JPH0786326A - Spool case for semiconductor bonding wire - Google Patents

Spool case for semiconductor bonding wire

Info

Publication number
JPH0786326A
JPH0786326A JP5224835A JP22483593A JPH0786326A JP H0786326 A JPH0786326 A JP H0786326A JP 5224835 A JP5224835 A JP 5224835A JP 22483593 A JP22483593 A JP 22483593A JP H0786326 A JPH0786326 A JP H0786326A
Authority
JP
Japan
Prior art keywords
spool
wire
case
lid
container
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5224835A
Other languages
Japanese (ja)
Other versions
JP2985598B2 (en
Inventor
Akira Togashi
亮 富樫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Metal Mining Co Ltd
Original Assignee
Sumitomo Metal Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Mining Co Ltd filed Critical Sumitomo Metal Mining Co Ltd
Priority to JP5224835A priority Critical patent/JP2985598B2/en
Publication of JPH0786326A publication Critical patent/JPH0786326A/en
Application granted granted Critical
Publication of JP2985598B2 publication Critical patent/JP2985598B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H75/00—Storing webs, tapes, or filamentary material, e.g. on reels
    • B65H75/02—Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks
    • B65H75/04—Kinds or types
    • B65H75/08—Kinds or types of circular or polygonal cross-section
    • B65H75/14—Kinds or types of circular or polygonal cross-section with two end flanges
    • B65H75/141—Kinds or types of circular or polygonal cross-section with two end flanges covers therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H49/00—Unwinding or paying-out filamentary material; Supporting, storing or transporting packages from which filamentary material is to be withdrawn or paid-out
    • B65H49/38—Skips, cages, racks, or containers, adapted solely for the transport or storage of bobbins, cops, or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H67/00—Replacing or removing cores, receptacles, or completed packages at paying-out, winding, or depositing stations
    • B65H67/06—Supplying cores, receptacles, or packages to, or transporting from, winding or depositing stations
    • B65H67/064—Supplying or transporting cross-wound packages, also combined with transporting the empty core
    • B65H67/065—Manipulators with gripping or holding means for transferring the packages from one station to another, e.g. from a conveyor to a creel trolley
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2402/00—Constructional details of the handling apparatus
    • B65H2402/40—Details of frames, housings or mountings of the whole handling apparatus
    • B65H2402/41—Portable or hand-held apparatus
    • B65H2402/414—Manual tools for filamentary material, e.g. for mounting or removing a bobbin, measuring tension or splicing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00—Handled material; Storage means
    • B65H2701/30—Handled filamentary material
    • B65H2701/36—Wires
    • B65H2701/361—Semiconductor bonding wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE:To solve the problems that the reliability of fixing the spool of a spool case for storing the spool for semiconductor bonding wire and the damage of wire caused by the contact of the surface of the wire in the step of mounting the case to a wire bonder. CONSTITUTION:A spool holding part 1b is provided, which comprises a container 1 and a lid 2 that engages each other, of which spool 3 is held by at least either of the container 1 or the lid 2 and which can be put on and taken off without touching directly the spool 3.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は、半導体素子製造におけ
るワイヤーボンディングに用いるファインワイヤーが巻
かれたスプールを収納するための、半導体ボンディング
ワイヤー用スプールケースに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor bonding wire spool case for accommodating a spool around which a fine wire used for wire bonding in the manufacture of semiconductor elements is housed.

【０００２】[0002]

【従来の技術】半導体素子上のチップ電極と外部リード
との結線（以下ボンディングという）には直径１０〜５
０μｍ、なかんずく２０〜３０μｍの金、アルミニウム
あるいは銅などの極細のワイヤーが用いられている。こ
のような極細のワイヤーは、スプールへ多層に巻かれ、
スプールケースへ納められており、使用時にはスプール
をケースより手で取り出すのが一般的である。2. Description of the Related Art For connecting a chip electrode on a semiconductor element to an external lead (hereinafter referred to as bonding), a diameter of 10 to 5 is used.
An ultrafine wire of 0 μm, especially 20 to 30 μm of gold, aluminum or copper is used. Such a fine wire is wound in multiple layers on the spool,
It is stored in a spool case, and it is common to take out the spool from the case by hand when using.

【０００３】近年半導体素子の集積度が向上するにした
がって、半導体素子１個当りのボンディング数が増大
し、その上、ワイヤーボンダーの高速化が計られるよう
になってきた。その結果、ボンディングワイヤーが巻か
れたスプールの取り替え頻度が多くなり、スプールホル
ダーへの取り付け作業時間の短縮を目的に、ワイヤーも
多層に巻き付けた製品を使用するようになってきてい
る。As the degree of integration of semiconductor elements has increased in recent years, the number of bondings per semiconductor element has increased, and in addition, the speed of the wire bonder has been increased. As a result, the spool around which the bonding wire is wound is frequently replaced, and a product in which the wire is wound in multiple layers has been used for the purpose of shortening the work time for mounting the spool holder.

【０００４】ワイヤー製造メーカーの出荷後から半導体
素子製造メーカーが使用するまでの間に、ワイヤー表面
にわずかな接触があっても、ワイヤーが折れ曲がった
り、傷ついたり、汚れたりする。これらの異常は半導体
素子の生産性を低下させたり、素子の信頼性に大きく影
響を及ぼすものである。Even after a slight contact with the surface of the wire between the shipment of the wire manufacturer and the use of the semiconductor element manufacturer, the wire may be bent, damaged or soiled. These abnormalities reduce the productivity of semiconductor devices and greatly affect the reliability of the devices.

【０００５】したがって、従来から、スプールケースと
しては、輸送中もスプールがケース内でしっかりと固定
され、また開封時には容易に取り出せるような構造のも
のが使用されてきた。特に、成形により作られた安価な
プラスチック製のスプールケースが主に用いられるよう
になっている。Therefore, conventionally, a spool case has been used in which the spool is firmly fixed in the case during transportation and can be easily taken out when opened. In particular, an inexpensive plastic spool case made by molding is mainly used.

【０００６】[0006]

【発明が解決しようとする課題】しかしながら、スプー
ルをワイヤーボンダーへ装着するためにはスプールを手
で持たねばならないため、スプールケースからの取り出
しを容易にしたとしても取り出したあとの装着するまで
の間にワイヤー表面への何らかの接触の危険は解消され
なかった。そこで、スプールケースに入れたままスプー
ルに手を触れることなくスプールをワイヤーボンダーへ
装着できる機能をスプールケースに具備したものを検討
したが、形状が従来よりも大きくなったり、重くなった
り、またコスト高になったりという問題があり、これら
を解消するスプールケースが強く望まれていた。However, in order to attach the spool to the wire bonder, the spool must be held by hand, so even if the spool is easily taken out from the spool case, the spool is not removed until it is attached. The risk of any contact with the wire surface has not been eliminated. Therefore, we examined a spool case with a function that allows you to attach the spool to the wire bonder without touching the spool while keeping it in the spool case, but the shape is larger or heavier than before, and the cost is also higher. There is a problem of becoming expensive, and a spool case that solves these problems has been strongly desired.

【０００７】本発明は、従来から用いられているスプー
ルケースのスプール固定の確実性の問題、および、ワイ
ヤーボンダーへの装着作業時におけるワイヤー表面への
何らかの接触によるワイヤーの損傷といった問題を解決
することを目的とする。The present invention solves the problem of reliability of spool fixing of a spool case which has been conventionally used, and the problem of damage to the wire due to some contact with the wire surface during mounting work on the wire bonder. With the goal.

【０００８】[0008]

【課題を解決するための手段】上記課題を解決するため
に、本発明は、ボンディングワイヤーが巻かれたスプー
ルを収納するケースであって、相互に嵌合する容器と蓋
とから構成され、容器及び蓋のうち少くとも一方に、ス
プールを保持するとともにスプールに直接手を触れるこ
となく着脱できるスプール保持部を備えていることを特
徴とする半導体ボンディングワイヤー用スプールケース
にある。In order to solve the above-mentioned problems, the present invention is a case for accommodating a spool around which a bonding wire is wound, which is composed of a container and a lid which are fitted to each other. The spool case for a semiconductor bonding wire is characterized in that at least one of the lid and the lid is provided with a spool holding portion that holds the spool and can be attached / detached without directly touching the spool.

【０００９】また上記のスプール保持部が、容器または
蓋の一体成形により形成されていることを特徴とする。Further, the spool holding portion is formed by integrally molding a container or a lid.

【００１０】[0010]

【作用】本発明の半導体ボンディングワイヤー用スプー
ルケースによれば、容器または蓋にスプールを保持する
とともにスプールに直接手を触れることなく着脱できる
スプール保持部を設けたので、スプールを直接手で持つ
必要が無くなり、取扱いミスなどによるワイヤー損傷の
危険が低下する。また、容器または蓋の周辺部を長く形
成しておけば、スプール上のワイヤーはワイヤーボンダ
ー装着終了まで保護される。したがって、ワイヤー損傷
によるボンディング時のトラブルが回避される。According to the spool case for a semiconductor bonding wire of the present invention, since the spool is held in the container or the lid and the spool holding portion can be attached and detached without directly touching the spool, it is necessary to directly hold the spool by hand. And the risk of wire damage due to mishandling is reduced. Further, if the peripheral portion of the container or the lid is formed long, the wire on the spool is protected until the wire bonder is attached. Therefore, the trouble at the time of bonding due to the wire damage can be avoided.

【００１１】[0011]

【実施例】次に、本発明の実施例を図面を参照して説明
する。図１は本発明の一実施例の正面図、図２は図１の
Ｘ−Ｘ断面図である。図３はスプールをワイヤーボンダ
ーに装着するときの概念図である。図４は本発明の他の
実施例を示す断面図である。Embodiments of the present invention will now be described with reference to the drawings. 1 is a front view of an embodiment of the present invention, and FIG. 2 is a sectional view taken along line XX of FIG. FIG. 3 is a conceptual diagram when the spool is attached to the wire bonder. FIG. 4 is a sectional view showing another embodiment of the present invention.

【００１２】スプールケースはプラスチック材を使用し
て熱成形等により成型された容器１およびそれと嵌合す
る蓋２とからなっていて、本実施例においては、容器１
には１ａおよび１ｂが、蓋２には２ａおよび２ｂがスプ
ール保持部として設けられている。３はスプールであ
り、外周にワイヤー４が巻かれ、スプール保持部１ａ，
１ｂ，２ａ，２ｂによって保持されている。なお、スプ
ール保持部は図１に示されるように上下に二分割されて
おり、後記するように、上下の間隔をせばめるように力
を加えれば、弾力的に上下巾がせばまって、スプール３
との間が離れるように形成されている。また、５はスプ
ールホルダーであり、ワイヤーボンディング作業のため
のものである。The spool case comprises a container 1 molded by thermoforming or the like using a plastic material and a lid 2 fitted with the container 1. In this embodiment, the container 1
2a and 2b are provided as spool holding portions on the lid 2 and 1a and 1b, respectively. 3 is a spool, the wire 4 is wound around the outer periphery, spool holding portion 1a,
It is held by 1b, 2a and 2b. As shown in FIG. 1, the spool holding portion is vertically divided into two parts. As will be described later, if a force is applied so that the upper and lower intervals are narrowed, the vertical width is elastically narrowed, Spool 3
It is formed so that it is separated from. Further, 5 is a spool holder for wire bonding work.

【００１３】スプールケースを開封する際には例えば左
右の人差し指と親指をそれぞれ２ａ，２ｂおよび１ａ，
１ｂに挿入する。次に、２ａ，２ｂの指を外側へ向けて
スプール保持部を開く様に持ち、蓋２のスプール保持機
能でスプールをしっかりと保持する。さらに、１ａ，１
ｂの指を内側に向けてスプール保持部を閉じる様に持ち
スプールを解放する。この状態で蓋２と容器１をそれぞ
れ左右に離せばスプールケースは容易に開封できるた
め、スプールケース開封作業時のワイヤーの損傷を防止
できる。When opening the spool case, for example, the left and right forefinger and thumb are respectively set to 2a, 2b and 1a,
Insert into 1b. Next, the fingers of 2a and 2b are directed outward so that the spool holding portion is opened, and the spool holding function of the lid 2 holds the spool firmly. Furthermore, 1a, 1
Hold the spool holding part with the finger of b facing inward and release the spool. In this state, the spool case can be easily opened by separating the lid 2 and the container 1 to the left and right, so that the wire can be prevented from being damaged when the spool case is opened.

【００１４】またスプールをワイヤーボンダーへ装着す
るには例えば図３に示す様に蓋２でスプールを持ったま
まワイヤーボンダーのスプールホルダー５へスプールを
装着する。装着後に２ａ，２ｂの指を内側に向けてスプ
ール保持部を閉じるようにしてスプールを解放し、蓋２
のみを容易に引き出して作業は終了する。この場合には
スプール３に巻かれたワイヤー４は装着作業終了まで蓋
２で保護されるため、ワイヤーの損傷を防止できる。To attach the spool to the wire bonder, for example, as shown in FIG. 3, the spool is attached to the spool holder 5 of the wire bonder while holding the spool with the lid 2. After mounting, the fingers of 2a and 2b are directed inward to close the spool holding portion to release the spool, and the lid 2
The work is completed by simply pulling out only. In this case, since the wire 4 wound around the spool 3 is protected by the lid 2 until the mounting work is completed, damage to the wire can be prevented.

【００１５】また、図３に示す例では、蓋２によって、
スプールホルダー５への装着作業を行なっているが、図
４に示すように、容器１の外周縁部を蓋２中に深く挿入
するように長く形成しておけば、蓋２ではなく容器１の
スプール保持部１ａ，１ｂによってスプール３を保持し
て、スプールホルダー５へ装着することができる。そし
て、その場合も、ワイヤーの損傷が防止できるのは同様
である。すなわち、スプール保持部は容器および蓋のい
ずれか一方に備わっていれば、本発明の目的を達し得
る。Further, in the example shown in FIG.
Although the work of mounting on the spool holder 5 is being performed, as shown in FIG. 4, if the outer peripheral edge portion of the container 1 is formed long so as to be deeply inserted into the lid 2, the container 1 is not the lid 2. The spool 3 can be held by the spool holding portions 1a and 1b and mounted on the spool holder 5. And, even in that case, the damage of the wire can be similarly prevented. In other words, the object of the present invention can be achieved if the spool holding portion is provided in either the container or the lid.

【００１６】[0016]

【発明の効果】以上の通り、本発明の半導体ボンディン
グワイヤー用スプールケースを使用すればスプールケー
スの開封作業およびワイヤーボンダーへのスプール装着
作業のいずれにおいてもワイヤーの損傷を防止すること
ができるため、ワイヤー損傷によるボンディング時のト
ラブルが回避され、半導体素子の生産性向上に大いに寄
与する。また、スプール保持部を容器または蓋の一体成
形により形成した場合には重量が軽くなるために取扱い
易くなることや、製造コストも極めて安価となるなど、
大きな効果が認められる。As described above, when the semiconductor bonding wire spool case of the present invention is used, it is possible to prevent the wire from being damaged in both the opening operation of the spool case and the mounting operation of the spool to the wire bonder. Trouble at the time of bonding due to wire damage is avoided, which greatly contributes to the improvement of the productivity of semiconductor devices. Further, when the spool holding portion is formed by integrally molding the container or the lid, the weight is light and thus easy to handle, and the manufacturing cost is extremely low.
A big effect is recognized.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明の一実施例の正面図である。FIG. 1 is a front view of an embodiment of the present invention.

【図２】図１のＸ−Ｘ断面図である。FIG. 2 is a sectional view taken along line XX of FIG.

【図３】スプールをワイヤーボンダーに装着するときの
概念図である。FIG. 3 is a conceptual diagram when the spool is attached to the wire bonder.

【図４】本発明の他の実施例を示す断面図である。FIG. 4 is a sectional view showing another embodiment of the present invention.

【符号の説明】[Explanation of symbols]

１ 容器 １ａ スプール保持部 １ｂ スプール保持部 ２ 蓋 ２ａ スプール保持部 ２ｂ スプール保持部 ３ スプール ４ ワイヤー ５ スプールホルダー 1 Container 1a Spool holding part 1b Spool holding part 2 Lid 2a Spool holding part 2b Spool holding part 3 Spool 4 Wire 5 Spool holder

─────────────────────────────────────────────────────
─────────────────────────────────────────────────── ───

【手続補正書】[Procedure amendment]

【提出日】平成５年９月２７日[Submission date] September 27, 1993

【手続補正１】[Procedure Amendment 1]

【補正対象書類名】図面[Document name to be corrected] Drawing

【補正対象項目名】全図[Correction target item name] All drawings

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【図１】 [Figure 1]

【図２】 [Fig. 2]

【図３】 [Figure 3]

【図４】 [Figure 4]

Claims (2)

【特許請求の範囲】[Claims] 【請求項１】 ボンディングワイヤーが巻かれたスプー
ルを収納するケースであって、相互に嵌合する容器と蓋
とから構成され、容器及び蓋のうち少くとも一方に、ス
プールを保持するとともにスプールに直接手を触れるこ
となく着脱できるスプール保持部を備えていることを特
徴とする半導体ボンディングワイヤー用スプールケー
ス。1. A case for accommodating a spool around which a bonding wire is wound, which comprises a container and a lid which are fitted to each other, wherein the spool is held in at least one of the container and the lid and is attached to the spool. A spool case for a semiconductor bonding wire, which is equipped with a spool holding portion that can be attached and detached without directly touching it. 【請求項２】 請求項１記載のスプール保持部が、容器
または蓋の一体成形により形成されていることを特徴と
する半導体ボンディングワイヤー用スプールケース。2. A spool case for a semiconductor bonding wire, wherein the spool holding portion according to claim 1 is formed by integrally molding a container or a lid.
JP5224835A 1993-09-10 1993-09-10 Spool case for semiconductor bonding wire Expired - Fee Related JP2985598B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5224835A JP2985598B2 (en) 1993-09-10 1993-09-10 Spool case for semiconductor bonding wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5224835A JP2985598B2 (en) 1993-09-10 1993-09-10 Spool case for semiconductor bonding wire

Publications (2)

Publication Number Publication Date
JPH0786326A true JPH0786326A (en) 1995-03-31
JP2985598B2 JP2985598B2 (en) 1999-12-06

Family

ID=16819931

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5224835A Expired - Fee Related JP2985598B2 (en) 1993-09-10 1993-09-10 Spool case for semiconductor bonding wire

Country Status (1)

Country Link
JP (1) JP2985598B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0896363A2 (en) * 1997-08-08 1999-02-10 Tanaka Denshi Kogyo Kabushiki Kaisha Spool case of bonding wire
US6241094B1 (en) 1997-08-08 2001-06-05 Tanaka Denshi Kogyo Kabushiki Kaisha Spool case of bonding wire
SG114577A1 (en) * 2001-10-31 2005-09-28 Heraeus Gmbh W C Spool case for bonding wire, and method of handling spool using same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0896363A2 (en) * 1997-08-08 1999-02-10 Tanaka Denshi Kogyo Kabushiki Kaisha Spool case of bonding wire
EP0896363A3 (en) * 1997-08-08 2000-04-26 Tanaka Denshi Kogyo Kabushiki Kaisha Spool case of bonding wire
US6241094B1 (en) 1997-08-08 2001-06-05 Tanaka Denshi Kogyo Kabushiki Kaisha Spool case of bonding wire
SG114577A1 (en) * 2001-10-31 2005-09-28 Heraeus Gmbh W C Spool case for bonding wire, and method of handling spool using same

Also Published As

Publication number Publication date
JP2985598B2 (en) 1999-12-06

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