JPH08116094A - Surface mount type light emitting element - Google Patents
Surface mount type light emitting elementInfo
- Publication number
- JPH08116094A JPH08116094A JP27563494A JP27563494A JPH08116094A JP H08116094 A JPH08116094 A JP H08116094A JP 27563494 A JP27563494 A JP 27563494A JP 27563494 A JP27563494 A JP 27563494A JP H08116094 A JPH08116094 A JP H08116094A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- electrode
- substrate
- diode chip
- emitting diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、各種ＡＶ機器、電話
機、その他一般電子機器に広く使用されている表面実装
型発光素子に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mount type light emitting device which is widely used in various AV equipments, telephones and other general electronic equipments.
【０００２】[0002]
【従来の技術】従来の表面実装型発光素子としては、図
８及び図９に示すような発光ダイオードやフォトカプラ
があった。この発光ダイオードは、ガラスエポキシ基板
２の表面に対向配置された一対の電極部４、６と、その
一方の電極部４の上にダイボンドされ且つ他方の電極部
６にワイヤーボンドされた発光ダイオードチップ８と、
ワイヤーの保護等を目的として発光ダイオードチップ８
及びその周辺を覆う液状エポキシ樹脂のポッティング又
はトランスファー成形にて形成される封止樹脂１０と、
から構成されていた。また、フォトカプラは、耐熱性樹
脂からなる基板１２と、この基板１２内にインサート成
形された複数のリードフレーム１４と、リードフレーム
１４の所定位置にダイボンド及びワイヤーボンドされた
赤外発光ダイオード１６及びフォトトランジスタ又はフ
ォトダイオードからなる受光素子１８と、それらを覆う
ようにトランスファー成形された封止樹脂２０と、から
構成されていた。2. Description of the Related Art Conventional surface mount type light emitting devices include light emitting diodes and photocouplers as shown in FIGS. This light emitting diode is a light emitting diode chip in which a pair of electrode portions 4 and 6 are arranged to face each other on the surface of a glass epoxy substrate 2 and die-bonded on one of the electrode portions 4 and wire-bonded to the other electrode portion 6. 8 and
Light emitting diode chip 8 for the purpose of wire protection etc.
And a sealing resin 10 formed by potting or transfer molding of a liquid epoxy resin covering the periphery thereof,
Was composed of. The photocoupler includes a substrate 12 made of heat-resistant resin, a plurality of lead frames 14 insert-molded in the substrate 12, an infrared light emitting diode 16 die-bonded and wire-bonded to predetermined positions of the lead frame 14, The light receiving element 18 is composed of a phototransistor or a photodiode, and the sealing resin 20 transfer-molded so as to cover them.
【０００３】[0003]
【発明が解決しようとする課題】上記のように表面実装
型発光素子においては、通常、発光ダイオードチップ８
等の化合物半導体素子を用いている。この化合物半導体
素子はもろいものであるため、機械的応力ストレスに弱
く破損する危険性があり、ワイヤーボンド時にボンディ
ング不良が発生したり、また、封止樹脂が硬化する時の
応力ストレスにより破損したり、更に実装する際にリフ
ロー半田付を行うと吸湿したエポキシ樹脂からなる封止
樹脂１０、２０が熱により膨張して応力ストレスが加わ
り破損する等、従来の構造では信頼性が低くなるという
課題があった。As described above, in the surface mount type light emitting device, the light emitting diode chip 8 is usually used.
And other compound semiconductor devices are used. Since this compound semiconductor element is fragile, it is vulnerable to mechanical stress stress and may be damaged, resulting in defective bonding during wire bonding or damage due to stress stress when the sealing resin is cured. Further, if reflow soldering is performed during mounting, the sealing resin 10 or 20 made of a moisture-absorbed epoxy resin expands due to heat and is stressed and damaged, and the conventional structure has a problem of low reliability. there were.
【０００４】また、従来の表面実装型発光素子において
は、その構造上、ワイヤーボンダーやトランスファー成
形機等の高価な設備が必要であるという課題もあった。Further, the conventional surface mount type light emitting device has a problem that expensive structure such as a wire bonder and a transfer molding machine is required due to its structure.
【０００５】本発明は、上記課題に鑑みなされたもの
で、その目的は、発光ダイオードチップに加わる機械的
応力ストレスをなくして発光ダイオードチップの破損や
接触不良等を防ぎ、製品の信頼性を高め、また高価な設
備を必要とする製造工程を削減してコストアップを防ぐ
ことができる表面実装型発光素子を提供することにあ
る。The present invention has been made in view of the above problems, and an object thereof is to prevent mechanical stress stress applied to a light emitting diode chip to prevent damage and contact failure of the light emitting diode chip, and to enhance product reliability. Another object of the present invention is to provide a surface-mounted light emitting device capable of preventing an increase in cost by reducing a manufacturing process which requires expensive equipment.
【０００６】[0006]
【課題を解決するための手段】本発明の表面実装型発光
素子は、表面に凹部が設けられた透光性を有する基板
と、該基板の表面に形成されると共に前記凹部の底部に
設けられた接続部を有する第１電極部と、前記基板の表
面に形成された第２電極部と、表裏面にそれぞれ電極接
続部が設けられその一方の電極接続部が前記第１電極部
の接続部に接触するように前記凹部の底部に固着された
発光ダイオードチップと、柔軟性を有し且つ前記凹部の
開口部を覆うように前記基板の表面に固着されるフレキ
シブル基板と、該フレキシブル基板の前記基板に対向す
る側の面上に設けられ、前記発光ダイオードチップの他
方の電極接続部に接触する接続部が設けられ且つ前記第
２電極部にも接触する第３電極部と、からなるものであ
る。A surface mount type light emitting device of the present invention is a substrate having a translucent surface provided with a recess, and a substrate formed on the surface of the substrate and provided at the bottom of the recess. A first electrode portion having a connecting portion, a second electrode portion formed on the front surface of the substrate, and electrode connecting portions provided on the front and back surfaces, and one electrode connecting portion of which is the connecting portion of the first electrode portion. A light emitting diode chip fixed to the bottom of the recess so as to contact the flexible substrate, a flexible substrate having flexibility and fixed to the surface of the substrate so as to cover the opening of the recess, and the flexible substrate A third electrode portion provided on the surface facing the substrate, provided with a connection portion that comes into contact with the other electrode connection portion of the light emitting diode chip, and also comes into contact with the second electrode portion. is there.
【０００７】[0007]
【作用】本発明の表面実装型発光素子においては、基板
に設けられている第１電極部とフレキシブル基板上に設
けられている第３電極部にそれぞれ発光ダイオードチッ
プの電極部に接触する接続部が設けられている。発光ダ
イオードチップを基板の凹部の底部に固着すると、発光
ダイオードチップの一方の電極接続部と第１電極部の接
続部とが接触し、また、フレキシブル基板を凹部の開口
部を覆うように固着すると、発光ダイオードチップの他
方の電極接続部と第３電極部とが接触し、更にこのとき
に第２電極部と第３電極部とが接触する。この結果、発
光ダイオードチップの一方の電極接続部は第１電極部に
接続され、また他方の電極接続部は第３電極部を介して
第２電極部に接続される。そして、このような構成から
なる表面実装型発光素子を、フレキシブル基板側をマザ
ーボード側に向けてマザーボード上に実装することによ
り、発光ダイオードチップは基板の凹部に収められて保
護されると共にフレキシブル基板とマザーボードとの間
に形成される空気層により熱等から保護される。In the surface mount type light emitting device of the present invention, the first electrode portion provided on the substrate and the third electrode portion provided on the flexible substrate are respectively connected to the electrode portion of the light emitting diode chip. Is provided. When the light emitting diode chip is fixed to the bottom of the concave portion of the substrate, one electrode connecting portion of the light emitting diode chip and the connecting portion of the first electrode portion contact each other, and when the flexible substrate is fixed so as to cover the opening portion of the concave portion. The other electrode connecting portion of the light emitting diode chip and the third electrode portion are in contact with each other, and at this time, the second electrode portion and the third electrode portion are in contact with each other. As a result, one electrode connecting portion of the light emitting diode chip is connected to the first electrode portion, and the other electrode connecting portion is connected to the second electrode portion via the third electrode portion. Then, by mounting the surface-mounted light-emitting element having such a configuration on the motherboard with the flexible substrate side facing the motherboard side, the light emitting diode chip is housed in the recess of the substrate and protected, and at the same time as the flexible substrate. An air layer formed between the motherboard and the motherboard protects it from heat and the like.
【０００８】[0008]
【実施例】図１は本発明の一実施例に係る表面実装型発
光素子を示す断面図である。２２は金属メッキが可能な
透光性を有するガラスエポキシ、ガラス等からなる基板
である。この基板２２は、図２にも示すように、比較的
薄い直方体をなすもので、その表面の中央に円形又は楕
円形状の凹部２４が設けられている。この凹部２４に
は、その開口部２４ａよりも径が小さい底部２４ｂと、
開口部２４ａから底部２４ｂに向かって傾斜する周状の
内側面２４ｃとが設けられている。1 is a sectional view showing a surface-mounted light emitting device according to an embodiment of the present invention. Reference numeral 22 denotes a substrate made of translucent glass epoxy, glass, or the like that can be plated with metal. As shown in FIG. 2, the substrate 22 has a relatively thin rectangular parallelepiped shape, and a circular or elliptical recess 24 is provided at the center of the surface thereof. In the recess 24, a bottom portion 24b having a diameter smaller than that of the opening 24a,
A circumferential inner side surface 24c that slopes from the opening 24a toward the bottom 24b is provided.
【０００９】２６、２８はメッキ、印刷等により基板２
２の表面に形成される第１及び第２電極部である。本実
施例における第１及び第２電極部２６、２８は、基板２
２の表面２２ａから側面２２ｂ及び裏面２２ｃにかけて
凹部２４を挟んで相対するように形成されている。ま
た、第１電極部２６は、基板２２の表面２２ａから凹部
２４の内側面２４ｃを通って底部２４ｂ上に延びる接続
部２６ａを有する。この接続部２６ａの端部は、後述す
る発光ダイオードチップの電極接続部の位置に適合する
ように、リングを略半分にしたような形状に形成されて
いる。Substrates 26 and 28 are formed by plating, printing or the like.
The first and second electrode portions are formed on the surface of No. 2. The first and second electrode portions 26, 28 in this embodiment are the substrate 2
The second surface 22a, the side surface 22b, and the rear surface 22c are formed so as to face each other with the recess 24 interposed therebetween. Further, the first electrode portion 26 has a connecting portion 26a extending from the surface 22a of the substrate 22 through the inner side surface 24c of the recess 24 and onto the bottom portion 24b. The end portion of the connecting portion 26a is formed in a shape that is approximately half the ring so as to match the position of the electrode connecting portion of the light emitting diode chip described later.
【００１０】３０は発光ダイオードチップであり、図３
及び図４にその表側及び裏側の外観を示すように、表側
から順にアノード３０ａ、カソード３０ｂ、サブストレ
ート３０ｃを重ね合わせた構造となっている。また、こ
のアノード３０ａの中央には電極接続部３０ｄが設けら
れており、サブストレート３０ｃの対角線上の２個の角
部にも電極接続部３０ｅが設けられている。この発光ダ
イオードチップ３０は、電極接続部３０ｅが第１電極部
２６の接続部２６ａに接触するように凹部２４の底部２
４ｂに銀ペースト又は高温半田によって固着される。A light emitting diode chip 30 is shown in FIG.
Further, as shown in the outer appearances of the front side and the back side in FIG. 4, the anode 30a, the cathode 30b, and the substrate 30c are stacked in this order from the front side. An electrode connecting portion 30d is provided at the center of the anode 30a, and electrode connecting portions 30e are also provided at two diagonal corners of the substrate 30c. The light emitting diode chip 30 has a bottom portion 2 of the recess 24 so that the electrode connecting portion 30e contacts the connecting portion 26a of the first electrode portion 26.
It is fixed to 4b by silver paste or high temperature solder.
【００１１】３２は柔軟性を有し金属メッキが可能なフ
レキシブル基板であり、基板２２の表面２２ａに凹部２
４の開口部２４ａを覆うように取り付けられるものであ
る。このフレキシブル基板３２の基板２２に対向する側
の面上には、第１及び第２電極部２６、２８にそれぞれ
銀ペースト又は高温半田により固着されて接続される第
４及び第３電極部３６、３４がメッキ、印刷等により形
成されている。この第３電極部３４には、フレキシブル
基板３２の略中央まで引き出された接続部３４ａが設け
られている。この接続部３４ａはフレキシブル基板３２
を基板２２に固着する際に、銀ペースト又は高温半田に
より発光ダイオードチップ３０の電極接続部３０ｄに固
着される。尚、第４電極部３６は、フレキシブル基板３
２を基板に固着する際に、第１電極部２６との密着性・
固着性を良くするために形成されているものである。Reference numeral 32 denotes a flexible substrate which is flexible and can be plated with metal. The concave portion 2 is formed on the surface 22a of the substrate 22.
4 is attached so as to cover the opening 24a. On the surface of the flexible substrate 32 on the side facing the substrate 22, the fourth and third electrode portions 36, which are fixedly connected to the first and second electrode portions 26 and 28 by silver paste or high-temperature solder, respectively, 34 is formed by plating, printing, or the like. The third electrode portion 34 is provided with a connection portion 34a that is extended to approximately the center of the flexible substrate 32. This connecting portion 34a is a flexible substrate 32.
When being fixed to the substrate 22, it is fixed to the electrode connecting portion 30d of the light emitting diode chip 30 with silver paste or high temperature solder. The fourth electrode portion 36 is formed on the flexible substrate 3
Adhesion with the first electrode portion 26 when fixing 2 to the substrate
It is formed to improve the adhesiveness.
【００１２】上記構成からなる本実施例の表面実装型発
光素子においては、凹部２４の底部２４ｂ上に固着され
た発光ダイオードチップ３０の表面が、基板２２の表面
２２ａよりも低い所に位置するように設定されている。
また、基板２２はその厚さが１ｍｍ〜数ｍｍに設定され
ており、フレキシブル基板３２の厚さは５０〜１００μ
ｍに設定されている。このため、第３電極部３４の接続
部３４ａを発光ダイオードチップ３０の電極接続部３０
ｄに固着すると、フレキシブル基板３２は、図１に示す
ように、凹部２４の内方に向かってわん曲することにな
る。In the surface mount type light emitting device of this embodiment having the above structure, the surface of the light emitting diode chip 30 fixed on the bottom portion 24b of the recess 24 is positioned lower than the surface 22a of the substrate 22. Is set to.
The thickness of the substrate 22 is set to 1 mm to several mm, and the thickness of the flexible substrate 32 is 50 to 100 μm.
It is set to m. Therefore, the connection portion 34a of the third electrode portion 34 is connected to the electrode connection portion 30 of the light emitting diode chip 30.
When fixed to d, the flexible substrate 32 bends inward of the recess 24, as shown in FIG.
【００１３】この表面実装型発光素子を、図６に示すよ
うに、マザーボード３８にリフロー半田付により実装す
る際には、フレキシブル基板３２側がマザーボード３８
の表面に当接するように固着する。その際に、フレキシ
ブル基板３２の中央は基板２２の凹部２４の内方に向か
ってわん曲しているので、フレキシブル基板３２とマザ
ーボード３８との間には隙間があき、ここに入った空気
により空気層４０が形成される。このようにして形成さ
れた空気層４０は、表面実装型発光素子をリフロー半田
付する際に受ける機械的応力ストレスや熱ストレスから
発光ダイオードチップ３０を保護する役目を果たしてい
る。When the surface mount type light emitting device is mounted on the mother board 38 by reflow soldering as shown in FIG. 6, the flexible substrate 32 side is located on the mother board 38.
It sticks so that it may contact the surface of. At that time, since the center of the flexible substrate 32 is bent toward the inside of the concave portion 24 of the substrate 22, there is a gap between the flexible substrate 32 and the mother board 38, and the air entering there causes air to flow. Layer 40 is formed. The air layer 40 thus formed plays a role of protecting the light emitting diode chip 30 from mechanical stress stress and thermal stress which are applied when the surface mounting type light emitting element is reflow-soldered.
【００１４】上記のように実装された表面実装型発光素
子は、発光ダイオードチップ３０が発する光を基板２２
を介して外部に照射する。このため、基板２２全体が明
るくなり、基板２２が光を集光・拡散する役目を果た
す。The surface mount type light emitting device mounted as described above emits the light emitted from the light emitting diode chip 30 to the substrate 22.
Irradiate to the outside via. Therefore, the entire substrate 22 becomes bright, and the substrate 22 plays a role of condensing and diffusing light.
【００１５】尚、ガラスエポキシ、ガラス等からなる基
板２２に光拡散剤を混合させても良い。また、製造時に
は、基板２２を多数集合させた集合基板を用いても良
い。A light diffusing agent may be mixed with the substrate 22 made of glass epoxy, glass or the like. Further, at the time of manufacturing, a collective substrate in which a large number of substrates 22 are assembled may be used.
【００１６】また、発光ダイオードチップ３０の全面
に、透明エポキシ樹脂又は透明シリコン樹脂をコーティ
ングして、光量を増加させても良い。Further, the entire surface of the light emitting diode chip 30 may be coated with transparent epoxy resin or transparent silicon resin to increase the amount of light.
【００１７】更に、本実施例における第１電極部２６の
接続部２６ａは、凹部２４の表面２２ａから内側面２４
ｃ上を通って底部２４ｂ上に形成されているが、図７に
示すように、第１電極部２６の基板２２の裏面２２ｃ側
に回り込んで形成されている部分からスルーホール電極
部２６ｂを介して凹部２４の底部２４ｂ上に形成されて
いる接続部２６ａに導通するように形成することもでき
る。Further, the connecting portion 26a of the first electrode portion 26 in the present embodiment includes the surface 22a of the recess 24 to the inner side surface 24.
Although it is formed on the bottom portion 24b by passing over the c, as shown in FIG. 7, the through-hole electrode portion 26b is formed from the portion formed around the first electrode portion 26 on the back surface 22c side of the substrate 22. It can also be formed so as to be electrically connected to the connecting portion 26a formed on the bottom portion 24b of the concave portion 24 via.
【００１８】また、基板２２に設けられた凹部２４の形
状も、図７に示すもののように、その内側面２４ｃが底
面２４ｂに対して垂直な面となるように形成しても良い
し、更に、その開口部２４ａや底部２４ｂの形状が矩形
であっても良い。The shape of the recess 24 provided in the substrate 22 may be such that the inner side surface 24c thereof is a surface perpendicular to the bottom surface 24b as shown in FIG. The shape of the opening 24a and the bottom 24b may be rectangular.
【００１９】[0019]
【発明の効果】本発明の表面実装型発光素子によれば、
フレキシブル基板の柔軟性を利用して第３電極部を発光
ダイオードチップに固着しているので、ワイヤーボンド
工程や液状エポキシ樹脂のポッティング又はトランスフ
ァー成形等の工程を削減することができる。従って、こ
れら削減した工程において生じていたワイヤーボンド不
良や発光ダイオードチップの破損等がなくなり、信頼性
を向上させることができる。According to the surface mount type light emitting device of the present invention,
Since the third electrode portion is fixed to the light emitting diode chip by utilizing the flexibility of the flexible substrate, the steps of wire bonding, potting of liquid epoxy resin, transfer molding and the like can be omitted. Therefore, the wire bond failure, the damage of the light emitting diode chip, and the like that have occurred in these reduced steps are eliminated, and the reliability can be improved.
【００２０】また、製造工程の一部を削減し、高価な機
械を使用する必要もなくなるので、製造コストを大幅に
引き下げることができる。Further, since a part of the manufacturing process is reduced and it is not necessary to use an expensive machine, the manufacturing cost can be greatly reduced.
【００２１】更に、フレキシブル基板のわん曲により生
じる空気層により、リフロー半田時における熱ストレス
等から発光ダイオードチップを保護することができ、信
頼性を更に高めることができる。Further, the air layer generated by the bending of the flexible substrate can protect the light emitting diode chip from thermal stress at the time of reflow soldering, and the reliability can be further enhanced.
【図１】本発明の一実施例に係る表面実装型発光素子を
示す断面図である。FIG. 1 is a sectional view showing a surface-mounted light emitting device according to an embodiment of the present invention.
【図２】図１に示す基板の外観を示す斜視図である。FIG. 2 is a perspective view showing the external appearance of the substrate shown in FIG.
【図３】図１に示す発光ダイオードチップの表側の外観
を示す斜視図である。FIG. 3 is a perspective view showing an outer appearance of a front side of the light emitting diode chip shown in FIG.
【図４】図１に示す発光ダイオードチップの裏側の外観
を示す斜視図である。FIG. 4 is a perspective view showing the outer appearance of the back side of the light emitting diode chip shown in FIG.
【図５】図１に示すフレキシブル基板の外観を示す斜視
図である。5 is a perspective view showing the appearance of the flexible substrate shown in FIG. 1. FIG.
【図６】図１に示す表面実装型発光素子を実装した状態
を示す断面図である。6 is a cross-sectional view showing a state in which the surface-mounted light emitting device shown in FIG. 1 is mounted.
【図７】第１電極部の一部及び基板の一部変更例を示す
断面図である。FIG. 7 is a cross-sectional view showing a modified example of a part of the first electrode part and a part of the substrate.
【図８】従来の発光ダイオードの構造を示す斜視図であ
る。FIG. 8 is a perspective view showing a structure of a conventional light emitting diode.
【図９】従来のフォトカプラの構造を示す斜視図であ
る。FIG. 9 is a perspective view showing the structure of a conventional photocoupler.
２２ 基板 ２４ 凹部 ２６ 第１電極部 ２８ 第２電極部 ３０ 発光ダイオードチップ ３２ フレキシブル基板 ３４ 第３電極部 22 substrate 24 concave portion 26 first electrode portion 28 second electrode portion 30 light emitting diode chip 32 flexible substrate 34 third electrode portion
Claims (1)
基板と、該基板の表面に形成されると共に前記凹部の底
部に設けられた接続部を有する第１電極部と、前記基板
の表面に形成された第２電極部と、表裏面にそれぞれ電
極接続部が設けられその一方の電極接続部が前記第１電
極部の接続部に接触するように前記凹部の底部に固着さ
れた発光ダイオードチップと、柔軟性を有し且つ前記凹
部の開口部を覆うように前記基板の表面に固着されるフ
レキシブル基板と、該フレキシブル基板の前記基板に対
向する側の面上に設けられ、前記発光ダイオードチップ
の他方の電極接続部に接触する接続部が設けられ且つ前
記第２電極部にも接触する第３電極部と、からなること
を特徴とする表面実装型発光素子。1. A light-transmitting substrate having a concave portion on its surface, a first electrode portion having a connecting portion formed on the surface of the substrate and provided at the bottom of the concave portion, and Light emission fixed to the bottom of the recess so that the second electrode portion formed on the front surface and the electrode connection portions on the front and back surfaces are provided, and one of the electrode connection portions is in contact with the connection portion of the first electrode portion. A diode chip, a flexible substrate having flexibility and fixed to the surface of the substrate so as to cover the opening of the recess, and provided on a surface of the flexible substrate facing the substrate, A surface mounting type light emitting device comprising: a third electrode portion that is provided with a connection portion that contacts the other electrode connection portion of the diode chip and that also contacts the second electrode portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27563494A JP3357756B2 (en) | 1994-10-14 | 1994-10-14 | Surface mount type light emitting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27563494A JP3357756B2 (en) | 1994-10-14 | 1994-10-14 | Surface mount type light emitting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08116094A true JPH08116094A (en) | 1996-05-07 |
| JP3357756B2 JP3357756B2 (en) | 2002-12-16 |
Family
ID=17558199
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27563494A Expired - Lifetime JP3357756B2 (en) | 1994-10-14 | 1994-10-14 | Surface mount type light emitting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3357756B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005202382A (en) * | 2003-12-18 | 2005-07-28 | Sumitomo Bakelite Co Ltd | Optical printed circuit board, surface mounting type semiconductor package, and mother board |
| WO2005104252A2 (en) * | 2004-03-29 | 2005-11-03 | Cree, Inc. | Semiconductor light emitting devices including flexible film having therein an optical element, and methods of assembling same |
| US7718991B2 (en) | 2006-05-23 | 2010-05-18 | Cree Led Lighting Solutions, Inc. | Lighting device and method of making |
| JPWO2013145071A1 (en) * | 2012-03-26 | 2015-08-03 | 富士機械製造株式会社 | LED package and manufacturing method thereof |
| JP2016167540A (en) * | 2015-03-10 | 2016-09-15 | シチズンホールディングス株式会社 | Light emitting module |
| DE102004047061B4 (en) | 2004-09-28 | 2018-07-26 | Osram Opto Semiconductors Gmbh | Optoelectronic component and method for producing an optoelectronic component |
-
1994
- 1994-10-14 JP JP27563494A patent/JP3357756B2/en not_active Expired - Lifetime
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005202382A (en) * | 2003-12-18 | 2005-07-28 | Sumitomo Bakelite Co Ltd | Optical printed circuit board, surface mounting type semiconductor package, and mother board |
| WO2005104252A2 (en) * | 2004-03-29 | 2005-11-03 | Cree, Inc. | Semiconductor light emitting devices including flexible film having therein an optical element, and methods of assembling same |
| WO2005104252A3 (en) * | 2004-03-29 | 2006-01-26 | Cree Inc | Semiconductor light emitting devices including flexible film having therein an optical element, and methods of assembling same |
| US7355284B2 (en) | 2004-03-29 | 2008-04-08 | Cree, Inc. | Semiconductor light emitting devices including flexible film having therein an optical element |
| KR101143207B1 (en) * | 2004-03-29 | 2012-05-18 | 크리 인코포레이티드 | Semiconductor light emitting devices including flexible film having therein an optical element, and methods of assembling same |
| EP2259351A3 (en) * | 2004-03-29 | 2017-01-04 | Cree, Inc. | Semiconductor light emitting devices including flexible film having therein an optical element, and methods of assembling same |
| DE102004047061B4 (en) | 2004-09-28 | 2018-07-26 | Osram Opto Semiconductors Gmbh | Optoelectronic component and method for producing an optoelectronic component |
| US7718991B2 (en) | 2006-05-23 | 2010-05-18 | Cree Led Lighting Solutions, Inc. | Lighting device and method of making |
| JPWO2013145071A1 (en) * | 2012-03-26 | 2015-08-03 | 富士機械製造株式会社 | LED package and manufacturing method thereof |
| JP2016167540A (en) * | 2015-03-10 | 2016-09-15 | シチズンホールディングス株式会社 | Light emitting module |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3357756B2 (en) | 2002-12-16 |
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