JPH0320056A - Inspection device for semiconductor device - Google Patents
Inspection device for semiconductor deviceInfo
- Publication number
- JPH0320056A JPH0320056A JP15544089A JP15544089A JPH0320056A JP H0320056 A JPH0320056 A JP H0320056A JP 15544089 A JP15544089 A JP 15544089A JP 15544089 A JP15544089 A JP 15544089A JP H0320056 A JPH0320056 A JP H0320056A
- Authority
- JP
- Japan
- Prior art keywords
- ink
- lead
- tube
- external wall
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title abstract description 25
- 238000007689 inspection Methods 0.000 title description 7
- 239000002184 metal Substances 0.000 claims description 2
- 239000012209 synthetic fiber Substances 0.000 claims 1
- 229920002994 synthetic fiber Polymers 0.000 claims 1
- 239000000523 sample Substances 0.000 abstract description 7
- 230000002950 deficient Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 238000012360 testing method Methods 0.000 description 3
- 241000976924 Inca Species 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】 産業上の利用分野 本発明は半導体装置の検査装置に関するものである。[Detailed description of the invention] Industrial applications The present invention relates to an inspection apparatus for semiconductor devices.
従来の技術
従来、ウェハ状額の半導体装置の電気特性を検査し、半
導体装置の良品・不良品を判定した後、後工程のダイス
ボンド工程で良品・不良品を分別できるようにするため
第２回に一例を示すような不良品インク打点装置（以降
インカーと称する。）を用いて不良品の半導体装置にイ
ンクの打点を行っている。Conventional technology Conventionally, after inspecting the electrical characteristics of a semiconductor device in the form of a wafer and determining whether the semiconductor device is good or defective, a second test is carried out in order to be able to separate the good and defective products in the subsequent die bonding process. Ink is dotted on defective semiconductor devices using a defective ink dotting device (hereinafter referred to as an inker), as shown in the following example.
インカ一の機構の概略を第２図を用いて説明する。イン
カ一本体は支持棒８によってブローパに固定される。金
属製針金あるいは合或繊維・装テグスより成るリード１
はインク壺３の内部を通りリード支持筒２のほぼ先端に
達している。筐たり−ド１は可動子６とも接続されてい
る。可動子５は電磁石４の内部を貫通してリード１を接
続し、電磁石４のコイルに電流を通じると磁力で下方に
動き、電流を断つとパネ６により上方に戻る機構になっ
ている。リード１は可動子６と連動してリード支持筒２
及びインク壺３内部を上下する。リード支持筒２は内径
及び外径とも均一な筒で、インク壺３にインクを充填し
リード１を数回上下させるとリード１の先端及び側壁と
リード支持筒２の内側壁間のｍｌ！ｆｌにインクが付着
する。第３図ａ及びｂに示すようにインカーの位置及び
高さを適当に調整し、電気特性が不良の半導体装置上で
リ一ド１を下げるとリード１の先端に付着したインクが
不良の半導体装置上に打点される。リード１の高さは打
点時に正しく半導体装置表面に接触するよう調節ネジ７
で調節する。An outline of the mechanism of Inca 1 will be explained using FIG. 2. The inker main body is fixed to the blower by a support rod 8. Lead 1 made of metal wire or composite fibers and threads
passes through the inside of the ink fountain 3 and reaches almost the tip of the lead support cylinder 2. The housing board 1 is also connected to the mover 6. The mover 5 penetrates the inside of the electromagnet 4 and connects the lead 1, and has a mechanism in which when a current is passed through the coil of the electromagnet 4, it moves downward by magnetic force, and when the current is cut off, it returns upward by a panel 6. The lead 1 moves in conjunction with the mover 6 to support the lead support tube 2.
and move the inside of the ink fountain 3 up and down. The lead support cylinder 2 is a cylinder with uniform inner and outer diameters, and when the ink bottle 3 is filled with ink and the lead 1 is moved up and down several times, the difference in ml between the tip and side wall of the lead 1 and the inner wall of the lead support cylinder 2! Ink adheres to fl. As shown in Figure 3a and b, when the position and height of the inker are adjusted appropriately and the lead 1 is lowered over a semiconductor device with poor electrical characteristics, the ink adhering to the tip of the lead 1 will be removed from the defective semiconductor device. A dot is placed on the device. Adjust the height of lead 1 by adjusting screw 7 so that it contacts the surface of the semiconductor device correctly at the point of impact.
Adjust with .
発明が解決しようとする課題
第３図は第２図のインク壺３の一部、リード支持筒２及
びリード１の拡大断面図で実際の使用状態を明確にする
ため、半導体装置１２，半導体装置のパッド１１及び電
気特性を測定するためのプロープ１０を付加させてある
。Problems to be Solved by the Invention FIG. 3 is an enlarged sectional view of a part of the ink fountain 3, the lead support tube 2, and the lead 1 shown in FIG. A pad 11 and a probe 10 for measuring electrical characteristics are added.
第３図ａはインク打点前の図である。インク壺３内に充
填されたインク９は表面張力及び毛細管現象でリード支
持筒２の先端付近まで達している。FIG. 3a is a diagram before ink dotting. The ink 9 filled in the ink bottle 3 reaches near the tip of the lead support cylinder 2 due to surface tension and capillary action.
第３図ｂはインク打点時の図である。リード１の先端に
付着したインク９の一部が不良の半導体装置１２の表面
に打点される。FIG. 3b is a diagram at the time of ink dotting. A portion of the ink 9 adhering to the tip of the lead 1 is dotted onto the surface of the defective semiconductor device 12.
第３図Ｃは前述の第３図ａ及びｂの動作を数十〜数百回
繰う返した時の状態の図である。リード支持筒２の外壁
部先端にインク９が付着し、その量がしだいに増加し表
面張力でインク９が球状になシその径も増加する。通常
、インクの粘度によって異なり、粘度の低い方が早く第
３図Ｃの状態になシやすい。FIG. 3C is a diagram of the state when the operations shown in FIGS. 3a and 3b described above are repeated several tens to hundreds of times. The ink 9 adheres to the tip of the outer wall of the lead support cylinder 2, the amount of which gradually increases, and the ink 9 becomes spherical due to surface tension, and its diameter also increases. Usually, it depends on the viscosity of the ink, and the lower the viscosity, the faster the state shown in FIG. 3C can be reached.
第３図Ｃの状態がさらに進行し、ついには第３図ｄに示
すようにインク９の大きな塊がプロープ１ｏあるいはパ
ッド１１に付着する。プローブ１０に付着した場合は以
降の半導体装置の測定時にパッド１１にインクが付着し
、後工程のワイヤポンド工程時にワイヤボンド不良を引
き起こす。１た、半導体装置表面に付着したインクの高
さが表面張力で数百ミクロン以上に達するため、ウエハ
上で隣の半導体装置の測定のためプローブ１０を移動す
る際、グローブ１０の先端がインクに接触し、プロープ
１０及び半導体装置のバッド１１がインクで汚染される
。またインク自身が糸を引いて次のチップを汚染するこ
ともある。The situation shown in FIG. 3C further progresses, and eventually a large lump of ink 9 adheres to the probe 1o or pad 11 as shown in FIG. 3D. If the ink adheres to the probe 10, the ink will adhere to the pad 11 during subsequent measurements of the semiconductor device, causing wire bonding defects during the subsequent wire bonding process. 1. Also, because the height of the ink adhering to the surface of a semiconductor device reaches several hundred microns or more due to surface tension, when the probe 10 is moved to measure an adjacent semiconductor device on the wafer, the tip of the glove 10 may touch the ink. As a result, the probe 10 and the pad 11 of the semiconductor device are contaminated with ink. Also, the ink itself can string and contaminate the next chip.
本発明は上記従来の問題点を解決するもので、リード支
持筒２の外壁部先端に付着したインク９が、リード１を
伝ってグローブ１ｏあるいはバッド１１に付着すること
なく半導体装置の電気的特性を検査することのできる半
導体装置の検査装置を提供することを目的とする。The present invention solves the above-mentioned conventional problems, and prevents the ink 9 adhering to the tip of the outer wall of the lead support tube 2 from traveling along the lead 1 and adhering to the globe 1o or the pad 11, thereby improving the electrical characteristics of the semiconductor device. An object of the present invention is to provide an inspection apparatus for semiconductor devices that can inspect semiconductor devices.
課題を解決するための手段
この目的を達成するために本発明の半導体装置の検査装
置は、リード支持筒の外壁部先端を真空で吸引するため
の真空吸引用チューブを備えた構戊を有している。Means for Solving the Problems To achieve this object, the semiconductor device inspection apparatus of the present invention has a structure that includes a vacuum suction tube for vacuuming the tip of the outer wall of the lead support cylinder. ing.
作 用
従来のインカ一のリード支持筒２の外壁部先端にインク
が付着する現象の原因は次のように考えられる。Function The cause of the phenomenon in which ink adheres to the tip of the outer wall of the lead support tube 2 of the conventional Inca 1 is considered to be as follows.
インク打点時にリード１の側壁に付着したインクはイン
クの粘度が低い場合リード１の下方に移動し、リード１
がパネ６の働きで上方に戻る際リード支持筒２の先端で
余分のインクを吸収しきれずに先端にたｔｂ、表面張力
でリード支持筒２の外壁部先端１で曾わυ込む。本発明
の構戒ではリード支持筒２の外壁部先端に真空吸引用チ
ューブを備えておシ、リード支持筒紳外壁部西端にたま
ったインクを真空で吸引することによってインクが球状
にた１る現象は解消される。If the viscosity of the ink is low, the ink adhering to the side wall of lead 1 during ink dotting moves downward to lead 1.
When the ink returns upward due to the action of the panel 6, the excess ink cannot be completely absorbed at the tip of the lead support tube 2, and the excess ink tb is trapped at the tip 1 of the outer wall of the lead support tube 2 due to surface tension. In the structure of the present invention, a vacuum suction tube is provided at the tip of the outer wall of the lead support tube 2, and by vacuum suctioning the ink accumulated at the western end of the outer wall of the lead support tube, the ink is collected in a spherical shape. The phenomenon will be resolved.
実施例
以下本発明の一実施例について、図面を参照しながら説
明する。EXAMPLE An example of the present invention will be described below with reference to the drawings.
第１図に本発明の一実施例における半導体装置の検査装
置の要部断面図である。第１図において、１はリード、
２はリード支持筒、３はインク壺、９はインク、１ｏぱ
グローブ、１１はパッド、１２は半導体装置、１３は真
空吸引用チューブである。FIG. 1 is a sectional view of a main part of a semiconductor device inspection apparatus according to an embodiment of the present invention. In Figure 1, 1 is a lead;
2 is a lead support cylinder, 3 is an ink pot, 9 is ink, 1 is a glove, 11 is a pad, 12 is a semiconductor device, and 13 is a vacuum suction tube.
以上のように構成された本実施例の半導体装置の検査装
置では、リード支持筒２の外壁部先端を真空吸引用チュ
ーブを通じてつねに真空で吸引されている。In the semiconductor device inspection apparatus of this embodiment configured as described above, the tip of the outer wall of the lead support cylinder 2 is constantly vacuumed through the vacuum suction tube.
なお、本発明の一実施例ではリード支持筒２の外殻にリ
ード支持筒２の外径より大きい口径の真空吸引用チュー
ブを備えた構或としたが、必ずしも真空吸引チューブが
リード支持筒２を覆うように構或されなくてもよく、真
空吸引チューブはリード支持簡の外壁部先端付近に設け
ておけばリード支持筒の外壁部先端にたまったインクは
十分に真空によって吸引できる。In one embodiment of the present invention, the outer shell of the lead support tube 2 is provided with a vacuum suction tube having a diameter larger than the outer diameter of the lead support tube 2. However, the vacuum suction tube is not necessarily attached to the lead support tube 2. The vacuum suction tube does not need to be constructed to cover the lead support tube, and if the vacuum suction tube is provided near the tip of the outer wall of the lead support tube, the ink accumulated at the tip of the outer wall of the lead support tube can be sufficiently vacuumed out.
発明の効果
以上のように本発明によれば、リード支持筒２の外壁部
先端を真空で吸引できるような真空吸引用チューブ１３
を備えることにより、リード支持筒２の外壁部先端にた
まるインク９がグローブ１ｏあるいはバッド１１に付着
することを防止できるので、半導体装置の検査が効率的
に行なえその工業的画値は大きい。Effects of the Invention As described above, according to the present invention, the vacuum suction tube 13 is capable of vacuum suctioning the tip of the outer wall of the lead support tube 2.
By providing this, it is possible to prevent the ink 9 accumulated at the tip of the outer wall portion of the lead support tube 2 from adhering to the glove 1o or the pad 11, so that semiconductor devices can be inspected efficiently and the industrial image value thereof is high.
第１図は本発明の一実施例における半４体装置の検査装
置の要部断面図、第２図は従来の半導体装置の検査装置
の平面概略図、第３図は第２図の半導体装置の検査装置
の問題点を説明するための要部断面図である。
１・・・・・・リード、２・・・・・・リード支持筒、
３・・・・・・インク壺、４・・・・・・電磁石、６・
・・・・・可動子、６・・・・・・バネ、７・・・・・
・リード高さ調節ネジ、８・・・・・・支持棒、９・・
・・・・インク、１０・・・・・・グローブ、１１・・
・・・・パッド、１２・・・・・一半導体装置、１３・
・・・・・真空吸引用チ１−ブFIG. 1 is a cross-sectional view of essential parts of a half-quad device testing device according to an embodiment of the present invention, FIG. 2 is a schematic plan view of a conventional semiconductor device testing device, and FIG. 3 is a diagram showing the semiconductor device shown in FIG. 2. FIG. 2 is a sectional view of a main part for explaining a problem with the inspection device of FIG. 1...Lead, 2...Lead support tube,
3... Ink pot, 4... Electromagnet, 6...
...Mover, 6...Spring, 7...
・Lead height adjustment screw, 8...Support rod, 9...
...Ink, 10...Glove, 11...
...Pad, 12...1 semiconductor device, 13.
...Vacuum suction tube 1-tub
Claims (1)
、そのリードを内壁で支持するリード支持筒と、リード
の先端及びリード側壁とリード支持筒内壁間の隙間に打
点用インクを供給するためのインク壷と、リード支持筒
の外壁部先端を真空で吸引するための真空吸引用チュー
ブとを有するインク打点装置を備えた半導体装置の検査
装置。A lead made of metal wire or synthetic fiber wire, a lead support tube that supports the lead on an inner wall, and an ink pot for supplying dotting ink to the tip of the lead and the gap between the lead side wall and the inner wall of the lead support tube. and a vacuum suction tube for vacuuming the tip of the outer wall of the lead support cylinder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15544089A JPH0320056A (en) | 1989-06-16 | 1989-06-16 | Inspection device for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15544089A JPH0320056A (en) | 1989-06-16 | 1989-06-16 | Inspection device for semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0320056A true JPH0320056A (en) | 1991-01-29 |
Family
ID=15606080
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15544089A Pending JPH0320056A (en) | 1989-06-16 | 1989-06-16 | Inspection device for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0320056A (en) |
-
1989
- 1989-06-16 JP JP15544089A patent/JPH0320056A/en active Pending
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