JPH08318593A - Production of copper clad laminated sheet - Google Patents
Production of copper clad laminated sheetInfo
- Publication number
- JPH08318593A JPH08318593A JP12657295A JP12657295A JPH08318593A JP H08318593 A JPH08318593 A JP H08318593A JP 12657295 A JP12657295 A JP 12657295A JP 12657295 A JP12657295 A JP 12657295A JP H08318593 A JPH08318593 A JP H08318593A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- resin
- clad laminate
- impregnated
- resin varnish
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電気・電子機器等で使
用するプリント配線板の材料である銅張積層板の製造方
法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a copper clad laminate which is a material for a printed wiring board used in electric and electronic equipment.
【０００２】[0002]
【従来の技術】ラジカル重合型熱硬化性樹脂及び無機充
填材を含有する樹脂ワニスをガラス基材に含浸した含浸
品を用いて銅張積層板を製造することが知られている。
この場合、樹脂ワニスをガラス基材に含浸した含浸品を
複数枚重ね、その上下に銅箔を配し、次いで加熱硬化さ
せて銅張積層板を製造するのが一般的である。このラジ
カル重合型熱硬化性樹脂を使用する方法は、樹脂ワニス
をガラス基材に含浸させる工程から、含浸品と銅箔とを
一体化する工程までを連続的に行うことが可能であり、
従って長尺のガラス基材と長尺の銅箔とを切断すること
なく一体化でき、ロスが少ない等の多くの利点がある。
また、樹脂ワニス中に無機充填材を含有するために、無
機充填材を含有しない場合に比べ厚み方向の線膨張係数
が小さくなるという利点もある。そして、ラジカル重合
型熱硬化性樹脂としてアクリル酸やメタクリル酸とエポ
キシ樹脂の反応物であるビニルエステル樹脂を使用した
場合、耐熱性、耐水性、電気特性、パンチング加工性等
の性能が優れる銅張積層板を製造することができ、その
用途を拡大している。2. Description of the Related Art It is known to manufacture a copper clad laminate using an impregnated product obtained by impregnating a glass substrate with a resin varnish containing a radical polymerization type thermosetting resin and an inorganic filler.
In this case, it is general to stack a plurality of impregnated products obtained by impregnating a glass substrate with a resin varnish, place copper foils on the upper and lower sides thereof, and then heat-cure them to produce a copper-clad laminate. The method of using this radical polymerization type thermosetting resin, it is possible to continuously perform from the step of impregnating the glass substrate with the resin varnish to the step of integrating the impregnated product and the copper foil,
Therefore, there are many advantages such that the long glass base material and the long copper foil can be integrated without cutting and the loss is small.
Further, since the resin varnish contains the inorganic filler, there is an advantage that the linear expansion coefficient in the thickness direction becomes smaller than that in the case where the inorganic varnish is not contained. When a vinyl ester resin, which is a reaction product of acrylic acid or methacrylic acid and an epoxy resin, is used as the radical-polymerization type thermosetting resin, copper-clad resin with excellent performance such as heat resistance, water resistance, electrical characteristics, and punching processability is used. Laminates can be manufactured and their applications are expanding.
【０００３】しかしながら、上記のラジカル重合型熱硬
化性樹脂及び無機充填材を含有する樹脂ワニスをガラス
基材に含浸した含浸品を用いて製造された銅張積層板
は、面方向の線膨張係数が大きいため、リードレスチッ
プキャリアをこの銅張積層板を加工して得られたプリン
トプリント配線板に直接実装し、ヒートサイクル試験を
すると接合ハンダ部にクラックが発生しやすいという問
題があった。However, a copper-clad laminate produced by using an impregnated product obtained by impregnating a glass base material with a resin varnish containing the above radical polymerization type thermosetting resin and an inorganic filler has a linear expansion coefficient in the plane direction. Therefore, when the leadless chip carrier is directly mounted on the printed wiring board obtained by processing this copper clad laminate and a heat cycle test is performed, there is a problem that cracks are likely to occur in the joint solder part.
【０００４】[0004]
【発明が解決しようとする課題】本発明は上記のような
事情に鑑みてなされたものであって、その目的とすると
ころは、ラジカル重合型熱硬化性樹脂及び無機充填材を
含有する樹脂ワニスをガラス基材に含浸した含浸品を用
いて製造される銅張積層板の面方向の線膨張係数を小さ
くすることができる製造方法を提供することを目的とし
ている。SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object thereof is to provide a resin varnish containing a radical polymerization type thermosetting resin and an inorganic filler. An object of the present invention is to provide a manufacturing method capable of reducing the linear expansion coefficient in the surface direction of a copper-clad laminate manufactured by using an impregnated product obtained by impregnating a glass substrate.
【０００５】[0005]
【課題を解決するための手段】請求項１に係る発明の銅
張積層板の製造方法は、ラジカル重合型熱硬化性樹脂及
び無機充填材を含有する樹脂ワニスをガラス基材に含浸
した含浸品を複数枚重ね、その少なくとも一方の表面に
銅箔を配し、次いで加熱硬化させてなる銅張積層板の製
造方法において、樹脂ワニス中にスチレン−酢酸ビニル
共重合体、ポリ酢酸ビニル又は熱可塑性アクリル樹脂を
含有していることを特徴とする。The method for producing a copper clad laminate of the invention according to claim 1 is an impregnated product obtained by impregnating a glass substrate with a resin varnish containing a radical polymerization type thermosetting resin and an inorganic filler. In the method for producing a copper-clad laminate, in which a copper foil is placed on at least one of the surfaces and then heat-cured, a styrene-vinyl acetate copolymer, polyvinyl acetate or thermoplastic resin is added to the resin varnish. It is characterized by containing an acrylic resin.
【０００６】請求項２に係る発明の銅張積層板の製造方
法は、ラジカル重合型熱硬化性樹脂及び無機充填材を含
有する樹脂ワニスをガラス基材に含浸した含浸品を複数
枚重ね、その少なくとも一方の表面に銅箔を配し、次い
で加熱硬化させてなる銅張積層板の製造方法において、
樹脂ワニス中に液状ポリブタジエンゴムを含有している
ことを特徴とする。In the method for producing a copper clad laminate according to the second aspect of the present invention, a plurality of impregnated products obtained by impregnating a glass substrate with a resin varnish containing a radical polymerization type thermosetting resin and an inorganic filler are stacked, A copper foil is arranged on at least one surface, and then in a method for producing a copper-clad laminate obtained by heating and curing,
The resin varnish contains a liquid polybutadiene rubber.
【０００７】請求項３に係る発明の銅張積層板の製造方
法は、請求項１又は請求項２記載の製造方法において、
含浸品を複数枚重ねる構成が、ガラスペーパー基材の含
浸品を芯とし、その上下にガラス布基材の含浸品を配し
た構成であることを特徴とする。A method of manufacturing a copper clad laminate according to a third aspect of the present invention is the manufacturing method according to the first or second aspect,
A feature of stacking a plurality of impregnated products is that the impregnated product of a glass paper base material is used as a core, and the impregnated product of a glass cloth base material is arranged above and below the core.
【０００８】本発明におけるラジカル重合型熱硬化性樹
脂は、ラジカル重合性不飽和基を１分子中に２個以上有
する化合物を指していて、例えば、ビニルエステル樹
脂、不飽和ポリエステル樹脂等が例示できる。また、本
発明における無機充填材については、電気絶縁性を具備
するものであればよく、例えば水酸化アルミニウム、タ
ルク等が例示できる。The radical-polymerizable thermosetting resin in the present invention refers to a compound having two or more radical-polymerizable unsaturated groups in one molecule, and examples thereof include vinyl ester resins and unsaturated polyester resins. . Further, the inorganic filler in the present invention may be any as long as it has electrical insulation properties, and examples thereof include aluminum hydroxide and talc.
【０００９】本発明ではスチレン−酢酸ビニル共重合
体、ポリ酢酸ビニル、熱可塑性アクリル樹脂又は液状ポ
リブタジエンゴムのいずれかを樹脂ワニス中に含有させ
ることにより、製造する銅張積層板の面方向の線膨張係
数を小さくしている。そして、これらの成分の含有量に
ついては、特に限定するものではないが、樹脂ワニスの
全重量の１〜２０重量％であることが好ましい。１重量
％未満の場合は線膨張係数を小さくする効果が顕著でな
くなり、また２０重量％を越えると樹脂ワニスの粘度が
高くなって、ガラス基材への含浸性に関して問題を生じ
ることがある。In the present invention, a line in the plane direction of a copper-clad laminate produced by incorporating any one of a styrene-vinyl acetate copolymer, polyvinyl acetate, a thermoplastic acrylic resin or a liquid polybutadiene rubber into a resin varnish. The expansion coefficient is reduced. The content of these components is not particularly limited, but is preferably 1 to 20% by weight of the total weight of the resin varnish. If it is less than 1% by weight, the effect of reducing the linear expansion coefficient becomes insignificant, and if it exceeds 20% by weight, the viscosity of the resin varnish becomes high, which may cause a problem with respect to the impregnation property into the glass substrate.
【００１０】また、請求項３に係る発明ではガラスペー
パー基材の含浸品を芯とし、その上下にガラス布基材の
含浸品を配して積層して銅張積層板を製造するが、この
ような構成の銅張積層板は、ガラス布基材の含浸品のみ
を積層して得られる銅張積層板よりも、面方向の線膨張
係数が大きいという問題が生じやすいので、上記のよう
にスチレン−酢酸ビニル共重合体、ポリ酢酸ビニル、熱
可塑性アクリル樹脂又は液状ポリブタジエンゴムのいず
れかを樹脂ワニス中に含有させて、銅張積層板の面方向
の線膨張係数を小さくすることがより有用となる。In the invention according to claim 3, the impregnated product of the glass paper base material is used as a core, and the impregnated products of the glass cloth base material are arranged above and below the core to produce a copper clad laminate. Since the copper-clad laminate having such a structure is more likely to have a problem that the linear expansion coefficient in the surface direction is larger than that of the copper-clad laminate obtained by laminating only the impregnated product of the glass cloth substrate, as described above. It is more useful to reduce the linear expansion coefficient in the plane direction of the copper-clad laminate by including any of styrene-vinyl acetate copolymer, polyvinyl acetate, thermoplastic acrylic resin or liquid polybutadiene rubber in the resin varnish. Becomes
【００１１】[0011]
【実施例】以下、本発明を実施例及び比較例に基づいて
説明する。EXAMPLES The present invention will be described below based on Examples and Comparative Examples.
【００１２】（実施例１）ラジカル重合型熱硬化性樹脂
として昭和高分子（株）製のビニルエステル樹脂（品番
Ｓ５１０）を１０００ｇ、スチレンモノマーを１００
ｇ、日本油脂（株）製のスチレン−酢酸ビニル共重合体
（商品名：モディパーＳ１０１）を８０ｇ配合したもの
をディスパーで十分攪拌した後、無機充填材として住友
化学工業（株）製の水酸化アルミ（品番ＣＬ−３０３）
を３００ｇとラジカル開始剤としてクメンハイドロパー
オキサイド７ｇを加えて、さらにディスパーで十分攪拌
して樹脂ワニスを作製した。Example 1 1000 g of a vinyl ester resin (Product No. S510) manufactured by Showa Highpolymer Co., Ltd., and 100 parts of a styrene monomer were used as a radical polymerization type thermosetting resin.
g, 80 g of styrene-vinyl acetate copolymer (trade name: Modiper S101) manufactured by NOF CORPORATION was thoroughly stirred with a disper, and then hydroxylated by Sumitomo Chemical Co., Ltd. as an inorganic filler. Aluminum (Product number CL-303)
And 300 g of cumene hydroperoxide as a radical initiator were added, and the mixture was further sufficiently stirred with a disper to prepare a resin varnish.
【００１３】上記の樹脂ワニスを厚さ２００μｍの平織
ガラス布（大きさ３００ｍｍ×３００ｍｍ）及びガラス
ぺーパー（単重５１ｇ／ｍ2 、密度０．１４ｇ／ｃ
ｍ3 、大きさ３００ｍｍ×３００ｍｍ）に含浸し、得ら
れたラスペーパー基材の含浸品２枚を芯とし、その上下
にガラス布基材の含浸品を各１枚配して、サンドイッチ
構造に積層し、さらにその両外側に厚さ１８μｍの銅箔
を各１枚配した積層物を作製した。次いでこの積層物を
金属プレートの間にはさみ、平置きの状態で１１０℃で
６０分間加熱硬化させ、さらに１７０℃で３０分間アフ
ターキュアし、厚さ１．６ｍｍの銅張積層板を作製し
た。なお、ガラス布、ガラスペーパー及び銅箔の方向性
については、これらの製造工程における連続流れ方向を
タテ方向とし、上記の積層物の作製に際しては、その方
向性が一致するようにして積層した。このようにして得
られた銅張積層板の面方向（タテ方向及びヨコ方向）の
線膨張係数を下記の方法で測定し、その結果を表１に示
した。 （線膨張係数の測定方法） サンプル：銅張積層板の銅箔を全面エッチングして除去
した基板 測定器 ：理学電機（株）製のＴＭＡ装置（ＴＡＳ−１
００） 測定条件：昇温スピード５℃／分、測定温度範囲４０〜
１５０℃A plain woven glass cloth (size 300 mm × 300 mm) having a thickness of 200 μm and a glass paper (single weight 51 g / m 2 , density 0.14 g / c) were prepared by using the above resin varnish.
m 3, was impregnated with 300 mm × 300 mm) size, obtained was impregnated article two core Las paper substrate, a glass cloth base material impregnated products by distribution one each above and below the sandwich structure Layers were laminated, and further, a copper foil having a thickness of 18 μm was arranged on both outer sides of each layer to prepare a layered product. Then, this laminate was sandwiched between metal plates, heat-cured at 110 ° C. for 60 minutes in a flat state, and after-cured at 170 ° C. for 30 minutes to prepare a copper-clad laminate having a thickness of 1.6 mm. Regarding the directionality of the glass cloth, the glass paper and the copper foil, the continuous flow direction in these manufacturing steps was set to the vertical direction, and when the above-mentioned laminate was produced, they were laminated so that the directions thereof would be the same. The coefficient of linear expansion of the copper clad laminate thus obtained in the plane direction (vertical direction and horizontal direction) was measured by the following method, and the results are shown in Table 1. (Measurement method of linear expansion coefficient) Sample: A substrate in which the copper foil of the copper clad laminate is completely etched and removed Measuring instrument: TMA device (TAS-1 manufactured by Rigaku Denki Co., Ltd.)
00) Measurement conditions: temperature rising speed 5 ° C / min, measurement temperature range 40 to
150 ° C
【００１４】（実施例２）実施例１のスチレン−酢酸ビ
ニル共重合体８０ｇの代わりに、ユニオンカーバイド日
本社製のポリ酢酸ビニル（商品名ニューロンＴプラス）
を８０ｇ使用するようにした以外は、実施例１と同様に
して、銅張積層板を作製し、その面方向（タテ方向及び
ヨコ方向）の線膨張係数を測定し、その結果を表１に示
した。(Example 2) Instead of 80 g of the styrene-vinyl acetate copolymer of Example 1, polyvinyl acetate (trade name: Neuron T Plus) manufactured by Union Carbide Japan Co., Ltd.
Was prepared in the same manner as in Example 1 except that 80 g was used, and the linear expansion coefficient in the plane direction (vertical direction and horizontal direction) was measured, and the results are shown in Table 1. Indicated.
【００１５】（実施例３）実施例１のスチレン−酢酸ビ
ニル共重合体８０ｇの代わりに、三菱レイヨン（株）製
の熱可塑性アクリル樹脂（品番ＢＲ−７７）を８０ｇ使
用するようにした以外は、実施例１と同様にして、銅張
積層板を作製し、その面方向（タテ方向及びヨコ方向）
の線膨張係数を測定し、その結果を表１に示した。(Example 3) 80 g of a thermoplastic acrylic resin (product number BR-77) manufactured by Mitsubishi Rayon Co., Ltd. was used instead of 80 g of the styrene-vinyl acetate copolymer of Example 1. A copper clad laminate was prepared in the same manner as in Example 1 and its surface direction (vertical direction and horizontal direction)
The coefficient of linear expansion was measured and the results are shown in Table 1.
【００１６】（実施例４）実施例１のスチレン−酢酸ビ
ニル共重合体８０ｇの代わりに、出光石油化学（株）製
の液状ポリブタジエンゴム（商品名Poly-bd 45HT）５６
ｇと出光石油化学（株）製の液状ポリブタジエンゴム
（商品名Poly-bd HTP9）２４ｇを併せて使用するように
した以外は、実施例１と同様にして、銅張積層板を作製
し、その面方向（タテ方向及びヨコ方向）の線膨張係数
を測定し、その結果を表１に示した。Example 4 Instead of 80 g of the styrene-vinyl acetate copolymer of Example 1, a liquid polybutadiene rubber (trade name Poly-bd 45HT) 56 manufactured by Idemitsu Petrochemical Co., Ltd. was used.
g and a liquid polybutadiene rubber (trade name: Poly-bd HTP9) manufactured by Idemitsu Petrochemical Co., Ltd. (24 g) were used together, and a copper clad laminate was prepared in the same manner as in Example 1. The linear expansion coefficient in the surface direction (vertical direction and horizontal direction) was measured, and the results are shown in Table 1.
【００１７】（実施例５）実施例１のスチレン−酢酸ビ
ニル共重合体８０ｇの代わりに、出光石油化学（株）製
の液状ポリブタジエンゴム（商品名Poly-bd 45HT）５６
ｇと出光石油化学（株）製の液状ポリブタジエンゴム
（商品名Poly-bd HTP9）１２ｇと出光石油化学（株）製
の液状ポリブタジエンゴム（商品名Ｒ−１５ＥＰＴ）１
２ｇを併せて使用するようにした以外は、実施例１と同
様にして、銅張積層板を作製し、その面方向（タテ方向
及びヨコ方向）の線膨張係数を測定し、その結果を表１
に示した。Example 5 Liquid polybutadiene rubber (trade name Poly-bd 45HT) 56 manufactured by Idemitsu Petrochemical Co., Ltd. was used in place of 80 g of the styrene-vinyl acetate copolymer of Example 1.
12 g and liquid polybutadiene rubber manufactured by Idemitsu Petrochemical Co., Ltd. (trade name Poly-bd HTP9) 12 g and liquid polybutadiene rubber manufactured by Idemitsu Petrochemical Co., Ltd. (trade name R-15EPT) 1
A copper clad laminate was produced in the same manner as in Example 1 except that 2 g was also used, and the linear expansion coefficient in the plane direction (vertical direction and horizontal direction) was measured. 1
It was shown to.
【００１８】（比較例１）実施例１のスチレン−酢酸ビ
ニル共重合体８０ｇを配合せずに樹脂ワニスを作製する
ようにした以外は、実施例１と同様にして、銅張積層板
を作製し、その面方向（タテ方向及びヨコ方向）の線膨
張係数を測定し、その結果を表１に示した。Comparative Example 1 A copper clad laminate was prepared in the same manner as in Example 1 except that the resin varnish was prepared without adding 80 g of the styrene-vinyl acetate copolymer of Example 1. Then, the linear expansion coefficient in the plane direction (vertical direction and horizontal direction) was measured, and the results are shown in Table 1.
【００１９】[0019]
【表１】 [Table 1]
【００２０】[0020]
【発明の効果】請求項１及び請求項２に係る発明によれ
ば、ラジカル重合型熱硬化性樹脂及び無機充填材を含有
する樹脂ワニスをガラス基材に含浸した含浸品を用いて
製造される銅張積層板の面方向の線膨張係数を小さくす
ることができる。EFFECTS OF THE INVENTION According to the inventions of claims 1 and 2, it is manufactured using an impregnated product obtained by impregnating a glass substrate with a resin varnish containing a radical polymerization type thermosetting resin and an inorganic filler. It is possible to reduce the linear expansion coefficient in the plane direction of the copper clad laminate.
【００２１】また、請求項３に係る発明によれば、ラジ
カル重合型熱硬化性樹脂及び無機充填材を含有する樹脂
ワニスをガラス基材に含浸した含浸品を用いて製造され
る銅張積層板であって、ガラスペーパー基材の含浸品を
芯とし、その上下にガラス布基材の含浸品を配して積層
して製造される銅張積層板の面方向の線膨張係数を小さ
くすることができる。According to the invention of claim 3, a copper clad laminate manufactured by using an impregnated product obtained by impregnating a glass base material with a resin varnish containing a radical polymerization type thermosetting resin and an inorganic filler. That is, the linear expansion coefficient in the plane direction of the copper-clad laminate manufactured by stacking the impregnated product of the glass paper base material as the core and arranging the impregnated product of the glass cloth base material above and below the core is made small. You can
───────────────────────────────────────────────────── フロントページの続き (72)発明者 柏原 圭子 大阪府門真市大字門真1048番地松下電工株 式会社内 (72)発明者 丸本 佳伸 大阪府門真市大字門真1048番地松下電工株 式会社内 (72)発明者 篠谷 賢一 大阪府門真市大字門真1048番地松下電工株 式会社内 (72)発明者 須川 美久 大阪府門真市大字門真1048番地松下電工株 式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Keiko Kashihara, 1048, Kadoma, Kadoma, Osaka Prefecture, Matsushita Electric Works Co., Ltd. (72) Inventor Kenichi Shinoya 1048, Kadoma, Kadoma-shi, Osaka Prefecture Matsushita Electric Works Ltd. (72) Inventor, Miku Sugawa, 1048, Kadoma, Kadoma-shi, Osaka Matsushita Electric Works Ltd.
Claims (3)
填材を含有する樹脂ワニスをガラス基材に含浸した含浸
品を複数枚重ね、その少なくとも一方の表面に銅箔を配
し、次いで加熱硬化させてなる銅張積層板の製造方法に
おいて、樹脂ワニス中にスチレン−酢酸ビニル共重合
体、ポリ酢酸ビニル又は熱可塑性アクリル樹脂を含有し
ていることを特徴とする銅張積層板の製造方法。1. A plurality of impregnated products obtained by impregnating a glass substrate with a resin varnish containing a radical-polymerization type thermosetting resin and an inorganic filler are stacked, a copper foil is placed on at least one surface of the product, and then heat-cured. In the method for producing a copper-clad laminate, the resin varnish contains a styrene-vinyl acetate copolymer, polyvinyl acetate or a thermoplastic acrylic resin, the method for producing a copper-clad laminate.
填材を含有する樹脂ワニスをガラス基材に含浸した含浸
品を複数枚重ね、その少なくとも一方の表面に銅箔を配
し、次いで加熱硬化させてなる銅張積層板の製造方法に
おいて、樹脂ワニス中に液状ポリブタジエンゴムを含有
していることを特徴とする銅張積層板の製造方法。2. A plurality of impregnated products obtained by impregnating a glass base material with a resin varnish containing a radical polymerization type thermosetting resin and an inorganic filler are stacked, a copper foil is placed on at least one surface of the impregnated product, and then heat-cured. The method for producing a copper-clad laminate as described above, wherein the resin varnish contains liquid polybutadiene rubber.
ーパー基材の含浸品を芯とし、その上下にガラス布基材
の含浸品を配した構成であることを特徴とする請求項１
又は請求項２記載の銅張積層板の製造方法。3. A structure in which a plurality of impregnated products are stacked is characterized in that a glass paper substrate-impregnated product is used as a core, and a glass cloth substrate-impregnated product is arranged above and below the core.
Alternatively, the method for manufacturing a copper clad laminate according to claim 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12657295A JPH08318593A (en) | 1995-05-25 | 1995-05-25 | Production of copper clad laminated sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12657295A JPH08318593A (en) | 1995-05-25 | 1995-05-25 | Production of copper clad laminated sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08318593A true JPH08318593A (en) | 1996-12-03 |
Family
ID=14938491
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12657295A Withdrawn JPH08318593A (en) | 1995-05-25 | 1995-05-25 | Production of copper clad laminated sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08318593A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001072879A1 (en) * | 2000-03-27 | 2001-10-04 | Mitsui Takeda Chemicals, Inc. | Lowly heat-expandable laminate |
| WO2018012205A1 (en) * | 2016-07-11 | 2018-01-18 | ジャパンコンポジット株式会社 | Radically curable resin composition and cured product of same |
-
1995
- 1995-05-25 JP JP12657295A patent/JPH08318593A/en not_active Withdrawn
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001072879A1 (en) * | 2000-03-27 | 2001-10-04 | Mitsui Takeda Chemicals, Inc. | Lowly heat-expandable laminate |
| US6815053B2 (en) | 2000-03-27 | 2004-11-09 | Japan Composite Co., Ltd. | Lowly heat-expandable laminate |
| KR100719866B1 (en) * | 2000-03-27 | 2007-05-21 | 제팬 컴포지트 컴파니 리미티드 | Lowly heat-expandable laminate |
| JP4779129B2 (en) * | 2000-03-27 | 2011-09-28 | ジャパンコンポジット株式会社 | Low thermal expansion laminate |
| WO2018012205A1 (en) * | 2016-07-11 | 2018-01-18 | ジャパンコンポジット株式会社 | Radically curable resin composition and cured product of same |
| JPWO2018012205A1 (en) * | 2016-07-11 | 2018-11-22 | ジャパンコンポジット株式会社 | Radical curable resin composition and cured product thereof |
| CN109071738A (en) * | 2016-07-11 | 2018-12-21 | 日本复合材料株式会社 | Radically curing resin combination and its solidfied material |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20020806 |