JPH0791417B2 - Conductive resin composition - Google Patents
Conductive resin compositionInfo
- Publication number
- JPH0791417B2 JPH0791417B2 JP5189288A JP5189288A JPH0791417B2 JP H0791417 B2 JPH0791417 B2 JP H0791417B2 JP 5189288 A JP5189288 A JP 5189288A JP 5189288 A JP5189288 A JP 5189288A JP H0791417 B2 JPH0791417 B2 JP H0791417B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- zinc oxide
- whiskers
- conductive
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Compositions Of Macromolecular Compounds (AREA)
- Conductive Materials (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は、導電性樹脂組成物に関する。この導電性樹脂
組成物はコンパウンド,ペースト,成型品などの形態で
特に半導体関係において、静電破壊防止のための包装,
保管,運搬用の材料、帯電防止や静電除去用の床材、電
磁波障害防止用のしゃへい材、コロナ放電劣化防止用の
電線被覆材、合成樹脂サーミスタなどの広範囲な分野で
使用される。TECHNICAL FIELD The present invention relates to a conductive resin composition. This conductive resin composition is in the form of compound, paste, molded product, etc., especially in the semiconductor-related form, for preventing electrostatic breakdown,
It is used in a wide range of fields such as materials for storage and transportation, floor materials for preventing static electricity and static electricity, shield materials for preventing electromagnetic interference, wire covering materials for preventing corona discharge deterioration, and synthetic resin thermistors.
従来の技術 樹脂に配合して、導電性を付与する素材即ちフィラーと
しては、銀,銅,アルミニウム,ニッケル,パラジウ
ム,鉄等の金属,炭化硅素,酸化錫,酸化インジウム,
酸化鉛等の金属化合物,カーボン等の非金属が結晶体,
非晶質体で、フレーク状,粉末状,繊維状等の形態で使
用されている。これらのフィラーにより、高い安定な導
電性組成物を得るには、樹脂中に均一に分散することが
肝要であり、これには上記の粉末状,フレーク状のもの
は粉砕等で各々微粒子化,薄肉化し、繊維状のものはそ
の径の微細化が要求されてきた。しかるに特に金属フィ
ラーの場合には上記処理時や保存中に湿気や酸素の影響
により表面に酸化被膜が発現し分散が良好化しても所期
の導電性を得がたい場合が多く、又他の化合物では加水
分解で同様な悪影響をうける場合が多く、更に化学的に
安定な化合物であったりかつ繊維状の場合には粉砕等の
微細化手法の効果が小さく、特殊な微細化手法が要求さ
れ処理コストが大となったりするために、樹脂への分散
上、好ましい微粒子化、微細化には限界を生じ、比較的
粗大寸法のまま使用さぜるを得なかった。したがって配
合後に樹脂とフィラーとの分離を生じ不均質な分散状態
となり易く、得られた組成物の耐湿性,耐食性等が劣
り、長期に導電性を維持するのが困難である場合が多
い。2. Description of the Related Art Materials that are added to a resin to give conductivity, that is, fillers, include metals such as silver, copper, aluminum, nickel, palladium, iron, silicon carbide, tin oxide, indium oxide,
Metal compounds such as lead oxide, non-metals such as carbon are crystalline,
It is an amorphous material and is used in the form of flakes, powder, fibers, and the like. In order to obtain a highly stable conductive composition with these fillers, it is important to disperse them uniformly in the resin. For this, the powdery or flake-like ones described above are made into fine particles by pulverization, Thinner and fibrous materials have been required to have a smaller diameter. However, especially in the case of metal fillers, it is often difficult to obtain the desired conductivity even when the oxide film is developed on the surface due to the influence of moisture and oxygen during the above treatment or storage and the dispersion is improved, and other compounds are used. Hydrolysis often has the same adverse effect, and if it is a chemically stable compound or is fibrous, the effect of micronization such as pulverization is small, and a special micronization method is required, and processing cost is high. In view of dispersion in the resin, there is a limit to making fine particles and fine particles, and it is unavoidable to use the particles with relatively large dimensions. Therefore, the resin and the filler are likely to separate from each other after the compounding, resulting in an inhomogeneous dispersed state, and the obtained composition is inferior in moisture resistance, corrosion resistance, and the like, and it is often difficult to maintain conductivity for a long period of time.
発明が解決しようとする課題 本発明は従来の技術、即ち導電性フィラーの微粒化,微
細化による高分散化,高導電性化と異なり、新規な酸化
亜鉛ウイスカーを導電性フィラーとして用い、樹脂中で
極めて能率的で安定な電気的接触を達成した高分散性の
組成物を提供することを目的とする。DISCLOSURE OF THE INVENTION The present invention uses a novel zinc oxide whisker as a conductive filler, which is different from conventional techniques, that is, atomization of a conductive filler, high dispersion and high conductivity due to miniaturization, and It is an object of the present invention to provide a highly dispersible composition which achieves extremely efficient and stable electrical contact.
課題を解決するための手段 本発明者は上記問題点に鑑み、安定したフィラーであ
り、樹脂に配合して成形性が良好でかつ成形品は耐湿
性,耐食性,導電性に優れた導電性フィラーを種々実験
研究,検討を行った結果、酸化亜鉛ウィスカーが樹脂と
の混練,成形時において極めて安定で樹脂に均質に分散
し、成型性が良く、得られた成形品は極めて安定な導電
性を示すことを確認した。Means for Solving the Problems In view of the above problems, the present inventor is a conductive filler that is a stable filler, has good moldability when compounded with a resin, and has a molded article having excellent moisture resistance, corrosion resistance, and conductivity. As a result of various experimental researches and studies, zinc oxide whiskers were extremely stable during kneading and molding with resin and were uniformly dispersed in the resin, with good moldability, and the resulting molded product had extremely stable conductivity. Confirmed to show.
即ち、本発明は樹脂に導電性フィラーとして新規なテト
ラポッド状の酸化亜鉛ウイスカーを配合してなる導電性
樹脂組成物に係るものである。尚、上記の新規な酸化亜
鉛ウイスカーとは、中心の核部、この核部から異る4軸
方向に伸びた針状結晶部からなり、前記針状結晶部の基
部の径が0.7〜14μm、特に1〜14μmであり、前記針
状結晶部の基部から先端までの長さが3〜200μm、特
に10〜200μmである等の形態的寸法的特長を有するも
のである。That is, the present invention relates to a conductive resin composition obtained by mixing a resin with a novel tetrapod-shaped zinc oxide whisker as a conductive filler. The novel zinc oxide whisker is composed of a central core portion and a needle-shaped crystal portion extending in four different axial directions from the core portion, and the diameter of the base portion of the needle-shaped crystal portion is 0.7 to 14 μm. In particular, it has a morphological dimensional characteristic such as 1 to 14 μm, and the length from the base to the tip of the needle-shaped crystal portion is 3 to 200 μm, and particularly 10 to 200 μm.
作用 本発明に使用する酸化亜鉛ウイスカーは前述したように
テトラポッド状の立体的な特異な構造を有するために、
樹脂中に配合された場合にはウイスカーの針状結晶部が
他のウイスカー針状結晶部と極めて能率的に導電性を高
める様な電気的接触をもたらす。これは従来電気的接触
に有利だとされてきた単純な線状繊維体に比しても、接
触確率が極めて高いものである。更にこの酸化亜鉛ウイ
スカーは他の従来から使用されている粒状,フレーク
状,繊維状,導電性フィラーと混合併用された場合でも
上記フィラー単独系より極めて高い電気的接触を達成
し、高導電性に大きく寄与する。更に樹脂との分散性に
就いても酸化亜鉛本来の性質による“ぬれ性”の良好性
に加え上記構造も寄与することから優れている。更に単
結晶性からくる安定性が組成物の経時劣化の減少耐湿性
の向上に寄与する。Action Since the zinc oxide whiskers used in the present invention have a tetrapod-like three-dimensional unique structure as described above,
When compounded in a resin, the whisker needle-shaped crystal parts make electrical contact with other whisker needle-shaped crystal parts in a highly efficient manner to enhance conductivity. This has a very high contact probability as compared with a simple linear fiber body which has been conventionally considered advantageous for electrical contact. Furthermore, this zinc oxide whisker achieves extremely high electrical contact compared with the above filler alone system even when mixed and used with other conventionally used granular, flake-like, fibrous, or conductive fillers, and has high conductivity. Make a big contribution. Further, the dispersibility with the resin is also excellent because the above structure contributes to the good wettability due to the inherent properties of zinc oxide. Further, the stability derived from the single crystal property contributes to the reduction of deterioration of the composition over time and the improvement of moisture resistance.
上記のテトラポッド状酸化亜鉛ウイスカーは、表面に酸
化膜を有する金属亜鉛粉末を酸素を含む雰囲気下で加熱
処理することによって得られる。得られるウイスカー
は、みかけの嵩比重0.05〜0.1を有し、収率は70%以上
である。そして、前記酸化皮膜の生成条件によってウイ
スカーの大きさをある程度コントロールすることができ
る。The above tetrapod-shaped zinc oxide whiskers are obtained by heat-treating metallic zinc powder having an oxide film on its surface in an atmosphere containing oxygen. The obtained whiskers have an apparent bulk specific gravity of 0.05 to 0.1 and a yield of 70% or more. The size of the whiskers can be controlled to some extent by the conditions for forming the oxide film.
第1図は実施例に用いた酸化亜鉛ウイスカーの電子顕微
鏡写真である。このウイスカーは次のようにして得た。
即ち純度99.99%の亜鉛線をアーク放電方式による溶射
法で空気中に溶射した粉末1Kgを回収し、これにイオン
交換水500gを加え、乳鉢形擂潰機で約20分間撹拌後、26
℃の水中に72時間放置し、次に150℃で30分間乾燥後、
アルミナ磁気製るつぼに入れ、1000℃に保たれた炉内に
入れ、1時間熱処理することによって得たものである。
みかけ嵩比重は0.09、針状結晶部の太さは1〜14μm、
長さは10〜200μmである。なお、図では針状結晶部が
3軸あるいは2軸のものも認められるが、4軸のものの
一部が折損したものと思われる。又板状晶のものも認め
られる。いずれにしてもテトラポッド状のものが約80%
を占める。第2図は上記ウイスカーのX線回折図を示
す。すべて酸化亜鉛のピークを示し、電子線回折の結果
も転移,格子欠陥の少ない単結晶性を示した。又不純物
含有量も少なく、原子吸光分析の結果、酸化亜鉛が99.9
8%であった。FIG. 1 is an electron micrograph of the zinc oxide whiskers used in the examples. This whisker was obtained as follows.
That is, powder 1Kg obtained by spraying a 99.99% pure zinc wire in the air by a thermal spraying method using an arc discharge method, adding 500g of ion-exchanged water thereto, stirring for about 20 minutes with a mortar-type crusher, and
Leave in water at ℃ for 72 hours, then dry at 150 ℃ for 30 minutes,
It was obtained by placing it in an alumina magnetic crucible, placing it in a furnace kept at 1000 ° C., and heat treating it for 1 hour.
The apparent bulk specific gravity is 0.09, the thickness of the needle-shaped crystal part is 1 to 14 μm,
The length is 10 to 200 μm. In the figure, the needle-shaped crystal part may be triaxial or biaxial, but it is considered that a part of the tetraaxial one is broken. Plate-like crystals are also recognized. In any case, about 80% is tetrapod-shaped
Occupy FIG. 2 shows an X-ray diffraction pattern of the above whiskers. All showed peaks of zinc oxide, and electron diffraction results showed single crystallinity with few dislocations and lattice defects. Also, the content of impurities is low, and as a result of atomic absorption spectrometry, zinc oxide is 99.9
It was 8%.
このようなウイスカーは又低粘度や高比重の樹脂中に配
合された場合にも成形時に樹脂から分離することなく良
好な分散性を示す。本発明においては樹脂に配合する導
電性フィラーとしての酸化亜鉛ウイスカーは単独で配合
することによって充分導電性を付与できるが、導電化の
目的によっては、他のフィラー、例えば銀,銅,アルミ
ニウム,ニッケル,パラジウム,鉄,酸化錫,酸化イン
ジウム,酸化鉛,炭化硅素,炭化ジルコニウム,炭化チ
タン,高導電性カーボン,グラファイト,アセチレンブ
ラック等の粉末,フレーク,繊維を併用,混合すること
も可能である。Such whiskers also exhibit good dispersibility without being separated from the resin at the time of molding even when blended in a resin having a low viscosity and a high specific gravity. In the present invention, zinc oxide whiskers as a conductive filler to be blended with the resin can impart sufficient conductivity by blending alone, but depending on the purpose of conductivity, other fillers such as silver, copper, aluminum and nickel can be used. , Palladium, iron, tin oxide, indium oxide, lead oxide, silicon carbide, zirconium carbide, titanium carbide, highly conductive carbon, graphite, powders of acetylene black, etc., flakes, and fibers can be used together and mixed.
本発明に用いる樹脂には、熱可塑性樹脂,熱硬化性樹脂
共に可能であり、これには、ポリ塩化ビニール,ポリエ
チレン,塩素化ポリエチレン,ポリプロピレン,ポリエ
チレンテレフタレート,ポリブチレンテレフタレート,
ポリアミド,ポリスルホン,ポリエーテルスルホン,ポ
リフェニレンサルファイド,ポリエーテルケトン,ABS樹
脂,ポリスチレン,ポリブタジエン,メチルメタクリレ
ート,ポリアクリロニトリル,ポリアセタール,ポリカ
ーボネート,エチレン−酢酸ビニール共重合体,ポリ酢
酸ビニール,エチレン−テトラフロロエチレン共重合
体,ポリフェニレンオキサイド,芳香族ポリエステル,
ポリ弗化ビニール,ポリ弗化ビニリデン,ポリ塩化ビニ
リデン等を挙げることができる。又熱硬化性樹脂として
は、エポキシ樹脂,不飽和ポリエステル,シリコン樹
脂,メラミン−ユリア樹脂,フェノール樹脂等がある。The resin used in the present invention may be either a thermoplastic resin or a thermosetting resin, which includes polyvinyl chloride, polyethylene, chlorinated polyethylene, polypropylene, polyethylene terephthalate, polybutylene terephthalate,
Polyamide, polysulfone, polyether sulfone, polyphenylene sulfide, polyether ketone, ABS resin, polystyrene, polybutadiene, methyl methacrylate, polyacrylonitrile, polyacetal, polycarbonate, ethylene-vinyl acetate copolymer, polyvinyl acetate, ethylene-tetrafluoroethylene copolymer Polymer, polyphenylene oxide, aromatic polyester,
Examples thereof include polyvinyl fluoride, polyvinylidene fluoride and polyvinylidene chloride. The thermosetting resin includes epoxy resin, unsaturated polyester, silicone resin, melamine-urea resin, phenol resin and the like.
樹脂に対する導電性フィラーの配合割合は特に限定され
ないが、配合量が少なすぎる場合は導電化の目的が達成
されず、必要以上に多量であると、比重が大となった
り、コスト面で不利となったり折角の良好な分散性阻外
して表面までフィラーが突出したりする弊害が生じたり
する。このため、導電化の目的に従って好ましい範囲が
ある。即ち樹脂に対し5〜50容量%,好ましくは10〜30
容量%である。The mixing ratio of the conductive filler with respect to the resin is not particularly limited, but if the mixing amount is too small, the purpose of conductivity is not achieved, and if it is more than necessary, the specific gravity becomes large, and it is disadvantageous in terms of cost. The dispersibility of the filler may be hindered and the filler may protrude to the surface. For this reason, there is a preferable range depending on the purpose of conductivity. That is, 5 to 50% by volume of the resin, preferably 10 to 30%
The capacity is%.
次に本発明の導電性樹脂組成物は樹脂と酸化亜鉛ウイス
カーとからなるが、使用の目的によって、安定剤,分散
助剤,充填剤等の添加剤を単独又は併用して配合しても
よい。又この組成物は例えば粉体,ペレット,ペースト
等の目的に従って好ましい形態とすることが可能であ
る。Next, the conductive resin composition of the present invention comprises a resin and zinc oxide whiskers, but additives such as stabilizers, dispersion aids, and fillers may be added alone or in combination depending on the purpose of use. . Further, this composition can be made into a preferable form according to the purpose such as powder, pellets, paste and the like.
粉体は樹脂とウイスカー、必要によっては添加剤を配合
して回転形あるいは固定形混合機等を使用して混和する
ことにより得られる。ペレットは同様に前記混合機で混
和した後、混練機等により混練した後、造粒装置等によ
り所望の形状に切断することにより得られる。The powder can be obtained by blending a resin and whiskers and, if necessary, an additive and mixing them using a rotary type or fixed type mixer. Similarly, the pellets are obtained by kneading with the above mixer, kneading with a kneader or the like, and then cutting into a desired shape with a granulator or the like.
ペーストは樹脂とウイスカーに少なくとも1種の溶剤又
は低分子量物及び必要により添加剤を配合し分散,混練
する方法によって得ることができる。又上記の如く、必
要によって配合する添加剤には、安定剤としては酸化防
止剤、例えばモノビストリフェノール,芳香族アミンに
代表されるラジカル連鎖禁止剤,メルカプタン,モノジ
ポリサルファイド等の過酸化物分解剤,酸アミド,ヒド
ラジド等の金属不活性剤,フェノール類,スルフィド
類,ホスファイド類等及び紫外線吸収剤、例えばベンゾ
フェノン系,ベンゾトリアゾール系のもの更には難燃
剤、例えば臭素系,燐系の難燃剤,酸化アンチモン等の
難燃助剤等が含まれる。分散助剤としては有機金属塩類
が挙げられ、充填剤としてはカーボンブラック,ホワイ
トカーボン,炭酸カルシウム,クレイ,ケイ酸塩類,タ
ルク,アルミナ水和物,石綿,ガラス繊維等が挙げられ
る。これら配合剤の配合量は特に限定されない。The paste can be obtained by a method in which a resin and whiskers are mixed with at least one solvent or low molecular weight substance and, if necessary, an additive and dispersed and kneaded. Further, as described above, the additives to be added as necessary include antioxidants as stabilizers, for example, monobistriphenol, radical chain inhibitors represented by aromatic amines, mercaptans, peroxide decomposition of monodipolysulfide, etc. Agents, metal deactivators such as acid amides and hydrazides, phenols, sulfides, phosphides and the like and ultraviolet absorbers such as benzophenone-based and benzotriazole-based flame retardants such as bromine-based and phosphorus-based flame retardants , Flame retardant aids such as antimony oxide are included. Examples of the dispersion aid include organic metal salts, and examples of the filler include carbon black, white carbon, calcium carbonate, clay, silicates, talc, alumina hydrate, asbestos, and glass fiber. The compounding amount of these compounding agents is not particularly limited.
又、ペーストに用いられる低分子量物にはジエチレング
リコール,ギ酸等のカルボン酸類,ジエチレングリコー
ル等の二量体化品,トリエチレングリコール等の三量体
化品等があり、又熱可塑性樹脂に配合する可塑剤にはフ
タル酸エステル,フタル酸混基エステル,脂肪族二基塩
酸エステル,グリコールエステル,脂肪酸エステル,リ
ン酸エステル,エポキシ系可塑剤,塩素化パラフィン等
を使用することができる。The low molecular weight substances used in the paste include carboxylic acids such as diethylene glycol and formic acid, dimerized products such as diethylene glycol, trimerized products such as triethylene glycol, and the like. As the agent, phthalic acid ester, phthalic acid mixed group ester, aliphatic digroup hydrochloric acid ester, glycol ester, fatty acid ester, phosphoric acid ester, epoxy plasticizer, chlorinated paraffin and the like can be used.
実 施 例 以下に本発明を実施例により具体的に説明するが、本発
明はこれらの実施例のみに限定されるものではない。Examples The present invention will be specifically described below with reference to examples, but the present invention is not limited to these examples.
実施例1 前記した酸化亜鉛ウイスカー20容量%,ポリプロピレン
樹脂,80容量%となるように採取し、V型回転混合機で
4分間混合した後、異方向二軸押出機で混練,形成して
ペレットを得た。このペレットを240℃でプレス成形し
直径50mm,厚さ3.5mmの円板状試験片を作成した。この試
験片について分散性の目視評価及び比抵抗を超絶縁計で
測定した。その後40℃,100%RH,7日間の耐湿試験を行い
上記と同様に比抵抗を測定した。Example 1 20% by volume of the zinc oxide whiskers, polypropylene resin, and 80% by volume were sampled, mixed for 4 minutes with a V-type rotary mixer, and then kneaded with a bidirectional extruder of different directions to form pellets. Got The pellets were press-molded at 240 ° C to prepare a disc-shaped test piece having a diameter of 50 mm and a thickness of 3.5 mm. With respect to this test piece, the dispersibility was visually evaluated and the specific resistance was measured with a super insulation meter. Thereafter, a humidity resistance test was performed at 40 ° C, 100% RH for 7 days, and the specific resistance was measured in the same manner as above.
測定結果を第1表に示した。The measurement results are shown in Table 1.
実施例2 実施例1と同じ酸化亜鉛ウイスカーにフレーク状銀粉
(20〜40μm粒)を4対1の割合で(容量比)で混合調
整した。導電性フィラー15容量%,実施例1と同じポリ
プロピレン樹脂85容量%となるように採集して、実施例
1と同様にペレットを作成して試験片を得た後、同様に
評価試験を行った。結果は第1表に示した。Example 2 The same zinc oxide whiskers as in Example 1 were mixed with flake-shaped silver powder (20 to 40 μm particles) at a ratio of 4: 1 (volume ratio). The conductive filler was collected so as to be 15% by volume and the same polypropylene resin as 85% by volume as in Example 1, pellets were prepared in the same manner as in Example 1 to obtain a test piece, and then the same evaluation test was performed. . The results are shown in Table 1.
実施例3〜6 樹脂はそれぞれポリブチレンテレフタレート,ABS樹脂,
ポリフェニレンサルファイド,ナイロン66を選択して実
施例1及び2同様にウイスカー及びウイスカー混合フィ
ラーを混合してペレットを得た後に1表に示した成形温
度で試験片を作成した。又同様に評価試験を行った。そ
れぞれの結果を第1表に示した。尚実施例5〜6ではウ
イスカー混合フィラーの種類及び混合比が異なる。これ
は第1表に表記した。Examples 3 to 6 are polybutylene terephthalate, ABS resin, and
Polyphenylene sulfide and nylon 66 were selected, whiskers and whisker mixed fillers were mixed in the same manner as in Examples 1 and 2 to obtain pellets, and then test pieces were prepared at the molding temperatures shown in Table 1. An evaluation test was conducted in the same manner. The respective results are shown in Table 1. In Examples 5 and 6, the type and mixing ratio of the whisker mixed filler are different. This is shown in Table 1.
比較例1〜3 樹脂としてポリプロピレン,導電性フィラーとして金属
フレーク及び粉末を用いて実施例1と同様の方法により
ペレットを得た後、240℃で試験片を作成し、評価試験
を実施例1と同様の方法で行った。結果を第2表に示し
た。Comparative Examples 1 to 3 After using polypropylene as a resin and metal flakes and powders as a conductive filler in the same manner as in Example 1 to obtain pellets, a test piece was prepared at 240 ° C, and an evaluation test was performed as Example 1. The same method was used. The results are shown in Table 2.
実施例7 実施例1と同様の方法にて得られた酸化亜鉛ウイスカー
20容量%とポリメチルメタクリレート80容量%の混合物
100gとトルエン150gを磁性ポットミルに採取し、混合し
てペースト状物とし、これをガラス板状に流延して室温
に2.5時間放置後、150℃で2時間乾燥して30μmの塗膜
を形成し試験片とした。評価試験は実施例1と同様に行
い結果を第3表に示した。Example 7 Zinc oxide whiskers obtained by the same method as in Example 1
Mixture of 20% by volume and 80% by volume of polymethylmethacrylate
100 g of toluene and 150 g of toluene were collected in a magnetic pot mill and mixed to form a paste, which was cast into a glass plate, left to stand at room temperature for 2.5 hours, and then dried at 150 ° C for 2 hours to form a 30 μm coating film. It was used as a test piece. The evaluation test was conducted in the same manner as in Example 1, and the results are shown in Table 3.
比較例5 ニッケル粉末20容量%,ポリメチルメタクリレート80容
量%を実施例7と同様にしてペースト状物,試験片を得
て同じ評価方法を用いた。測定結果を第3表に示した。Comparative Example 5 Nickel powder 20% by volume and polymethylmethacrylate 80% by volume were obtained in the same manner as in Example 7 to obtain a paste-like material and a test piece, and the same evaluation method was used. The measurement results are shown in Table 3.
実施例3〜6の混合フィラー添加量は全て15容量%とし
た。 The amount of the mixed filler added in each of Examples 3 to 6 was 15% by volume.
発明の効果 本発明の導電性樹脂組成物は粉体あるいはペレットにお
いて種々の成形体とすることができる。この成形体は成
形時に樹脂とフィラーとの分離を生じることなく均一な
分散状態となり、殊に酸化亜鉛ウイスカーの効果により
少量添加で導電性も極めて高く、かつ経時変化,耐湿劣
化が少なく、静電破壊防止用材料,帯電防止用材料,電
磁波障害防止用材料,コロナ放電防止用材料等として好
適に使用し得るものである。上記の用途において、圧縮
成形,押出成形,射出成形等の成形法によって成形する
ことができる。又ペーストは導電性被膜用材料、導電性
接着剤等として使用できる。又上記の少量添加による効
果が大なる点から樹脂本来の物性をそこなうことが少な
く、かつ樹脂のみより優れた物性を発見する点もあり、
その利用価値は大なるものである。 EFFECTS OF THE INVENTION The conductive resin composition of the present invention can be formed into various molded bodies in the form of powder or pellets. This molded body is in a uniformly dispersed state without causing separation of resin and filler during molding, and in particular, due to the effect of zinc oxide whiskers, the addition of a small amount makes it extremely high in conductivity, has little deterioration over time and is resistant to moisture resistance, and has an electrostatic property. It can be suitably used as a material for preventing breakage, a material for preventing static electricity, a material for preventing electromagnetic interference, a material for preventing corona discharge, and the like. In the above-mentioned applications, molding can be performed by a molding method such as compression molding, extrusion molding, injection molding or the like. Moreover, the paste can be used as a material for a conductive film, a conductive adhesive, or the like. In addition, from the point that the effect of adding a small amount of the above is great, the physical properties of the resin are rarely impaired, and there is also a point of discovering physical properties superior to the resin alone.
Its utility value is enormous.
第1図はZnOウイスカーの結晶の構造を示す電子顕微鏡
写真、第2図はX線回折図である。FIG. 1 is an electron micrograph showing the structure of a ZnO whisker crystal, and FIG. 2 is an X-ray diffraction pattern.
Claims (1)
り、かつ前記酸化亜鉛ウイスカーは該部とこの該部から
異なる4軸方向に伸びた針状結晶部からなるテトラポッ
ド状構造を有し、前記針状結晶部の径が0.7〜14μmで
あり、前記針状結晶部の基部から先端までの長さが3〜
200μmであることを特徴とする導電性樹脂組成物。1. A resin is blended with zinc oxide whiskers, and said zinc oxide whiskers have a tetrapod-like structure comprising said portion and needle-shaped crystal portions extending in different four-axis directions from this portion, The needle crystal part has a diameter of 0.7 to 14 μm, and the length of the needle crystal part from the base to the tip is 3 to
A conductive resin composition having a thickness of 200 μm.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5189288A JPH0791417B2 (en) | 1988-03-04 | 1988-03-04 | Conductive resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5189288A JPH0791417B2 (en) | 1988-03-04 | 1988-03-04 | Conductive resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01225663A JPH01225663A (en) | 1989-09-08 |
JPH0791417B2 true JPH0791417B2 (en) | 1995-10-04 |
Family
ID=12899534
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5189288A Expired - Fee Related JPH0791417B2 (en) | 1988-03-04 | 1988-03-04 | Conductive resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0791417B2 (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE68918575T2 (en) * | 1988-11-30 | 1995-05-24 | Matsushita Electric Ind Co Ltd | Coating composition containing tetrahedral zinc oxide whiskers. |
JPH03207722A (en) * | 1990-01-10 | 1991-09-11 | Matsushita Electric Ind Co Ltd | Composite reinforcing material |
JPH03289004A (en) * | 1990-04-04 | 1991-12-19 | Matsushita Electric Ind Co Ltd | Conductive resin composite |
JPH05117447A (en) * | 1991-10-31 | 1993-05-14 | Matsushita Electric Ind Co Ltd | Conductive resin composition and container for electronic part |
WO2008084512A1 (en) * | 2006-12-26 | 2008-07-17 | Asahi Kasei E-Materials Corporation | Radiating material and radiating sheet molded from radiating material |
CN103221501B (en) * | 2011-03-29 | 2015-03-25 | 日本瑞翁株式会社 | Heat-conductive, pressure-sensitive adhesive composition, heat-conductive, pressure-sensitive adhesive sheet formed body, method for producing each, and electronic component |
KR101994736B1 (en) * | 2014-07-16 | 2019-07-01 | 삼성전기주식회사 | Paste for electrostatic protection and their manufacturing method |
JP6438701B2 (en) * | 2014-08-18 | 2018-12-19 | パナソニック株式会社 | Heat dissipation rubber composition |
-
1988
- 1988-03-04 JP JP5189288A patent/JPH0791417B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH01225663A (en) | 1989-09-08 |
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