CN108973269A - Two layers of gum-free double side flexible copper coated board of one kind and preparation method thereof - Google Patents
Two layers of gum-free double side flexible copper coated board of one kind and preparation method thereof Download PDFInfo
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- CN108973269A CN108973269A CN201810855390.9A CN201810855390A CN108973269A CN 108973269 A CN108973269 A CN 108973269A CN 201810855390 A CN201810855390 A CN 201810855390A CN 108973269 A CN108973269 A CN 108973269A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/30—Processes for applying liquids or other fluent materials performed by gravity only, i.e. flow coating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
- B32B27/322—Layered products comprising a layer of synthetic resin comprising polyolefins comprising halogenated polyolefins, e.g. PTFE
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/732—Dimensional properties
- B32B2307/734—Dimensional stability
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
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Abstract
The present invention relates to a kind of two layers of gum-free double side flexible copper coated boards and preparation method thereof, including upper and lower two copper foil layer and the insulating layer being located between two copper foil layers, the insulating layer include intermediate polytetrafluoroethylene film and above and below polytetrafluoroethylene film two sides PBAT/PLA laminated film.The existing good ductility of the PBAT and PLA that the present invention uses and elongation at break, also there is preferable heat resistance and impact resistance, flexible group is not contained in its strand and free volume is small, it is not hygroscopic, and PBAT and PLA itself are also thermoplastic material, it equally can be realized the bonding between insulating layer and copper foil under its high temperature after melting pressing, thermoplastic polyimide resin (TPI), which is substituted, using it perfectly solves TPI poor heat resistance afterwards, the problems such as hygroscopic, therefore, gum-free double side flexible copper coated board provided by the invention is provided with high peel strength and dimensional stability simultaneously.
Description
Technical field
The present invention relates to a kind of copper-clad plate and preparation method thereof more particularly to a kind of gum-free double side flexible copper coated board and its
Preparation method belongs to technical field of copper clad laminate.
Background technique
In recent years, along with digital camera, DV, automobile navigation instrument, computer fittings and other electronic products
High performance, miniaturization, lightness and high-end electronic product, such as the appearance of tablet computer, smart phone, electricity therein
Sub-line road is also constantly towards the trend development of " light, thin, short, small ".The rigid copper-clad plate that tradition uses, does not have pliability, raw
Assembling can not be bent by producing obtained electronic circuit, bulky, can no longer meet actual demand.Densification, multiple stratification, height
The double side flexible copper coated board of heat resistance, high-dimensional stability is gradually replacing these rigid copper-clad plates, becomes the market mainstream.
The manufacturing method of traditional double side flexible copper coated board, which is three layers, glue-type, and thickness is generally 24.5~110 μm, nothing
Method meets the demands such as copper-clad plate slimming, pliability, and the adhesive for having used heat resistance not high in production, is unable to satisfy resistance to
The performances such as hot, soldering stability, applied at elevated temperature be easy layering blistering, therefore, people considers extensively do not use epoxy resin or
Acrylic tackifier only uses polyimide material to do the two of insulating layer layers of gum-free double side flexible copper coated board.
Known polyimide material is divided into non-thermal plasticity polyimide resin (PI) and thermoplastic polyimide resin
(TPI) two kinds, for both polyimide resins due to the difference of monomer structure, performance has apparent difference, non-thermoplastic
Property polyimide resin (PI) thermal expansion coefficient it is relatively low, apply in copper-clad plate, make copper-clad plate have good size it is steady
Qualitative and high-fire resistance, but it is relatively low with the peel strength of copper foil, it is difficult to it is used alone；Thermoplastic polyimide resin
(TPI) heat resistance is not so good as non-thermal plasticity polyimide resin, but thermal expansion coefficient is very high, the dimensional stability of copper-clad plate of support
It shrinks excessive, but pressing can be melted at high temperature, realize the heat pressure adhesive between resin layer and copper foil, it is therefore, existing
Thermoplastic polyimide and two kinds of non-thermal plasticity polyimides are existed simultaneously in two layers of method double side flexible copper coated board, wherein non-thermal
Plastic polyimide resin provides excellent dimensional stability, rather than thermoplastic polyimide resin plays cementation, with
Phase obtains good dimensional stability and high-peeling strength simultaneously.
Currently, commercialization two layers of method double side flexible copper coated board mainstream structure there are two types of, Cu/TPI/PI/TPI/Cu and
Cu/PI/TPI/PI/Cu, the existing higher peel strength of the double side flexible copper coated board of former structure have good size steady again
Qualitative, but its problem is that the TPI heat resistance of outer layer is poor, when encountering burning, TPI layers are easy to decompose, cause this two
The anti-flammability of layer method double side flexible copper coated board is poor, simultaneously because TPI itself contains more flexible group and has larger
Free volume, be easy to absorb water, under the repeatedly damp and hot impact of the following process of pcb board, it is easy to lead to plate bursting, it is latter
Although kind of structure avoids to a certain extent to be influenced brought by the deficiency of TPI, it is difficult to avoid TPI performance completely not
Problem brought by foot, and the structure is higher to the formula of TPI and PI, the requirement of manufacturing process technique, increases production difficulty.
For copper-clad plate industry, if it is desired to lower dielectric constant is obtained, using polytetrafluoroethylene (PTFE) as insulation material
Material is that preferably selection, a PTFE also has other than with good electrical insulation capability, chemical stability and thermal stability
Down to 2.1 or so dielectric constant, and its dielectric constant and dielectric loss factor are more stable in high-frequency range, be prepare it is low
The preferred matrix resin of dielectric constant substrate.
Summary of the invention
It is two-sided to provide a kind of two layers of gum-free for deficiency existing for double side flexible copper coated board of the present invention for existing two layers of method
Flexibility coat copper plate and preparation method thereof.
The technical scheme to solve the above technical problems is that
A kind of two layers of gum-free double side flexible copper coated board, including upper and lower two copper foil layer and are located in exhausted between two copper foil layers
Edge layer, the insulating layer include intermediate polytetrafluoroethylene film and above and below polytetrafluoroethylene film two sides PBAT/PLA
Laminated film.
Further, the insulating layer with a thickness of 18~65 μm.
Further, the copper foil is one of rolled copper foil or electrolytic copper foil.
The beneficial effect of double side flexible copper coated board provided by the invention is:
1) present invention employs the copolymers (PBAT) and poly- cream of tetramethylene adipate and mutual-phenenyl two acid bromide two alcohol ester
Sour (PLA) as the material for carrying out heat pressure adhesive in insulating layer with copper foil, the existing good ductility of PBAT, PLA and fracture are stretched
Long rate, it may have preferable heat resistance and impact resistance, in strand without containing flexible group and free volume it is small, be not easy to inhale
Water, and PBAT and PLA itself are also thermoplastic material, equally can be realized after melting pressing under high temperature insulating layer and copper foil it
Between bonding, using its substitute thermoplastic polyimide resin (TPI) perfectly solve TPI poor heat resistance, hygroscopic etc. afterwards
Problem, therefore, double side flexible copper coated board provided by the invention are provided with high peel strength and dimensional stability simultaneously, solve
The problems of existing two layers of method double side flexible copper coated board.
2) contain polytetrafluoroethylene film in the insulating materials of copper-clad plate of the present invention, greatly improve insulating materials entirety
Electrical insulation capability, chemical stability and thermal stability, and be provided with relatively low dielectric constant, and then improve and cover copper
The overall performance of plate.
The preparation method of above-mentioned double side flexible copper coated board is also claimed in the present invention, includes the following steps:
1) agitating and heating is dry after mixing PBAT with PLA raw material, and is delivered to the storage bin of laminating machine；
2) raw material in storage bin enters after the screw rod of laminating machine to heat and promote, and is divided into laminating machine along screw rod direction multiple
The temperature of bringing-up section, each bringing-up section is gradually risen along screw rod direction until reaching the fusing point of PBAT, and arrival is drenched after material melts
The mixed material lamination of PBAT and PLA is coated on polytetrafluoroethylene film by the film head of film machine, control laminating machine, Zhi Houleng
It can be quickly cooled down solidification after being coated on the PBAT/PLA laminated film of molten condition on polytetrafluoroethylene film, obtain list
The polytetrafluoroethylene film of face coating PBAT/PLA laminated film；
3) using the polytetrafluoroethylene film of single side coating PBAT/PLA laminated film obtained in step 2) as substrate, again
PBAT and PLA lamination is coated on the another side of polytetrafluoroethylene film by control laminating machine, and cooling makes molten condition later
PBAT/PLA laminated film can be quickly cooled down solidification after being coated on polytetrafluoroethylene film, obtain two-sided coating PBAT/PLA
The polytetrafluoroethylene film of laminated film, i.e. insulating layer；
4) two sides of insulating layer is respectively covered with one layer of copper foil, carries out hot pressing at 350~400 DEG C through vacuum pressing-combining machine,
So that the melting of PBAT/PLA laminated film is bonded with copper foil, so that double side flexible copper coated board be made.
Further, the weight ratio of both PBAT and PLA raw material is (3~5) in step 1): 1.
Further, the pressure of vacuum pressing-combining machine described in step 4) is 10~15MPa, and the time of hot pressing is 60~90s.
Further, the range of number-average molecular weight of the PBAT is 1~1,000,000, and the number-average molecular weight of the PLA is 1~100
Ten thousand.
Further, multiple bringing-up sections described in step 2) are 6 bringing-up sections, and the heating temperatures of 6 bringing-up sections is from 150
DEG C with 30~40 DEG C incremented by successively, 60~70 DEG C, 10~20 DEG C, 10~20 DEG C, 10~20 DEG C rule increase.
The beneficial effect of preparation method provided by the invention is:
1) the obtained copper-clad plate of method of hot pressing after insulating layer is made preparation method of the invention using lamination in situ, so that
Bond strength between Kapton and PBAT/PLA film, between PBAT/PLA film and copper foil reaches maximum, so that made
The copper foil obtained has highest peel strength and dimensional stability；
2) want much lower with respect to conventional method using its thickness of the resulting copper-clad plate of preparation method of the invention, insulating layer
Thickness is substantially at 65 μm hereinafter, can meet the application demand of high-end electronic product；
3) process of synthesis and coating that laminating machine is come instead of chemistry is cleverly utilized in preparation method of the invention,
Chemical reagent and artificial use are greatly reduced, working efficiency is greatly improved.
Specific embodiment
Principles and features of the present invention are described below in conjunction with example, the given examples are served only to explain the present invention, and
It is non-to be used to limit the scope of the invention.
Embodiment 1:
A kind of two layers of gum-free double side flexible copper coated board, including upper and lower two copper foil layer and are located in exhausted between two copper foil layers
Edge layer, the insulating layer include intermediate polytetrafluoroethylene film and above and below polytetrafluoroethylene film two sides PBAT/PLA
Film.
Wherein, the copper foil is rolled copper foil, with a thickness of 12~35 μm, polytetrafluoroethylene film with a thickness of 20~35 μ
M, PBAT/PLA film with a thickness of 6~20 μm, the weight ratio of both PBAT and PLA are 3:1, and the number-average molecular weight of PBAT is 1
The number-average molecular weight of~60 ten thousand, PLA are 50~1,000,000.
Above-mentioned double side flexible copper coated board the preparation method is as follows:
1) PBAT and PLA raw material agitating and heating is dry, and it is delivered to the storage bin of laminating machine；
2) raw material in storage bin enters after the screw rod of laminating machine to heat and promote, and is divided into 6 along screw rod direction in laminating machine
Bringing-up section, the heating temperatures of 6 bringing-up sections are increased from 150 DEG C with 40 DEG C incremented by successively, 60 DEG C, 10 DEG C, 20 DEG C, 20 DEG C of rule
Until reaching the film head of laminating machine after the fusing point of arrival PBAT, PBAT and PLA melting, laminating machine is controlled by PBAT and PLA lamination
It is coated on polytetrafluoroethylene film, cooling is coated on the PBAT/PLA film of molten condition on polytetrafluoroethylene film later
After can be quickly cooled down solidification, obtain the polytetrafluoroethylene film of single side coating PBAT/PLA film；
3) using the polytetrafluoroethylene film of single side coating PBAT/PLA film obtained in step 2) as substrate, control leaching again
PBAT and PLA lamination is coated on the another side of polytetrafluoroethylene film by film machine, later the cooling PBAT/PLA for making molten condition
Film can be quickly cooled down solidification after being coated on polytetrafluoroethylene film, obtain the polytetrafluoroethylene (PTFE) of two-sided coating PBAT/PLA film
Film, i.e. insulating layer；
4) two sides of insulating layer is respectively covered with one layer of copper foil, carries out hot pressing, vacuum pressure at 350 DEG C through vacuum pressing-combining machine
The pressure of conjunction machine is 15MPa, and the time of hot pressing is 60s, so that the melting of PBAT/PLA film is bonded with copper foil, to be made two-sided
Flexibility coat copper plate.
Embodiment 2:
A kind of two layers of gum-free double side flexible copper coated board, including upper and lower two copper foil layer and are located in exhausted between two copper foil layers
Edge layer, the insulating layer include intermediate polytetrafluoroethylene film and above and below polytetrafluoroethylene film two sides PBAT/PLA
Film.
Wherein, the copper foil is electrolytic copper foil, with a thickness of 12~70 μm, polytetrafluoroethylene film with a thickness of 15~20 μ
M, PBAT/PLA film with a thickness of 6~20 μm, the weight ratio of both PBAT and PLA are 5:1, and the number-average molecular weight of PBAT is 60
The number-average molecular weight of~100 ten thousand, PLA are 1~500,000.
Above-mentioned double side flexible copper coated board the preparation method is as follows:
1) PBAT and PLA raw material agitating and heating is dry, and it is delivered to the storage bin of laminating machine；
2) raw material in storage bin enters after the screw rod of laminating machine to heat and promote, and is divided into 6 along screw rod direction in laminating machine
Bringing-up section, the heating temperatures of 6 bringing-up sections are increased from 150 DEG C with 30 DEG C incremented by successively, 70 DEG C, 20 DEG C, 10 DEG C, 10 DEG C of rule
Until reaching the film head of laminating machine after the fusing point of arrival PBAT, PBAT and PLA melting, control laminating machine drapes over one's shoulders PBAT/PLA lamination
It overlays on polytetrafluoroethylene film, after cooling is coated on the PBAT/PLA film of molten condition on polytetrafluoroethylene film later
It can be quickly cooled down solidification, obtain the polytetrafluoroethylene film of single side coating PBAT/PLA film；
3) using the polytetrafluoroethylene film of single side coating PBAT/PLA film obtained in step 2) as substrate, control leaching again
PBAT and PLA lamination is coated on the another side of polytetrafluoroethylene film by film machine, later the cooling PBAT/PLA for making molten condition
Film can be quickly cooled down solidification after being coated on polytetrafluoroethylene film, obtain the polytetrafluoroethylene (PTFE) of two-sided coating PBAT/PLA film
Film, i.e. insulating layer；
4) two sides of insulating layer is respectively covered with one layer of copper foil, carries out hot pressing, vacuum pressure at 400 DEG C through vacuum pressing-combining machine
The pressure of conjunction machine is 15MPa, and the time of hot pressing is 90s, so that the melting of PBAT/PLA film is bonded with copper foil, to be made two-sided
Flexibility coat copper plate.
Comparative example 1:
1) prepare the rolled copper foil with a thickness of 12~35 μm, polyamide thermoplastic acid resin glue and thermosetting polyamide acid
Resin adhesive liquid；
2) by thermosetting polyamide acid resin glue-coating in the surface of copper foil, the double-deck knot is obtained through 120 DEG C of baking oven drying
The single sided board of structure, in single sided board surface drying layer surface coating thermoplastic polyamic acid resin glue, after dried in 120 DEG C, using
Imidization obtains the single sided board of three-decker；
3) single sided board of two pieces of three-deckers is pressed through 350~400 DEG C of pressing machine, obtains the dual platen of five-layer structure.
Comparative example 2:
1) prepare the electrolytic copper foil with a thickness of 12~70 μm, polyamide thermoplastic acid resin glue and thermosetting polyamide acid
Resin adhesive liquid；
2) by polyamide thermoplastic acid resin glue-coating in the surface of copper foil, the double-deck knot is obtained through 120 DEG C of baking oven drying
The single sided board of structure, single sided board surface drying layer surface be coated with thermosetting property polyamic acid resin glue, after in 120 DEG C dry, using
Imidization obtains the single sided board of three-decker；
3) single sided board of two pieces of three-deckers is pressed through 350~400 DEG C of pressing machine, obtains the dual platen of five-layer structure.
Thermosetting polyamide acid resin glue the preparation method is as follows:
NMP (N-Methyl pyrrolidone) and DMAc (DMAC N,N' dimethyl acetamide) is added in the three-necked flask of 1L altogether
360g weighs the PDA of the ODA and 16.006g of 6.50g, is dissolved in above-mentioned polar solvent NMP and DMAc and obtains solution, then will
The solution cools down in a water bath, and the BPDA (bibenzene tetracarboxylic dianhydride) of 52.665g is added under nitrogen flowing, and control reaction temperature is
It 15~20 DEG C, persistently stirs 8 hours and is reacted, thermosetting polyamide acid resin glue, solid content 15% is prepared.
Polyamide thermoplastic acid resin glue the preparation method is as follows:
NMP (N-Methyl pyrrolidone) and DMAc (DMAC N,N' dimethyl acetamide) is added in the three-necked flask of 1L altogether
460g weighs the BAPP of the BAPS and 32.841g of 8.654g, is dissolved in above-mentioned polar solvent NMP and DMAc and obtains solution, then
The solution is cooled down in a water bath, is added the BPDA's (bibenzene tetracarboxylic dianhydride) and 18.631g of 11.697g under nitrogen flowing
OPDA (3,3', 4,4'- diphenyl ether dianhydride), control reaction temperature are 15~20 DEG C, persistently stir 8 hours and are reacted, are prepared
Obtain polyamide thermoplastic acid resin glue, solid content 14%.
In order to verify the technical effect of double side flexible copper coated board provided by the invention, we are by embodiment 1,2 and of embodiment
Comparative example 1, the resulting copper-clad plate of comparative example 2 carry out the test of properties, and concrete outcome is as shown in table 1:
The properties test result of table 1 embodiment 1,2 and comparative example 1,2 gained copper-clad plates
Glass transition temperature test: it uses dynamic thermomechanical analysis apparatus (DMA2980, TA company of the U.S.)；Assign 1Hz's
Vibration frequency, in a nitrogen atmosphere with the heating rate of 3 DEG C/min from room temperature to 400 DEG C, in dielectric loss angle tangent
Glass transition temperature is found out at maximum value survey；
Thermal decomposition temperature (Td 5%): use thermogravimetric analyzer (TGA) with the rate of 10 DEG C/min by room temperature to 800
DEG C, weight change is observed, 5% weight is found out and reduces temperature；
Crimpness test method: material is cut into the size of 250mm × 250mm, on the table, four sides of measurement crimp for tiling
The average value of height；
Thermal stress: plate being placed in 340 DEG C of tin furnaces after handling 10 seconds and taken out, and observation plate shows situation；
Thermal expansion coefficient: using thermomechanical analyzer (TMA), and the polyimides sample to test is warming up in TMA
It 250 DEG C, keeps after ten minutes, with the rate of temperature fall of 5 DEG C/min, finding out the thermal expansion between 240 DEG C to 100 DEG C at such a temperature
Coefficient；
Dimensional stability: it is tested according to the method for IPC-TM-650-2.4.4；
Peel strength: it is tested according to the method for IPC-TM-650-2.4.8；
Anti-flammability: it is tested referring to UL94 standard；
Dielectric constant (Dk) measurement: testing according to ASTM NO.D-150, tests under 1MHz；
Folding resistance: the test of folding resistance uses MIT method, crooked process radius 0.38mm, clamping force 4.9N, the folding of test
Number is more, shows that the folding resistance of insulating layer is better.
In conclusion not only to be provided with high peel strength and size steady simultaneously for double side flexible copper coated board provided by the invention
It is qualitative, and there is excellent thermal stability and lower dielectric constant, the thickness of copper-clad plate will also want low with respect to conventional method
It is more, the thickness of insulating layer is substantially at 65 μm hereinafter, can meet the application demand of high-end electronic product.
The foregoing is merely presently preferred embodiments of the present invention, is not intended to limit the invention, it is all in spirit of the invention and
Within principle, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.
Claims (8)
1. a kind of two layers of gum-free double side flexible copper coated board, which is characterized in that including upper and lower two copper foil layer and be located in two copper foils
Insulating layer between layer, the insulating layer include intermediate polytetrafluoroethylene film and are located at polytetrafluoroethylene film two sides up and down
PBAT/PLA laminated film.
2. double side flexible copper coated board according to claim 1, which is characterized in that the insulating layer with a thickness of 18~65 μ
m。
3. double side flexible copper coated board according to claim 1 or 2, which is characterized in that the copper foil is rolled copper foil or electricity
Solve one of copper foil.
4. a kind of preparation method of two layers of gum-free double side flexible copper coated board, which comprises the steps of:
1) agitating and heating is dry after mixing PBAT with PLA raw material, and is delivered to the storage bin of laminating machine；
2) raw material in storage bin enters after the screw rod of laminating machine to heat and promote, and is divided into multiple heating along screw rod direction in laminating machine
The temperature of section, each bringing-up section gradually rises the fusing point until arrival PBAT along screw rod direction, reaches laminating machine after material melts
Film head, control laminating machine the mixed material lamination of PBAT and PLA is coated on polytetrafluoroethylene film, later cooling make
The PBAT/PLA laminated film of molten condition can be quickly cooled down solidification after being coated on polytetrafluoroethylene film, obtain single side and drape over one's shoulders
Cover the polytetrafluoroethylene film of PBAT/PLA laminated film；
3) using the polytetrafluoroethylene film of single side coating PBAT/PLA laminated film obtained in step 2) as substrate, then secondary control
PBAT and PLA lamination is coated on the another side of polytetrafluoroethylene film by laminating machine, later the cooling PBAT/ for making molten condition
PLA laminated film can be quickly cooled down solidification after being coated on polytetrafluoroethylene film, and it is compound to obtain two-sided coating PBAT/PLA
The polytetrafluoroethylene film of film, i.e. insulating layer；
4) two sides of insulating layer is respectively covered with one layer of copper foil, carries out hot pressing at 350~400 DEG C through vacuum pressing-combining machine, so that
The melting of PBAT/PLA laminated film is bonded with copper foil, so that double side flexible copper coated board be made.
5. the preparation method according to claim 4, which is characterized in that the weight of both PBAT and PLA raw material in step 1)
Than for (3~5): 1.
6. preparation method according to claim 4 or 5, which is characterized in that the pressure of vacuum pressing-combining machine described in step 4)
For 10~15MPa, the time of hot pressing is 60~90s.
7. preparation method according to claim 6, which is characterized in that the range of number-average molecular weight of the PBAT is 1~100
The number-average molecular weight of ten thousand, the PLA are 1~1,000,000.
8. preparation method according to claim 6, which is characterized in that multiple bringing-up sections described in step 2) are 6 heating
Section, the heating temperature of 6 bringing-up sections is from 150 DEG C with 30~40 DEG C incremented by successively, 60~70 DEG C, 10~20 DEG C, 10~20
DEG C, 10~20 DEG C rule increase.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021082164A1 (en) * | 2019-10-30 | 2021-05-06 | 深圳市弘海电子材料技术有限公司 | High-frequency, low-loss, adhesive-free flexible copper clad laminate and manufacturing method thereof |
-
2018
- 2018-07-31 CN CN201810855390.9A patent/CN108973269A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021082164A1 (en) * | 2019-10-30 | 2021-05-06 | 深圳市弘海电子材料技术有限公司 | High-frequency, low-loss, adhesive-free flexible copper clad laminate and manufacturing method thereof |
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