JPH08259912A - Insulating adhesive film and production of multilayer printed wiring board - Google Patents
Insulating adhesive film and production of multilayer printed wiring boardInfo
- Publication number
- JPH08259912A JPH08259912A JP7069043A JP6904395A JPH08259912A JP H08259912 A JPH08259912 A JP H08259912A JP 7069043 A JP7069043 A JP 7069043A JP 6904395 A JP6904395 A JP 6904395A JP H08259912 A JPH08259912 A JP H08259912A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- film
- layer
- adhesive film
- insulating adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
- H05K3/4676—Single layer compositions
Landscapes
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、絶縁接着フィルム及び
これを用いた多層プリント配線板の製造方法に関する。
なお、本発明でいうフィルムは、シートを含む意味であ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an insulating adhesive film and a method for manufacturing a multilayer printed wiring board using the same.
The film in the present invention is meant to include a sheet.
【０００２】[0002]
【従来の技術】多層プリント配線板は内層回路板と外層
板又は金属はくとを接着用プリプレグを介して接着一体
化して製造している。銅張積層板をエッチングして回路
を形成するエッチドホイル法又は、銅はくの無い積層板
に無電解めっきによって回路を形成するアデティブ法に
よるものが内層回路板として用いられている。いずれに
しても、内層回路板には回路の凹凸が有するため、厚み
が大きく、樹脂分の多い接着用プリプレグを使用し、凹
部にボイドを残さないようにしている。2. Description of the Related Art A multilayer printed wiring board is manufactured by integrally bonding an inner layer circuit board and an outer layer board or a metal foil via a bonding prepreg. An etched foil method for etching a copper-clad laminate to form a circuit or an additive method for forming a circuit on a laminate without copper foil by electroless plating is used as an inner layer circuit board. In any case, since the inner-layer circuit board has circuit irregularities, an adhesive prepreg having a large thickness and a large amount of resin is used so that no void is left in the recess.
【０００３】また、外層に金属はくを配する場合は、金
属はくに凹凸があると精密な回路を形成することができ
ないので、内層回路の形状が表面に浮き出てこないよう
にすることが必要である。そのために厚みの大きい接着
プリプレグを使用するか、又は２枚以上の接着プリプレ
グを重ねて使用し、さらに内層回路の周囲にエアー抜き
用のスリットを設けたすてパターンを設け、かつ、高い
積層圧力で成形してボイドやかすれ等の外観不良を生じ
ないようにしている。Further, when a metal foil is arranged on the outer layer, it is necessary to prevent the shape of the inner layer circuit from protruding because the precise circuit cannot be formed if the metal foil has irregularities. Is. For that purpose, use a thick adhesive prepreg, or use two or more adhesive prepregs in piles, and also provide a vertical pattern with slits for air bleeding around the inner layer circuit, and a high lamination pressure. Are molded to prevent appearance defects such as voids and scratches.
【０００４】内層回路板はスルーホール接続の信頼性を
保つため厚みの大きい銅はくを使用しており、多層化接
着時に内層回路の形状を表面に浮き出しやすく、また、
接着層の厚みも大となり、プリント配線板全体の厚みも
大きくなる。また、接着用プリプレグにガラス繊維を含
むため、ガラス繊維に沿った金属イオンの移動があり、
高温、高湿度下での耐電食性に問題がある。The inner layer circuit board uses a thick copper foil in order to maintain the reliability of the through-hole connection, so that the shape of the inner layer circuit can be easily exposed on the surface at the time of multilayer bonding.
The thickness of the adhesive layer also becomes large, and the thickness of the entire printed wiring board also becomes large. Also, since the bonding prepreg contains glass fibers, there is migration of metal ions along the glass fibers,
There is a problem with electrolytic corrosion resistance under high temperature and high humidity.
【０００５】単純に、従来の接着プリプレグからガラス
織布を除くことを試みが、内層回路の凹凸を埋めやすく
するために軟化点を低くすると、外層材に内層回路の凹
凸が浮き出し、逆に軟化点を高くすると、内層回路の凹
凸を埋めることができず、ボイドができてしまう。An attempt was made simply to remove the glass woven cloth from the conventional adhesive prepreg, but if the softening point was lowered to make it easier to fill the unevenness of the inner layer circuit, the unevenness of the inner layer circuit was exposed on the outer layer material and conversely softened. If the point is raised, the unevenness of the inner layer circuit cannot be filled, and a void is created.
【０００６】そこで、軟化温度が異なる２種の熱硬化性
接着剤フィルムを用意し、軟化温度が低い熱硬化性接着
剤フィルムを内層回路板側に、軟化温度が低い熱硬化性
接着剤フィルムを外層剤側に配して加熱加圧する方法が
提案された（特開平６−１２０６６４号公報参照）。Therefore, two kinds of thermosetting adhesive films having different softening temperatures are prepared, and the thermosetting adhesive film having a low softening temperature is placed on the inner circuit board side, and the thermosetting adhesive film having a low softening temperature is provided. A method has been proposed in which it is placed on the outer layer agent side and heated and pressed (see Japanese Patent Laid-Open No. 6-120664).
【０００７】[0007]
【発明が解決しようとする課題】この方法によれば、前
述した課題を解決できるが、２種の熱硬化性接着剤フィ
ルムを用意しなければならずコスト高となる。また、プ
リント配線板の厚さに制限があり、熱硬化性接着剤フィ
ルムも薄いものにしなければならず、その取扱いに、特
に、ベースフィルムから剥離する作業が困難である。本
発明はこのような欠点を解消しようとするものである。According to this method, the above-mentioned problems can be solved, but the cost becomes high because two kinds of thermosetting adhesive films must be prepared. In addition, the thickness of the printed wiring board is limited, and the thermosetting adhesive film must be thin, and it is difficult to handle it, especially to remove it from the base film. The present invention is intended to eliminate such drawbacks.
【０００８】[0008]
【課題を解決するための手段】本発明は、連続する繊維
基材を含まず、かつ、軟化温度が異なる熱硬化性接着剤
を２層構造にしてなる絶縁接着フィルムである。The present invention is an insulating adhesive film which does not include a continuous fiber substrate and has a two-layer structure of thermosetting adhesives having different softening temperatures.
【０００９】軟化温度の差は、１５℃以上、好ましくは
３０℃以上あるようにする。軟化温度の低い熱硬化性接
着剤層の厚みは、内層導体層の厚みの１．５〜２．０倍
とし、軟化温度の高い熱硬化性接着剤層の厚みは、貫層
耐電圧の関係から少なくとも２０μｍ以上で、必要最低
限の厚さとするのが、全体を薄くするために好ましい。The difference in softening temperature is 15 ° C. or more, preferably 30 ° C. or more. The thickness of the thermosetting adhesive layer having a low softening temperature is 1.5 to 2.0 times the thickness of the inner conductor layer, and the thickness of the thermosetting adhesive layer having a high softening temperature is related to the inter-layer withstand voltage. Therefore, it is preferable that the thickness is at least 20 μm or more and the necessary minimum thickness in order to reduce the overall thickness.
【００１０】熱硬化性接着剤の接着成分となる熱硬化性
樹脂としては、フェノール樹脂、エポキシ樹脂、ポリイ
ミド樹脂等を用いることができる。これらを単独又は他
の樹脂と混合して用いる。軟化温度は、構成成分を変
え、または同一樹脂でも樹脂の分子量を違える等の手段
によって調整する。また、ベースフィルム上に第一の熱
硬化性接着剤層を形成してＢステージ化し、その上に第
二の熱硬化性接着剤層を形成してＢステージ化すると、
第一の熱硬化性接着剤層は２回加熱されるので、軟化温
度が第二の熱硬化性接着剤層よりも高くなる。第一、第
二の熱硬化性接着剤層の樹脂成分は異なっていてもよい
が熱硬化性接着剤フィルム層相互の親和性を考えると、
同一樹脂を用いるのが好ましい。A phenol resin, an epoxy resin, a polyimide resin or the like can be used as the thermosetting resin which is an adhesive component of the thermosetting adhesive. These are used alone or as a mixture with another resin. The softening temperature is adjusted by changing the constituent components, or by varying the molecular weight of the same resin, or the like. In addition, when the first thermosetting adhesive layer is formed on the base film to be B-staged, and the second thermosetting adhesive layer is formed thereon to be B-staged,
Since the first thermosetting adhesive layer is heated twice, the softening temperature becomes higher than that of the second thermosetting adhesive layer. The resin components of the first and second thermosetting adhesive layers may be different, but considering the mutual affinity of the thermosetting adhesive film layers,
It is preferable to use the same resin.
【００１１】熱硬化性接着剤は、接着成分となる熱硬化
性樹脂のほかに、フィルム形成性を有する高分子量エポ
キシ重合体を配合すると、接着フィルムが強くなり好ま
しい。このような高分子量エポキシ重合体は、二官能エ
ポキシ樹脂と二官能フェノール類とを、二官能エポキシ
樹脂と二官能フェノール類の配合当量比をエポキシ基／
フェノール性水酸基＝１．０：０．９〜１．１とし、触
媒の存在下、沸点が１００℃以上のアミド系またはケト
ン系溶媒中、反応固形分濃度５０重量％以下で、加熱し
て重合させて得られる。高分子量エポキシ重合体の重量
平均分子量は、５０，０００より高いものが好ましく、
１００，０００より高いものがさらに好ましい。It is preferable that the thermosetting adhesive contains a high molecular weight epoxy polymer having a film-forming property in addition to a thermosetting resin as an adhesive component, because the adhesive film becomes strong. In such a high molecular weight epoxy polymer, the compounding equivalence ratio of the bifunctional epoxy resin and the bifunctional phenol is the epoxy group / the bifunctional epoxy resin and the bifunctional phenol.
Phenolic hydroxyl group = 1.0: 0.9 to 1.1, polymerization is carried out in the presence of a catalyst, in an amide-based or ketone-based solvent having a boiling point of 100 ° C or higher at a reaction solid content concentration of 50% by weight or less. Can be obtained. The weight average molecular weight of the high molecular weight epoxy polymer is preferably higher than 50,000,
Those higher than 100,000 are more preferable.
【００１２】ベースフィルムとしては、銅はく、ポリエ
チレンテレフタレートフィルムが使用できる。ベースフ
ィルムとして、銅はくを使用すると、銅はくがそのまま
外層材となり、ベースフィルムを剥離する手間を省くこ
とができる。A copper foil or a polyethylene terephthalate film can be used as the base film. When copper foil is used as the base film, the copper foil serves as the outer layer material as it is, and the labor of peeling the base film can be omitted.
【００１３】本発明の絶縁接着フィルムは、銅はくをベ
ースフィルムとしたものはそのまま内層回路板に重ね加
熱加圧する。ポリエチレンテレフタレートフィルムをベ
ースフィルムとしたときは、ポリエチレンテレフタレー
トフィルムを剥離し、内層回路材と外層材との間に、絶
縁接着フィルムを、軟化点の低い層が内層回路材側にな
るようにして挟み、加熱加圧する。The insulating adhesive film of the present invention, which uses copper foil as a base film, is directly laminated on the inner layer circuit board and heated and pressed. When using a polyethylene terephthalate film as the base film, peel off the polyethylene terephthalate film and sandwich the insulating adhesive film between the inner layer circuit material and the outer layer material with the layer with the lower softening point on the inner layer circuit material side. , Heat and pressurize.
【００１４】加熱加圧するときの条件としては、軟化温
度の低い接着剤層が充分流動できるように、軟化温度の
高い接着剤層の軟化点の前後、好ましくは−５〜＋１５
℃の範囲の温度に一旦保持し、その後、硬化温度まで上
昇させる二段加熱を行うのが好ましい。The heating and pressurizing conditions are before and after the softening point of the adhesive layer having a high softening temperature, preferably from -5 to +15 so that the adhesive layer having a low softening temperature can sufficiently flow.
It is preferable to temporarily hold the temperature in the range of ° C and then perform a two-stage heating for raising the temperature to the curing temperature.
【００１５】[0015]
内層回路板の調製 厚さ３５μｍの銅はくを両面に積層した、厚さ０．２ｍ
ｍの両面銅張りガラス基材エポキシ樹脂積層板を用い、
エッチング法により回路加工を施したのち、銅はく面に
酸化処理を施し、内層回路板を得た。Preparation of inner layer circuit board Copper foil with thickness of 35 μm laminated on both sides, thickness of 0.2 m
Using a double-sided copper-clad glass base epoxy resin laminate of m,
After the circuit was processed by the etching method, the copper foil surface was oxidized to obtain an inner layer circuit board.
【００１６】ワニスの調製 エポキシ当量が１７１．５のビスフェノールＡ型エポキ
シ樹脂、分子量５００，０００の高分子量エポキシ樹脂
及びイソシアネートを、Ｎ，−Ｎジメチルアセトアミド
に溶解し、ワニスとした。配合比は、重量比で、高分子
量エポキシ樹脂１００、イソシアネート２０、ビスフェ
ノールＡ型エポキシ樹脂３０である。Preparation of varnish A bisphenol A type epoxy resin having an epoxy equivalent of 171.5, a high molecular weight epoxy resin having a molecular weight of 500,000 and an isocyanate were dissolved in N, -N dimethylacetamide to prepare a varnish. The compounding ratio is, by weight, high molecular weight epoxy resin 100, isocyanate 20, and bisphenol A type epoxy resin 30.
【００１７】接着剤フィルム（接着剤フィルムＡ）の調
製 厚さ５０μｍのポリエチレンテレフタレートフィルムに
前記ワニスを塗布し、１００℃で１０分間、さらに１５
０℃で１０分間加熱して溶剤を除去して、接着剤層をＢ
ステージ化した。接着剤層の厚さは、２０μｍであっ
た。次に、接着剤層側に再度前記ワニスを塗布し、１０
０℃で１０分間、１５０℃で１０分間加熱して溶剤を除
去して、接着剤層をＢステージ化し、接着剤層の厚さが
２層合わせて８０μｍのポリエチレンテレフタレートフ
ィルム付き絶縁接着フィルムを得た。最初に塗布した接
着剤層は、２度の加熱の為に軟化温度が８０度であった
のに対して、後から塗布した接着剤層は、軟化温度が４
５℃であった。Preparation of Adhesive Film (Adhesive Film A) The above-mentioned varnish was applied to a polyethylene terephthalate film having a thickness of 50 μm, followed by heating at 100 ° C. for 10 minutes, and further 15
Remove the solvent by heating at 0 ° C for 10 minutes and remove the adhesive layer with B
Staged. The thickness of the adhesive layer was 20 μm. Next, the varnish is applied again to the adhesive layer side, and 10
The solvent is removed by heating at 0 ° C. for 10 minutes and 150 ° C. for 10 minutes, and the adhesive layer is B-staged, and the thickness of the two adhesive layers is combined to obtain an insulating adhesive film with a polyethylene terephthalate film of 80 μm. It was The adhesive layer applied first had a softening temperature of 80 degrees because it was heated twice, whereas the adhesive layer applied later had a softening temperature of 4 degrees.
5 ° C.
【００１８】銅はく付き接着剤フィルムの調製 ポリエチレンテレフタレートフィルムに代えて、厚さ１
８μｍの銅はくを用いて以下接着剤フィルムＡと同様に
して銅はくをベースフィルムとする接着剤フィルムを得
た。Preparation of Copper Foil Adhesive Film Instead of polyethylene terephthalate film, thickness 1
An adhesive film having a copper foil as a base film was obtained in the same manner as in the adhesive film A using 8 μm copper foil.
【００１９】実施例１ 内層回路板の両面に、軟化温度の低い接着剤フィルム層
が接するように、ポリエチレンテレフタレートフィルム
を剥離除去した接着剤フィルムＡを各１枚、その外側に
厚さ１８μｍの銅はくを各１枚配置し、８０℃２ＭＰａ
で１０分間加熱加圧し、さらに温度を１７０℃圧力を４
ＭＰａまで上昇させて３０分間加熱加圧し、４層のプリ
ント配線板を得た。Example 1 One adhesive film A from which a polyethylene terephthalate film was peeled off and removed so that the adhesive film layers having a low softening temperature were in contact with both surfaces of the inner layer circuit board, and copper having a thickness of 18 μm was provided on the outside thereof. Arrange one foil each, 80 ℃ 2MPa
Heat and pressurize for 10 minutes at a temperature of 170 ° C and a pressure of 4
The pressure was raised to MPa and heated and pressed for 30 minutes to obtain a four-layer printed wiring board.
【００２０】実施例２ 内層回路板の両面に、接着剤フィルム層が接するように
銅はく付き接着剤フィルムを各１枚、配置し、８０℃２
ＭＰａで１０分間加熱加圧し、さらに温度を１７０℃圧
力を４ＭＰａまで上昇させて３０分間加熱加圧し、４層
のプリント配線板を得た。Example 2 One adhesive film with copper foil was placed on each side of the inner-layer circuit board so that the adhesive film layers were in contact with each other.
It was heated and pressed at 10 MPa for 10 minutes, further heated at 170 ° C. to 4 MPa and heated and pressed for 30 minutes to obtain a four-layer printed wiring board.
【００２１】比較例１ 内層回路板の両面に、厚さ０．１ｍｍのガラス布基材エ
ポキシ樹脂プリプレグを各１枚配置し、さらにその外側
に厚さ１８μｍの銅はくを各１枚配置し、１８０℃、３
ＭＰａで８０分間加熱加圧し、４層のプリン配線板を得
た。Comparative Example 1 A glass cloth base material epoxy resin prepreg having a thickness of 0.1 mm is arranged on each of both surfaces of the inner circuit board, and a copper foil having a thickness of 18 μm is arranged on the outside thereof. , 180 ° C, 3
It was heated and pressed at 80 MPa for 80 minutes to obtain a four-layer pudding wiring board.
【００２２】比較例２ 接着剤フィルム（接着剤フィルムＢ）の調製 厚さ５０μｍのポリエチレンテレフタレートフィルムに
前記ワニスを塗布し、１００℃で２０分間、さらに１５
０℃で２０分間加熱して溶剤を除去して、接着剤層をＢ
ステージ化した。接着剤層の厚さは、２０μｍであっ
た。 接着剤フィルム（接着剤フィルムＣ）の調製 厚さ５０μｍのポリエチレンテレフタレートフィルムに
前記ワニスを塗布し、１００℃で１０分間、さらに１５
０℃で１０分間加熱して溶剤を除去して、接着剤層をＢ
ステージ化した。接着剤層の厚さは、６０μｍであっ
た。内層回路板の両面に、ポリエチレンテレフタレート
フィルムを剥離除去した接着剤フィルムＣを各１枚、そ
の外側にポリエチレンテレフタレートフィルムを剥離除
去した接着剤フィルムＢを各１枚、さらにその外側に厚
さ１８μｍの銅はくを各１枚配置し、８０℃、２ＭＰａ
で１０分間加熱加圧し、さらに温度を１８０℃に、圧力
を３ＭＰａに上昇させて３０分間加熱加圧し、４層のプ
リン配線板を得た。Comparative Example 2 Preparation of Adhesive Film (Adhesive Film B) The above-mentioned varnish was applied to a polyethylene terephthalate film having a thickness of 50 μm, followed by heating at 100 ° C. for 20 minutes, and further 15
Remove the solvent by heating at 0 ° C for 20 minutes, and apply the adhesive layer to B
Staged. The thickness of the adhesive layer was 20 μm. Preparation of Adhesive Film (Adhesive Film C) The polyethylene terephthalate film having a thickness of 50 μm was coated with the above varnish, and the temperature was 100 ° C. for 10 minutes.
Remove the solvent by heating at 0 ° C for 10 minutes and remove the adhesive layer with B
Staged. The thickness of the adhesive layer was 60 μm. On each side of the inner layer circuit board, one adhesive film C from which the polyethylene terephthalate film has been peeled off and removed, one adhesive film B on which the polyethylene terephthalate film has been peeled off and removed, and 18 μm thick on the outside Place one copper foil each, 80 ℃, 2MPa
Was heated and pressed for 10 minutes, the temperature was further raised to 180 ° C., the pressure was raised to 3 MPa, and heated and pressed for 30 minutes to obtain a four-layer pudding wiring board.
【００２３】得られた４層プリント配線板について、表
面粗さ、層間厚さ、全体の板厚、銅はくエッチング後の
外観、内層ピール、耐電食性を調べた。その結果を表１
に示す。The obtained four-layer printed wiring board was examined for surface roughness, interlayer thickness, overall board thickness, appearance after copper foil etching, inner layer peeling, and electrolytic corrosion resistance. The results are shown in Table 1.
Shown in
【００２４】[0024]
【表１】 ━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━ 項目 実施例１ 実施例２ 比較例１ 比較例２ ──────────────────────────────────── 表面粗さ（μｍ） ３〜５ ３〜５ ２〜４ ３〜５ 層間厚さ（μｍ） ７６ ７６ １００ ７６ 全体の板厚（ｍｍ） ０．３９ ０．３９ ０．４４ ０．３９ エッチング後外観 ボイドなし ボイドなし ボイドなし ボイドなし 内層ピール（ｋＮ／ｍ） １．２ １．２ ０．９ １．２ 耐電食性（ｈ） 1000以上 1000以上 200 1000以上 ━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━ なお、耐電食性は、クリアランス０．５５ｍｍの電極間に、ＤＣ１００Ｖを、８ ５℃、８５％ＲＨで連続印加し、絶縁抵抗が１０8 Ω以下となるまでの時間で示 した。[Table 1] ━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━ Item Example 1 Example 2 Comparative example 1 Comparative Example 2 ──────────────────────────────────── Surface roughness (μm) 3-5 3〜 5 2-4 3-5 Interlayer thickness (μm) 76 76 100 100 76 Overall plate thickness (mm) 0.39 0.39 0.44 0.39 Appearance after etching No void No void No void No inner layer peel ( kN / m) 1.2 1.2 0.9 1.2 1.2 Electrolytic corrosion resistance (h) 1000 or more 1000 or more 200 1000 or more ━━━━━━━━━━━━━━━━━━━━━━━━ ━━━━━━━━━━━━━━ Electrolytic corrosion resistance is 10 8 Ω when DC100V is continuously applied between electrodes with a clearance of 0.55mm at 85 ° C and 85% RH. It is shown by the time until it becomes the following.
【００２５】[0025]
【発明の効果】本発明により、多層プリント配線板にお
いて、内層板の回路凹部にボイドを発生させず、かつ外
層の銅はくに凹凸を発生させずに、接着層の厚みを小さ
くできるようになる。このことにより、従来よりさらに
高密度化された薄型の多層プリント配線板の作製が可能
となる。しかも、本発明により得られる多層プリント配
線板は、耐電食性に優れたものである。また、接着剤フ
ィルムを２層構造にすることで、単独では、脆さや収縮
性、タック性のために形状を維持できない接着剤フィル
ムも、他の接着剤フィルムと一体化することで使用が可
能となる。さらに、ベースフィルムから引き剥がす手
間、使用する材料の数が少なくなり、作業しやすくな
る。According to the present invention, in a multilayer printed wiring board, it is possible to reduce the thickness of the adhesive layer without generating voids in the circuit recess of the inner layer board and generating unevenness in the copper foil of the outer layer. . As a result, it becomes possible to manufacture a thin multilayer printed wiring board having a higher density than ever before. Moreover, the multilayer printed wiring board obtained by the present invention has excellent electrolytic corrosion resistance. Also, by using an adhesive film with a two-layer structure, an adhesive film that cannot maintain its shape due to its brittleness, shrinkage, and tackiness can be used by integrating it with other adhesive films. Becomes Furthermore, the time and effort required for peeling off the base film and the number of materials used are reduced, which facilitates the work.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０５Ｋ 3/46 6921−4Ｅ Ｈ０５Ｋ 3/46 Ｔ (72)発明者 鈴木 隆之 茨城県下館市大字小川1500番地 日立化成 工業株式会社下館工場内─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. 6 Identification number Internal reference number FI Technical indication H05K 3/46 6921-4E H05K 3/46 T (72) Inventor Takayuki Suzuki Shimodate City, Ibaraki Ogawa Ogawa 1500 Inside Hitachi Chemical Co., Ltd. Shimodate factory
Claims (5)
温度が異なる熱硬化性接着剤を２層構造にしてなる絶縁
接着フィルム。1. An insulating adhesive film which does not include a continuous fiber base material and has a two-layer structure of thermosetting adhesives having different softening temperatures.
する高分子量エポキシ重合体と、接着性を有するエポキ
シ樹脂を必須成分とすることを特徴とする請求項１記載
の絶縁接着フィルム。2. The insulating adhesive film according to claim 1, wherein the thermosetting adhesive contains a film-forming high-molecular-weight epoxy polymer and an adhesive epoxy resin as essential components.
縁接着フィルムを形成した銅はくをベースフィルムとす
る絶縁接着フィルム。3. An insulating adhesive film having a copper foil as a base film, wherein the insulating adhesive film according to claim 1 is formed on a copper foil.
に塗布し、加熱して熱硬化性接着剤をＢステージまで硬
化させ、前記Ｂステージまで硬化した熱硬化性接着剤の
上に熱硬化性接着剤ワニスを塗布し、加熱して熱硬化性
接着剤をＢステージまで硬化させることを特徴とする絶
縁接着フィルムの製造方法。4. A thermosetting adhesive varnish is applied to a base film and heated to cure the thermosetting adhesive to the B stage, and the thermosetting adhesive is cured on the thermosetting adhesive to the B stage. A method for producing an insulating adhesive film, which comprises applying an adhesive varnish and heating it to cure the thermosetting adhesive to the B stage.
１、２又は３に記載の絶縁接着フィルムを、軟化点の低
い層が内層回路材側になるようにして挟み、加熱加圧す
ることを特徴とする多層板プリント配線板の製造方法。5. The insulating adhesive film according to claim 1, 2 or 3 is sandwiched between the inner layer circuit material and the outer layer material so that the layer having a low softening point is on the inner layer circuit material side and heated. A method for manufacturing a multilayer printed wiring board, which comprises applying pressure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7069043A JPH08259912A (en) | 1995-03-28 | 1995-03-28 | Insulating adhesive film and production of multilayer printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7069043A JPH08259912A (en) | 1995-03-28 | 1995-03-28 | Insulating adhesive film and production of multilayer printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08259912A true JPH08259912A (en) | 1996-10-08 |
Family
ID=13391171
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7069043A Pending JPH08259912A (en) | 1995-03-28 | 1995-03-28 | Insulating adhesive film and production of multilayer printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08259912A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5776662A (en) * | 1995-08-08 | 1998-07-07 | International Business Machines Corporation | Method for fabricating a chip carrier with migration barrier, and resulating chip carrier |
| JPH10212460A (en) * | 1997-01-30 | 1998-08-11 | Tomoegawa Paper Co Ltd | Adhesive tape for electronic part |
| JPH1135902A (en) * | 1997-07-23 | 1999-02-09 | Tomoegawa Paper Co Ltd | Adhesive tape for electronic parts |
| JP2001152107A (en) * | 1999-11-25 | 2001-06-05 | Hitachi Chem Co Ltd | Laminated adhesive film, substrate for mounting semiconductor chip and semiconductor device |
| JP2006237630A (en) * | 1996-11-22 | 2006-09-07 | Fanuc Ltd | Optical source device and surface light emitting device |
| JP2017007206A (en) * | 2015-06-22 | 2017-01-12 | 日鐵住金建材株式会社 | Design metal sheet and method for manufacturing the same |
| JP2020073634A (en) * | 2019-09-17 | 2020-05-14 | 日鉄建材株式会社 | Composition for upper layer side adhesion layer and composition for lower layer side adhesion layer |
-
1995
- 1995-03-28 JP JP7069043A patent/JPH08259912A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5776662A (en) * | 1995-08-08 | 1998-07-07 | International Business Machines Corporation | Method for fabricating a chip carrier with migration barrier, and resulating chip carrier |
| JP2006237630A (en) * | 1996-11-22 | 2006-09-07 | Fanuc Ltd | Optical source device and surface light emitting device |
| JPH10212460A (en) * | 1997-01-30 | 1998-08-11 | Tomoegawa Paper Co Ltd | Adhesive tape for electronic part |
| JPH1135902A (en) * | 1997-07-23 | 1999-02-09 | Tomoegawa Paper Co Ltd | Adhesive tape for electronic parts |
| JP2001152107A (en) * | 1999-11-25 | 2001-06-05 | Hitachi Chem Co Ltd | Laminated adhesive film, substrate for mounting semiconductor chip and semiconductor device |
| JP2017007206A (en) * | 2015-06-22 | 2017-01-12 | 日鐵住金建材株式会社 | Design metal sheet and method for manufacturing the same |
| JP2020073634A (en) * | 2019-09-17 | 2020-05-14 | 日鉄建材株式会社 | Composition for upper layer side adhesion layer and composition for lower layer side adhesion layer |
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