JPH08156020A - Manufacture of key top plate - Google Patents

Manufacture of key top plate

Info

Publication number
JPH08156020A
JPH08156020A JP32995894A JP32995894A JPH08156020A JP H08156020 A JPH08156020 A JP H08156020A JP 32995894 A JP32995894 A JP 32995894A JP 32995894 A JP32995894 A JP 32995894A JP H08156020 A JPH08156020 A JP H08156020A
Authority
JP
Japan
Prior art keywords
mold
key top
cavity
film plate
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP32995894A
Other languages
Japanese (ja)
Other versions
JP3101859B2 (en
Inventor
Takashi Shinoki
高司 篠木
Tatsuya Okamura
達也 岡村
Harunobu Sunaga
治伸 須永
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Teikoku Tsushin Kogyo Co Ltd
Original Assignee
Teikoku Tsushin Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teikoku Tsushin Kogyo Co Ltd filed Critical Teikoku Tsushin Kogyo Co Ltd
Priority to JP06329958A priority Critical patent/JP3101859B2/en
Publication of JPH08156020A publication Critical patent/JPH08156020A/en
Application granted granted Critical
Publication of JP3101859B2 publication Critical patent/JP3101859B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C2045/1486—Details, accessories and auxiliary operations
    • B29C2045/14967—Injecting through an opening of the insert
    • B29C2045/14975—Injecting through an opening of the insert the injection nozzle penetrating through the insert
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/46—Knobs or handles, push-buttons, grips
    • B29L2031/466—Keypads, keytops
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H2229/00—Manufacturing
    • H01H2229/044—Injection moulding
    • H01H2229/047—Preformed layer in mould

Abstract

PURPOSE: To prevent a film sheet from peeling off and simplify a die structure. CONSTITUTION: This method of manufacturing a key top plate is to manufacture a key top plate with a key top of a molded resin formed on the upper surface of a film sheet 20. There are provided a first die 40 with a cavity 41 of the same shape as that of the upper part of the key top, the film sheet 20 with a through hole 27 opened at a specified opposite position to the cavity 41, and a second die 50 with a pin gate 55 projected toward the cavity 41, which is opposed to the through hole 27. The film sheet 20 is held between the first and the second dies 40, 50, and a molten resin is poured into the cavity 41 in the first die 40 from the pin gate 55 formed in the through hole 27. The first and the second dies 40, 50 are removed after the molten resin is solidified.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は、押釦スイッチに用いる
キートップ板の製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a key top plate used for a push button switch.

【０００２】[0002]

【従来技術】従来、小型化・薄型化を図るために樹脂フ
イルムからなるフイルム板上に直接モールド樹脂製のキ
ートップを成型したキートップ板が開発されており、そ
の中でもフイルム板に所望の印刷層を印刷しておき、こ
れをその下側に配置した照明手段によって照らし出すタ
イプのキートップ板が開発されている。2. Description of the Related Art Conventionally, a key top plate has been developed in which a key top made of a mold resin is directly molded on a film plate made of a resin film in order to reduce the size and thickness of the film. Among them, desired printing is performed on the film plate. A key top plate of a type has been developed in which a layer is printed and is illuminated by a lighting means arranged under the layer.

【０００３】図７はこの種の従来のキートップ板のキー
トップの部分を示す要部概略側断面図である。同図に示
すようにこのキートップ板２００は、透明であってその
上面に所望の印刷層を印刷した樹脂製のフイルム板２０
１の上に、透明なモールド樹脂製のキートップ２１１を
直接成型して構成されている。FIG. 7 is a schematic side sectional view showing a key top portion of a conventional key top plate of this type. As shown in the figure, the key top plate 200 is a resin film plate 20 which is transparent and has a desired printing layer printed on the upper surface thereof.
1, a key top 211 made of a transparent mold resin is directly molded on the top surface of the base 1.

【０００４】フイルム板２０１とキートップ２１１間の
固定は、キートップ２１１の外周に設けたつば部２１５
と、フイルム板２０１に設けた貫通孔２０５を通してつ
ば部２１５からフイルム板２０１の裏面側に到る固定部
２１７とによってフイルム板２０１を挟持することによ
って行われる。The film plate 201 and the key top 211 are fixed to each other by fixing a flange portion 215 provided on the outer periphery of the key top 211.
Then, the film plate 201 is sandwiched by the fixing portion 217 extending from the flange portion 215 to the back surface side of the film plate 201 through the through hole 205 provided in the film plate 201.

【０００５】そして図示しない照明手段によってこのキ
ートップ板２００をその下側から照らし出せば、フイル
ム板２０１上に印刷した色彩・模様などがキートップ２
１１の表面にくっきりと照らし出される。特にこのキー
トップ２１１の場合、キートップ２１１のつば部２１５
を除く真下の部分全体に、貫通孔２０５や固定部２１７
が位置しないので、該部分全体に印刷した色彩・模様な
どが何ものにも妨げられずに表示できるので好適であ
る。When the key top plate 200 is illuminated from the lower side by an illuminating means (not shown), the colors and patterns printed on the film plate 201 are displayed on the key top 2
The surface of 11 is illuminated clearly. Particularly in the case of this key top 211, the collar portion 215 of the key top 211
Through hole 205 and fixing part 217
This is preferable since the color and pattern printed on the entire portion can be displayed without being obstructed by anything because the is not located.

【０００６】図８はこの種のキートップ板２００を製造
する方法を示す要部概略側断面図である。同図に示すよ
うにこのキートップ板２００を製造するには、キートッ
プ２１１の上部の形状と同形状のキャビティー３０１を
有する第１金型３００と、その所定位置に複数の貫通孔
２０５を設けたフイルム板２０１と、キートップ２１１
の固定部２１７の形状と同形状のキャビティー３２１を
設けた第２金型３２０とを用意し、フイルム板２０１を
第１，第２金型３００，３２０で挟持し、第１金型３０
０のキャビティー３０１のつば部２１５を成型する部分
に取り付けたピンゲート３０３から溶融樹脂を充填し、
第１金型３００のキャビティー３０１内に溶融樹脂を充
填すると同時にフイルム板２０１に設けた貫通孔２０５
を通して第２金型３２０のキャビティー３２１内にも溶
融樹脂を充填する。そして溶融樹脂が固化した後に第
１，第２金型３００，３２０を取り外す。FIG. 8 is a schematic side sectional view of a main part showing a method of manufacturing the key top plate 200 of this type. As shown in the figure, in order to manufacture this key top plate 200, a first mold 300 having a cavity 301 having the same shape as the upper shape of the key top 211 and a plurality of through holes 205 at predetermined positions are formed. The provided film plate 201 and the key top 211
A second mold 320 provided with a cavity 321 having the same shape as the shape of the fixing portion 217 of the first mold 30 and the film plate 201 is sandwiched between the first and second molds 300 and 320.
The molten resin is filled from the pin gate 303 attached to the portion where the collar portion 215 of the cavity 301 of 0 is molded,
Through holes 205 formed in the film plate 201 at the same time when the molten resin is filled in the cavity 301 of the first mold 300.
The molten resin is also filled in the cavity 321 of the second mold 320 through. Then, after the molten resin has solidified, the first and second molds 300 and 320 are removed.

【０００７】ここで第１金型３００のキャビティー３０
１のつば部２１５を成型する部分にピンゲート３０３を
取り付けたのは以下の理由による。即ち、キートップ２
１１のピンゲート３０３を接続した部分の表面にはゲー
ト跡が残るが、このゲート跡がつば部２１５上にあれ
ば、このつば部２１５はこのキートップ２１１の上に取
り付けられるケース（図示せず）に隠されるので、キー
トップ２１１のケースから露出する部分には何らゲート
跡が現われないためである。言い替えればキートップ２
１１の外周につば部２１５を設けている理由の１つはこ
のゲート跡を隠すためである。Here, the cavity 30 of the first mold 300
The reason why the pin gate 303 is attached to the portion where the first brim portion 215 is molded is as follows. That is, key top 2
A gate mark is left on the surface of the portion of the pin 11 to which the pin gate 303 is connected. If this gate mark is on the brim portion 215, the brim portion 215 is attached to the key top 211 (not shown). This is because there is no gate trace on the exposed portion of the key top 211 from the case. In other words, key top 2
One of the reasons why the brim portion 215 is provided on the outer periphery of 11 is to hide the trace of the gate.

【０００８】[0008]

【発明が解決しようとする課題】しかしながら上記構造
のキートップを上記方法で製造した場合、以下のような
問題点があった。 第１金型３００にピンゲート３０３を設けて溶融樹脂
を充填すると、図９に矢印で示すように、ピンゲート３
０３から射出された溶融樹脂は直接フイルム板２０１の
貫通孔２０５を通して第２金型３２０のキャビティー３
２１内に勢い良く充填された後に上方向に向かうため、
フイルム板２０１の下面を点線で示すようにめくり上げ
てしまい、正常な成型ができなくなってしまう恐れがあ
った。However, when the key top having the above structure is manufactured by the above method, there are the following problems. When the pin gate 303 is provided on the first mold 300 and the molten resin is filled therein, as shown by the arrow in FIG.
The molten resin injected from 03 directly passes through the through hole 205 of the film plate 201 and the cavity 3 of the second mold 320.
Since it heads upward after being filled with force in 21,
There is a risk that the lower surface of the film plate 201 is turned up as shown by the dotted line, and normal molding cannot be performed.

【０００９】上記図８に示すように、ピンゲート３０
３を第１金型３００側に設けると、ピンゲート３０３は
ある程度の径を有してつば部２１５を形成する凹部上に
位置するため、キャビティー３０１とピンゲート３０３
が接近してしまい、このためその分つば部２１５を形成
する凹部の幅を大きくせざるを得ず、それゆえキートッ
プ全体の径が大きくなってしまう。As shown in FIG. 8, the pin gate 30
When 3 is provided on the side of the first mold 300, the pin gate 303 has a certain diameter and is located on the concave portion that forms the collar portion 215. Therefore, the cavity 301 and the pin gate 303
Are approached, and therefore the width of the concave portion forming the collar portion 215 must be increased correspondingly, and therefore the overall diameter of the key top is increased.

【００１０】第１金型３００には構造の複雑なキャビ
ティー３０１が設けられているが、その第１金型３００
にピンゲート３０３を設けると、さらに構造が複雑とな
って金型製造コストが高くなってしまう。The first mold 300 is provided with a cavity 301 having a complicated structure.
If the pin gate 303 is provided in the mold, the structure becomes more complicated and the die manufacturing cost increases.

【００１１】ところでつば部を設けない構造のキート
ップ板の中には、フイルム板の上面に成型したモールド
樹脂と、フイルム板に設けた貫通孔を介してフイルム板
の裏面側に成型したキートップの固定部によって該フイ
ルム板を挟持する構造のキートップ板がある。このよう
な構造のキートップ板は、図１０に示すように、第１金
型４００にキートップの上部の形状のキャビティー４０
１を設け、第２金型５００に固定部の形状のキャビティ
ー５０１を設け、キャビティー５０１に接続したピンゲ
ート５０３から溶融樹脂を圧入することによって成型さ
れる。しかしながらこの製造方法においても、溶融樹脂
の圧入時に該溶融樹脂が同図に点線で示すようにフイル
ム板６００の貫通孔６０１周囲の部分を上方向にめくれ
上げてしまい、正常な成型ができなくなってしまうとい
う問題点があった。By the way, in the key top plate having the structure in which the brim portion is not provided, the molding resin molded on the upper surface of the film plate and the key top molded on the back surface side of the film plate through the through holes formed in the film plate. There is a key top plate having a structure in which the film plate is sandwiched by the fixing portions of. As shown in FIG. 10, the key top plate having such a structure has a cavity 40 in the shape of the upper part of the key top in the first mold 400.
1 is provided, the second mold 500 is provided with a cavity 501 in the shape of a fixed portion, and molten resin is pressed into the cavity 501 from a pin gate 503 connected to the cavity 501 to perform molding. However, even in this manufacturing method, when the molten resin is press-fitted, the molten resin flips up the portion around the through hole 601 of the film plate 600 as shown by the dotted line in FIG. There was a problem that it would end up.

【００１２】本発明は上述の点に鑑みてなされたもので
ありその目的は、フイルム板がめくれ上がることがな
く、また金型構造が簡単になるキートップ板の製造方法
を提供することにある。The present invention has been made in view of the above points, and an object thereof is to provide a method for manufacturing a key top plate in which the film plate does not turn up and the die structure is simple. .

【００１３】[0013]

【課題を解決するための手段】上記問題点を解決するた
め本発明は、可撓性を有する樹脂フイルムからなるフイ
ルム板の上面に、モールド樹脂からなるキートップを成
形してなるキートップ板の製造方法において、前記キー
トップの上部の形状と同型状のキャビティーを有する第
１金型と、該第１金型のキャビティーに対向する所定位
置に貫通孔を設けたフイルム板と、該フイルム板の貫通
孔に対向する位置に前記第１金型のキャビティー内に向
かって突出するピンゲートを設けた第２金型とを用意
し、前記フイルム板を第１金型と第２金型の間に挟持す
ることによって、第２金型に設けたピンゲートをフイル
ム板の貫通孔に貫通して第１金型のキャビティー内に突
入せしめ、該ピンゲートから第１金型に設けたキャビテ
ィー内に溶融樹脂を注入して該キャビティー内を溶融樹
脂で満たし、該溶融樹脂が固化した後に第１金型と第２
金型を取り外すことによって、フイルム板上にキートッ
プを成形することとした。In order to solve the above problems, the present invention provides a key top plate formed by molding a key top made of a mold resin on the upper surface of a film plate made of a flexible resin film. In the manufacturing method, a first mold having a cavity having the same shape as the upper part of the key top, a film plate having a through hole at a predetermined position facing the cavity of the first mold, and the film. A second mold having a pin gate protruding toward the inside of the cavity of the first mold is prepared at a position facing the through hole of the plate, and the film plate is divided into the first mold and the second mold. The pin gate provided on the second mold penetrates through the through hole of the film plate and is inserted into the cavity of the first mold by sandwiching it between the inside of the cavity provided on the first mold from the pin gate. Molten resin to Input to meet within the cavity with the molten resin, the first mold after the molten resin has solidified and a second
By removing the mold, the key top was formed on the film plate.

【００１４】[0014]

【作用】ピンゲートが第１金型のキャビティー内に突入
しているので、該ピンゲートから射出された溶融樹脂
は、一旦第１金型のキャビティー内面に衝突した後、フ
イルム板を第２金型に押し付けるように流れていく。従
ってピンゲート周辺のフイルム板が第２金型からめくれ
上がることはなく、確実に第２金型上に密着した状態で
溶融樹脂を充填できる。Since the pin gate projects into the cavity of the first mold, the molten resin injected from the pin gate once collides with the inner surface of the cavity of the first mold, and then the film plate is moved to the second mold. It flows as if pressing it against the mold. Therefore, the film plate around the pin gate does not flip up from the second mold, and the molten resin can be filled in a state in which the film plate is surely in close contact with the second mold.

【００１５】[0015]

【実施例】以下、本発明の実施例を図面に基づいて詳細
に説明する。図１は本発明の１実施例にかかるキートッ
プ板１０の要部を示す図であり、同図（ａ）は平面図、
同図（ｂ）は側面図、同図（ｃ）は同図（ａ）のＡ−Ａ
断面図、同図（ｄ）は裏面図である。Embodiments of the present invention will now be described in detail with reference to the drawings. FIG. 1 is a diagram showing a main part of a key top plate 10 according to one embodiment of the present invention, FIG. 1 (a) is a plan view,
The figure (b) is a side view, the figure (c) is AA of the figure (a).
A sectional view and the same figure (d) are rear views.

【００１６】同図に示すようにこのキートップ板１０
は、フイルム板２０の上面にキートップ３０を成形して
構成されている。なおこのキートップ３０の外周にはつ
ば部３１が設けられており、該つば部３１はフイルム板
２０に設けた貫通孔２５を介してフイルム板２０の裏面
側に設けた固定部３３とともにフイルム板２０を挟持し
てこのキートップ３０をフイルム板２０に固定してい
る。As shown in the figure, the key top plate 10
Is formed by molding a key top 30 on the upper surface of the film plate 20. A collar portion 31 is provided on the outer periphery of the key top 30, and the collar portion 31 is provided with a fixing portion 33 provided on the back surface side of the film plate 20 through a through hole 25 provided in the film plate 20. The key top 30 is fixed to the film plate 20 by sandwiching 20.

【００１７】ここでフイルム板２０は可撓製を有する透
明な樹脂フイルム、例えばポリエチレンテレフタレート
（ＰＥＴ），ポリカーボネート樹脂等からなり、その上
面には変性ウレタン樹脂からなる印刷層２１と透明な塩
化ビニル樹脂からなる接着剤層２３（図１には示さず）
が印刷されて構成されている。なお印刷層２１と接着剤
層２３は薄いので、図１（ｃ）の断面図には示していな
い（下記する図２参照）。そしてこのフイルム板２０に
は前記キートップ３０の３つの固定部３３を設けるため
の３つの貫通孔２５が設けられており、また下記する第
２金型５０のピンゲート５５（図２（ｃ）参照）を挿入
するための貫通孔２７が設けられている。The film plate 20 is made of a flexible transparent resin film, for example, polyethylene terephthalate (PET), polycarbonate resin, or the like, and a printed layer 21 made of a modified urethane resin and a transparent vinyl chloride resin on the upper surface thereof. Adhesive layer 23 consisting of (not shown in FIG. 1)
Is printed and configured. Since the printing layer 21 and the adhesive layer 23 are thin, they are not shown in the sectional view of FIG. 1C (see FIG. 2 below). The film plate 20 is provided with three through holes 25 for providing the three fixing portions 33 of the key top 30, and the pin gate 55 of the second mold 50 described below (see FIG. 2C). ) Is provided in the through hole 27.

【００１８】一方キートップ３０は熱可塑性の透明な材
料、例えばアクリル樹脂，ポリカーボネート樹脂等から
なり、該キートップ３０の前記フイルム板２０の貫通孔
２７に面する部分には、下記する第２金型５０のピンゲ
ート５５によって形成される凹部３５が設けられてい
る。On the other hand, the key top 30 is made of a transparent thermoplastic material such as acrylic resin or polycarbonate resin, and a portion of the key top 30 facing the through hole 27 of the film plate 20 is provided with a second metal described below. A recess 35 formed by the pin gate 55 of the mold 50 is provided.

【００１９】そしてこのキートップ３０とフイルム板２
０の真下に図示しないスイッチ接点を配置して、該キー
トップ３０を押圧すれば該スイッチ接点がオンオフす
る。The key top 30 and the film plate 2
If a switch contact (not shown) is arranged directly below 0 and the key top 30 is pressed, the switch contact is turned on / off.

【００２０】またフイルム板２０の下面側に発光素子を
配置してその光をキートップ３０に導けば、透明なフイ
ルム板２０とキートップ３０を通して、フイルム板２０
に印刷された模様などの印刷層２１がキートップ３０の
表面に明るく照らし出される。このときキートップ３０
のつば部３１を除く中央部分の真下のフイルム板２０に
は何ら貫通孔２５，２７が設けられていないので、該キ
ートップ３０のつば部３１を除く中央部分全体の下側の
面上に印刷層２１を設けることができ、該部分に貫通孔
による印刷層２１の欠けが生じないので、キートップ３
０装飾上好適である。If a light emitting element is arranged on the lower surface side of the film plate 20 and the light is guided to the key top 30, the film plate 20 is passed through the transparent film plate 20 and the key top 30.
The printed layer 21 such as a pattern printed on the key top 30 is brightly illuminated on the surface of the key top 30. Key top 30 at this time
Since no through holes 25 and 27 are provided in the film plate 20 directly below the central portion excluding the collar portion 31, the key top 30 is printed on the lower surface of the entire central portion excluding the collar portion 31. Since the layer 21 can be provided and the printed layer 21 is not chipped due to the through hole in the portion, the key top 3
0 Suitable for decoration.

【００２１】次にこのキートップ板１０の製造方法を説
明する。図２はキートップ板１０の製造方法を示す図で
ある。図２（ａ）に示すように、まずフイルム板２０上
に、所望の文字・数字・模様等からなる印刷層２１を印
刷し、その上に透明な接着剤層２３を印刷する。Next, a method of manufacturing the key top plate 10 will be described. FIG. 2 is a diagram showing a method of manufacturing the key top plate 10. As shown in FIG. 2A, first, a print layer 21 including desired letters, numbers and patterns is printed on the film plate 20, and a transparent adhesive layer 23 is printed thereon.

【００２２】次に図２（ｂ）に示すように、該フイルム
板２０に３つの貫通孔２５と１つの貫通孔２７をプレス
によって穿孔する。なお貫通孔２５を設ける位置は前記
キートップ３０の固定部３３を設ける位置であり、貫通
孔２７を設ける位置は前記キートップ３０の凹部３５を
設ける位置であることは言うまでもない。Next, as shown in FIG. 2B, three through holes 25 and one through hole 27 are punched in the film plate 20 by pressing. Needless to say, the position where the through hole 25 is provided is the position where the fixing portion 33 of the key top 30 is provided, and the position where the through hole 27 is provided is the position where the recess 35 of the key top 30 is provided.

【００２３】次に図２（ｃ）に示すように、このフイル
ム板２０を第１，第２金型４０，５０の間に挟持する。Next, as shown in FIG. 2C, the film plate 20 is sandwiched between the first and second molds 40 and 50.

【００２４】ここで第１金型４０には、前記キートップ
３０の上部の形状と同型状のキャビティー４１が設けら
れている。The first mold 40 is provided with a cavity 41 having the same shape as the upper part of the key top 30.

【００２５】一方第２金型５０の前記キートップ３０の
固定部３３を設ける位置には、該固定部３３と同型状の
３つのキャビティー５１が設けられている。On the other hand, at the position where the fixing portion 33 of the key top 30 of the second die 50 is provided, three cavities 51 of the same shape as the fixing portion 33 are provided.

【００２６】またこの第２金型５０の前記キートップ３
０の凹部３５を設ける位置には、前記第１金型４０のキ
ャビティー４１内に到る高さのピンゲート５５が設けら
れている。Further, the key top 3 of the second mold 50.
A pin gate 55 having a height reaching the inside of the cavity 41 of the first mold 40 is provided at the position where the zero recess 35 is provided.

【００２７】従って第１，第２金型４０，５０でフイル
ム板２０を挟持した際、フイルム板２０の全ての貫通孔
２５，２７は、いずれも第１金型４０のキャビティー４
１のつば部３１を成形する部分に位置し、同時に３つの
貫通孔２５は第２金型５０の３つのキャビティー５１の
部分に位置し、さらに第２金型５０に設けたピンゲート
５５先端は、フイルム板２０の貫通孔２７を貫通した状
態で第１金型４０のキャビティー４１内に突入してい
る。Therefore, when the film plate 20 is held between the first and second molds 40 and 50, all the through holes 25 and 27 of the film plate 20 are all in the cavity 4 of the first mold 40.
The first through-hole 25 is located in the portion where the one brim portion 31 is molded, and at the same time, the three through holes 25 are located in the three cavities 51 of the second mold 50. , Penetrates into the cavity 41 of the first mold 40 while penetrating the through hole 27 of the film plate 20.

【００２８】そしてこの状態で第２金型５０に設けたピ
ンゲート５５から溶融した樹脂を圧入して第１金型４０
のキャビティー４１内を該溶融樹脂で満たすと共に、３
つの貫通孔２５を通して第２金型５０に設けたキャビテ
ィー５１内にも溶融樹脂を満たす。Then, in this state, the molten resin is press-fitted from the pin gate 55 provided on the second mold 50 to press the first mold 40.
The inside of the cavity 41 of is filled with the molten resin and
The molten resin is also filled in the cavity 51 provided in the second mold 50 through the one through hole 25.

【００２９】そして該溶融樹脂が固化した後に第１，第
２金型４０，５０を取り外せば、図１に示すキートップ
板１０が完成する。After the molten resin has solidified, the first and second molds 40 and 50 are removed, and the key top plate 10 shown in FIG. 1 is completed.

【００３０】ここで図３は溶融樹脂を充填しているとき
のピンゲート５５周辺の部分を示す要部拡大側断面図で
ある。同図に示すように本発明の場合、ピンゲート５５
が第１金型４０のキャビティー４１内に突入しているの
で、該ピンゲート５５から射出された溶融樹脂は一旦第
１金型４０のキャビティー４１内面に衝突した後、フイ
ルム板２０を第２金型５０に押し付けるように流れてい
く。従ってピンゲート５５周辺のフイルム板２０が第２
金型５０からめくれ上ることはなく、確実に第２金型５
０上に密着した状態で溶融樹脂が充填される。Here, FIG. 3 is an enlarged side sectional view of an essential part showing a portion around the pin gate 55 when the molten resin is filled. In the case of the present invention, as shown in FIG.
Of the first mold 40, the molten resin injected from the pin gate 55 once collides with the inner surface of the cavity 41 of the first mold 40, and then the film plate 20 is moved to the second position. It flows as if pressing it against the mold 50. Therefore, the film plate 20 around the pin gate 55 is the second
The second mold 5 is surely not turned up from the mold 50.
The molten resin is filled in a state in which the molten resin is in close contact with the upper surface.

【００３１】ところで本実施例にかかるキートップ３０
は、図１に示すように、つば部３１と固定部３３によっ
てフイルム板２０を挟持することによって固定されてお
り、さらに該キートップ３０は接着剤層２３（図２参
照）によって接着されているので、その固定が確実であ
る。なおこの実施例の場合は接着剤層２３は必ずしも必
要ではない。また接着剤層２３自体に装飾を施して印刷
機能を兼ね備えさせ、印刷層２１を省略しても良い。逆
に下記する図４に示すように接着剤層２３を用いる場合
は必ずしもつば部３１と固定部３３と貫通孔２５は必要
ではない。By the way, the key top 30 according to the present embodiment.
1, is fixed by sandwiching the film plate 20 by a collar portion 31 and a fixing portion 33, and the key top 30 is further adhered by an adhesive layer 23 (see FIG. 2). So its fixation is certain. The adhesive layer 23 is not always necessary in this embodiment. Alternatively, the adhesive layer 23 itself may be decorated to have a printing function and the printing layer 21 may be omitted. On the contrary, when the adhesive layer 23 is used as shown in FIG. 4 described below, the flange portion 31, the fixing portion 33, and the through hole 25 are not always necessary.

【００３２】即ち図４に示すキートップ板１０−２のよ
うに、キートップ３０−２の外周につば部を設けず１つ
の舌片２９のみを設け、一方フイルム板２０−２には該
舌片２９に対向する位置に１つの貫通孔２７のみを設
け、キートップ３０−２のフイルム板２０−２への固定
をフイルム板２０−２上に印刷した接着剤層２３（図２
参照）のみによって行っても良い。That is, like the key top plate 10-2 shown in FIG. 4, only one tongue piece 29 is provided on the outer periphery of the key top 30-2 without providing a collar portion, while the tongue piece 29 is provided on the film plate 20-2. Only one through hole 27 is provided at a position facing the piece 29, and the fixing of the key top 30-2 to the film plate 20-2 is printed on the film plate 20-2 by an adhesive layer 23 (see FIG. 2).
(Refer to) only).

【００３３】このように構成すれば、つば部３１と固定
部３３が不要なので、キートップ３０−２の小型化が図
れる。According to this structure, since the collar portion 31 and the fixing portion 33 are unnecessary, the key top 30-2 can be downsized.

【００３４】また本発明をつば部又は舌片を設けない構
造のキートップ板に応用する場合は、図５に示すよう
に、つば部のないキートップの上部の形状と同形状のキ
ャビティー６１を有する第１金型６０と、その中央と周
囲の所定位置にそれぞれ貫通孔６７，６８を設けたフイ
ルム板６５と、キートップの下面に設ける固定部の形状
と同形状のキャビティー７１を設けた第２金型７０とを
用意し、フイルム板６５を第１，第２金型６０，７０の
間に挟持する。なおフイルム板６５上には接着剤層６９
が印刷されている。When the present invention is applied to a key top plate having a structure without a brim or tongue, as shown in FIG. 5, a cavity 61 having the same shape as the upper part of the key top without a brim is formed. A first mold 60 having a film, a film plate 65 having through holes 67 and 68 at predetermined positions in the center and the periphery thereof, and a cavity 71 having the same shape as the shape of the fixing portion provided on the lower surface of the key top. The second mold 70 is prepared, and the film plate 65 is sandwiched between the first and second molds 60 and 70. An adhesive layer 69 is formed on the film plate 65.
Is printed.

【００３５】ここで第２金型７０の前記フイルム板６５
の中央の貫通孔６７の位置には、前記第１金型６０のキ
ャビティー６１内に到る高さのピンゲート６３が設けら
れている。従って第１，第２金型６０，７０でフイルム
板６５を挟持した際、ピンゲート６３先端はフイルム板
６５の中央の貫通孔６７を貫通した状態で第１金型６０
のキャビティー６１内に突入する。Here, the film plate 65 of the second mold 70.
A pin gate 63 having a height reaching the inside of the cavity 61 of the first mold 60 is provided at the position of the through hole 67 at the center of the. Therefore, when the film plate 65 is sandwiched between the first and second molds 60 and 70, the first mold 60 with the tip of the pin gate 63 penetrating the through hole 67 in the center of the film plate 65.
Plunge into the cavity 61.

【００３６】そしてこの状態でピンゲート６３から溶融
した樹脂を圧入して第１金型６０のキャビティー６１内
を該溶融樹脂で満たすと共に、周囲の貫通孔６８を通し
て第２金型７０に設けたキャビティー７１内にも溶融樹
脂を満たすことによってキートップを成型する。In this state, molten resin is press-fitted from the pin gate 63 to fill the cavity 61 of the first mold 60 with the molten resin, and the cavity provided in the second mold 70 through the through holes 68 in the periphery. The key top is molded by filling the tee 71 with the molten resin.

【００３７】このようにして製造すれば、上記実施例と
同様にピンゲート６３周辺のフイルム板６５が第２金型
７０からめくれ上がることはなく、確実に第２金型７０
上に密着した状態で溶融樹脂が充填される。When manufactured in this manner, the film plate 65 around the pin gate 63 does not flip up from the second mold 70 as in the above-described embodiment, and the second mold 70 is surely produced.
The molten resin is filled in a state in which the molten resin is in close contact with the top.

【００３８】また本発明をつば部と固定部を設けない構
造のキートップ板に応用する場合は、図６に示すよう
に、つば部のないキートップの上部の形状と同形状のキ
ャビティー６１を有する第１金型６０と、その中央に貫
通孔６７を設けたフイルム板６５と、フイルム板６５の
中央の貫通孔６７の位置に第１金型６０のキャビティー
６１内に到る高さのピンゲート６３を設けた第２金型７
０とを用意し、フイルム板６５を第１，第２金型６０，
７０の間に挟持する。なおフイルム板６５上面には接着
剤層６９を印刷しておく。When the present invention is applied to a key top plate having a structure in which a collar portion and a fixing portion are not provided, as shown in FIG. 6, a cavity 61 having the same shape as the upper portion of the key top without a collar portion is formed. A first die 60 having a film, a film plate 65 having a through hole 67 in the center thereof, and a height reaching the cavity 61 of the first die 60 at the position of the through hole 67 in the center of the film plate 65. Second mold 7 provided with the pin gate 63 of
0 is prepared, and the film plate 65 is attached to the first and second molds 60,
It is sandwiched between 70. An adhesive layer 69 is printed on the upper surface of the film plate 65.

【００３９】そしてフイルム板６５の中央の貫通孔６７
を貫通したピンゲート６３先端から溶融した樹脂を圧入
して第１金型６０のキャビティー６１内を該溶融樹脂で
満たすことによってキートップを成型する。A through hole 67 at the center of the film plate 65
A molten resin is press-fitted from the tip of the pin gate 63 penetrating through to fill the cavity 61 of the first mold 60 with the molten resin to mold the key top.

【００４０】この実施例の場合も、上記実施例と同様に
ピンゲート６３周辺のフイルム板６５が第２金型７０か
らめくれ上がることはなく、確実に第２金型７０上に密
着した状態で溶融樹脂が充填される。Also in the case of this embodiment, the film plate 65 around the pin gate 63 does not flip up from the second mold 70 as in the case of the above-mentioned embodiment, and is melted in a state of being firmly adhered to the second mold 70. Filled with resin.

【００４１】この実施例のようにしてキートップを成型
すれば、つば部と固定部を設けない構造のキートップで
あるにもかかわらず、ピンゲートを第１金型６０のキャ
ビティー６１側に設けなくてもよく、従ってピンゲート
の跡がキートップ表面に現われない。When the key top is molded as in this embodiment, the pin gate is provided on the cavity 61 side of the first mold 60, although the key top has a structure in which the collar portion and the fixing portion are not provided. It may not be present, so no trace of pin gate appears on the key top surface.

【００４２】以上本発明の実施例を詳細に説明したが、
本発明はこれらに限定されず、他の種々の構造のキート
ップ板に適用できることは言うまでもない。要はフイル
ム板の上面に、モールド樹脂からなるキートップを成形
してなるキートップ板であれば、どのような構造のもの
にも適用できるのである。The embodiment of the present invention has been described in detail above.
It goes without saying that the present invention is not limited to these and can be applied to key top plates of various other structures. In short, the key top plate formed by molding the key top made of the molding resin on the upper surface of the film plate can be applied to any structure.

【００４３】[0043]

【発明の効果】以上詳細に説明したように、本発明によ
れば、以下のような優れた効果を有する。 第２金型に設けたピンゲートをフイルム板の貫通孔に
貫通して第１金型のキャビティー内に突入し、該ピンゲ
ートから第１金型に設けたキャビティー内に溶融樹脂を
注入することとしたので、第２金型上のフイルム板が第
２金型からめくれ上がることはなく、正常な成型が確実
に行える。As described in detail above, the present invention has the following excellent effects. To penetrate the pin gate provided in the second mold into the cavity of the first mold by penetrating the through hole of the film plate, and inject the molten resin from the pin gate into the cavity provided in the first mold. Therefore, the film plate on the second mold does not turn up from the second mold, and normal molding can be reliably performed.

【００４４】舌片又はつば部を設けた構造のキートッ
プを成型する場合、ピンゲートを第２金型に設けたの
で、ピンゲートの開口を容易に第１金型のキャビティー
のつば部又は舌片を設ける部分のつけ根近傍に設けるこ
とができ、これによってつば部又は舌片の小型化が図れ
る。When a key top having a structure having a tongue piece or a brim portion is molded, since the pin gate is provided in the second mold, the opening of the pin gate can be easily opened and the collar part or the tongue piece of the cavity of the first mold can be easily formed. It can be provided in the vicinity of the base of the portion in which the ridge is provided, whereby the collar portion or the tongue piece can be downsized.

【００４５】構造の複雑なキャビティーを有する第１
金型にピンゲートを設ける必要はなく、構造の簡単な第
２金型にピンゲートを設けることができるので、全体と
して金型製造コストの低減化が図れる。First with a complex cavity of structure
Since it is not necessary to provide the pin gate to the mold, and the pin gate can be provided to the second mold having a simple structure, the mold manufacturing cost can be reduced as a whole.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明の１実施例にかかるキートップ板１０の
要部を示す図であり、同図（ａ）は平面図、同図（ｂ）
は側面図、同図（ｃ）は同図（ａ）のＡ−Ａ断面図、同
図（ｄ）は裏面図である。1A and 1B are views showing a main part of a key top plate 10 according to an embodiment of the present invention, in which FIG. 1A is a plan view and FIG.
Is a side view, FIG. 6C is a cross-sectional view taken along the line AA of FIG.

【図２】図２（ａ），（ｂ），（ｃ）はキートップ板１
０の製造方法を示す図である。2 (a), 2 (b) and 2 (c) are key top plates 1;
It is a figure which shows the manufacturing method of 0.

【図３】溶融樹脂を充填しているときのピンゲート５５
周辺の部分を示す要部拡大側断面図である。FIG. 3 is a pin gate 55 when filled with molten resin.
It is a principal part expanded side sectional view which shows the periphery part.

【図４】本発明の他の実施例にかかるキートップ板１０
−２を示す図であり、同図（ａ）は平面図、同図（ｂ）
は側面図、同図（ｃ）は同図（ａ）のＣ−Ｃ断面図、同
図（ｄ）は裏面図である。FIG. 4 is a key top plate 10 according to another embodiment of the present invention.
FIG. 2 is a diagram showing -2, in which FIG.
Is a side view, FIG. 7C is a cross-sectional view taken along line CC of FIG. 8A, and FIG.

【図５】本発明の他の実施例にかかるキートップ板の製
造方法を示す図である。FIG. 5 is a diagram showing a method of manufacturing a key top plate according to another embodiment of the present invention.

【図６】本発明の他の実施例にかかるキートップ板の製
造方法を示す図である。FIG. 6 is a diagram showing a method of manufacturing a key top plate according to another embodiment of the present invention.

【図７】従来のキートップ板２００のキートップ２１１
の部分を示す要部概略側断面図である。FIG. 7 is a key top 211 of the conventional key top plate 200.
FIG. 3 is a schematic side cross-sectional view showing the main part of FIG.

【図８】キートップ板２００を製造する方法を示す要部
概略側断面図である。FIG. 8 is a schematic side sectional view of an essential part showing the method of manufacturing the key top plate 200.

【図９】溶融樹脂を充填しているときのピンゲート３０
３周辺の部分を示す要部拡大側断面図である。FIG. 9: Pin gate 30 when filled with molten resin
FIG. 3 is an enlarged side sectional view of an essential part showing a part around 3.

【図１０】従来の他のキートップ板を製造する方法を示
す要部概略側断面図である。FIG. 10 is a schematic side sectional view of an essential part showing a method for manufacturing another conventional key top plate.

【符号の説明】[Explanation of symbols]

１０ キートップ板 ２０，２０−２ フイルム板 ２７ 貫通孔 ２９ 舌片 ３０，３０−２ キートップ ３１ つば部 ３５ 凹部 ４０ 第１金型 ４１ キャビティー ５０ 第２金型 ５５ ピンゲート 10 Key Top Plate 20, 20-2 Film Plate 27 Through Hole 29 Tongue Piece 30, 30-2 Key Top 31 Collar 35 Recess 40 First Mold 41 Cavity 50 Second Mold 55 Pin Gate

Claims (2)

【特許請求の範囲】[Claims] 【請求項１】 可撓性を有する樹脂フイルムからなるフ
イルム板の上面に、モールド樹脂からなるキートップを
成形してなるキートップ板の製造方法において、 前記キートップの上部の形状と同型状のキャビティーを
有する第１金型と、該第１金型のキャビティーに対向す
る所定位置に貫通孔を設けたフイルム板と、該フイルム
板の貫通孔に対向する位置に前記第１金型のキャビティ
ー内に向かって突出するピンゲートを設けた第２金型と
を用意し、 前記フイルム板を第１金型と第２金型の間に挟持するこ
とによって、第２金型に設けたピンゲートをフイルム板
の貫通孔に貫通して第１金型のキャビティー内に突入せ
しめ、該ピンゲートから第１金型に設けたキャビティー
内に溶融樹脂を注入して該キャビティー内を溶融樹脂で
満たし、該溶融樹脂が固化した後に第１金型と第２金型
を取り外すことによって、フイルム板上にキートップを
成形することを特徴とするキートップ板の製造方法。1. A method of manufacturing a key top plate, which comprises molding a key top made of a molding resin on the upper surface of a film plate made of a flexible resin film, the method having the same shape as the upper part of the key top. A first mold having a cavity, a film plate having a through hole at a predetermined position facing the cavity of the first mold, and a first mold at a position facing the through hole of the film plate. A second mold provided with a pin gate protruding toward the inside of the cavity is prepared, and the film plate is sandwiched between the first mold and the second mold, thereby providing the pin gate provided in the second mold. Through the through-hole of the film plate and project into the cavity of the first mold, and the molten resin is injected from the pin gate into the cavity provided in the first mold so that the cavity is filled with the molten resin. Fill and melt By removing the first mold and the second mold after the resin has solidified, the manufacturing method of the key top plate, characterized by molding the key top on the film plate. 【請求項２】 可撓性を有する樹脂フイルムからなるフ
イルム板の上面に、モールド樹脂からなりその外周に樹
脂注入用の舌片又はつば部を突出せしめた形状のキート
ップを成形してなるキートップ板の製造方法において、 前記キートップの上部の形状と同型状のキャビティーを
有する第１金型と、該第１金型のキャビティーの舌片又
はつば部を成型する部分に対向する所定位置に貫通孔を
設けたフイルム板と、該フイルム板の貫通孔に対向する
位置に前記第１金型のキャビティー内に向かって突出す
るピンゲートを設けた第２金型とを用意し、 前記フイルム板を第１金型と第２金型の間に挟持するこ
とによって、第２金型に設けたピンゲートをフイルム板
の貫通孔に貫通して第１金型のキャビティーの舌片又は
つば部を成形する部分内に突入せしめ、該ピンゲートか
ら第１金型に設けたキャビティー内に溶融樹脂を注入し
て該キャビティー内を溶融樹脂で満たし、該溶融樹脂が
固化した後に第１金型と第２金型を取り外すことによっ
て、フイルム板上にキートップを成形することを特徴と
するキートップ板の製造方法。2. A key formed by molding a key top of a flexible resin film on a top surface of the film plate, the key top having a shape made of a molding resin and having a tongue or a collar portion for resin injection protruding from the outer periphery thereof. In the method for manufacturing a top plate, a first die having a cavity having the same shape as the shape of the upper part of the key top, and a predetermined portion facing a portion for forming a tongue piece or a collar portion of the cavity of the first die. A film plate having a through hole at a position and a second mold having a pin gate projecting into the cavity of the first mold at a position facing the through hole of the film plate are prepared. By sandwiching the film plate between the first mold and the second mold, the pin gate provided on the second mold penetrates the through hole of the film plate and the tongue piece or the collar of the cavity of the first mold. Project inside the part to be molded Then, the molten resin is injected from the pin gate into the cavity provided in the first mold to fill the cavity with the molten resin, and after the molten resin is solidified, the first mold and the second mold are removed. A key top plate is thus manufactured by molding the key top on the film plate.
JP06329958A 1994-12-05 1994-12-05 Manufacturing method of key top plate Expired - Fee Related JP3101859B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP06329958A JP3101859B2 (en) 1994-12-05 1994-12-05 Manufacturing method of key top plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP06329958A JP3101859B2 (en) 1994-12-05 1994-12-05 Manufacturing method of key top plate

Publications (2)

Publication Number Publication Date
JPH08156020A true JPH08156020A (en) 1996-06-18
JP3101859B2 JP3101859B2 (en) 2000-10-23

Family

ID=18227175

Family Applications (1)

Application Number Title Priority Date Filing Date
JP06329958A Expired - Fee Related JP3101859B2 (en) 1994-12-05 1994-12-05 Manufacturing method of key top plate

Country Status (1)

Country Link
JP (1) JP3101859B2 (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100302462B1 (en) * 1997-12-29 2001-11-30 양윤홍 Button assembly with many buttons
JP2002103385A (en) * 2000-09-28 2002-04-09 Daiwa Gosei Kk Method for manufacturing plastic gear and molding die
EP1316978A1 (en) * 2001-11-28 2003-06-04 Polymatech Co., Ltd. Key sheet
EP1385187A1 (en) * 2002-07-25 2004-01-28 Polymatech Co., Ltd. Film key sheet and method of manufacturing the same
JP2004165102A (en) * 2002-11-29 2004-06-10 Teikoku Tsushin Kogyo Co Ltd Manufacturing method of key-top with film plate
JP2004299340A (en) * 2003-03-31 2004-10-28 Yoshino Kogyosho Co Ltd Method of molding patterned transparent synthetic resin lid and die used for the method
JP2007307769A (en) * 2006-05-17 2007-11-29 Kitagawa Ind Co Ltd Package of synthetic resin molded product and its manufacturing method
CN102615783A (en) * 2012-04-09 2012-08-01 昆山金利表面材料应用科技股份有限公司 Injection mold with auxiliary boss
WO2013073541A1 (en) * 2011-11-18 2013-05-23 日本電気株式会社 Electronic module and method for producing electronic module
JP2018086772A (en) * 2016-11-29 2018-06-07 ダイキョーニシカワ株式会社 Indicator panel and two color injection molding method thereof
KR20200139077A (en) * 2019-06-03 2020-12-11 (주)엘지하우시스 Window cover for display, window cover parts, manufacturing machine and manufacturing method of the same

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100302462B1 (en) * 1997-12-29 2001-11-30 양윤홍 Button assembly with many buttons
JP2002103385A (en) * 2000-09-28 2002-04-09 Daiwa Gosei Kk Method for manufacturing plastic gear and molding die
EP1316978A1 (en) * 2001-11-28 2003-06-04 Polymatech Co., Ltd. Key sheet
US6967056B2 (en) 2001-11-28 2005-11-22 Polymatech Co., Ltd. Key sheet
US6863951B2 (en) 2002-07-25 2005-03-08 Polymatech Co., Ltd. Film key sheet and method of manufacturing the same
EP1385187A1 (en) * 2002-07-25 2004-01-28 Polymatech Co., Ltd. Film key sheet and method of manufacturing the same
JP2004165102A (en) * 2002-11-29 2004-06-10 Teikoku Tsushin Kogyo Co Ltd Manufacturing method of key-top with film plate
JP2004299340A (en) * 2003-03-31 2004-10-28 Yoshino Kogyosho Co Ltd Method of molding patterned transparent synthetic resin lid and die used for the method
JP4502172B2 (en) * 2003-03-31 2010-07-14 株式会社吉野工業所 Method for molding transparent lid with synthetic resin pattern and mold used in the molding method
JP2007307769A (en) * 2006-05-17 2007-11-29 Kitagawa Ind Co Ltd Package of synthetic resin molded product and its manufacturing method
WO2013073541A1 (en) * 2011-11-18 2013-05-23 日本電気株式会社 Electronic module and method for producing electronic module
CN102615783A (en) * 2012-04-09 2012-08-01 昆山金利表面材料应用科技股份有限公司 Injection mold with auxiliary boss
JP2018086772A (en) * 2016-11-29 2018-06-07 ダイキョーニシカワ株式会社 Indicator panel and two color injection molding method thereof
KR20200139077A (en) * 2019-06-03 2020-12-11 (주)엘지하우시스 Window cover for display, window cover parts, manufacturing machine and manufacturing method of the same
KR20200139078A (en) * 2019-06-03 2020-12-11 (주)엘지하우시스 Window cover for display and manufacturing method of the same

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