JPH0752162B2 - X-ray tomography system - Google Patents
X-ray tomography systemInfo
- Publication number
- JPH0752162B2 JPH0752162B2 JP62042535A JP4253587A JPH0752162B2 JP H0752162 B2 JPH0752162 B2 JP H0752162B2 JP 62042535 A JP62042535 A JP 62042535A JP 4253587 A JP4253587 A JP 4253587A JP H0752162 B2 JPH0752162 B2 JP H0752162B2
- Authority
- JP
- Japan
- Prior art keywords
- image
- ray
- sample
- tomography apparatus
- rays
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000003325 tomography Methods 0.000 title claims description 11
- 238000001514 detection method Methods 0.000 claims description 18
- 238000006243 chemical reaction Methods 0.000 claims description 10
- 230000005540 biological transmission Effects 0.000 claims description 8
- 230000001678 irradiating effect Effects 0.000 claims description 3
- 238000007689 inspection Methods 0.000 description 28
- 230000006870 function Effects 0.000 description 15
- 238000010586 diagram Methods 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 7
- 230000003287 optical effect Effects 0.000 description 5
- 230000007547 defect Effects 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 238000005315 distribution function Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000003321 amplification Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、Ｘ線による断層撮影技術に関し、特に工業用
部品の微細な欠陥検査、より具体的には電子回路基板の
はんだ付け部分の欠陥検査に最適なＸ線断層撮影装置に
関するものである。Description: TECHNICAL FIELD The present invention relates to X-ray tomography technology, and particularly to fine defect inspection of industrial parts, and more specifically, defects in soldered portions of electronic circuit boards. The present invention relates to an X-ray tomography apparatus most suitable for inspection.
従来の工業用CT装置には、「産業用Ｘ線CTスキャナとそ
の適用」計装,P48〜51,Vol27,No.2,中村著に記載されて
いるものがある。これは、検査対象に比べて比較的大き
なＸ線源と、キセノン（Xe）ガスを封入してなるＸ線検
出器であって単位チャンネル当たりの幅が１〜2mmで、
多数個（300〜500チャンネル）の集合体からなるものを
用いている。そしてＸ線源から扇状に放射されるＸ線を
検査対象に照射しながら、検査対象を自転させて、検査
対象の全周方向から透過するＸ線強度を検出し、この検
出データを用いて検査対象の断面像を再構成している。Among conventional industrial CT apparatuses, there is one described in "Industrial X-ray CT Scanner and Its Application", Instrumentation, P48-51, Vol 27, No. 2, Nakamura. This is an X-ray detector that contains a relatively large X-ray source and xenon (Xe) gas compared to the inspection object, and the width per unit channel is 1 to 2 mm.
It is composed of a large number of (300 to 500 channels) aggregates. Then, while irradiating the inspection target with X-rays radiated in a fan shape from the X-ray source, the inspection target is rotated and the intensity of X-rays transmitted from all directions of the inspection target is detected, and the inspection data is used to perform the inspection. A cross-sectional image of the subject is reconstructed.
上記した従来技術では、検査対象に対する分解能は300
μｍ平方程度であり、より微細な部分の検査が不可能で
あった。In the above-mentioned conventional technology, the resolution for the inspection object is 300
It was about μm square, and it was impossible to inspect a finer portion.
本発明の目的は、微細部分の検査、より詳しくは断面像
を高分解能で検出可能なＸ線断層撮影装置を提供するこ
とにある。An object of the present invention is to provide an X-ray tomography apparatus capable of inspecting a fine portion, more specifically, capable of detecting a cross-sectional image with high resolution.
上記目的を達成するために、本発明では、Ｘ線断層撮影
装置に、微小スポットのＸ線を発生するＸ線発生手段
と、試料を載置し、試料を載置する面がＸ線発生手段で
発生させた微小スポットのＸ線の照射方向とほぼ平行
で、試料を前記した平行な面内で２軸方向に移動させる
と共に前記した平行な面に直交する軸の回りに回転させ
る試料載置手段と、この試料載置手段に載置された試料
に照射され試料を透過したＸ線による透過Ｘ線像を像変
換して増幅させる像変換手段と、この像変換手段から出
力された像変換して増幅された像を電気信号に変換する
像検出手段と、Ｘ線を試料に照射しながら試料載置手段
で試料を軸の回りに１回転させたときに像検出手段によ
り検出される所定の回転角度ごとの試料の透過Ｘ線像に
基づいて試料の断面形状を再構成するＸ線画像処理手段
と、この再構成された試料の断面形状を表示するＸ線断
面画像表示手段と を備える構成とした。To achieve the above object, in the present invention, an X-ray tomography apparatus is provided with an X-ray generation unit that generates X-rays of a minute spot, a sample is placed, and a surface on which the sample is placed is an X-ray generation unit. The sample placement is substantially parallel to the X-ray irradiation direction of the micro-spot generated in 1. and the sample is moved biaxially in the parallel plane and rotated around the axis orthogonal to the parallel plane. Means, image conversion means for performing image conversion and amplification of a transmitted X-ray image of X-rays radiated to and transmitted through the sample mounted on the sample mounting means, and image conversion output from the image conversion means. And an image detecting means for converting the amplified image into an electric signal, and a predetermined amount detected by the image detecting means when the sample is rotated around the axis by the sample placing means while irradiating the sample with X-rays. Cross-sectional shape of the sample based on the transmission X-ray image of the sample for each rotation angle And X-ray image processing means for reconstructing and was configured to include an X-ray cross section image display means for displaying the reconstructed samples of the cross-sectional shape.
ここで、上記した像変換手段には、イメージインテンシ
ファイアを用いてＸ線像を可視化して処理することもで
きるし、また、特に可視化せずとも、即ち、Ｘ線像の波
長スペクトル分布が紫外又は赤外にずれても、当該変換
像が増幅される機能を有する手段であれば、本発明の構
成要素たり得る。Here, the above-mentioned image conversion means can visualize and process an X-ray image by using an image intensifier, or even if it is not visualized, that is, the wavelength spectrum distribution of the X-ray image is It may be a constituent element of the present invention as long as it has a function of amplifying the converted image even if it shifts to ultraviolet or infrared.
微小なスポットサイズのＸ線源に近接した位置に検査対
象を保持し、イメージインテンシファイアの位置を適
宜、選ぶことにより検査部分を拡大投影したＸ線透過像
を得ることができる。An X-ray transmission image in which the inspection portion is enlarged and projected can be obtained by holding the inspection target at a position close to the X-ray source having a minute spot size and selecting the position of the image intensifier appropriately.
イメージインテンシファイアを用いてＸ線透過像を可視
光の像に変換すると共に可視光の強度を増幅させて出力
する像変換手段と、この像変換手段から出力された可視
光の像を電気信号に変換する１次元画像検出部である電
荷蓄積型のリニアイメージセンサからなる像検出手段と
により、高感度かつ広いダイナミックレンジが得られる
のみならず、高解像度の検出が可能となる。An image conversion unit that converts an X-ray transmission image into a visible light image by using an image intensifier and amplifies and outputs the intensity of visible light, and an image of the visible light output from the image conversion unit as an electric signal. With the image detecting means including a charge storage type linear image sensor which is a one-dimensional image detecting unit for converting to, it is possible to obtain not only high sensitivity and wide dynamic range but also high resolution detection.
また撮像管により２次元画像のモニターが行えるので、
微小な検査対象の検査部分に対して精密なＸ線の照射を
可能とする初期位置合わせが実現できる。In addition, because the two-dimensional image can be monitored by the image pickup tube,
It is possible to realize initial alignment that enables precise X-ray irradiation to a minute inspection portion of an inspection target.
本発明の一実施例を以下に図面を用いて説明する。 An embodiment of the present invention will be described below with reference to the drawings.
第２図（ａ）は、検査対象であるLSIチップキャリアの
一例を示すもので、具体的にはセラミック基板21上にLS
Iチップ22をCCB（Collapsed Connecting Bamp）はんだ
接続23により搭載したものである。第２図（ｂ）は、こ
の断面構造の一例を示すものでセラミック基板21は配線
層24a〜24dが積層された多層構造であり、各層間には金
属が充填されたスルーホール26があり、また各配線層に
は金属による回路配線が設けられている。これらのチッ
プキャリアは、下面のはんだ30により接続することで、
同図（ｃ）に示すように、マザー基板31上に多数実装で
きるよう構成されている。FIG. 2 (a) shows an example of an LSI chip carrier to be inspected. Specifically, LS on the ceramic substrate 21.
The I chip 22 is mounted by CCB (Collapsed Connecting Bamp) solder connection 23. FIG. 2B shows an example of this cross-sectional structure. The ceramic substrate 21 has a multilayer structure in which wiring layers 24a to 24d are laminated, and there is a through hole 26 filled with metal between the layers. In addition, circuit wiring made of metal is provided in each wiring layer. By connecting these chip carriers with the solder 30 on the bottom surface,
As shown in FIG. 7C, a large number can be mounted on the mother board 31.
本実施例では、第２図（ｂ）で示すような、LSIチップ
キャリアのCCBはんだ接続部分に発生する気泡27や形状
不良28等の欠陥を検査することを目的としている。尚、
本発明はこれらに限らず、50μｍφ程度の分解能で電子
部品等のＸ線断層撮影検査に適用できる。The purpose of this embodiment is to inspect for defects such as bubbles 27 and defective shapes 28 generated in the CCB solder connection portion of the LSI chip carrier as shown in FIG. 2 (b). still,
The present invention is not limited to these, and can be applied to X-ray tomography inspection of electronic parts and the like with a resolution of about 50 μmφ.
第１図は、本発明の全体構成を示すもので、試料ホルダ
ー10で保持した検査試料２に対して、微小焦点Ｘ線源１
を設けてＸ線照射を行ないこの透過Ｘ線像をイメージイ
ンテンシファイア４により可視像に変換する。この後、
光路切替ミラー７及びレンズ17〜19を介して前記の可視
像を撮像管５又はリニアイメージセンサ６へ導く構成と
している。更に、撮像管５で検出したＸ線像はモニタテ
レビ９で観察されると共に、リニアイメージセンサ６で
検出したＸ線像はA/D変換器11で逐次、量子化された
後、画像メモリ12に格納され、計算機13から読み出しで
きるように構成されている。FIG. 1 shows the overall configuration of the present invention. For a test sample 2 held by a sample holder 10, a micro focus X-ray source 1
Is provided to perform X-ray irradiation, and the transmitted X-ray image is converted into a visible image by the image intensifier 4. After this,
The visible image is guided to the image pickup tube 5 or the linear image sensor 6 via the optical path switching mirror 7 and the lenses 17 to 19. Further, the X-ray image detected by the image pickup tube 5 is observed on the monitor television 9, and the X-ray image detected by the linear image sensor 6 is sequentially quantized by the A / D converter 11 and then the image memory 12 And is configured to be read from the computer 13.
また、操作盤15からの操作指示に従い、計算機13、駆動
制御回路16を介して、試料ホルダー10のX,Y方向の初期
の位置決め調整及び光路切替ミラー７の切替えができる
ように構成されている。また画像検出周期回路８によ
り、試料ホルダー10のθ方向に対する所定回転角度△θ
ごとに、リニアイメージセンサ６でＸ線像の検出ができ
るように構成されている。Further, according to an operation instruction from the operation panel 15, the initial positioning adjustment of the sample holder 10 in the X and Y directions and the switching of the optical path switching mirror 7 can be performed via the computer 13 and the drive control circuit 16. . Further, the image detection cycle circuit 8 causes the sample holder 10 to rotate at a predetermined rotation angle Δθ with respect to the θ direction.
The linear image sensor 6 is configured to detect an X-ray image.
以下、本実施例に従って、はんだ接続部分の断面形状検
出動作を説明する。The operation of detecting the cross-sectional shape of the solder connection portion will be described below according to this embodiment.
先ず、検査試料２（第１図）のはんだ検査箇所の初期位
置合わせを行う。このため光路切替ミラー７を撮像管５
によるモニター検出側に切替え、検査試料２のＸ線透過
像をモニタテレビ９に表示する（第３図）。ここでリニ
アイメージセンサ６の検出位置に対応したモニタテレビ
９上の画面位置に、予めカーソル24を設定しておき、カ
ーソル24に対して検査個所が一致するように、検査試料
２のX,Y位置を移動し調整する。これにより精度のよい
初期位置合せが容易に行える。First, the initial alignment of the solder inspection spot of the inspection sample 2 (FIG. 1) is performed. Therefore, the optical path switching mirror 7 is attached to the image pickup tube 5
To switch to the monitor detection side, and the X-ray transmission image of the inspection sample 2 is displayed on the monitor television 9 (FIG. 3). Here, the cursor 24 is set in advance at the screen position on the monitor TV 9 corresponding to the detection position of the linear image sensor 6, and the X and Y of the inspection sample 2 are set so that the inspection point coincides with the cursor 24. Move and adjust the position. This facilitates accurate initial alignment.
次に光路切替ミラー７をリニアイメージセンサ６の検出
側に切り替え、駆動機構３（第１図）により検査試料２
をθ方向に回転させながら正面図の第４図（ａ）及び側
面図の第４図（ｂ）で示すように、はんだ接続部分の検
査個所を透過するＸ線強度を検出する。Next, the optical path switching mirror 7 is switched to the detection side of the linear image sensor 6, and the inspection sample 2 is driven by the drive mechanism 3 (FIG. 1).
As shown in FIG. 4 (a) of the front view and FIG. 4 (b) of the side view, the X-ray intensity transmitted through the inspection portion of the solder connection portion is detected while rotating in the θ direction.
リニアイメージセンサ６（第１図）では、θ方向の所定
回転角度△θ毎にＸ線透過像の検出を行ない、その検出
信号をA/D変換器11で量子化しながら、逐次、画像メモ
リ12に格納し、θ＝０〜360゜の全周方向の検出データ
を得る。The linear image sensor 6 (FIG. 1) detects an X-ray transmission image at each predetermined rotation angle Δθ in the θ direction, and the detected signal is quantized by the A / D converter 11 while sequentially being recorded in the image memory 12 To obtain detection data in the entire circumferential direction of θ = 0 to 360 °.
第５図は、このようにして得られる検査試料２の各角度
方向θに対応して得られる検出データ関数Ｉ（L,θ）の
例を示す。ここで、Ｌはリニアイメージセンサ上の検出
位置を示すものとする。FIG. 5 shows an example of the detection data function I (L, θ) obtained corresponding to each angle direction θ of the inspection sample 2 obtained in this way. Here, L indicates the detection position on the linear image sensor.
以下、これらの多数方向の検出データＩ（L,θ）を用
い、計算機13の演算処理によりはんだ接続部分の断面形
状の再構成を行ない、ディスプレイ14上に表示を行な
う。Thereafter, using the detection data I (L, θ) in these multiple directions, the cross-sectional shape of the solder connection portion is reconstructed by the arithmetic processing of the computer 13 and displayed on the display 14.
リニアイメージセンサで検出される透過Ｘ線強度のデー
タ関数Ｉ（L,θ）は、検査対象のＸ線吸収係数の分布関
数をμ（x,y）とすれば、次式で与えられる。The data function I (L, θ) of the transmitted X-ray intensity detected by the linear image sensor is given by the following equation, where μ (x, y) is the distribution function of the X-ray absorption coefficient of the inspection target.
Ｉ（L,θ）＝I0（Ｌ）・ｅ−∫μ（x,y）dl ……（１） ここで∫μ（x,y）dlはＸ線ビームの通過位置における
Ｘ線吸収係数の関数μ（x,y）の線積分を表わす。またI
0（Ｌ）は、照射Ｘ線の強度分布関数を示すものとす
る。I (L, θ) = I 0 (L) ・ e − ∫μ (x, y) dl …… (1) where ∫μ (x, y) dl is the X-ray absorption coefficient at the X-ray beam passage position. Represents the line integral of the function μ (x, y) of. See also I
0 (L) represents the intensity distribution function of the irradiation X-ray.
式（１）を書き直せば下式が得られる。By rewriting the formula (1), the following formula is obtained.
−∫μ（x,y）dl＝I0（Ｌ）/I（L,θ）＝Ｐ（L,θ） …
…（２） 式（２）で示すＰ（L,θ）は検査対象なしで予めリニア
イメージセンサでＸ線を検出し求めた照射Ｘ線の強度分
布関数I0（Ｌ）より求められる投影データである。−∫μ (x, y) dl = I 0 (L) / I (L, θ) = P (L, θ)
(2) P (L, θ) shown in equation (2) is projection data obtained from the intensity distribution function I 0 (L) of the irradiation X-ray obtained by detecting the X-ray in advance with the linear image sensor without the inspection object. Is.
断面再構成の問題は、各検出方向の投影データ関数Ｐ
（L,θ）を算出した後、Ｘ線吸収係数の関数μ（x,y）
の分布を求めることである。The problem of cross-section reconstruction is that the projection data function P for each detection direction is
After calculating (L, θ), the function μ (x, y) of the X-ray absorption coefficient
Is to find the distribution of.
このμ（x,y）の算出方法には各種方法が知られている
が、コンボリューション法を適用する一例について概要
を説明する。Although various methods are known for calculating μ (x, y), an outline of an example of applying the convolution method will be described.
この再構成原理は、第６図の平行Ｘ線ビームを用いた例
で示すように平行ビームによる投影データ関数をP
0（L0,θ０）とすれば、これに対して所定の補正関数を
作用してコンボリューション関数を得ながら、各方向の
投影データに対するコンボリューション関数を合成して
断面像を得るものである。この演算式を下記に示す。This reconstruction principle is based on the projection data function by the parallel beam as shown in the example using the parallel X-ray beam in FIG.
If 0 (L 0 , θ 0 ), a predetermined correction function is applied to this to obtain a convolution function, and the convolution function for the projection data in each direction is synthesized to obtain a cross-sectional image. is there. This calculation formula is shown below.
μ（x,y）＝∫０ ｘ｛P0（L0,θ０＊ｇ（L0）｝ｄθ０…
…（３） ここで、＊はコンボリューションを表わす。またｇ
（L0）は補正関数を表わし、SheppとLoganが開発した下
記のものを用いれば、精度の良い画像が得られることが
実証されている。μ (x, y) = ∫ 0 x {P 0 (L 0 , θ 0 * g (L 0 )} dθ 0 ...
(3) Here, * represents convolution. Also g
(L 0 ) represents a correction function, and it has been proved that an accurate image can be obtained by using the following developed by Shepp and Logan.
ただしL0＝na（ｎ＝0,±1,±2,…）とし、ａは投影デー
タの得られるサンプリング間隔を示す。 However, L 0 = na (n = 0, ± 1, ± 2, ...) And a represents the sampling interval at which projection data is obtained.
本発明の場合、投影データ関数Ｐ（L,θ）はファンビー
ム（扇状ビーム）によって検出されるため、Ｐ（L,θ）
から平行ビーム座標系における投影データ関数P0（L0,
θ０）を求める必要がある。これは、第７図の幾何学的
関数で示すように、下記の関係式より変換できる。In the case of the present invention, since the projection data function P (L, θ) is detected by the fan beam (fan beam), P (L, θ)
To the projection data function P 0 (L 0 ,
It is necessary to calculate θ 0 ). This can be converted from the following relational expression as shown by the geometrical function in FIG.
L0＝Ｄsinφ＝Ｄsin（θ−θ０） ……（６） ここで、ＳはＸ線源から検出器までの距離、またＤは、
Ｘ線源から検査試料の回転中心までの距離を表わすもの
とする。 L 0 = D sin φ = D sin (θ−θ 0 ) (6) where S is the distance from the X-ray source to the detector, and D is
It represents the distance from the X-ray source to the center of rotation of the test sample.
以上で示すように、式（５），（６）を用い、平行ビー
ムとして考えた場合の投影データ関数P0（L0,θ０）を
算出して断面形状の算出を行なうことができる。As described above, the cross-sectional shape can be calculated by using the equations (5) and (6) to calculate the projection data function P 0 (L 0 , θ 0 ) when considering the parallel beam.
本発明によれば、微小な検査対象、具体的には50μｍφ
の分解能を必要とする対象物の所定位置における断面検
出撮影が可能となる。更には電子回路のはんだ付け部分
における微細な内部欠陥の検査が行える効果がある。According to the present invention, a minute inspection target, specifically 50 μmφ
It becomes possible to perform cross-section detection and imaging at a predetermined position of the object requiring the resolution of. Furthermore, there is an effect that a fine internal defect can be inspected in a soldered portion of an electronic circuit.
第１図は本発明の一実施例を示す全体構成図、第２図は
検査対象の説明図、第３図はＸ線検出位置のモニタTV表
示例の説明図、第４図は検査試料に対するＸ線像検出動
作の説明図、第５図はリニアイメージセンサにより検出
される検出データの説明図、第６図は断面形状を再構成
するアルゴリズムの原理説明図、第７図はファンビーム
Ｘ線による検出データと平行ビームによる検出データと
の座標関係の説明図である。 １……微小焦点Ｘ線源、２……検査試料、 ３……駆動機構、４……イメージ・インテンシファイ
ア、５……撮像管、 ６……リニア・イメージセンサ、 ７……光路切替ミラー、８……画像検出同期回路、 ９……モニタテレビ、10……試料ホルダー、 11……A/D変換器、12……画像メモリ、 13……計算機、14……断面像ディスプレイ、 15……操作盤、16……駆動制御回路。1 is an overall configuration diagram showing an embodiment of the present invention, FIG. 2 is an explanatory diagram of an inspection target, FIG. 3 is an explanatory diagram of an example of a monitor TV display at an X-ray detection position, and FIG. 4 is an inspection sample. FIG. 5 is an explanatory diagram of an X-ray image detection operation, FIG. 5 is an explanatory diagram of detection data detected by a linear image sensor, FIG. 6 is an explanatory diagram of a principle of an algorithm for reconstructing a sectional shape, and FIG. 7 is a fan beam X-ray. FIG. 6 is an explanatory diagram of a coordinate relationship between detection data obtained by (1) and detection data obtained by parallel beams. 1 ... Micro focus X-ray source, 2 ... Inspection sample, 3 ... Driving mechanism, 4 ... Image intensifier, 5 ... Image pickup tube, 6 ... Linear image sensor, 7 ... Optical path switching mirror , 8 …… Image detection synchronization circuit, 9 …… Monitor TV, 10 …… Sample holder, 11 …… A / D converter, 12 …… Image memory, 13 …… Calculator, 14 …… Section image display, 15… … Control panel, 16 …… Drive control circuit.
Claims (4)
段と、 試料を載置し、該試料を載置する面が前記Ｘ線発生手段
で発生させた前記微小スポットのＸ線の照射方向とほぼ
平行で、前記試料を該平行な面内で２軸方向に移動させ
ると共に該平行な面に直交する軸の回りに回転させる試
料載置手段と、 該試料載置手段に載置された前記試料に照射され該試料
を透過した前記Ｘ線による透過Ｘ線像を像変換して増幅
させる像変換手段と、 該像変換手段から出力された像変換して増幅された像を
電気信号に変換する像検出手段と、 前記Ｘ線を前記試料に照射しながら前記試料載置手段で
前記試料を前記軸の回りに１回転させたときに前記像検
出手段により検出される所定の回転角度ごとの前記試料
の透過Ｘ線像に基づいて前記試料の断面形状を再構成す
るＸ線画像処理手段と、 該Ｘ線画像処理手段により再構成された前記試料の断面
形状を表示するＸ線断面画像表示手段と を備えたことを特徴とするＸ線断層撮影装置。1. X-ray generating means for generating X-rays of minute spots, and a surface on which a sample is mounted, and the surface on which the sample is mounted is irradiated with X-rays of the minute spots generated by the X-ray generating means. A sample placing means for moving the sample in two axial directions in the parallel plane and rotating about an axis orthogonal to the parallel plane, and the sample placing means placed on the sample placing means. And an image conversion unit for converting and amplifying a transmitted X-ray image of the X-rays which is irradiated to the sample and transmitted through the sample, and an image signal output from the image conversion unit and converted and amplified by an electric signal. And a predetermined rotation angle detected by the image detecting means when the sample is rotated once around the axis by the sample placing means while irradiating the sample with the X-ray. The cross-sectional shape of the sample based on the transmission X-ray image of the sample for each An X-ray tomography apparatus comprising: an X-ray image processing unit for reconstructing; and an X-ray sectional image displaying unit for displaying a sectional shape of the sample reconstructed by the X-ray image processing unit.
光の像に変換すると共に該可視光の強度を増倍させるこ
とを特徴とする特許請求の範囲第１項記載のＸ線断層撮
影装置。2. The X-ray according to claim 1, wherein the image conversion means converts the transmitted X-ray image into an image of visible light and multiplies the intensity of the visible light. Tomography equipment.
り前記可視光の像を電気信号に変換することを特徴とす
る特許請求の範囲第１項記載のＸ線断層撮影装置。3. The X-ray tomography apparatus according to claim 1, wherein the image detecting means converts the visible light image into an electric signal by a one-dimensional image detecting section.
で検出した前記透過Ｘ線像に基づいて前記試料の所望に
部分の透過Ｘ線像が前記１次元画像検出部で検出される
ように前記試料の位置合わせをする位置合わせ手段を更
に有することを特徴とする特許請求の範囲第２項記載の
Ｘ線断層撮影装置。4. In the X-ray tomography apparatus, a transmission X-ray image of a desired portion of the sample is detected by the one-dimensional image detection unit based on the transmission X-ray image detected by the image detecting means. The X-ray tomography apparatus according to claim 2, further comprising a positioning unit that positions the sample.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62042535A JPH0752162B2 (en) | 1987-02-27 | 1987-02-27 | X-ray tomography system |
| US07/156,179 US4872187A (en) | 1987-02-27 | 1988-02-16 | X-ray tomographic imaging system and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62042535A JPH0752162B2 (en) | 1987-02-27 | 1987-02-27 | X-ray tomography system |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8139927A Division JP2713287B2 (en) | 1996-06-03 | 1996-06-03 | X-ray tomography method and apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63210651A JPS63210651A (en) | 1988-09-01 |
| JPH0752162B2 true JPH0752162B2 (en) | 1995-06-05 |
Family
ID=12638767
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62042535A Expired - Lifetime JPH0752162B2 (en) | 1987-02-27 | 1987-02-27 | X-ray tomography system |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0752162B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01305929A (en) * | 1988-06-02 | 1989-12-11 | Toshiba Corp | X-ray diagnosing device |
| JPH0555329A (en) * | 1991-08-22 | 1993-03-05 | Nec Yamagata Ltd | Visual pellet inspecting device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4809308A (en) * | 1986-02-20 | 1989-02-28 | Irt Corporation | Method and apparatus for performing automated circuit board solder quality inspections |
-
1987
- 1987-02-27 JP JP62042535A patent/JPH0752162B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63210651A (en) | 1988-09-01 |
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| EXPY | Cancellation because of completion of term |