JP3552352B2 - Bonding wire spool - Google Patents

Bonding wire spool Download PDF

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Publication number
JP3552352B2
JP3552352B2 JP20388095A JP20388095A JP3552352B2 JP 3552352 B2 JP3552352 B2 JP 3552352B2 JP 20388095 A JP20388095 A JP 20388095A JP 20388095 A JP20388095 A JP 20388095A JP 3552352 B2 JP3552352 B2 JP 3552352B2
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Prior art keywords
spool
bonding wire
case
bonding
wire
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JPH0936163A (en
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敏幸 久保
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Sumitomo Metal Mining Co Ltd
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Sumitomo Metal Mining Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45015—Cross-sectional shape being circular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【０００１】
【発明の属する技術分野】
本発明は、例えば半導体素子のチップ電極と外部リードとを接続する場合などに用いられるボンディングワイヤを巻き付けるためのスプールに関する。
【０００２】
【従来の技術】
従来、例えば半導体素子のチップ電極と外部リードとを接続するためのボンディングワイヤＷは、一般に直径０．０１〜０．１ｍｍ程度の金線等が用いられ、図４に示すような両端部にフランジ部１１・１２を有するスプール１の筒部１０に巻に付けた状態で使用される。なお、１つのスプールに巻付けるワイヤの長さは、一般に５００〜２０００ｍ程度である。
【０００３】
この場合、ワイヤ表面にごみ等が付着すると、ボンディング不良等の原因となるため、クリーンルーム等でスプール１にボンディングワイヤＷを巻付けると共に、そのワイヤＷを巻付けたスプール１を図４に示すような合成樹脂等からなる略キャップ状のスプールケース２で覆い、そのケース２の下部に底蓋３を嵌めて密閉した状態で運搬・保管等している。図中、３０はスプールケース２の下部開口縁部に嵌合する短筒部、２１・３１は上記スプールケース２および底蓋３の内面に一体的に形成した凸部で、その凸部２１・３１を上記密閉時にスプール１の筒部１０内に嵌合することによってスプール１が位置決め固定される。
【０００４】
そして、上記のようにスプールケース２および底蓋３等で密閉収容したスプール１をボンディング機（ワイヤボンダ）に装着する際には、底蓋３を持ってスプールケース２を取外した後、スプール１の筒部１０に巻かれているボンディングワイヤＷに指等が触れないように注意しながら図４に示すように一方のフランジ部１１等を指等で摘んで底蓋３からスプール１を取出し、図に省略したボンディング機の所定の位置にセットするものである。
【０００５】
【発明が解決しようとする課題】
ところが最近、高速の自動ボンディング機の開発に伴いボンディング速度が速くなり、しかも１つの半導体素子当たりのワイヤ使用量が増加する傾向にあり、従来の巻き量ではスプール交換頻度が高く、ボンディング作業の能率および作業性が低下する原因となっている。
【０００６】
そのため、スプール１へのワイヤＷの巻き量を増加させることが望まれており、それには、スプール１の筒部の径を大きくするか、あるいは筒部の長さを長くすればよいが、そのようにすると、既存のボンディング機への装着が困難になる等の不都合がある。
【０００７】
そこで、従来はスプール１の大きさ形状を変更することなく、ボンディングワイヤＷの巻き量を増加させているが、スプール１に巻き付けたボンディングワイヤＷの厚さ、すなわち外径寸法が大きくなり、そのスプール１をスプールケース２や底蓋３から取り出す際、あるいはボンディング機に装着する際に、往々にしてワイヤに指等が触れるおそれがあった。
【０００８】
上記のようにワイヤＷに指等が触れると、ワイヤが変形したり、あるいは汚れてしまうため、ボンディングに使用できない。また指等が接触した部分は取り除けばよいが、その除去作業はワイヤが細いため困難であり、しかも時間が掛かる等の問題がある。
【０００９】
本発明は上記の問題点に鑑みて提案されたもので、ボンディングワイヤの巻き量を増大させてもワイヤに指等が接触するおそれが少なく、しかもボンディング作業を迅速かつ良好に行うことのできるボンディングワイヤ用スプールを提供することを目的とする。
【００１０】
【課題を解決するための手段】
上記の目的を達成するために本発明によるボンディングワイヤ用スプールは、以下の構成としたものである。即ち、ボンディングワイヤを巻き付ける筒部と、その筒部の両端部にフランジ部を有するボンディングワイヤ用スプールにおいて、上記両フランジ部の一方のフランジ部における筒部と反対側に、外方に突出する把持部を一体的に設け、前記一方のフランジ部の周面に、略キャップ状のスプールケースの下部開口縁部を嵌合保持させる構成とし、上記フランジ部および前記把持部を上記スプールケースの下部開口部を塞ぐ底蓋に兼用したことを特徴とする。
【００１１】
上記のように構成されたスプールをスプールケース等から取り出したり、あるいはボンディング機に装着する際には、上記の把持部を指等で摘んで取り扱うことができ、その際、上記の把持部は一方のフランジ部の筒部と反対側において外方に突出させて設けられているので、スプールに巻付けたボンディングワイヤに不用意に指等が触れるのを可及的に低減することが可能となる。
【００１２】
また、上記スプールに前記のような略キャップ状のスプールケースを被せる場合、そのスプールケースの下部開口縁部を上記フランジ部の周面に嵌合保持させる構成とし、そのフランジ部および前記把持部をスプールケースの下部開口部を塞ぐ底蓋に兼用させるようにしたことにより、前記従来の底蓋を省略することができる。
【００１３】
【発明の実施の形態】
図１は本発明によるボンディングワイヤ用スプールの一実施形態を示す分解正面図であり、前記従来例と同様の機能を有する部材には同一の符号を付して説明する。
【００１４】
本実施形態は筒部１０とフランジ部１１・１２とからなるスプール１の一方のフランジ部１２の上記筒部１０と反対側に、該フランジ部１２と一体に把持部１３を設けると共に、上記フランジ部１２の外周面にスプールケース２の下部開口縁部を嵌合保持させるようにしたものである。
【００１５】
上記の把持部１３は、フランジ部１２よりも大径の円板状に形成され、スプール１をスプールケース２から取り出す際、もしくはボンディング機に装着する際には、図１の鎖線示のように上記把持部１３の周縁部を指Ｆ等で摘むことによって、スプール１に巻き付けたボンディングワイヤＷに不用意に指等が触れるのを防ぐことができる。
【００１６】
また上記のようにフランジ部１２の外周面にスプールケース２の下部開口縁部を嵌合保持させるようにしたことよって、スプール１に巻き付けたボンディングワイヤＷにごみ等が付着するのを防止できると共に、上記フランジ部１２および前記把持部１３がスプールケース２の下部開口部を塞ぐ底蓋としての機能を兼ね、前記従来の底蓋３を省略することができる。
【００１７】
なお上記フランジ部１２とスプールケース２との嵌合部には、必要に応じて抜け止め係止手段を設けてもよい。図２はその一例を示すもので、同図（ａ）はフランジ部１２とスプールケース２との嵌合部に互いに係合する凹凸部４を形成した例、同図（ｂ）はフランジ部１２の外周面の把持部１３との境界部に凹部５を形成し、それに係合する内向きの凸部６をスプールケース２下端部に形成した例である。上記の凹凸部４および凹部５と凸部６は、フランジ部１２およびスプールケース２の円周方向全長に設けるか、あるいは一部にのみ設けてもよい。また上記フランジ部１２とスプールケース２とを、ねじ結合させることもできる。
【００１８】
さらに前記の実施形態では、把持部１３をフランジ部１２の外側に該フランジ部１２よりも大径の円板状に形成したが、例えば図３に示すようにフランジ部１２を下方に長く形成し、そのフランジ部１２の下部を把持部１３とすると共に、フランジ部１２の上部をスプールケース２の嵌合部としてもよい。この場合、上記フランジ部を長くした分だけスプール１の長さが長くなるが、スプールの長さに制約を受けないボンディング機にあっては適用可能である。
【００１９】
【発明の効果】
以上説明したように本発明は、ボンディングワイヤＷを巻き付ける筒部１０と、その筒部の両端部にフランジ部１１・１２を有するボンディングワイヤ用スプール１において、上記両フランジ部の一方のフランジ部１２における筒部１０と反対側に、外方に突出する把持部１３を一体的に設けたから、ボンディングワイヤＷを巻き付けたスプール１をスプールケース２から取り出したり、ボンディング機に装着する際には、上記把持部１３を指等で摘むことによって、上記筒部１０へのボンディングワイヤＷの巻付け量を増大させた場合にも該ワイヤに不用意に指等が接触するのを可及的に低減させることができると共に、上記のようにボンディングワイヤＷの巻付け量を増大させることで、ボンディング機に装着したスプールの交換頻度が少なくて済み、ボンディング作業の能率や作業性を大幅に向上させることができる等の効果がある。
【図面の簡単な説明】
【図１】本発明によるボンディングワイヤ用スプールの一実施形態の分解正面図。
【図２】（ａ）・（ｂ）はスプールケースの抜け止め係止手段の構成例の説明図。
【図３】把持部の他の構成例を示す要部の縦断面図。
【図４】従来のボンディングワイヤ用スプールの一例を示す分解正面図。
【符号の説明】
１ スプール
１０ 筒部
１１、１２ フランジ部
２ スプールケース
３ 底蓋[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a spool for winding a bonding wire used for connecting, for example, a chip electrode of a semiconductor element and an external lead.
[0002]
[Prior art]
Conventionally, for example, a bonding wire W for connecting a chip electrode of a semiconductor element and an external lead is generally a gold wire having a diameter of about 0.01 to 0.1 mm, and flanges at both ends as shown in FIG. It is used in a state of being wound around the cylindrical portion 10 of the spool 1 having the portions 11 and 12. The length of a wire wound around one spool is generally about 500 to 2000 m.
[0003]
In this case, if dust or the like adheres to the surface of the wire, it causes a bonding failure or the like. Therefore, the bonding wire W is wound around the spool 1 in a clean room or the like. It is covered with a substantially cap-shaped spool case 2 made of a synthetic resin or the like, and is transported and stored in a sealed state with a bottom lid 3 fitted under the case 2. In the figure, reference numeral 30 denotes a short cylindrical portion fitted to the lower opening edge of the spool case 2, and 21 and 31 are convex portions formed integrally on the inner surfaces of the spool case 2 and the bottom lid 3. The spool 1 is positioned and fixed by fitting 31 into the cylindrical portion 10 of the spool 1 at the time of sealing.
[0004]
When mounting the spool 1 hermetically sealed with the spool case 2 and the bottom lid 3 as described above to the bonding machine (wire bonder), after removing the spool case 2 with the bottom lid 3, While taking care not to touch the bonding wire W wound around the cylindrical portion 10 with a finger or the like, as shown in FIG. 4, the one flange portion 11 or the like is picked with a finger or the like, and the spool 1 is taken out from the bottom lid 3. Is set at a predetermined position of the bonding machine omitted.
[0005]
[Problems to be solved by the invention]
However, recently, with the development of high-speed automatic bonding machines, the bonding speed has increased and the amount of wire used per semiconductor element tends to increase. With the conventional winding amount, the spool replacement frequency is high, and the efficiency of the bonding work is increased. In addition, workability is reduced.
[0006]
For this reason, it is desired to increase the winding amount of the wire W around the spool 1, and for that purpose, the diameter of the cylindrical portion of the spool 1 may be increased or the length of the cylindrical portion may be increased. In this case, there is a disadvantage that it is difficult to attach to an existing bonding machine.
[0007]
Therefore, conventionally, the winding amount of the bonding wire W is increased without changing the size and shape of the spool 1, but the thickness of the bonding wire W wound around the spool 1, that is, the outer diameter dimension is increased. When the spool 1 is taken out from the spool case 2 or the bottom lid 3 or attached to the bonding machine, there is often a risk that a finger or the like touches the wire.
[0008]
When a finger or the like touches the wire W as described above, the wire is deformed or dirty, and thus cannot be used for bonding. Further, it is only necessary to remove the part touched by a finger or the like, but the removal work is difficult because the wire is thin, and there is a problem that it takes time.
[0009]
The present invention has been proposed in view of the above-described problems, and there is little risk that a finger or the like will come into contact with the wire even if the winding amount of the bonding wire is increased, and the bonding operation can be performed quickly and satisfactorily. An object is to provide a wire spool.
[0010]
[Means for Solving the Problems]
In order to achieve the above object, a bonding wire spool according to the present invention has the following configuration. That is, in a tubular portion for winding a bonding wire and a bonding wire spool having flange portions at both ends of the tubular portion, a grip protruding outwardly on the opposite side to the tubular portion of one flange portion of both the flange portions. And the flange portion and the gripping portion are opened at the lower opening of the spool case. It is also used as a bottom lid to close the part .
[0011]
When the spool configured as described above is taken out from the spool case or attached to the bonding machine, the gripping portion can be picked and handled with a finger or the like. Since it is provided to project outward on the opposite side of the cylindrical portion of the flange portion, it is possible to reduce as much as possible that a finger etc. touches the bonding wire wound around the spool as much as possible. .
[0012]
Further , when the above-mentioned spool is covered with the substantially cap-shaped spool case, the lower opening edge of the spool case is fitted and held on the peripheral surface of the flange portion, and the flange portion and the grip portion are by that so as to alternate in the bottom lid for closing the lower opening of the spool case, it is possible to omit the conventional bottom lid.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1 is an exploded front view showing an embodiment of a bonding wire spool according to the present invention. Members having the same functions as those in the conventional example will be described with the same reference numerals.
[0014]
In the present embodiment, a grip portion 13 is provided integrally with the flange portion 12 on the opposite side of the one flange portion 12 of the spool 1 including the cylinder portion 10 and the flange portions 11 and 12 to the flange portion 12, and the flange The lower opening edge of the spool case 2 is fitted and held on the outer peripheral surface of the portion 12.
[0015]
The grip portion 13 is formed in a disk shape having a diameter larger than that of the flange portion 12, and when the spool 1 is taken out from the spool case 2 or attached to the bonding machine, as shown by a chain line in FIG. By gripping the peripheral edge of the grip portion 13 with a finger F or the like, it is possible to prevent the finger or the like from inadvertently touching the bonding wire W wound around the spool 1.
[0016]
In addition, since the lower opening edge of the spool case 2 is fitted and held on the outer peripheral surface of the flange portion 12 as described above, dust and the like can be prevented from adhering to the bonding wire W wound around the spool 1. The flange portion 12 and the grip portion 13 also serve as a bottom lid that closes the lower opening of the spool case 2, and the conventional bottom lid 3 can be omitted.
[0017]
The fitting portion between the flange portion 12 and the spool case 2 may be provided with a retaining locking means if necessary. FIG. 2 shows an example thereof. FIG. 2A shows an example in which concave and convex portions 4 that engage with each other are formed in the fitting portion between the flange portion 12 and the spool case 2, and FIG. This is an example in which a concave portion 5 is formed at a boundary portion between the outer peripheral surface and the grip portion 13 and an inward convex portion 6 that engages with the concave portion 5 is formed at the lower end portion of the spool case 2. The concave / convex portion 4 and the concave portion 5 and the convex portion 6 may be provided on the entire length in the circumferential direction of the flange portion 12 and the spool case 2, or may be provided only on a part thereof. Further, the flange portion 12 and the spool case 2 can be screwed together.
[0018]
Furthermore, in the above-described embodiment, the grip portion 13 is formed on the outer side of the flange portion 12 in a disk shape having a larger diameter than the flange portion 12, but the flange portion 12 is formed to be long downward as shown in FIG. The lower portion of the flange portion 12 may be the grip portion 13 and the upper portion of the flange portion 12 may be the fitting portion of the spool case 2. In this case, the length of the spool 1 is increased by the length of the flange portion, but the present invention is applicable to a bonding machine that is not limited by the length of the spool.
[0019]
【The invention's effect】
As described above, according to the present invention, in the bonding wire spool 1 having the cylindrical portion 10 around which the bonding wire W is wound and the flange portions 11 and 12 at both ends of the cylindrical portion, one flange portion 12 of the both flange portions is provided. Since the gripping portion 13 projecting outward is integrally provided on the opposite side to the cylindrical portion 10 in the above, when the spool 1 around which the bonding wire W is wound is taken out from the spool case 2 or mounted on the bonding machine, By gripping the gripping part 13 with a finger or the like, even when the amount of the bonding wire W wound around the cylindrical part 10 is increased, it is possible to reduce as much as possible the finger or the like inadvertently contacting the wire. In addition to increasing the winding amount of the bonding wire W as described above, the frequency of replacing the spool mounted on the bonding machine can be reduced. Without it finished, there are effects such as the efficiency and workability of the bonding work can be greatly improved.
[Brief description of the drawings]
FIG. 1 is an exploded front view of an embodiment of a bonding wire spool according to the present invention.
FIGS. 2A and 2B are explanatory views of a configuration example of a spool case retaining prevention means. FIG.
FIG. 3 is a longitudinal sectional view of a main part showing another configuration example of a gripping part.
FIG. 4 is an exploded front view showing an example of a conventional bonding wire spool.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Spool 10 Tube part 11, 12 Flange part 2 Spool case 3 Bottom cover

Claims (1)

ボンディングワイヤを巻き付ける筒部と、その筒部の両端部にフランジ部を有するボンディングワイヤ用スプールにおいて、上記両フランジ部の一方のフランジ部における筒部と反対側に、外方に突出する把持部を一体的に設け、前記一方のフランジ部の周面に、略キャップ状のスプールケースの下部開口縁部を嵌合保持させる構成とし、上記フランジ部および前記把持部を上記スプールケースの下部開口部を塞ぐ底蓋に兼用したことを特徴とするボンディングワイヤ用スプール。In a tubular portion around which a bonding wire is wound, and a bonding wire spool having flange portions at both ends of the tubular portion, a gripping portion projecting outward is provided on the opposite side to the tubular portion of one of the flange portions. The lower opening edge portion of the substantially cap-shaped spool case is fitted and held on the peripheral surface of the one flange portion, and the flange portion and the gripping portion are connected to the lower opening portion of the spool case. A bonding wire spool that is also used as a bottom lid for closing .
JP20388095A 1995-07-18 1995-07-18 Bonding wire spool Expired - Fee Related JP3552352B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20388095A JP3552352B2 (en) 1995-07-18 1995-07-18 Bonding wire spool

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20388095A JP3552352B2 (en) 1995-07-18 1995-07-18 Bonding wire spool

Publications (2)

Publication Number Publication Date
JPH0936163A JPH0936163A (en) 1997-02-07
JP3552352B2 true JP3552352B2 (en) 2004-08-11

Family

ID=16481254

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20388095A Expired - Fee Related JP3552352B2 (en) 1995-07-18 1995-07-18 Bonding wire spool

Country Status (1)

Country Link
JP (1) JP3552352B2 (en)

Also Published As

Publication number Publication date
JPH0936163A (en) 1997-02-07

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