JPH0793347B2 - Semiconductor device inspection equipment - Google Patents
Semiconductor device inspection equipmentInfo
- Publication number
- JPH0793347B2 JPH0793347B2 JP1155457A JP15545789A JPH0793347B2 JP H0793347 B2 JPH0793347 B2 JP H0793347B2 JP 1155457 A JP1155457 A JP 1155457A JP 15545789 A JP15545789 A JP 15545789A JP H0793347 B2 JPH0793347 B2 JP H0793347B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- ink
- semiconductor device
- conductive
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は半導体装置の検査装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device inspection apparatus.
従来の技術 従来、ウェハ状態の半導体装置の電気特性を検査しその
良，不良を判定した後、後工程のダイスボンド工程で良
品と不良品を分別するため、第２図に一例を示すような
不良品インク打点装置（以後インカーと称する）を用い
て不良の半導体装置にインクの打点を行っていた。2. Description of the Related Art Conventionally, after inspecting the electrical characteristics of a semiconductor device in a wafer state and judging whether the semiconductor device is good or bad, in order to separate a good product and a defective product in a die bonding process as a post process, an example is shown in FIG. Ink dots have been applied to defective semiconductor devices by using a defective ink dot device (hereinafter referred to as an inker).
インカーの機構の概略を第２図を用いて説明する。イン
カー本体は支持棒８によってプローバに固定される。合
成繊維製テグスよりなるリード１はインク壷３の内部を
通りリード支持筒２のほぼ先端に達している。またリー
ド１は可動子５とも接続されている。可動子５は電磁石
４の内部を貫通してリード１を接続し、電磁石４のコイ
ルに電流を流すと磁力で下方に動き電流を段つとバネ６
により上方に戻る機構になっている。リード１は可動子
５と連動してリード支持筒２及び、インク壷３内部を上
下する。リード支持筒は内径及び外径とも均一な筒で、
インク壷３にインクを充填し、リード１を数回上下させ
るとリード１の先端及び側壁にインクが付着する。第３
図ａ及びｂに示すようにインカーの位置及び高さを適当
に調整し、電気特性が不良の半導体装置上でリード１を
下げるとリード１の先端に付着したインクが不良の半導
体装置上に打点される。リード１の高さは打点時に正し
く半導体装置の表面に接触するように調節ネジ７で調整
する。The outline of the mechanism of the inker will be described with reference to FIG. The inker body is fixed to the prober by the support rod 8. The lead 1 made of synthetic fiber Tegus passes through the inside of the ink fountain 3 and reaches almost the tip of the lead support cylinder 2. The lead 1 is also connected to the mover 5. The mover 5 penetrates the inside of the electromagnet 4 and connects the lead 1, and when a current is passed through the coil of the electromagnet 4, the mover 5 moves downward due to the magnetic force, and when the current is stepped, the spring 6
It is a mechanism that returns to the top. The lead 1 moves up and down inside the lead support cylinder 2 and the ink fountain 3 in conjunction with the mover 5. The lead support cylinder has a uniform inner diameter and outer diameter.
When the ink fountain 3 is filled with ink and the lead 1 is moved up and down several times, the ink adheres to the tip and side wall of the lead 1. Third
As shown in FIGS. A and b, when the position and height of the inker are appropriately adjusted and the lead 1 is lowered on the semiconductor device having the defective electric characteristics, the ink adhering to the tip of the lead 1 becomes a dot on the defective semiconductor device. To be done. The height of the lead 1 is adjusted by the adjusting screw 7 so that the lead 1 is brought into proper contact with the surface of the semiconductor device at the time of hitting.
発明が解決しようとする課題 すなわち、第３図は第２図のインク壷３の一部、リード
支持筒２及びリード１の拡大断面図で、実際の使用状態
を明確にするため、半導体装置12,半導体装置のパット1
1,及び電気特性を測定するためのプローブ10を付加させ
てある。That is, FIG. 3 is an enlarged cross-sectional view of a part of the ink fountain 3, the lead support cylinder 2 and the lead 1 of FIG. 2 in order to clarify the actual use state. Semiconductor device pad 1
1, and a probe 10 for measuring electrical characteristics is added.
第３図ａはインク打点前の図である。インク壷３内に充
填されたインク９は表面張力及び毛細管現像でリード支
持筒２の先端付近まで達している。FIG. 3a is a diagram before ink dots are applied. The ink 9 filled in the ink fountain 3 reaches near the tip of the lead support cylinder 2 due to surface tension and capillary development.
第３図ｂはインク打点時の図である。リード１が下がっ
て不良の半導体装置12の表面に達し、リード１の先端に
付着したインク９の一部が不良の半導体装置12の表面に
打点される。FIG. 3b is a diagram at the time of hitting the ink. The lead 1 drops and reaches the surface of the defective semiconductor device 12, and a part of the ink 9 attached to the tip of the lead 1 is spotted on the surface of the defective semiconductor device 12.
第３図ｃは前述の第３図a,bの動作を数百〜数千回繰り
返した時の状態の図である。リード支持筒２の先端外壁
部にインク９が付着し、その量がしだいに増加し表面張
力でインク９が球状になり、その径も大きくなる。通
常、インクの粘度によって異なり、粘度の低い方が早く
第３図ｃの状態になりやすい。FIG. 3c is a diagram showing a state in which the operations shown in FIGS. 3a and 3b are repeated hundreds to thousands of times. The ink 9 adheres to the outer wall of the tip of the lead support cylinder 2 and its amount gradually increases, and the ink 9 becomes spherical due to the surface tension and its diameter also increases. Usually, it depends on the viscosity of the ink, and the lower the viscosity, the faster the state of FIG.
第３図ｃの状態がさらに進行し、ついには第３図ｄに示
すようにインク９の大きな塊がプローブ10又は、パット
11に付着する。プローブ10に付着した場合は以後の半導
体装置の測定時にはパット11にインクが付着し、後工程
のワイヤボンド工程時にワイヤボンド不良を起こす。
又、半導体装置の表面に付着したインクの高さが表面張
力で数百ミクロン以上に達するため、ウェハー上で隣の
半導体装置の測定のためプローブ10を移動する際、プロ
ーブ10の先端がインクに接触し、プローブ10及び半導体
装置のパット11がインクで汚染される。またインク自身
が糸を引いて次のチップを汚染することがある。The state of FIG. 3c further progresses, and finally, as shown in FIG. 3d, a large lump of ink 9 is generated by the probe 10 or the pad.
Attach to 11. When the ink adheres to the probe 10, the ink adheres to the pad 11 during the subsequent measurement of the semiconductor device, causing wire bond failure during the wire bond process in the subsequent process.
Further, since the height of the ink attached to the surface of the semiconductor device reaches several hundreds of microns or more due to the surface tension, when the probe 10 is moved to measure the adjacent semiconductor device on the wafer, the tip of the probe 10 is exposed to the ink. Upon contact, the probe 10 and the pad 11 of the semiconductor device are contaminated with ink. Also, the ink itself may pull the thread and contaminate the next chip.
課題を解決するための手段 本発明は絶縁製リード支持筒の外壁に導電性材料よりな
るセンサーを付け、絶縁製リード支持筒とセンサーの間
に電圧を印加してそのリーク電流を検知するものであ
る。Means for Solving the Problems The present invention is to attach a sensor made of a conductive material to the outer wall of an insulating lead supporting cylinder and to detect a leak current by applying a voltage between the insulating lead supporting cylinder and the sensor. is there.
作用 この構成により、導電性リードとセンサー間には常に電
圧が印加されており、絶縁製リード支持筒の先端に導電
性インクがたまり、センサーと接触するとリーク電流が
流れて検知も可能とする。Operation With this configuration, the voltage is always applied between the conductive lead and the sensor, the conductive ink collects at the tip of the insulating lead supporting cylinder, and when the sensor comes into contact with the sensor, a leak current flows to enable detection.
実 施 例 第１図ａに実施例を示す。導電性リード１（例、金属
製，カーボン系）、絶縁製リード支持筒13の外壁先端上
に金属製の筒14を付け、導電性リード１と金属製の筒14
は電気的につなぎ、ブザー15を付ける。インク９は導電
性インクとする（例、カーボン系，水性インク）。Example 1 An example is shown in Fig. 1a. Conductive lead 1 (eg, metal, carbon-based), insulating lead support cylinder 13 is attached with metal cylinder 14 on the outer wall tip, and conductive lead 1 and metal cylinder 14 are attached.
Is electrically connected and a buzzer 15 is attached. The ink 9 is a conductive ink (eg, carbon-based ink, water-based ink).
初めに、第１図ａの状態では導電性リード１と金属製の
筒14の間に絶縁製リード支持筒13があり、電気的につな
がっていないのでブザー15は動作しない。絶縁製リード
支持筒13の先端にインク９の塊ができた時が第１図ｂの
状態である。この時、インク９の導電性であると、導電
性リード１と金属製の筒14の間に絶縁製リード支持筒13
があるが、インク９を介することにより、導電性リード
１と金属製の筒14は電気的につながり、ブサー15が動作
する、これにより絶縁製リード支持筒13の先端にインク
の塊が球状にできることが確認でき、これを排除するこ
とにより、良品半導体装置のインクによる汚染が防止で
きる。First, in the state of FIG. 1A, the buzzer 15 does not operate because there is the insulating lead support cylinder 13 between the conductive lead 1 and the metal cylinder 14 and they are not electrically connected. The state shown in FIG. 1B is when the ink 9 is formed at the tip of the insulating lead support cylinder 13. At this time, if the ink 9 is conductive, the insulating lead supporting cylinder 13 is provided between the conductive lead 1 and the metal cylinder 14.
However, through the ink 9, the conductive lead 1 and the metal tube 14 are electrically connected to each other, and the buser 15 operates, so that a lump of ink is formed into a spherical shape at the tip of the insulating lead support tube 13. It can be confirmed that this is possible, and by eliminating this, contamination of the non-defective semiconductor device with ink can be prevented.
発明の効果 本発明を用いれば半導体装置の検査が効率的に行いその
工業的価値は大きい。EFFECTS OF THE INVENTION If the present invention is used, a semiconductor device can be efficiently inspected and its industrial value is great.
第１図は本発明の実施例にかかる半導体装置の検査装置
の構造模式図、第２図は従来の検査装置の模式図、第３
図は従来の動作状態図である。 １……リード（第１図では導電性リード）、２……リー
ド支持筒、３……インク壷、４……電磁石、５……可動
子、６……バネ、７……リード高さ調節ネジ、８……支
持棒、９……インク（第１図では同電性インク）、10…
…プローブ、11……パッド、12……半導体装置、13……
絶縁製リード支持筒、14……金属製の筒、15……ブザ
ー。FIG. 1 is a structural schematic diagram of a semiconductor device inspection apparatus according to an embodiment of the present invention, FIG. 2 is a schematic diagram of a conventional inspection apparatus, and FIG.
The figure is a conventional operation state diagram. 1 ... Lead (conductive lead in FIG. 1), 2 ... Lead support cylinder, 3 ... Inkwell, 4 ... Electromagnet, 5 ... Mover, 6 ... Spring, 7 ... Lead height adjustment Screw, 8 ... Support rod, 9 ... Ink (same electrical ink in Fig. 1), 10 ...
… Probe, 11 …… Pad, 12 …… Semiconductor device, 13 ……
Insulated lead support tube, 14 …… Metal tube, 15 …… Buzzer.
Claims (1)
持する絶縁製リード支持筒と、前記リード支持筒と前記
リードの先端及び、リード側壁とリード支持筒内壁間の
隙間に不良品打点用の導電性インクを供給するためのイ
ンク壷と、上記リード支持筒の外壁先端に設けられた導
電性材料よりなるセンサーを備えて前記導電性リードと
前記センサー間に電圧を印加しながら流れるリーク電流
を検知する半導体装置の検査装置。1. A conductive lead, an insulating lead supporting cylinder for supporting the lead on an inner wall, a lead supporting cylinder and a tip of the lead, and a defective product spot in a gap between the lead side wall and the inner wall of the lead supporting cylinder. A leak that flows while applying a voltage between the conductive lead and the sensor, which is provided with an ink bottle for supplying a conductive ink for use with the sensor and a sensor made of a conductive material provided on the tip of the outer wall of the lead support cylinder. Semiconductor device inspection device that detects current.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1155457A JPH0793347B2 (en) | 1989-06-16 | 1989-06-16 | Semiconductor device inspection equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1155457A JPH0793347B2 (en) | 1989-06-16 | 1989-06-16 | Semiconductor device inspection equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0320058A JPH0320058A (en) | 1991-01-29 |
| JPH0793347B2 true JPH0793347B2 (en) | 1995-10-09 |
Family
ID=15606466
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1155457A Expired - Fee Related JPH0793347B2 (en) | 1989-06-16 | 1989-06-16 | Semiconductor device inspection equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0793347B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6834807B2 (en) | 2001-07-13 | 2004-12-28 | Hand Held Products, Inc. | Optical reader having a color imager |
| US7293712B2 (en) | 2004-10-05 | 2007-11-13 | Hand Held Products, Inc. | System and method to automatically discriminate between a signature and a dataform |
| JP5599691B2 (en) * | 2010-10-27 | 2014-10-01 | シャープ株式会社 | Semiconductor inspection equipment |
-
1989
- 1989-06-16 JP JP1155457A patent/JPH0793347B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0320058A (en) | 1991-01-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |