JPH08125297A - Through-hole double-sided board - Google Patents
Through-hole double-sided boardInfo
- Publication number
- JPH08125297A JPH08125297A JP28266894A JP28266894A JPH08125297A JP H08125297 A JPH08125297 A JP H08125297A JP 28266894 A JP28266894 A JP 28266894A JP 28266894 A JP28266894 A JP 28266894A JP H08125297 A JPH08125297 A JP H08125297A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- conductor
- board
- substrate
- double
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、セラミック基板の両面
に設けた回路導体が、スルーホールを介して接続される
スルーホール両面基板に関する。このようなスルーホー
ル両面基板はハイブリッドＩＣ製品における回路基板等
として利用される。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a through-hole double-sided board in which circuit conductors provided on both sides of a ceramic board are connected through through-holes. Such a through-hole double-sided board is used as a circuit board or the like in a hybrid IC product.
【０００２】[0002]
【従来の技術】セラミック基板の両面に導体配線を行な
う場合、セラミック基板の上面および下面に設けた導体
間の接続を確保するため、例えば図８に示すように、セ
ラミック基板１を貫通するスルーホール２が適所に形成
される。スルーホール２の形成は、保持台に載置した未
焼成のセラミックグリーンシートをピン状の打ち抜き具
で打ち抜くことによりなされ、その後、焼成して基板と
する。次いで、上部導体３を、スルーホール２部で真空
吸引しながら印刷し、さらに基板１を反転してその下面
に同様の工程により下部導体４を印刷、焼成する（図
９）。これにより、これら導体３、４は上記スルーホー
ル２内周壁で重なり合い、導通可能となる。2. Description of the Related Art When conducting wiring on both sides of a ceramic substrate, in order to secure a connection between conductors provided on the upper surface and the lower surface of the ceramic substrate, for example, as shown in FIG. 2 is formed in place. The through holes 2 are formed by punching an unfired ceramic green sheet placed on a holding table with a pin-shaped punching tool, and then firing to obtain a substrate. Next, the upper conductor 3 is printed while vacuum-sucking in the through holes 2, the substrate 1 is inverted, and the lower conductor 4 is printed and fired on the lower surface of the substrate 1 by the same process (FIG. 9). As a result, the conductors 3 and 4 are overlapped with each other on the inner peripheral wall of the through hole 2 and can be electrically connected.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、上記従
来の構成では、スルーホール２の上下端縁２２におい
て、上記導体３、４の膜厚が極端に薄くなり（図９）、
導体抵抗の増大、あるいは断線による不良をおこすおそ
れがあった。これは、上記基板１がスルーホール２端縁
で直角におちこんでいてこのコーナー部における導体ペ
ースト塗布量を充分厚くすることが容易でないこと、さ
らに塗布後、乾燥する際に導体ペーストが収縮すること
による。このため、通常、導体ペーストを二度塗りして
膜厚の増加を図っているが、工程が複雑となる上、必ず
しも十分な効果が得られるとは言えなかった。However, in the above conventional structure, the conductors 3 and 4 are extremely thin at the upper and lower edges 22 of the through hole 2 (FIG. 9).
There was a risk of increasing the conductor resistance or causing a defect due to disconnection. This is because the board 1 is dented at a right angle at the edge of the through hole 2 and it is not easy to make the applied amount of the conductor paste in this corner portion sufficiently thick, and the conductor paste shrinks when it is dried after the application. by. For this reason, the conductor paste is usually applied twice to increase the film thickness, but the process is complicated and the sufficient effect cannot be always obtained.
【０００４】一方、セラミック基板を回路基板として用
いる場合、基板表面に回路保護用のシリコンゲルを塗布
することがよくある。ところが、スルーホール両面基板
は、スルーホールを介してシリコンゲルが裏面に漏れる
ことを防止するため、予め保護ガラス等によりスルーホ
ールを穴埋めしておく必要があった。しかも、スルーホ
ールを完全に埋めることは容易ではなく、歩留りが悪か
った。On the other hand, when a ceramic substrate is used as a circuit board, silicon gel for circuit protection is often applied to the surface of the board. However, in the through-hole double-sided board, in order to prevent the silicon gel from leaking to the back surface through the through-hole, it is necessary to fill the through-hole with protective glass or the like in advance. Moreover, it was not easy to completely fill the through hole, and the yield was poor.
【０００５】しかして、本発明は、工程数を増加させる
ことなく、スルーホール上下端縁における導体膜厚を充
分厚くし、導体抵抗の増大や断線による不良をおこすお
それを解消することを目的とする。また、シリコンゲル
の保護膜を形成する際の、シリコンゲルの漏れをなくす
ことを第２の目的とする。Therefore, the object of the present invention is to increase the conductor film thickness at the upper and lower edges of the through hole without increasing the number of steps, and to eliminate the possibility of causing a defect due to an increase in the conductor resistance or disconnection. To do. A second object is to prevent leakage of the silicon gel when forming the silicon gel protective film.
【０００６】[0006]
【課題を解決するための手段】本発明のスルーホール両
面基板は、図１に示すように、セラミック基板１を貫通
するスルーホール２を有し、該スルーホール２を介して
基板１上面に形成した第１の導体３と基板１下面に形成
した第２の導体４とを接触せしめる。そして、上記スル
ーホール２は基板１上面より下面方向にかけて縮径する
すりばち状に形成し、半径０．２mm以下の小孔２１にて
基板１下面に開口させる。上記スルーホール内壁面の傾
斜角θは３５°≦θ≦５５°とする（請求項１）。As shown in FIG. 1, a through-hole double-sided substrate of the present invention has a through-hole 2 penetrating a ceramic substrate 1, and is formed on the upper surface of the substrate 1 through the through-hole 2. Then, the first conductor 3 and the second conductor 4 formed on the lower surface of the substrate 1 are brought into contact with each other. Then, the through hole 2 is formed in the shape of a brim which is reduced in diameter from the upper surface of the substrate 1 toward the lower surface, and is opened on the lower surface of the substrate 1 by a small hole 21 having a radius of 0.2 mm or less. The inclination angle θ of the inner wall surface of the through hole is 35 ° ≦ θ ≦ 55 ° (claim 1).
【０００７】上記スルーホール内壁面の傾斜角θは好ま
しくは４０°≦θ≦５５°とする（請求項２）。また、
上記両導体３、４は、それぞれ導体ペーストを印刷、焼
成することにより順次形成されたものであり、かつ上記
両導体により上記小孔２１を閉鎖せしめてある（請求項
３）。The inclination angle θ of the inner wall surface of the through hole is preferably 40 ° ≦ θ ≦ 55 ° (claim 2). Also,
The conductors 3 and 4 are sequentially formed by printing and firing conductor paste, and the small holes 21 are closed by the conductors (claim 3).
【０００８】[0008]
【作用】上記スルーホール２をすりばち状とすること
で、スルーホール２内壁面と基板１上面とで形成される
角αが鈍角となる。従って、スルーホール２上端縁部へ
の導体ペーストの塗布が容易にでき、他の部分に比べ膜
厚が薄くなることがない。特に、上記スルーホール２内
壁面の傾斜角θを５５°以下とすることで確実に断線が
防止でき、傾斜が緩いほど断線のおそれは小さくなる。
ただし、傾斜が緩すぎるとスルーホール２内に充填され
る導体ペースト量が増え、焼成時に剥離するおそれがあ
り、θを３５°以上にすることでこれを防止することが
できる。両導体３、４を同時焼成せず、個々に印刷、焼
成すると、導体ペースト量の多い小孔２１付近で焼成時
に剥離が生じるのを抑制する効果が大きい。また、スル
ーホール２と基板下面とを連通する小孔２１が半径０．
２mm以下であると、基板下面への導体４形成によってス
ルーホール２が埋まり、シリコンゲル塗布時にシリコン
ゲルが基板１下面側に漏れることがない。By forming the through-hole 2 into a serrated shape, the angle α formed between the inner wall surface of the through-hole 2 and the upper surface of the substrate 1 becomes an obtuse angle. Therefore, the conductor paste can be easily applied to the upper edge portion of the through hole 2, and the film thickness does not become thinner than other portions. Particularly, by setting the inclination angle θ of the inner wall surface of the through hole 2 to 55 ° or less, disconnection can be reliably prevented, and the looser the inclination, the less the possibility of disconnection.
However, if the inclination is too gentle, the amount of the conductor paste filled in the through holes 2 increases and there is a risk of peeling during the firing. This can be prevented by setting θ to 35 ° or more. If both conductors 3 and 4 are not simultaneously fired but individually printed and fired, the effect of suppressing peeling during firing in the vicinity of the small holes 21 with a large amount of conductor paste is great. Further, the small hole 21 that connects the through hole 2 and the lower surface of the substrate has a radius of 0.
When the thickness is 2 mm or less, the through hole 2 is filled with the conductor 4 formed on the lower surface of the substrate, and the silicon gel does not leak to the lower surface side of the substrate 1 when the silicon gel is applied.
【０００９】[0009]
【実施例】図１は本発明のスルーホール両面基板の断面
図である。図においてセラミック基板であるアルミナ基
板１には、適当個所にスルーホール２が形成してある。
このスルーホール２は、基板１上面側を大径とし、次第
に縮径するすりばち状に形成してあり、小孔２１により
上記基板１下面に開口している。基板１上面には上記ス
ルーホール２内壁面を覆うように導体３が形成され、一
方、基板１下面には導体４が形成されて上記スルーホー
ル２の小孔２１を介して上記導体３と接触している。な
お、図中、５は抵抗体である。1 is a cross-sectional view of a through-hole double-sided board of the present invention. In the figure, through holes 2 are formed at appropriate places on an alumina substrate 1 which is a ceramic substrate.
The through hole 2 has a large diameter on the upper surface side of the substrate 1 and is formed in a tapered shape which gradually reduces in diameter, and is opened to the lower surface of the substrate 1 by a small hole 21. A conductor 3 is formed on the upper surface of the substrate 1 so as to cover the inner wall surface of the through hole 2, while a conductor 4 is formed on the lower surface of the substrate 1 and contacts the conductor 3 through the small hole 21 of the through hole 2. are doing. In the figure, 5 is a resistor.
【００１０】上記小孔２１は半径を０．２mm以下、好ま
しくは半径０．１mm以下とするのがよい。小孔２１の半
径が０．２mmより大きいと、導体形成時にスルーホール
２が完全に埋まらないおそれがある。また、スルーホー
ル２はすりばち状とした内壁面の傾斜が緩やかである
程、スルーホール２上端縁の導体膜厚を厚くするのに有
効であるが、あまり傾斜が小さいとスルーホール２上端
部の径が大きくなり、基板の小型化に不利であるととも
に、導体印刷時にペーストが多量に塗布されすぎ、焼成
工程で導体が剥離するおそれがある。また、傾斜角θが
大きいと断線のおそれが増加する。The small hole 21 has a radius of 0.2 mm or less, preferably 0.1 mm or less. If the radius of the small hole 21 is larger than 0.2 mm, the through hole 2 may not be completely filled when the conductor is formed. Further, the more gentle the inclination of the inner wall surface of the through hole 2 is, the more effective it is to increase the conductor film thickness at the upper edge of the through hole 2. However, if the inclination is too small, the upper edge of the through hole 2 becomes The diameter is large, which is disadvantageous for downsizing the substrate, and the paste may be too much applied during printing of the conductor, and the conductor may peel off in the firing step. Further, if the inclination angle θ is large, the risk of disconnection increases.
【００１１】図２にスルーホール２の傾斜角θと導体の
断線による不良率および焼成時の剥離発生率の関係を示
す。θ＝２０°では剥離発生率が８５％と極めて高く、
その後急激に減少して３５°以上でほぼ０となる。不良
率はθが小さい場合すなわち５５°以下でほぼ０であ
る。θが５５°を越えると不良率は急激に上昇する。従
って、傾斜角θは３５°≦θ≦５５°の範囲とするのが
よい。FIG. 2 shows the relationship between the inclination angle θ of the through hole 2 and the defective rate due to the disconnection of the conductor and the peeling occurrence rate during firing. When θ = 20 °, the peeling occurrence rate was extremely high at 85%,
After that, it rapidly decreases and becomes almost 0 at 35 ° or more. The defect rate is almost 0 when θ is small, that is, at 55 ° or less. When θ exceeds 55 °, the defect rate sharply increases. Therefore, the inclination angle θ is preferably in the range of 35 ° ≦ θ ≦ 55 °.
【００１２】図３（ａ）は、図３（ｂ）で小孔２１径を
０．２mm、基板１の厚みｔを０．８mmとしたときの傾斜
角θとスルーホール２の上端部径Ｌの関係を示したもの
である。基板１の小型化にはＬが小さい程よく、実用的
にはＬ＝２．１mm、すなわち傾斜角θは、より好ましく
は、４０°≦θ≦５５°とすることが望ましい。FIG. 3A shows the inclination angle θ and the upper end diameter L of the through hole 2 when the diameter of the small hole 21 is 0.2 mm and the thickness t of the substrate 1 is 0.8 mm in FIG. 3B. It shows the relationship of. The smaller L is, the better for downsizing the substrate 1, and practically, L = 2.1 mm, that is, the inclination angle θ is more preferably 40 ° ≦ θ ≦ 55 °.
【００１３】上記形状のスルーホール２を形成するため
に使用される打ち抜き具６を図４、５に示す。打ち抜き
具６は下端部に円錐形の打ち抜き部６１を有し、その先
端には小径のピン部６２を有している。保持台７にアル
ミナグリーンシート１１を位置決め固定し（図４）、上
方より上記打ち抜き具６を押圧、ピン部６２を貫通させ
ることによりグリーンシート１１が打ち抜かれ、スルー
ホール２が形成される。抜きカス１２は保持台７に設け
た孔７１から下方へ抜ける。A punching tool 6 used for forming the through hole 2 having the above-described shape is shown in FIGS. The punching tool 6 has a conical punching portion 61 at the lower end and a small diameter pin portion 62 at the tip thereof. The alumina green sheet 11 is positioned and fixed on the holding base 7 (FIG. 4), the punch 6 is pressed from above and the pin portion 62 is penetrated to punch the green sheet 11 to form the through hole 2. The scrap 12 is pulled out downward from a hole 71 provided in the holding table 7.
【００１４】打ち抜き具６の形状は（図５）、グリーン
シート１１厚さｈ1 、ピン部６２の径Ｒ2 に対し、打ち
抜き部６１基端部の径Ｒ1 を、例えば２ｈ1 ＋Ｒ2 とす
ればよく、スルーホール２内壁面の傾斜角が４５°とな
る。具体的には、グリーンシート１１厚さｈ1 が１mmの
とき、ピン部６２の径Ｒ2 を０．２mmとすると、Ｒ1は
２．２mmとなる。このとき、上部導体３を印刷、焼成す
ると、基板１に形成された小孔２１径はＲ2 よりさらに
小さくなり、０．１mm程度とすることができる。The shape of the punching tool 6 (FIG. 5) is such that the diameter R1 of the base end of the punching portion 61 is, for example, 2h1 + R2 with respect to the thickness h1 of the green sheet 11 and the diameter R2 of the pin portion 62. The inclination angle of the inner wall surface of the hole 2 is 45 °. Specifically, when the thickness h1 of the green sheet 11 is 1 mm and the diameter R2 of the pin portion 62 is 0.2 mm, R1 is 2.2 mm. At this time, when the upper conductor 3 is printed and fired, the diameter of the small hole 21 formed in the substrate 1 becomes smaller than R2, and can be about 0.1 mm.
【００１５】スルーホール２を形成したグリーンシート
１１は、次いで、１５００〜１６００℃で焼成し、基板
１とした後、さらに上部表面に導体３を形成する。導体
材料としては、金、銀、銅、銀−パラジウム、銀−白金
等が使用でき、この導体ペーストを、通常の厚膜形成手
法により印刷、乾燥し、基板下面方向より真空吸引しな
がら、８００〜９５０℃で焼成する（膜厚７〜１５μ
ｍ）。これにより基板１上面およびスルーホール２内周
面に上部導体３が形成される。The green sheet 11 having the through holes 2 is then fired at 1500 to 1600 ° C. to form the substrate 1, and then the conductor 3 is further formed on the upper surface. As the conductor material, gold, silver, copper, silver-palladium, silver-platinum, or the like can be used. This conductor paste is printed by a normal thick film forming method, dried, and vacuum sucked from the lower surface of the substrate to 800 Bake at ~ 950 ° C (film thickness 7 ~ 15μ
m). As a result, the upper conductor 3 is formed on the upper surface of the substrate 1 and the inner peripheral surface of the through hole 2.
【００１６】その後、同様にして基板１下面に導体ペー
ストを印刷し、焼成を行なって、下部導体４とする。こ
れにより上記導体３と下部導体４とが小孔２１にて接続
する。このとき、真空吸引しなければ、上記小孔２１は
導体４によって完全に埋まることになる（図６）。Thereafter, in the same manner, a conductor paste is printed on the lower surface of the substrate 1 and fired to form the lower conductor 4. As a result, the conductor 3 and the lower conductor 4 are connected to each other through the small hole 21. At this time, if the vacuum suction is not performed, the small hole 21 is completely filled with the conductor 4 (FIG. 6).
【００１７】なお、打ち抜き具６を用いる代わりに、図
７に示すドリル８を用いてドリリングによってスルーホ
ール２を形成してもよい。上記ドリル８は先端にスルー
ホール２に対応する円錐形状を有するドリル部８１を有
し、保持台７に固定したグリーンシート１１に上方より
ドリリングを施す。ドリル部８１がグリーンシート１１
を貫通し、貫通穴径が０．０５〜０．２mmとなったとこ
ろでドリリングを停止させれば、焼成後のスルーホール
２の小孔２１径を０．２mm以下、好ましくは０．１mm以
下とすることができる。また、ドリリングで生ずるグリ
ーンシート１１の削りかすは、エア、あるいは窒素ガス
を吹きつけて吹き飛ばすか、吸引により除去することが
できる。Instead of using the punching tool 6, the drill 8 shown in FIG. 7 may be used to form the through hole 2 by drilling. The drill 8 has a conical drill portion 81 corresponding to the through hole 2 at the tip, and drills the green sheet 11 fixed to the holding table 7 from above. Drill part 81 is green sheet 11
If the drilling is stopped when the diameter of the through hole reaches 0.05 to 0.2 mm, the diameter of the small hole 21 of the through hole 2 after firing becomes 0.2 mm or less, preferably 0.1 mm or less. can do. Further, the shavings of the green sheet 11 generated by the drilling can be removed by blowing air or nitrogen gas to blow off or by suction.
【００１８】本実施例ではセラミック基板としてアルミ
ナ基板の例について説明したが、本発明でいうセラミッ
ク基板としては、それ以外にも、例えば窒化アルミニウ
ム、炭化けい素、ベリリア、ガラスセラミックス等の基
板が使用できる。In the present embodiment, an example of an alumina substrate was explained as the ceramic substrate, but other substrates such as aluminum nitride, silicon carbide, beryllia, glass ceramics, etc. may be used as the ceramic substrate in the present invention. it can.
【００１９】[0019]
【発明の効果】以上のように、本発明のスルーホール両
面基板は、スルーホール上下端縁における導体の膜厚を
充分に厚くすることができ、導体抵抗の増大や断線によ
る不良を防止する。しかも導体の剥離が生じるおそれが
ない。さらに基板表面に保護用のシリコンゲルを塗布形
成する際に、保護ガラス等によりスルーホールを穴埋め
する必要がなく、製造工程の簡略化が図れる。As described above, according to the through-hole double-sided board of the present invention, the film thickness of the conductor at the upper and lower edges of the through-hole can be made sufficiently thick and the defect due to the increase of the conductor resistance and the disconnection can be prevented. Moreover, there is no risk of peeling of the conductor. Further, when the protective silicon gel is applied and formed on the surface of the substrate, it is not necessary to fill the through holes with protective glass or the like, and the manufacturing process can be simplified.
【図１】本発明のスルーホール両面基板の部分拡大断面
図である。FIG. 1 is a partially enlarged sectional view of a through-hole double-sided board of the present invention.
【図２】スルーホールの傾斜角と剥離発生率および不良
発生率の関係を示す図である。FIG. 2 is a diagram showing a relationship between an inclination angle of a through hole and a peeling occurrence rate and a defect occurrence rate.
【図３】図３（ａ）はスルーホールの傾斜角と上端部の
径の関係を示す図、図３（ｂ）はアルミナ基板の部分拡
大断面図である。FIG. 3 (a) is a diagram showing a relationship between a tilt angle of a through hole and a diameter of an upper end portion, and FIG. 3 (b) is a partially enlarged sectional view of an alumina substrate.
【図４】本発明のスルーホール両面基板の製造工程を示
す部分拡大断面図である。FIG. 4 is a partial enlarged cross-sectional view showing the manufacturing process of the through-hole double-sided board of the present invention.
【図５】本発明の実施例で用いた打ち抜き具の部分拡大
図である。FIG. 5 is a partially enlarged view of the punching tool used in the example of the present invention.
【図６】本発明の作用を説明するスルーホール両面基板
の部分拡大断面図である。FIG. 6 is a partially enlarged cross-sectional view of a through-hole double-sided board for explaining the operation of the present invention.
【図７】ドリルによるスルーホールの形成方法を示す部
分拡大図である。FIG. 7 is a partially enlarged view showing a method of forming a through hole with a drill.
【図８】従来のスルーホール両面基板の全体斜視図であ
る。FIG. 8 is an overall perspective view of a conventional through-hole double-sided board.
【図９】従来のスルーホール両面基板の部分拡大断面図
で、図８のＩＸ−ＩＸ線拡大断面図である。9 is a partially enlarged cross-sectional view of a conventional through-hole double-sided board, which is an enlarged cross-sectional view taken along line IX-IX of FIG.
１ セラミック基板 ２ スルーホール ２１ 小孔 ３ 第１の導体 ４ 第２の導体 ５ 抵抗体 ６ 打ち抜き具 ７ 保持台 ８ ドリル 1 Ceramic Substrate 2 Through Hole 21 Small Hole 3 First Conductor 4 Second Conductor 5 Resistor 6 Punching Tool 7 Holding Table 8 Drill
Claims (3)
を有し、該スルーホールを介して基板上面に形成した第
１の導体と基板下面に形成した第２の導体とが接触して
いるスルーホール両面基板において、上記スルーホール
を、基板上面より下面方向にかけて縮径するすりばち状
に形成し、半径０．２mm以下の小孔にて基板下面に開口
せしめるとともに、上記スルーホール内壁面の傾斜角θ
を３５°≦θ≦５５°としたことを特徴とするスルーホ
ール両面基板。1. Both sides of a through hole having a through hole penetrating through the ceramic substrate, and a first conductor formed on the upper surface of the substrate and a second conductor formed on the lower surface of the substrate are in contact with each other through the through hole. In the board, the through hole is formed in a shape of a skirt having a diameter reduced from the top surface of the board toward the bottom surface, and the through hole is opened to the bottom surface of the board by a small hole having a radius of 0.2 mm or less.
35 ° ≦ θ ≦ 55 °. A through-hole double-sided board.
０°≦θ≦５５°とした請求項１記載のスルーホール両
面基板。2. The inclination angle θ of the inner wall surface of the through hole is 4
The through-hole double-sided board according to claim 1, wherein 0 ° ≦ θ ≦ 55 °.
れぞれ導体ペーストを印刷、焼成することにより順次形
成され、かつ上記両導体によりスルーホールの上記小孔
を閉鎖した請求項１または２記載のスルーホール両面基
板。3. The first conductor and the second conductor are successively formed by printing and firing a conductor paste, and the small holes of the through holes are closed by the both conductors. Through-hole double-sided board described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28266894A JPH08125297A (en) | 1994-10-21 | 1994-10-21 | Through-hole double-sided board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28266894A JPH08125297A (en) | 1994-10-21 | 1994-10-21 | Through-hole double-sided board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08125297A true JPH08125297A (en) | 1996-05-17 |
Family
ID=17655506
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28266894A Pending JPH08125297A (en) | 1994-10-21 | 1994-10-21 | Through-hole double-sided board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08125297A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001067824A1 (en) * | 2000-03-07 | 2001-09-13 | Idemitsu Kosan Co., Ltd. | Active-drive organic el display and method for manufacturing the same |
| JP2021086880A (en) * | 2019-11-26 | 2021-06-03 | Ｎｇｋエレクトロデバイス株式会社 | Ceramic wiring board and method for manufacturing ceramic wiring board |
-
1994
- 1994-10-21 JP JP28266894A patent/JPH08125297A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001067824A1 (en) * | 2000-03-07 | 2001-09-13 | Idemitsu Kosan Co., Ltd. | Active-drive organic el display and method for manufacturing the same |
| US6995736B2 (en) | 2000-03-07 | 2006-02-07 | Idemitsu Kosan Co., Ltd. | Active-driving type organic EL display device, and a method of producing the same |
| US7227518B2 (en) | 2000-03-07 | 2007-06-05 | Idemitsu Kosan Co., Ltd. | Active-driving type organic el display device, and a method of producing the same |
| KR100851156B1 (en) * | 2000-03-07 | 2008-08-08 | 이데미쓰 고산 가부시키가이샤 | Active-drive organic el display and method for manufacturing the same |
| JP2021086880A (en) * | 2019-11-26 | 2021-06-03 | Ｎｇｋエレクトロデバイス株式会社 | Ceramic wiring board and method for manufacturing ceramic wiring board |
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