed to a circuit pattern by curing of the conductive paste.
くはポリエステル系樹脂である請求項１〜３いずれか一
項に記載の導電性ペーストを用いた回路基板。4. The circuit board using the conductive paste according to claim 1, wherein the insulating resin substrate is a styrene-based resin or a polyester-based resin.
り回路パターンを印刷し、回路パターンの所定位置に電
子部品を配置し、導電性ペーストを硬化させて回路パタ
ーンを固化させ、回路パターンに電子部品を接続及び固
定することを特徴とする導電性ペーストを用いた回路基
板の製造方法。5. A circuit pattern is printed by a conductive paste on an insulating resin substrate, an electronic component is arranged at a predetermined position of the circuit pattern, and the conductive paste is hardened to solidify the circuit pattern. A method of manufacturing a circuit board using a conductive paste, wherein components are connected and fixed.
り回路パターンを印刷し、導電性ペーストを硬化させて
回路パターンを固化させ、回路パターン上の電子部品実
装位置に導電性ペーストを印刷し、この導電性ペースト
上に電子部品を配置し、導電性ペーストを硬化させて回
路パターンに電子部品を接続及び固定することを特徴と
する導電性ペーストを用いた回路基板の製造方法。6. A circuit pattern is printed on the insulating resin substrate with a conductive paste, the conductive paste is hardened to solidify the circuit pattern, and the conductive paste is printed on an electronic component mounting position on the circuit pattern. A method of manufacturing a circuit board using a conductive paste, comprising disposing an electronic component on the conductive paste, curing the conductive paste, and connecting and fixing the electronic component to a circuit pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000238754A JP2002057423A (en) | 2000-08-07 | 2000-08-07 | Circuit board using conductive paste, and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000238754A JP2002057423A (en) | 2000-08-07 | 2000-08-07 | Circuit board using conductive paste, and its manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002057423A true JP2002057423A (en) | 2002-02-22 |
Family
ID=18730406
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000238754A Pending JP2002057423A (en) | 2000-08-07 | 2000-08-07 | Circuit board using conductive paste, and its manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002057423A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1482524A1 (en) * | 2002-03-07 | 2004-12-01 | TDK Corporation | Laminate type electronic component |
| JP2006040650A (en) * | 2004-07-26 | 2006-02-09 | Mitsui Mining & Smelting Co Ltd | Silver paste and its manufacturing method |
| KR100887134B1 (en) * | 2007-08-27 | 2009-03-04 | 삼성전기주식회사 | Method of manufacturing printed circuit board using paste and printed circuit board manufactured by the method |
| WO2009069273A1 (en) * | 2007-11-28 | 2009-06-04 | Panasonic Corporation | Electrically conductive paste, and electrical and electronic device comprising the same |
| JP2013511143A (en) * | 2009-11-13 | 2013-03-28 | テクノロジアン テュトキムスケスクス ヴェーテーテー | Methods and products for deposited particles |
| JPWO2014006787A1 (en) * | 2012-07-04 | 2016-06-02 | パナソニックＩｐマネジメント株式会社 | Electronic component mounting structure, IC card, COF package |
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2000
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1482524A1 (en) * | 2002-03-07 | 2004-12-01 | TDK Corporation | Laminate type electronic component |
| EP1482524A4 (en) * | 2002-03-07 | 2008-08-27 | Tdk Corp | Laminate type electronic component |
| JP2006040650A (en) * | 2004-07-26 | 2006-02-09 | Mitsui Mining & Smelting Co Ltd | Silver paste and its manufacturing method |
| KR100887134B1 (en) * | 2007-08-27 | 2009-03-04 | 삼성전기주식회사 | Method of manufacturing printed circuit board using paste and printed circuit board manufactured by the method |
| WO2009069273A1 (en) * | 2007-11-28 | 2009-06-04 | Panasonic Corporation | Electrically conductive paste, and electrical and electronic device comprising the same |
| US8540903B2 (en) | 2007-11-28 | 2013-09-24 | Panasonic Corporation | Electrically conductive paste, and electrical and electronic device comprising the same |
| JP5342453B2 (en) * | 2007-11-28 | 2013-11-13 | パナソニック株式会社 | Conductive paste and electrical and electronic equipment using the same |
| JP2013511143A (en) * | 2009-11-13 | 2013-03-28 | テクノロジアン テュトキムスケスクス ヴェーテーテー | Methods and products for deposited particles |
| JPWO2014006787A1 (en) * | 2012-07-04 | 2016-06-02 | パナソニックＩｐマネジメント株式会社 | Electronic component mounting structure, IC card, COF package |
| CN110050352A (en) * | 2016-11-07 | 2019-07-23 | 信越化学工业株式会社 | The manufacturing method of high efficiency solar cell |
| CN110050352B (en) * | 2016-11-07 | 2022-04-29 | 信越化学工业株式会社 | Method for manufacturing high-efficiency solar cell |
| WO2020012626A1 (en) * | 2018-07-13 | 2020-01-16 | 株式会社Ｆｕｊｉ | Circuit formation method and circuit formation device |
| JPWO2020012626A1 (en) * | 2018-07-13 | 2021-02-15 | 株式会社Ｆｕｊｉ | Circuit formation method and circuit formation device |
| CN112385322A (en) * | 2018-07-13 | 2021-02-19 | 株式会社富士 | Circuit forming method and circuit forming apparatus |
| WO2020095340A1 (en) * | 2018-11-05 | 2020-05-14 | 株式会社Ｆｕｊｉ | Circuit forming method |
| JPWO2020095340A1 (en) * | 2018-11-05 | 2021-09-02 | 株式会社Ｆｕｊｉ | Circuit formation method |
| US11570900B2 (en) | 2018-11-05 | 2023-01-31 | Fuji Corporation | Circuit forming method |
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