JPH08222512A - Rotary substrate treatment apparatus - Google Patents

Abstract

PURPOSE: To obtain a rotary substrate treatment apparatus by which a chuck trace is not generated on the rear of a substrate, by which particles are not generated due to the support of the substrate and which can increase the cleanliness at the edge or on the rear of the substrate without spoiling the uniformity of a coating operation. CONSTITUTION: A substrate support member 9 which comes into point contact with the rear of a substrate W having a circular or nearly circular external shape and which supports the substrate W and a regulation pin 8 the upper end side of which protrudes to the upper part from the surface of the substrate W supported by the substrate support member 9, which comes into point contact with the outer circumferential end edge of the substrate W and which regulates the position in the horizontal direction of the substrate W are installed on a freely rotatable bottom plate 7. The outside diameter of the regulation pin 8 is set at 2mm, and the protrusion height of the pin from the surface of the substrate W supported by the substrate support member 9 is set at 2mm.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は、半導体基板、光ディス
ク用の円形基板等の基板にレジスト液などの塗布液を塗
布したり、また、基板の外周縁に溶剤を供給して洗浄す
る、いわゆるエッジリンスを行うなどのために、外形形
状が円形あるいはほぼ円形の基板の外周縁を保持する基
板保持手段と、その基板保持手段を鉛直方向の軸芯周り
で回転する基板回転手段と、基板保持手段に保持された
基板に処理液を供給する処理液供給手段とを備えた回転
式基板処理装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to coating a substrate such as a semiconductor substrate or a circular substrate for an optical disk with a coating liquid such as a resist liquid, or supplying a solvent to the outer peripheral edge of the substrate for cleaning. Substrate holding means for holding the outer peripheral edge of the substrate having a circular or nearly circular outer shape for edge rinsing, etc., substrate rotating means for rotating the substrate holding means around a vertical axis, and substrate holding And a processing liquid supply means for supplying a processing liquid to the substrate held by the means.

【０００２】[0002]

【従来の技術】この種の回転式基板処理装置としては、
従来一般に、基板を真空吸着によって保持するように構
成されている。ところが、その強い吸着力に起因して基
板裏面にチャック跡が残り、このチャック跡が前工程か
らの汚染に加わり、基板表面の高さにズレを生じて、露
光時のフォーカス異常を発生させる問題があった。ま
た、基板の裏面に付着したパーティクルが離脱し、カセ
ットに収容する場合に、下側に収容されている基板の表
面を汚染するとか、あるいは、基板搬送装置に転移して
他の基板を汚染するといった問題があった。2. Description of the Related Art As a rotary substrate processing apparatus of this type,
Conventionally, the substrate is generally held by vacuum suction. However, due to the strong suction force, chuck marks are left on the back surface of the substrate, and the chuck marks add to the contamination from the previous process, causing a deviation in the height of the substrate surface, which causes focus abnormality during exposure. was there. Further, when particles adhering to the back surface of the substrate are detached and housed in a cassette, the surface of the substrate housed in the lower side is contaminated, or transferred to a substrate transfer device to contaminate other substrates. There was such a problem.

【０００３】そこで、上述のような問題を回避するため
に、基板の外周縁側に、基板の裏面を支持する支持ピン
と、基板の端面と当接して水平方向の位置を規制する上
端が基板上面より大きく突出した規制ピンとを設けると
か、あるいは、基板の外周縁をその全周にわたって覆い
ながら支持する環状部材を設けるなど、基板をその外周
縁側でのみ支持するように構成したものが提案されてい
る。Therefore, in order to avoid the above-mentioned problems, a support pin for supporting the back surface of the substrate and an upper end for abutting the end surface of the substrate to regulate the horizontal position are provided on the outer peripheral edge side of the substrate from the upper surface of the substrate. It has been proposed that the substrate is supported only on the outer peripheral edge side, such as by providing a greatly protruding restriction pin or by providing an annular member that supports the outer peripheral edge of the substrate while covering the entire outer peripheral edge thereof.

【０００４】また、特公平３−７７５８５号公報に開示
されているように、回転台の同心円上に、複数個の支持
棒を回転中心に向けて回動自在に取り付け、支持棒の支
点よりも上側に基板を支持する支持部を設け、一方、支
持棒の重心が支点よりも下側になるように構成し、支持
部に基板を載置して回転台を回転することにより、遠心
力によって支持部を回転中心に向けて回動させ、基板を
一定の力で強固に支持するように構成したものもある。As disclosed in Japanese Examined Patent Publication No. 3-77585, a plurality of support rods are rotatably mounted on a concentric circle of a turntable toward the center of rotation, and the support rods are not supported at a fulcrum. A support part for supporting the substrate is provided on the upper side, while the center of gravity of the support rod is configured to be below the fulcrum, and the substrate is placed on the support part and the turntable is rotated to generate centrifugal force. There is also a structure in which the support portion is rotated toward the center of rotation to firmly support the substrate with a constant force.

【０００５】[0005]

【発明が解決しようとする課題】しかしながら、支持ピ
ンと規制ピンとから構成した場合、回転に伴って規制ピ
ンにより乱流が発生し、基板の上面の外周縁側の規制ピ
ンの周囲において塗布均一性が低下する欠点があった。
一方、環状部材を設けるものの場合、塗布均一性には優
れているが、基板の端面や裏面が汚れやすく、また、そ
れらを洗浄しても洗浄液が残りやすく、基板の端面や裏
面の清浄度が低下する欠点があった。However, when the support pin and the regulation pin are used, turbulent flow is generated by the regulation pin due to the rotation, and the coating uniformity is reduced around the regulation pin on the outer peripheral edge side of the upper surface of the substrate. There was a drawback to
On the other hand, in the case of providing the annular member, although the coating uniformity is excellent, the end surface and the back surface of the substrate are easily contaminated, and the cleaning liquid tends to remain even after cleaning them, so that the cleanliness of the end surface and the back surface of the substrate is improved. There was a downside.

【０００６】また、特公平３−７７５８５号公報に開示
されているものの場合、前述の支持ピンと規制ピンとか
ら構成した場合と同様に、回転に伴って支持棒により乱
流が発生し、基板の上面の外周縁側の支持棒の周囲にお
いて塗布均一性が低下する欠点とともに、回転台の回転
や停止に伴って支持棒が回動するときに、支持部と基板
の端縁とが摺動し、その摺動摩擦によって基板に付着し
たレジストが剥離するなど、パーティクルが発生する欠
点があった。Further, in the case of the one disclosed in Japanese Patent Publication No. 3-77585, turbulent flow is generated by the support rod along with the rotation, as in the case of the above-mentioned support pin and the regulation pin, and the upper surface of the substrate is rotated. In addition to the drawback that the coating uniformity is reduced around the support rod on the outer peripheral edge side, when the support rod rotates with the rotation or stop of the rotating table, the support portion and the edge of the substrate slide, There is a defect that particles are generated such that the resist adhered to the substrate is peeled off due to sliding friction.

【０００７】本発明は、このような事情に鑑みてなされ
たものであって、請求項１に係る発明の回転式基板処理
装置は、基板裏面にチャック跡を生じさせたり、基板支
持に起因してパーティクルを発生させたりしないもので
ありながら、塗布均一性を損なうことなく、基板の端面
や裏面の清浄度を高くできるようにすることを目的と
し、また、請求項２に係る発明の回転式基板処理装置
は、基板の処理位置と受け渡し位置とにわたる昇降構成
を簡単にできるようにすることを目的とする。The present invention has been made in view of the above circumstances, and the rotary substrate processing apparatus according to the first aspect of the present invention causes a chuck mark on the back surface of the substrate or causes the substrate support. The object of the present invention is to prevent the particles from being generated and to increase the cleanliness of the end surface and the back surface of the substrate without impairing the coating uniformity. An object of the substrate processing apparatus is to make it possible to easily perform an elevating / lowering structure between a processing position and a delivery position of a substrate.

【０００８】[0008]

【課題を解決するための手段】請求項１に係る発明は、
上述のような目的を達成するために、外形形状が円形あ
るいはほぼ円形の基板の外周縁を保持する基板保持手段
と、その基板保持手段を鉛直方向の軸芯周りで回転する
基板回転手段と、基板保持手段に保持された基板に処理
液を供給する処理液供給手段とを備えた回転式基板処理
装置において、基板保持手段に、基板の裏面に点接触し
て基板を支持する基板支持部材と、その基板支持部材に
支持された基板の上面よりも上方に上端側が突出すると
ともに基板の外周端縁に点接触して基板の水平方向の位
置を規制する規制ピンとを備え、かつ、規制ピンを、基
板接触部位近辺から上部分の外径が２mm以内で基板支持
部材に支持された基板の上面からの突出高さが２mm以内
になるように設けて構成する。The invention according to claim 1 is
In order to achieve the above-mentioned object, a substrate holding means for holding an outer peripheral edge of a substrate having a circular or substantially circular outer shape, and a substrate rotating means for rotating the substrate holding means around a vertical axis. In a rotary substrate processing apparatus including a processing liquid supply unit that supplies a processing liquid to a substrate held by a substrate holding unit, a substrate supporting member that supports the substrate by point-contacting the back surface of the substrate with the substrate holding unit. , A regulation pin that protrudes above the upper surface of the substrate supported by the substrate support member and regulates the horizontal position of the substrate by making point contact with the outer peripheral edge of the substrate, and The outer diameter of the upper portion from the vicinity of the substrate contact portion is within 2 mm, and the protrusion height from the upper surface of the substrate supported by the substrate supporting member is within 2 mm.

【０００９】また、請求項２に係る発明の回転式基板処
理装置は、上述のような目的を達成するために、請求項
１に係る発明の回転式基板処理装置における基板支持部
材を、処理液供給手段からの処理液を供給する処理位置
とそれより上方の基板受け渡し位置とに昇降可能に設け
るとともに、基板支持部材を昇降する昇降手段を設けて
構成する。Further, in order to achieve the above-mentioned object, the rotary substrate processing apparatus of the invention according to claim 2 is characterized in that the substrate supporting member in the rotary substrate processing apparatus of the invention according to claim 1 is treated with a processing liquid. It is configured such that it can be raised and lowered between a processing position for supplying the processing liquid from the supply means and a substrate transfer position above the processing position, and an elevating means for elevating and lowering the substrate supporting member.

【００１０】[0010]

【作用】請求項１に係る発明の回転式基板処理装置の構
成によれば、基板支持部材を基板の裏面に点接触させ、
そして、規制ピンを基板の外周端縁に点接触させること
により、真空吸着によらずに基板を保持して回転させる
ことができ、レジスト液の塗布などに際して、基板とわ
ずかに接触するだけで基板を支持することができる。し
かも、規制ピンの構成について種々の考察を加えたとこ
ろ、規制ピンの外径および基板の上面からの突出高さを
それぞれ合理的に設定することにより、回転に伴って規
制ピンに起因して発生する乱流およびその周囲の塗布ム
ラを抑えることができることを見い出すに至り、この点
に着目して、規制ピンの基板接触部位近辺から上部分の
外径を２mm以内に、そして、基板支持部材に支持された
基板の上面からの規制ピンの突出高さを２mm以内にし、
規制ピンに起因して発生する乱流およびその周囲の塗布
ムラを抑えることができる。According to the structure of the rotary substrate processing apparatus of the first aspect of the present invention, the substrate supporting member is brought into point contact with the back surface of the substrate,
Then, by making the contact point of the regulation pin to the outer peripheral edge of the substrate, the substrate can be held and rotated without vacuum suction, and when the resist solution is applied, the substrate is only slightly contacted with the substrate. Can be supported. Moreover, various considerations were added to the structure of the regulation pin, and by setting the outer diameter of the regulation pin and the height of protrusion from the top surface of the board rationally, it was caused by the regulation pin accompanying rotation. It was found that the turbulent flow that occurs and the coating unevenness around it can be suppressed. Focusing on this point, the outer diameter of the regulating pin from the vicinity of the substrate contact portion to the upper portion within 2 mm and the substrate support member Set the protruding height of the regulation pin from the upper surface of the supported substrate within 2 mm,
It is possible to suppress turbulent flow caused by the restriction pin and uneven coating around the turbulent flow.

【００１１】また、請求項２に係る発明の回転式基板処
理装置の構成によれば、処理液を供給して処理する処理
位置で基板を支持する基板支持部材そのものの昇降によ
って基板を受け渡し位置まで上昇することができる。Further, according to the configuration of the rotary substrate processing apparatus of the second aspect of the present invention, the substrate supporting member itself for supporting the substrate at the processing position where the processing liquid is supplied and processed is moved up and down to the transfer position. Can rise.

【００１２】[0012]

【実施例】次に、本発明の実施例を図面を用いて詳細に
説明する。図１は本発明の回転式基板処理装置の実施例
を示す全体概略縦断面図、図２は要部の平面図、図３は
要部の斜視図であり、電動サーボモータ１の駆動によっ
て鉛直方向の軸芯周りで回転する回転軸２の上端に、基
板Ｗの外周縁を載置して保持する基板保持手段３が一体
回転可能に取り付けられている。電動サーボモータ１と
回転軸２とから成る構成を基板回転手段と称する。Embodiments of the present invention will now be described in detail with reference to the drawings. FIG. 1 is an overall schematic vertical sectional view showing an embodiment of a rotary substrate processing apparatus of the present invention, FIG. 2 is a plan view of an essential part, and FIG. 3 is a perspective view of the essential part. A substrate holding means 3 for mounting and holding the outer peripheral edge of the substrate W is integrally rotatably attached to the upper end of the rotating shaft 2 that rotates around the axis in the direction. The structure composed of the electric servomotor 1 and the rotary shaft 2 is referred to as a substrate rotating means.

【００１３】基板保持手段３およびそれによって水平姿
勢に保持された基板Ｗの周囲は、処理液の飛散を防止す
るためのカップ４で覆われている。The periphery of the substrate holding means 3 and the substrate W held in a horizontal posture by the substrate holding means 3 is covered with a cup 4 for preventing scattering of the processing liquid.

【００１４】カップ４の外側には、基板Ｗ上の回転中心
に相当する供給位置と基板Ｗ上から離れた待機位置にわ
たって移動可能に構成されたレジスト液供給ノズル５が
設けられ、供給位置において基板Ｗの表面にレジスト液
を供給し、基板Ｗの回転により基板Ｗの表面にレジスト
液を塗布できるように構成されている。また、カップ４
の外側には、基板Ｗの外周縁上に相当する供給位置と基
板Ｗ上から離れた待機位置にわたって移動可能に構成さ
れた溶剤供給ノズル６が設けられ、供給位置において基
板Ｗの表面の外周縁に溶剤を供給し、基板外周縁の不要
なレジスト液を除去できるように構成されている。On the outside of the cup 4, there is provided a resist solution supply nozzle 5 configured to be movable between a supply position corresponding to the rotation center on the substrate W and a standby position separated from the substrate W, and the substrate is provided at the supply position. The resist solution is supplied to the surface of W, and the resist solution can be applied to the surface of the substrate W by rotating the substrate W. Also, cup 4
A solvent supply nozzle 6 configured to be movable over a supply position corresponding to the outer peripheral edge of the substrate W and a standby position separated from the substrate W is provided on the outer side of the outer peripheral edge of the substrate W at the supply position. A solvent is supplied to the substrate to remove unnecessary resist liquid on the outer peripheral edge of the substrate.

【００１５】基板保持手段３は、回転軸２に一体回転可
能に連結される底板７に、その周方向に所定間隔を隔て
て６本の規制ピン８…を設けるとともに、規制ピン８…
よりも回転中心側に基板Ｗを支持する３本のピン状の基
板支持部材９…を設けて構成され、規制ピン８…を基板
Ｗの外周端縁に点接触させて基板Ｗの水平方向の位置を
規制するとともに、基板支持部材９…を基板Ｗの裏面に
点接触させて基板Ｗを支持するように構成されている。
規制部材８…のうちの所定の２本は、基板Ｗのオリエン
テーションフラットの外周端縁に点接触して基板Ｗに回
転力を有効に伝達できるように設けられている。The substrate holding means 3 is provided with six restriction pins 8 at predetermined intervals in the circumferential direction on a bottom plate 7 which is integrally rotatably connected to the rotary shaft 2, and the restriction pins 8 ...
Is provided on the side closer to the center of rotation than three pin-shaped substrate support members 9 ... Which support the substrate W, and the regulating pins 8 are brought into point contact with the outer peripheral edge of the substrate W in the horizontal direction of the substrate W. The position of the substrate W is regulated, and the substrate supporting members 9 are brought into point contact with the back surface of the substrate W to support the substrate W.
Predetermined two of the regulating members 8 ... Are provided so as to make point contact with the outer peripheral edge of the orientation flat of the substrate W so that the rotational force can be effectively transmitted to the substrate W.

【００１６】前記回転軸２が筒状に構成され、その回転
軸２内から底板７を貫通する状態で洗浄液供給ノズル１
０が設けられ、基板Ｗの裏面に洗浄液を供給し、基板Ｗ
の裏面を洗浄できるように構成されている。The rotary shaft 2 is formed in a cylindrical shape, and the cleaning liquid supply nozzle 1 is provided in a state where the rotary shaft 2 penetrates the bottom plate 7 from inside.
0, the cleaning liquid is supplied to the back surface of the substrate W,
It is configured so that the back side of can be washed.

【００１７】図１および図４の要部の拡大断面図に示す
ように、底板７の下向き面の所定の３箇所に下方に延び
る筒体１１が取り付けられ、その筒体１１…それぞれ内
に基板支持部材９の下方側が昇降可能に内嵌されるとと
もに、基板支持部材９を下降側に変位するように付勢す
る圧縮コイルスプリング１２が設けられている。筒体１
１の下部に開口１３が形成され、その開口１３の下方に
対応させて、基板支持部材９に当接して上昇させる押圧
部材１４が昇降可能に設けられるとともに押圧部材１４
にエアシリンダ１５が連動連結されている。この押圧部
材１４とエアシリンダ１５とから成る構成を昇降手段と
称する。As shown in the enlarged cross-sectional views of the main parts of FIGS. 1 and 4, cylindrical bodies 11 extending downward are attached to predetermined three positions on the downward surface of the bottom plate 7, and the substrates are provided in the respective cylindrical bodies 11. A lower side of the support member 9 is internally fitted so as to be able to move up and down, and a compression coil spring 12 that urges the substrate support member 9 to be displaced downward is provided. Cylinder 1
1. An opening 13 is formed in the lower part of 1, and a pressing member 14 that abuts and raises the substrate supporting member 9 is provided so as to correspond to the lower side of the opening 13 and can be moved up and down.
An air cylinder 15 is interlocked with the. The configuration including the pressing member 14 and the air cylinder 15 is referred to as lifting means.

【００１８】前記規制ピン８…それぞれは、図４に示す
ように、その外径Ｄが２mmに、そして、処理位置にある
基板Ｗの上面からの突出高さＨが２mmにそれぞれ設定さ
れている。As shown in FIG. 4, each of the regulation pins 8 has an outer diameter D of 2 mm and a protrusion height H from the upper surface of the substrate W at the processing position of 2 mm. .

【００１９】上記構成により、基板Ｗの搬入時には、ロ
ータリー・エンコーダなどにより所定位置で停止された
基板保持手段３に対して押圧部材１４を上昇させ、基板
支持部材９に当接してそれを基板Ｗの受け渡し位置まで
上昇させる。そして、基板Ｗの受け渡し後には、押圧部
材１４を筒体１１外まで下降させて、基板支持部材９に
対して非当接状態にし、圧縮コイルスプリング１２の弾
性復元力により基板支持部材９を下降させ、基板Ｗを処
理位置に下降する。この状態で、基板Ｗを回転してレジ
スト液の塗布やエッジリンスや裏面洗浄処理を行う。こ
のとき、基板支持部材９と筒体１１との間で密閉状態に
維持され、基板Ｗの昇降構成に起因して下部から空気を
流入させることが無く、基板Ｗの裏面の汚染を発生しな
い。次いで、基板Ｗを搬出するときには、基板保持手段
３の回転をロータリー・エンコーダなどにより所定位置
で停止させ、基板保持手段３に対して押圧部材１４を上
昇させ、基板支持部材９に当接してそれに支持された基
板Ｗを受け渡し位置まで上昇させて搬出する。With the above structure, when the substrate W is carried in, the pressing member 14 is raised with respect to the substrate holding means 3 stopped at a predetermined position by a rotary encoder or the like, and abuts against the substrate supporting member 9 to bring the substrate W into contact therewith. Raise to the delivery position. Then, after the substrate W is delivered, the pressing member 14 is lowered to the outside of the cylindrical body 11 to be in a non-contact state with the substrate supporting member 9, and the substrate supporting member 9 is lowered by the elastic restoring force of the compression coil spring 12. Then, the substrate W is lowered to the processing position. In this state, the substrate W is rotated to apply the resist solution, perform edge rinse and back surface cleaning processing. At this time, the airtight state is maintained between the substrate support member 9 and the cylindrical body 11, air does not flow from the lower portion due to the elevating structure of the substrate W, and the back surface of the substrate W is not contaminated. Next, when the substrate W is unloaded, the rotation of the substrate holding means 3 is stopped at a predetermined position by a rotary encoder or the like, the pressing member 14 is raised with respect to the substrate holding means 3, and the substrate supporting member 9 is brought into contact with it. The supported substrate W is raised to the transfer position and carried out.

【００２０】この第１実施例において、基板支持部材９
を下降側に変位するように付勢するのに、上述のような
圧縮コイルスプリング１２に代えて、例えば、引っ張り
スプリングを用いるとか、更に、基板支持部材９そのも
のを重量物で構成するとか、あるいは、基板支持部材９
に重量物を付設するなど、重力を利用しても良い。In this first embodiment, the substrate support member 9
In order to urge the plate to move downward, for example, a tension spring is used instead of the compression coil spring 12 as described above, or the substrate supporting member 9 itself is composed of a heavy object, or , Substrate support member 9
Gravity may be used such as attaching a heavy object to the.

【００２１】図５は、本発明の回転式基板処理装置の第
２実施例を示す全体概略縦断面図、図６はその要部の拡
大断面図であり、第１実施例と異なるところは次の通り
である。FIG. 5 is an overall schematic vertical cross-sectional view showing a second embodiment of the rotary substrate processing apparatus of the present invention, and FIG. 6 is an enlarged cross-sectional view of the main part thereof, which differs from the first embodiment in the following. Is the street.

【００２２】すなわち、底板７上に環状部材１６が取り
付けられ、その環状部材１６の上面に、その周方向に所
定間隔を隔てて６本の規制ピン８…が設けられるととも
に、規制ピン８よりも回転中心側の位置に、周方向に所
定間隔を隔てて３本の基板支持部材９が設けられてい
る。That is, the annular member 16 is mounted on the bottom plate 7, and six restriction pins 8 are provided on the upper surface of the annular member 16 at predetermined intervals in the circumferential direction, and more than the restriction pins 8. Three substrate support members 9 are provided at positions on the rotation center side at predetermined intervals in the circumferential direction.

【００２３】底板７の下方に、３本の基板昇降ピン１７
…が一体的に昇降可能に設けられるとともに、環状部材
１６よりも回転中心側の同心円状の位置において、底板
７に、基板昇降ピン１７を挿脱する開口１８が設けら
れ、基板保持手段３の回転をロータリー・エンコーダな
どにより所定位置で停止させ、開口１８を通じて基板昇
降ピン１７を昇降させ、基板Ｗを基板支持部材９に支持
させる処理位置と、それよりも上方の受け渡し位置とに
わたって昇降し、基板Ｗを搬入・搬出できるように構成
されている。Below the bottom plate 7, three board lifting pins 17 are provided.
... are provided so as to be able to move up and down integrally, and at a concentric position on the rotation center side of the annular member 16, an opening 18 for inserting and removing the substrate elevating pin 17 is provided in the bottom plate 7, and the substrate holding means 3 The rotation is stopped at a predetermined position by a rotary encoder or the like, the substrate elevating pin 17 is moved up and down through the opening 18, and the substrate W is supported by the substrate support member 9, and the transfer position is moved upward and downward. The substrate W is configured so that it can be loaded and unloaded.

【００２４】この第２実施例においても、規制ピン８…
それぞれは、図６に示すように、その外径Ｄが２mmに、
そして、処理位置にある基板Ｗの上面からの突出高さＨ
が２mmにそれぞれ設定されている。他の構成は第１実施
例と同じであり、同一図番を付してその説明は省略す
る。Also in this second embodiment, the regulating pin 8 ...
As shown in FIG. 6, each has an outer diameter D of 2 mm,
Then, the protrusion height H from the upper surface of the substrate W at the processing position
Are set to 2 mm respectively. The other structure is the same as that of the first embodiment, and the same reference numerals are given and the description thereof is omitted.

【００２５】次に、上記第２実施例の回転式基板処理装
置を用いて行った実験結果について説明する。規制ピン
８として外径が 0.8mm、 1.0mm、1.25mm、 2.0mm、 3.0
mmのものを用い、その基板の上面からの突出高さを 0.5
mm、 1.0mm、 2.0mm、 3.0mm、 4.0mmと変更し、それぞ
れにおいて、基板として６インチの半導体ウエハを 2,0
00〜4,000rpmで回転させ、粘度が９〜17cpのＥＣＡ（エ
チレングリコールモノエチルエーテルアセテート）系お
よびＮＯＮ−ＥＣＡ系のレジスト液を塗布し、各条件で
の、塗布ムラが生じている領域の基板Ｗの外周縁からの
幅を測定したところ、表１に示す結果が得られた。Next, the results of experiments conducted using the rotary substrate processing apparatus of the second embodiment will be described. Outer diameter is 0.8mm, 1.0mm, 1.25mm, 2.0mm, 3.0 as the regulation pin 8.
mm, and the protrusion height from the top surface of the substrate is 0.5
mm, 1.0mm, 2.0mm, 3.0mm, 4.0mm. In each of them, a 6-inch semiconductor wafer is used as a substrate for 2,0
Rotate at 00 ~ 4,000 rpm, apply ECA (ethylene glycol monoethyl ether acetate) type and NON-ECA type resist solution with viscosity of 9 ~ 17 cp, and the substrate in the area where coating unevenness occurs under each condition When the width of W from the outer peripheral edge was measured, the results shown in Table 1 were obtained.

【００２６】[0026]

【表１】 [Table 1]

【００２７】上記結果から、規制ピン８として外径を
0.8〜 2.0mm、基板Ｗの上面からの突出高さを 0.5〜 2.
0mmとしさえすれば、塗布ムラが生じている領域の基板
Ｗの外周縁からの幅を４mmに抑えることができることが
明らかであった。From the above results, the outer diameter of the regulating pin 8 is
0.8 to 2.0 mm, the protrusion height from the upper surface of the substrate W is 0.5 to 2.
It was apparent that the width from the outer peripheral edge of the substrate W in the area where the coating unevenness occurred can be suppressed to 4 mm as long as it is set to 0 mm.

【００２８】上記結果は、第１実施例の回転式基板処理
装置を用いた場合でも、また、基板として８インチの半
導体ウエハを用いた場合でも同様であった。これらのこ
とから、規制ピン８の外径を 0.8〜 2.0mmに、そして、
基板Ｗの上面からの突出高さを 0.5〜 2.0mmとするのが
好ましいことがわかった。また、強度面を考慮すれば、
規制ピン８の外径および基板Ｗの上面からの突出高さの
いずれをも 2.0mmに近い値に設定するのがより好まし
い。The above results were the same when the rotary substrate processing apparatus of the first embodiment was used and when an 8-inch semiconductor wafer was used as the substrate. From these things, the outer diameter of the regulation pin 8 should be 0.8-2.0mm, and
It has been found that the height of protrusion of the substrate W from the upper surface is preferably 0.5 to 2.0 mm. Also, considering the strength,
It is more preferable that both the outer diameter of the regulation pin 8 and the projection height from the upper surface of the substrate W are set to values close to 2.0 mm.

【００２９】前述のレジスト液供給ノズル５、溶剤供給
ノズル６および洗浄液供給ノズル１０をして処理液供給
手段と総称する。The resist solution supply nozzle 5, the solvent supply nozzle 6 and the cleaning solution supply nozzle 10 are collectively referred to as a processing solution supply means.

【００３０】上記第１実施例および第２実施例において
は、基板Ｗを処理位置と、受渡し位置との間で昇降させ
る構成をとったが、底板７の上面と基板支持部材９に支
持された基板Ｗの下面との間隙を、基板搬送装置が、基
板Ｗの受渡しのために進入できるに設定することができ
るような場合には、基板Ｗを昇降させる構成を省略する
ことができる。In the first and second embodiments, the substrate W is moved up and down between the processing position and the delivery position, but it is supported by the upper surface of the bottom plate 7 and the substrate support member 9. In the case where the gap between the lower surface of the substrate W and the lower surface of the substrate W can be set so that the substrate transfer apparatus can enter for the delivery of the substrate W, the configuration for raising and lowering the substrate W can be omitted.

【００３１】本発明としては、規制ピン８の外径は、必
ずしもその全体にわたって２mm以内である必要は無く、
少なくとも基板接触部位近辺から上方について２mm以内
の外径となるように構成すれば良い。In the present invention, the outer diameter of the regulation pin 8 does not necessarily have to be within 2 mm over the entire length,
The outer diameter may be set to be within 2 mm at least from the vicinity of the substrate contact portion.

【００３２】本発明としては、上述実施例のようなオリ
エンテーションフラットを有する円形基板に限らず、ノ
ッチを有する円形基板にも適用でき、要するに、外形形
状が円形あるいはほぼ円形の基板に対する回転式基板処
理装置に適用できる。The present invention can be applied not only to the circular substrate having the orientation flat as in the above-described embodiment but also to the circular substrate having the notch. In short, the rotary substrate processing for the substrate having the circular outer shape or the substantially circular shape. Applicable to devices.

【００３３】[0033]

【発明の効果】以上の説明から明らかなように 請求項
１に係る発明の回転式基板処理装置の構成によれば、基
板支持部材を基板の裏面に点接触させ、そして、規制ピ
ンを基板の外周端縁に点接触させることにより、真空吸
着によらずに基板を保持して回転させることができ、レ
ジスト液の塗布などに際して、基板とわずかに接触する
だけで基板を支持することができる。しかも、規制ピン
を合理的に構成し、回転に伴って規制ピンに起因して発
生する乱流およびその周囲の塗布ムラを抑えるから、基
板裏面にチャック跡を生じさせたり、基板支持に起因し
てパーティクルを発生させたりしないものでありなが
ら、塗布均一性を損なうことなく、基板の端面や裏面の
清浄度を高くできるようになった。As is apparent from the above description, according to the configuration of the rotary substrate processing apparatus of the first aspect of the present invention, the substrate support member is brought into point contact with the back surface of the substrate, and the regulation pin is attached to the substrate. By making point contact with the outer peripheral edge, the substrate can be held and rotated without vacuum suction, and the substrate can be supported with only slight contact with the substrate when applying a resist solution or the like. Moreover, since the regulation pin is rationally configured to suppress the turbulent flow caused by the regulation pin due to the rotation and the coating unevenness around it, a chuck mark may be generated on the back surface of the substrate, or the substrate may not be supported. It is possible to increase the cleanliness of the end surface and the back surface of the substrate without impairing the coating uniformity, while preventing particles from being generated.

【００３４】また、請求項２に係る発明の回転式基板処
理装置の構成によれば、処理液を供給して処理する処理
位置で基板を支持する基板支持部材そのものの昇降によ
って基板を受け渡し位置まで上昇するから、従来のよう
に、基板を受け渡し位置まで昇降するための専用の基板
支持ピンを不用にできるとともに、基板支持ピンとの接
触に伴う基板裏面の再汚染を防止でき、基板を昇降する
構成を簡単にできるとともに、基板の搬入・搬出のため
に基板を昇降する構成に起因する基板の裏面の汚れ発生
を回避でき、基板の端面や裏面の清浄度をより高くでき
て処理品質を向上できるようになった。According to the structure of the rotary type substrate processing apparatus of the second aspect of the invention, the substrate is moved up and down to the transfer position by raising and lowering the substrate supporting member itself which supports the substrate at the processing position where the processing liquid is supplied and processed. Since it rises, it is possible to eliminate the need for a dedicated substrate support pin for raising and lowering the substrate to the transfer position, and prevent recontamination of the back surface of the substrate due to contact with the substrate support pin, thus raising and lowering the substrate. In addition to simplifying, it is possible to avoid the occurrence of dirt on the back surface of the substrate due to the configuration of raising and lowering the substrate for loading and unloading the substrate, and it is possible to further improve the cleanliness of the end surface and the back surface of the substrate and improve the processing quality. It became so.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明の回転式基板処理装置の第１実施例を示
す全体概略縦断面図である。FIG. 1 is an overall schematic vertical sectional view showing a first embodiment of a rotary substrate processing apparatus of the present invention.

【図２】要部の平面図である。FIG. 2 is a plan view of a main part.

【図３】要部の斜視図である。FIG. 3 is a perspective view of a main part.

【図４】要部の拡大断面図である。FIG. 4 is an enlarged cross-sectional view of a main part.

【図５】本発明の回転式基板処理装置の第２実施例を示
す全体概略縦断面図である。FIG. 5 is an overall schematic vertical sectional view showing a second embodiment of the rotary substrate processing apparatus of the present invention.

【図６】要部の拡大断面図である。FIG. 6 is an enlarged cross-sectional view of a main part.

【符号の説明】[Explanation of symbols]

１…電動サーボモータ ２…回転軸 ３…基板保持手段 ５…レジスト液供給ノズル ６…溶剤供給ノズル ８…規制ピン ９…基板支持部材 １０…洗浄液供給ノズル １４…押圧部材 １５…エアシリンダ Ｗ…基板 DESCRIPTION OF SYMBOLS 1 ... Electric servo motor 2 ... Rotating shaft 3 ... Substrate holding means 5 ... Resist solution supply nozzle 6 ... Solvent supply nozzle 8 ... Regulation pin 9 ... Substrate support member 10 ... Cleaning solution supply nozzle 14 ... Pressing member 15 ... Air cylinder W ... Substrate

Claims (2)

【特許請求の範囲】[Claims] 【請求項１】 外形形状が円形あるいはほぼ円形の基板
の外周縁を保持する基板保持手段と、その基板保持手段
を鉛直方向の軸芯周りで回転する基板回転手段と、前記
基板保持手段に保持された前記基板に処理液を供給する
処理液供給手段とを備えた回転式基板処理装置であっ
て、 前記基板保持手段に、前記基板の裏面に点接触して前記
基板を支持する基板支持部材と、前記基板支持部材に支
持された前記基板の上面よりも上方に上端側が突出する
とともに前記基板の外周端縁に点接触して前記基板の水
平方向の位置を規制する規制ピンとを備え、かつ、前記
規制ピンを、基板接触部位近辺から上部分の外径が２mm
以内で前記基板支持部材に支持された前記基板の上面か
らの突出高さが２mm以内になるように設けたことを特徴
とする回転式基板処理装置。1. A substrate holding means for holding an outer peripheral edge of a substrate having an outer shape of a circle or a substantially circular shape, a substrate rotating means for rotating the substrate holding means around a vertical axis, and a substrate holding means for holding the substrate holding means. And a processing liquid supply means for supplying a processing liquid to the substrate, wherein the substrate holding means supports the substrate by holding the substrate holding means in point contact with the back surface of the substrate. And a regulation pin whose upper end side projects above the upper surface of the substrate supported by the substrate supporting member and which is in point contact with the outer peripheral edge of the substrate to regulate the horizontal position of the substrate, and The outer diameter of the regulating pin is 2mm from the vicinity of the board contact part to the upper part.
A rotary substrate processing apparatus, characterized in that the protrusion height from the upper surface of the substrate supported by the substrate supporting member is within 2 mm. 【請求項２】 請求項１に記載の基板支持部材を、前記
処理液供給手段からの処理液を供給する処理位置とそれ
より上方の基板受け渡し位置とに昇降可能に設けるとと
もに、前記基板支持部材を昇降する昇降手段を設けてあ
る回転式基板処理装置。2. The substrate supporting member according to claim 1 is provided so as to be capable of moving up and down between a processing position for supplying the processing liquid from the processing liquid supply means and a substrate delivery position above the processing position, and the substrate supporting member. A rotary substrate processing apparatus provided with an elevating means for elevating and lowering.