JPH0537095A - End-plated printed wiring board and its manufacture - Google Patents
End-plated printed wiring board and its manufactureInfo
- Publication number
- JPH0537095A JPH0537095A JP21044391A JP21044391A JPH0537095A JP H0537095 A JPH0537095 A JP H0537095A JP 21044391 A JP21044391 A JP 21044391A JP 21044391 A JP21044391 A JP 21044391A JP H0537095 A JPH0537095 A JP H0537095A
- Authority
- JP
- Japan
- Prior art keywords
- board
- wiring board
- printed wiring
- plating
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、端面に銅めっきなどの
めっきを施した端面めっき付きプリント配線板と、その
製造方法とに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board having an end face plated with copper or the like on the end face, and a method for manufacturing the same.
【0002】[0002]
【従来の技術および発明の背景】マイクロ波周波数帯な
どの高周波の電気信号を処理する電気回路を有するプリ
ント配線板では、基板の端面において筐体などの外部機
器との間で発生する電気的悪影響を防ぐために、端面に
めっきを施すことが従来より行われている。すなわちこ
のめっき(端面めっきという)は主として高周波領域で
の(磁気)シールド効果を得るものである。2. Description of the Related Art In a printed wiring board having an electric circuit for processing a high frequency electric signal such as a microwave frequency band, an electric adverse effect which occurs at an end face of the board with an external device such as a casing. In order to prevent this, plating has been conventionally performed on the end surface. That is, this plating (called end face plating) mainly obtains a (magnetic) shield effect in a high frequency region.
【0003】図5はこの端面めっき付きプリント配線板
の製造途中のワークボードを示す図、図6はプリント配
線板の平面図、図7はそのVII − VII線断面図である。
図5に示すワークボード10はプリント基板部12とそ
の周囲の枠部14とを持ち、この枠部14をつかんでプ
リント配線の回路パターンを形成するための種々の処理
工程に搬送される。例えばフォレレジストの塗布、露
光、洗浄、エッチング、めっき処理、スルーホール加工
等の処理が行われる。FIG. 5 is a view showing a work board in the process of manufacturing this printed wiring board with end face plating, FIG. 6 is a plan view of the printed wiring board, and FIG. 7 is a sectional view taken along line VII-VII thereof.
The work board 10 shown in FIG. 5 has a printed circuit board section 12 and a frame section 14 around the printed circuit board section 12, and is conveyed to various processing steps for forming a circuit pattern of a printed wiring by grasping the frame section 14. For example, processing such as coating of photoresist, exposure, cleaning, etching, plating, and through hole processing is performed.
【0004】プリント基板部12の処理が終了すると、
このプリント配線部12の周縁に沿って複数のスリット
16が形成され、これらのスリット16の内周および周
縁部付近にめっき処理が施される。これらスリット加工
およびめっき処理はスルーホールなどの加工と同時に行
ってもよい。めっき処理により、銅めっき、金めっき、
ニッケルめっきなどのめっき層18が形成される。When the processing of the printed circuit board section 12 is completed,
A plurality of slits 16 are formed along the peripheral edge of the printed wiring portion 12, and plating treatment is applied to the inner periphery of the slit 16 and the vicinity of the peripheral edge portion. These slit processing and plating processing may be performed simultaneously with the processing of through holes and the like. Depending on the plating process, copper plating, gold plating,
A plating layer 18 such as nickel plating is formed.
【0005】次にこのワークボード10は、各スリット
16間のつなぎ部20を切断してプリント基板部12を
枠部14から切離し、図6のプリント配線板22を得
る。ここにつなぎ部20の切断面は図5に仮想線24で
示されている。この結果図6に示すように、スリット1
6があった部分a、bだけにめっき層18が形成され他
の部分には切断面24が表れた端面めっき付きのプリン
ト配線板22が得られるものである。ここにめっき層1
8は図7に示すように、スリット16の内周だけでなく
その周縁付近まで延出させ、プリント配線板22の上下
面のグランド(接地)パターン26、28に接続される
ようにしてもよい。Next, in the work board 10, the connecting portion 20 between the slits 16 is cut to separate the printed board portion 12 from the frame portion 14 to obtain a printed wiring board 22 shown in FIG. The cut surface of the connecting portion 20 is shown by an imaginary line 24 in FIG. As a result, as shown in FIG. 6, the slit 1
The printed wiring board 22 with the end surface plating is obtained in which the plating layer 18 is formed only on the portions a and b where the 6 was present and the cut surface 24 appears on the other portions. Plating layer 1 here
As shown in FIG. 7, the reference numeral 8 may extend not only to the inner periphery of the slit 16 but also to the vicinity of its periphery so as to be connected to the ground patterns 26 and 28 on the upper and lower surfaces of the printed wiring board 22. .
【0006】従来はこのつなぎ部20の切断は、カッタ
ーややすりを用いた手作業により行ったり、NCルータ
を用いて行っていた。図8は手作業の場合の切断部付近
の平面図、図9はこの切断部付近のめっき層を配線板2
2の端面側から見た図、図10は同じく平面図である。
手作業による場合は、図8に示すように一方のスリット
16から高速で回転する薄い円盤状の回転刃(例えばダ
イヤモンドカッター)を入れて切断面24に沿って移動
させながら切断するものである。そしてその後切断面2
4をやすりにより平滑化するものである。Conventionally, the cutting of the connecting portion 20 has been performed manually by using a cutter or a file, or by using an NC router. FIG. 8 is a plan view of the vicinity of the cut portion in the case of manual work, and FIG. 9 shows the plating layer near the cut portion of the wiring board 2.
FIG. 10 is a view seen from the end face side of FIG. 2, and FIG.
In the case of manual work, as shown in FIG. 8, a thin disk-shaped rotary blade (for example, a diamond cutter) that rotates at a high speed is inserted from one slit 16 and cut while moving along a cutting surface 24. And then cut surface 2
4 is smoothed with a file.
【0007】しかしこの手作業による方法では切断面2
4とめっき層18との境界部cにおいて、めっき層18
が不規則に削り取られ、図9に示すようにめっき層18
の端部が切断面24側に大きく進入したり後退したりす
ることがあった。このめっき層18をグランドパターン
26、28に接続する場合には、通常配線板22の上・
下面のグランドパターン(図7の26、28参照)に重
なるように延出しているから、このように境界部cでめ
っき層18が不規則になると、このグランドパターン
(26、28)との接続が不安定になったり、切断面2
4側や配線板22の上・下面に延出した部分d、e(図
9、10)が配線板22から剥離し易くなるという問題
があった。However, with this manual method, the cut surface 2
4 at the boundary portion c between the plating layer 18 and the plating layer 18
Irregularly scraped off, and as shown in FIG.
There was a case where the end of the blade greatly entered or retreated to the cut surface 24 side. When connecting the plating layer 18 to the ground patterns 26 and 28, the
Since it extends so as to overlap with the ground pattern (see 26 and 28 in FIG. 7) on the lower surface, if the plating layer 18 becomes irregular at the boundary portion c in this way, connection with this ground pattern (26, 28) Becomes unstable, and the cut surface 2
There is a problem that the portions d and e (FIGS. 9 and 10) extending to the fourth side and the upper and lower surfaces of the wiring board 22 are easily separated from the wiring board 22.
【0008】また図11はNCルーターを用いる場合の
切断工程を示す平面図、図12はその切断部付近の平面
図である。NCルーターは丸棒状の回転刃の回転周面を
切断線に沿って移動させることにより端面の切断を行う
ものであり、この回転刃は図11に仮想線で示すように
一方のスリット16の端に貫挿された状態で他方のスリ
ット16に向って矢印の方向に移動される。この結果f
の部分を切削することにより、つなぎ部20を切断面2
4に沿って切断するものである。Further, FIG. 11 is a plan view showing a cutting process when an NC router is used, and FIG. 12 is a plan view near the cutting portion. The NC router cuts the end face by moving the rotary peripheral surface of a round bar-shaped rotary blade along a cutting line, and this rotary blade cuts the end of one slit 16 as shown by a virtual line in FIG. It is moved in the direction of the arrow toward the other slit 16 in the state of being inserted. This result f
By cutting the part of the
It cuts along with 4.
【0009】しかしこのNCルーターを用いる場合に
は、回転刃の円周面がめっき部18に接触する際に、め
っき部18の端gが図12に示す用に剥離し易いという
問題があった。However, when this NC router is used, when the circumferential surface of the rotary blade comes into contact with the plated portion 18, the end g of the plated portion 18 is easily peeled off as shown in FIG. .
【0010】このように従来のものではめっき層18の
端が不揃いになったり、めっき層の端が剥離し易いた
め、特にこのような部分に接近して高周波回路を配線し
たり、外部機器に組込んだ場合には、電気的特性が不安
定になるという問題が生じ易かった。また大きい衝撃が
加わった時にめっき層18の端の剥離部分が脱落する心
配もあった。As described above, in the conventional case, the edges of the plating layer 18 are uneven, and the edges of the plating layer are easily peeled off. When incorporated, the problem of unstable electrical characteristics was likely to occur. Further, there is a concern that the peeled portion at the end of the plating layer 18 may fall off when a large impact is applied.
【0011】[0011]
【発明の目的】本発明は以上のような事情に鑑みなされ
たものであり、めっき層の端が不揃いにならず、まため
っき層の端が剥離するおそれもない端面めっき付きプリ
ント配線板を提供することを目的とする。またその製造
方法を提供することを他の目的とする。SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and provides an end face plated printed wiring board in which the edges of the plating layer do not become uneven and the edges of the plating layer do not peel off. The purpose is to do. Another object is to provide a manufacturing method thereof.
【0012】[0012]
【発明の構成】本発明によればこの目的は、プリント基
板部の外形より大きいワークボードに、このプリント基
板部の外周に沿った複数のスリットを形成し、このスリ
ットにめっき層を形成してからスリット間のつなぎ部を
前記プリント基板部の外周に沿って切断した端面めっき
付きプリント配線板において、前記各スリットの端部と
前記つなぎ部切断面との間にプリント基板部側へ弧状に
進入するドリル加工孔が形成されていることを特徴とす
る端面めっき付きプリント配線板により達成される。ま
た他の目的は、プリント基板部の外形より大きいワーク
ボードに、このプリント基板部の外周に沿った複数のス
リットを形成し、このスリットにめっき層を形成してか
らスリット間のつなぎ部を前記プリント基板部の外周に
沿って切断する端面めっき付きプリント配線板の製造方
法において、前記スリットの端にこのスリット幅より大
径のドリル孔明け加工を施して前記プリント基板部側へ
弧状に進入するドリル加工孔を形成した後、このドリル
加工孔をつなぐように前記つなぎ部の切断加工を行うこ
とを特徴とする端面めっき付きプリント配線板の製造方
法により達成される。According to the present invention, an object of the present invention is to form a plurality of slits along the outer circumference of a printed board portion on a work board larger than the outer shape of the printed board portion, and to form a plating layer in the slits. In the printed wiring board with end face plating, which cuts the connecting portion between the slits along the outer periphery of the printed circuit board portion, the printed wiring board is arcuately inserted between the end portion of each slit and the cut surface of the connecting portion. This is achieved by a printed wiring board with end face plating, which is characterized in that a drilled hole is formed. Still another object is to form a plurality of slits along the outer circumference of the printed board portion on a work board larger than the outer shape of the printed board portion, form a plating layer on the slits, and then connect the slits to each other. In a method for manufacturing an end-plated printed wiring board that is cut along the outer periphery of a printed circuit board part, the end of the slit is subjected to a drilling process having a diameter larger than the slit width to enter the printed circuit board part side in an arc shape. This is achieved by a method for manufacturing a printed wiring board with an end face plating, which comprises forming a drilled hole and then cutting the connecting portion so as to connect the drilled hole.
【0013】[0013]
【実施例】図1は本発明の一実施例の平面図、図2はド
リル孔明け工程を示す平面図、図3はNCルーター加工
工程を示す平面図、図4は要部の拡大平面図である。前
記図5に示したワークボード10までの製造工程は従来
と同一であるからその説明は繰り返さない。スリット1
6にめっき処理を施した後のワークボード10には、図
2に示すようにドリル孔50の孔明け加工が行われる。
このドリル孔50の加工に用いるドリル径Dは、スリッ
ト16の径すなわち幅Lよりも大きく、ドリル孔50が
スリット16の端付近で幅方向の両内壁に重なるように
位置決めされる。この結果このドリル孔50の周面がプ
リント基板部12(図5参照)側へ円弧状に進入する。1 is a plan view of an embodiment of the present invention, FIG. 2 is a plan view showing a drilling step, FIG. 3 is a plan view showing an NC router processing step, and FIG. 4 is an enlarged plan view of an essential part. Is. Since the manufacturing process up to the work board 10 shown in FIG. 5 is the same as the conventional process, the description thereof will not be repeated. Slit 1
The work board 10 after the plating process is performed on 6 is subjected to drilling of the drill hole 50 as shown in FIG.
The drill diameter D used for processing the drill hole 50 is larger than the diameter of the slit 16, that is, the width L, and is positioned so that the drill hole 50 overlaps both inner walls in the width direction near the end of the slit 16. As a result, the peripheral surface of the drill hole 50 enters the printed board portion 12 (see FIG. 5) side in an arc shape.
【0014】全てのスリット16の両端付近にそれぞれ
ドリル加工孔50が明けられた後、図3に示すように2
つのドリル加工孔50間のつなぎ部20がNCルーター
により切断される。この図3で斜線で示す部分はこのN
Cルーターによる切除部52を示す。この切除部52は
この実施例ではスリット16と同じ幅Lを持ち、またス
リット16の中心線Mの延長線上に位置する。この結果
図1に示すように、めっき層18Aと切断面24Aとの
間に、プリント配線板22A側へ円弧状に進入するドリ
ル加工孔50が形成されることになる。After drilling holes 50 are formed near both ends of all the slits 16, as shown in FIG.
The connecting portion 20 between the two drilled holes 50 is cut by the NC router. In FIG. 3, the hatched portion is this N
The excision part 52 by a C router is shown. The cutout 52 has the same width L as the slit 16 in this embodiment, and is located on an extension of the centerline M of the slit 16. As a result, as shown in FIG. 1, a drilled hole 50 is formed between the plating layer 18A and the cut surface 24A so as to enter the printed wiring board 22A side in an arc shape.
【0015】ドリル加工孔50による加工は、先端が刃
になったドリル刃を用い、このドリル刃をワークボード
10に対してその厚さ方向に前進させて孔明けを行うか
ら、このドリル刃の前進により刃の先端がめっき層18
Aの端を厚さ方向に切削することになる。このためめっ
き層18Aの端を剥離することなく切削できる。またド
リル刃の位置はワークボード10に対して不変であるか
ら、めっき層18Aの端面も不揃いになることがない。The drilling with the drilling hole 50 uses a drilling blade having a tip at the tip, and this drilling blade is advanced in the thickness direction with respect to the work board 10 to make a hole. Due to the forward movement, the tip of the blade is plated layer 18
The end of A will be cut in the thickness direction. Therefore, it is possible to cut without peeling the end of the plated layer 18A. Further, since the position of the drill blade does not change with respect to the work board 10, the end surface of the plating layer 18A does not become uneven.
【0016】[0016]
【発明の効果】請求項1の発明は以上のように、スリッ
ト(16)の内周面およびつなぎ部(20)の切断面
(24A)よりもプリント配線板(22A)側へ弧状に
進入するドリル加工孔(50)を形成したものであるか
ら、めっき層18Aの端が不揃いにならずまた剥離する
こともなくなる。このため高周波回路に対する電気的特
性が安定化し、また激しい衝撃が加わってもめっき層の
脱落が生じないから回路装置の耐久性、信頼性が向上す
る。また請求項2の発明によればこのプリント配線板の
製造方法が得られる。As described above, according to the first aspect of the present invention, the inner peripheral surface of the slit (16) and the cut surface (24A) of the connecting portion (20) enter the printed wiring board (22A) side in an arc shape. Since the drilled holes (50) are formed, the edges of the plating layer 18A are neither uneven nor peeled off. As a result, the electrical characteristics of the high frequency circuit are stabilized, and the plating layer does not fall off even when a strong shock is applied, so that the durability and reliability of the circuit device are improved. According to the invention of claim 2, the method for manufacturing the printed wiring board can be obtained.
【0017】[0017]
【図1】本発明の一実施例の平面図FIG. 1 is a plan view of an embodiment of the present invention.
【図2】ドリル加工を示す平面図FIG. 2 is a plan view showing drilling.
【図3】NCルータ加工を示す平面図FIG. 3 is a plan view showing machining of an NC router.
【図4】その一部の拡大図FIG. 4 is an enlarged view of a part thereof.
【図5】ワークボードを示す平面図FIG. 5 is a plan view showing a work board.
【図6】従来のプリント配線板の平面図FIG. 6 is a plan view of a conventional printed wiring board.
【図7】そのVII − VII線断面図FIG. 7: VII-VII line sectional view
【図8】手作業による切断加工の説明図FIG. 8 is an explanatory diagram of a manual cutting process.
【図9】その切断面を示す図FIG. 9 is a view showing the cut surface.
【図10】同じく平面図FIG. 10 is a plan view of the same.
【図11】NCルータによる加工の説明図FIG. 11 is an explanatory diagram of processing by an NC router.
【図12】その加工結果を示す平面図FIG. 12 is a plan view showing the processing result.
10 ワークボード 12 プリント基板部 16 スリット 18A めっき層 20 つなぎ部 22A プリント配線板 24A 切断面 50 ドリル加工孔 10 work boards 12 Printed circuit board 16 slits 18A plating layer 20 ties 22A printed wiring board 24A cut surface 50 drilled holes
Claims (2)
ボードに、このプリント基板部の外周に沿った複数のス
リットを形成し、このスリットにめっき層を形成してか
らスリット間のつなぎ部を前記プリント基板部の外周に
沿って切断した端面めっき付きプリント配線板におい
て、前記各スリットの端部と前記つなぎ部切断面との間
にプリント基板部側へ弧状に進入するドリル加工孔が形
成されていることを特徴とする端面めっき付きプリント
配線板。1. A work board, which is larger than the outer shape of a printed circuit board section, is formed with a plurality of slits along the outer circumference of the printed circuit board section, a plating layer is formed on the slits, and then a connecting portion between the slits is printed on the work board. In the printed wiring board with end face plating cut along the outer periphery of the substrate portion, a drilled hole is formed between the end portion of each slit and the cut surface of the connecting portion in an arc shape toward the printed board portion side. A printed wiring board with an end surface plating, which is characterized in that
ボードに、このプリント基板部の外周に沿った複数のス
リットを形成し、このスリットにめっき層を形成してか
らスリット間のつなぎ部を前記プリント基板部の外周に
沿って切断する端面めっき付きプリント配線板の製造方
法において、前記スリットの端にこのスリット幅より大
径のドリル孔明け加工を施して前記プリント基板部側へ
弧状に進入するドリル加工孔を形成した後、このドリル
加工孔をつなぐように前記つなぎ部の切断加工を行うこ
とを特徴とする端面めっき付きプリント配線板の製造方
法。2. A work board, which is larger than the outer shape of the printed circuit board section, is formed with a plurality of slits along the outer periphery of the printed circuit board section, a plating layer is formed in the slits, and then a connecting portion between the slits is printed on the work board. In a method for manufacturing a printed wiring board with an end face plating that cuts along the outer periphery of a board portion, a drill that makes a drill hole having a diameter larger than this slit width at the end of the slit and enters the printed board portion in an arc shape. A method for manufacturing a printed wiring board with an end surface plating, which comprises forming a processed hole and then cutting the connecting portion so as to connect the drilled hole.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21044391A JPH0736464B2 (en) | 1991-07-29 | 1991-07-29 | Printed wiring board with end face plating and method for manufacturing the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21044391A JPH0736464B2 (en) | 1991-07-29 | 1991-07-29 | Printed wiring board with end face plating and method for manufacturing the same |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0537095A true JPH0537095A (en) | 1993-02-12 |
JPH0736464B2 JPH0736464B2 (en) | 1995-04-19 |
Family
ID=16589417
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP21044391A Expired - Fee Related JPH0736464B2 (en) | 1991-07-29 | 1991-07-29 | Printed wiring board with end face plating and method for manufacturing the same |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0736464B2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008042000A (en) * | 2006-08-08 | 2008-02-21 | Denso Corp | Printed-wiring board and its manufacturing method |
JP2017199764A (en) * | 2016-04-26 | 2017-11-02 | 京セラ株式会社 | Module printed wiring board and method of manufacturing the same |
JP2021015898A (en) * | 2019-07-12 | 2021-02-12 | Idec株式会社 | Substrate, mounting method of mounting component on substrate, and manufacturing method of substrate |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004247980A (en) * | 2003-02-14 | 2004-09-02 | Hitachi Ltd | Connection structure and method of transmission line |
-
1991
- 1991-07-29 JP JP21044391A patent/JPH0736464B2/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008042000A (en) * | 2006-08-08 | 2008-02-21 | Denso Corp | Printed-wiring board and its manufacturing method |
JP2017199764A (en) * | 2016-04-26 | 2017-11-02 | 京セラ株式会社 | Module printed wiring board and method of manufacturing the same |
JP2021015898A (en) * | 2019-07-12 | 2021-02-12 | Idec株式会社 | Substrate, mounting method of mounting component on substrate, and manufacturing method of substrate |
Also Published As
Publication number | Publication date |
---|---|
JPH0736464B2 (en) | 1995-04-19 |
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