TW201312102A - X-ray inspecting device, method for controlling the same, program for controlling the same and recording media for stroing the program thereof - Google Patents
X-ray inspecting device, method for controlling the same, program for controlling the same and recording media for stroing the program thereof Download PDFInfo
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B6/00—Apparatus for radiation diagnosis, e.g. combined with radiation therapy equipment
- A61B6/02—Devices for diagnosis sequentially in different planes; Stereoscopic radiation diagnosis
- A61B6/027—Devices for diagnosis sequentially in different planes; Stereoscopic radiation diagnosis characterised by the use of a particular data acquisition trajectory, e.g. helical or spiral
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B6/00—Apparatus for radiation diagnosis, e.g. combined with radiation therapy equipment
- A61B6/02—Devices for diagnosis sequentially in different planes; Stereoscopic radiation diagnosis
- A61B6/03—Computerised tomographs
- A61B6/032—Transmission computed tomography [CT]
- A61B6/035—Mechanical aspects of CT
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B6/00—Apparatus for radiation diagnosis, e.g. combined with radiation therapy equipment
- A61B6/54—Control of apparatus or devices for radiation diagnosis
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
- G01N23/04—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material
- G01N23/046—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material using tomography, e.g. computed tomography [CT]
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/30—Accessories, mechanical or electrical features
- G01N2223/33—Accessories, mechanical or electrical features scanning, i.e. relative motion for measurement of successive object-parts
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/40—Imaging
- G01N2223/419—Imaging computed tomograph
Abstract
Description
本發明係有關於X光檢查裝置，更特定言之，係有關於迅速地取得X光影像的X光檢查裝置。 The present invention relates to an X-ray inspection apparatus, and more particularly to an X-ray inspection apparatus that rapidly acquires an X-ray image.
在使用X光的CT(Computed Tomography)自動檢查裝置，為了在線上檢查而要求高速化。關於高速化用的攝像系構成例，例如特開2009-156788號公報(專利文獻1)揭示一種藉由使用在平行之面上移動的XY軸使檢查對象物及二維X光檢測器移動，而從複數個相異的方向取得X光影像(以下稱為「投影影像」)之技術。 In the CT (Computed Tomography) automatic inspection device using X-ray, it is required to increase the speed for on-line inspection. For example, Japanese Laid-Open Patent Publication No. 2009-156788 (Patent Document 1) discloses an object to be inspected and a two-dimensional X-ray detector by using an XY axis that moves on a parallel surface. The technique of acquiring an X-ray image (hereinafter referred to as "projected image") from a plurality of different directions.
[專利文獻1]特開2009-156788號公報 [Patent Document 1] JP-A-2009-156788
在具有使用二維X光檢測器可將同一處從複數個角度拍攝之機構的傾斜CT自動檢查裝置，用以變更拍攝角度之機構的移動及停止與攝像(照射X光及X光檢測器的曝光)(所謂的停與動(STOP&GO)方式)係在時間上串列地執行。結果，因為無益於攝像之機構的移動時間成為檢查時間的損失，所以具有無法更縮短檢查時間的問題。 A tilt CT automatic inspection device having a mechanism for photographing the same portion from a plurality of angles using a two-dimensional X-ray detector for changing the movement of the photographing angle and stopping and imaging (illuminating the X-ray and X-ray detectors) Exposure) (so-called stop and move (STOP & GO) mode) is performed in series in time. As a result, since the moving time of the mechanism that does not contribute to the imaging becomes a loss of the inspection time, there is a problem that the inspection time cannot be further shortened.
本發明係為了解決如上述所示之問題點而開發的，其目的在於提供一種可使X光影像之取得高速化的X光檢查裝置。 The present invention has been made in order to solve the problems as described above, and an object of the invention is to provide an X-ray inspection apparatus that can speed up the acquisition of an X-ray image.
其他形態的目的係提供一種X光影像之取得高速化的X光檢查方法。其他形態的目的係提供一種用以將X光檢查裝置控制成可高速化取得X光影像的程式。另外之形態的目的係提供一種儲存該程式之電腦可讀取的記錄媒體。 The other object is to provide an X-ray inspection method for achieving high speed X-ray image. Another object is to provide a program for controlling an X-ray inspection apparatus to obtain an X-ray image at a high speed. Another form of object is to provide a computer readable recording medium storing the program.
依據一實施形態，係提供一種X光檢查裝置，該X光檢查裝置係藉由以複數個檢測面接收穿透過對象物之檢查對象區域的X光，而執行該檢查對象區域之像之重建處理的X光檢查裝置。X光檢查裝置係具有：對象物移動機構，係用以使對象物移動；X光源，係用以將X光照射於對象物；X光檢測器，係用以檢測出透過檢查對象區域的X光；檢測器移動機構，係用以使X光檢測器移動；運算手段，係在預設有供對象物與X光檢測器移動之預設的軌道條件下，以透過檢查對象區域之一點的X光可被投影至該X光檢測器之受光中心的方式算出X光檢測器的移動目標位置與對象物的移動目標位置；檢測器位置控制手段，係控制檢測器移動機構的驅動，使X光檢測器沿著算出之移動目標位置所在的軌道條件中之第1軌道移動；對象物位置控制手段，係控制對象物移動機構的驅動，使對象物沿著已算出之移動目標位置所在的軌道條件中之第2軌道移動；X光源控制手段，係在X光檢測器及對象物移動的期間，將X光源控制成朝向對象物照射X光；X光影像取得手段，係在X光檢測器及對象物移動的期間，藉由使X光檢測器在穿透過對象物的X光曝露複數次，以 取得複數張投影影像；及運算手段，係使用重建運算法則，從複數張投影影像重建三維影像。 According to one embodiment, there is provided an X-ray inspection apparatus that performs image reconstruction processing of an inspection target area by receiving X-rays that have passed through an inspection target area of an object by a plurality of detection surfaces. X-ray inspection device. The X-ray inspection apparatus includes an object moving mechanism for moving an object, an X-ray source for irradiating X-rays to the object, and an X-ray detector for detecting X passing through the inspection target region. Light; a detector moving mechanism for moving the X-ray detector; and an operation means for transmitting a predetermined track condition for moving the object and the X-ray detector to pass through one of the inspection target areas The X-ray can be projected onto the light receiving center of the X-ray detector to calculate the moving target position of the X-ray detector and the moving target position of the object; and the detector position control means controls the driving of the detector moving mechanism to make X The photodetector moves along the first track in the track condition in which the calculated moving target position is located; the object position control means controls the driving of the object moving mechanism so that the object follows the track in which the calculated moving target position is located The second orbital movement in the condition; the X-ray source control means controls the X-ray source to emit X-rays toward the object while the X-ray detector and the object move; and the X-ray image acquisition means During the X-ray detector and the object to be moved, by the X-ray detector in the X object penetrates through the light exposure plural times to Obtaining a plurality of projected images; and computing means reconstructing the three-dimensional images from the plurality of projected images using a reconstruction algorithm.
最好第1軌道及第2軌道係圓軌道。檢測器移動機構係移動X光檢測器，對象物移動機構移動對象物移動，俾使X光檢測器及對象物以該X光源為中心呈同心圓狀移動。 Preferably, the first track and the second track are circular orbits. The detector moving mechanism moves the X-ray detector, and the object moving mechanism moves the object to move, so that the X-ray detector and the object move concentrically around the X-ray source.
最好X光檢測器係根據矩形的視野，以複數個檢測面接收X光受光並拍攝之矩形的X光檢測器；檢測器位置控制手段係進行使X光檢測器沿著第1軌道平行移動的控制，俾使各移動目標位置之X光檢測器之矩形的各邊朝向同一方向。 Preferably, the X-ray detector is a rectangular X-ray detector that receives X-rays and takes a plurality of detection surfaces according to a rectangular field of view; and the detector position control means moves the X-ray detectors in parallel along the first track. The control is such that the sides of the rectangle of the X-ray detector of each moving target position face in the same direction.
最好X光源控制手段係在對象物及X光檢測器移動的期間，將X光源驅動成連續地照射X光。 Preferably, the X-ray source control means drives the X-ray source to continuously illuminate the X-ray while the object and the X-ray detector are moving.
最好X光源控制手段係將X光源控制成對對象物照射複數次的X光。X光檢測器係因應於X光所照射之時序進行複數次曝光。 Preferably, the X-ray source control means controls the X-ray source to emit X-rays that are applied to the object a plurality of times. The X-ray detector performs multiple exposures in response to the timing of the X-ray exposure.
依據其他的實施形態，提供一種用以控制X光檢查裝置之方法，該控制方法係藉由使用X光檢測器以複數個檢測面接收穿透過對象物之檢查對象區域的X光，以執行檢查對象區域之像的重建處理。該控制方法係包含以下的步驟：算出步驟，係在預設有供對象物與X光檢測器移動的軌道條件下，以穿透過檢查對象區域之一點的X光可被投影至X光檢測器之受光中心的方式算出X光檢測器的移動目標位置與對象物的移動目標位置；檢測器移動步驟，係使X光檢測器沿著已算出之X光檢測器的移動目標 位置所在之軌道條件中的第1軌道移動；對象物移動步驟，係使對象物沿著已算出之對象物的移動目標位置所在之軌道條件中的第2軌道移動；照射步驟，係在X光檢測器及對象物移動的期間，朝向對象物照射X光；取得步驟，係在X光檢測器及對象物移動的期間，藉由使X光檢測器在穿透過對象物的X光曝露複數次，以取得複數張投影影像；及重建步驟，係使用重建運算法則，從複數張投影影像重建三維影像。 According to another embodiment, there is provided a method for controlling an X-ray inspection apparatus, which performs an inspection by receiving X-rays penetrating an inspection target region of an object with a plurality of detection surfaces by using an X-ray detector. Reconstruction of the image of the object area. The control method includes the following steps: the calculating step is performed under the condition that a track for moving the object and the X-ray detector is provided, and X-rays penetrating through a point of the inspection target region can be projected to the X-ray detector. The light receiving center calculates the moving target position of the X-ray detector and the moving target position of the object; and the detector moving step causes the X-ray detector to move along the calculated moving target of the X-ray detector The first track moves in the track condition where the position is located; the object moving step moves the object along the second track in the orbital condition in which the calculated target position of the object is located; the illumination step is in the X-ray During the movement of the detector and the object, the X-ray is irradiated toward the object; and the obtaining step is performed by exposing the X-ray detector to the X-ray that has penetrated the object during the movement of the X-ray detector and the object. To obtain a plurality of projected images; and a reconstruction step of reconstructing a three-dimensional image from a plurality of projected images using a reconstruction algorithm.
最好第1軌道及第2軌道係圓軌道。使X光檢測器移動的步驟係包含以X光檢測器及對象物可以X光源為中心呈同心圓狀移動的方式移動X光檢測器的步驟。使對象物移動的步驟係包含以X光檢測器及對象物可以X光源為中心呈同心圓狀移動的方式移動對象物的步驟。 Preferably, the first track and the second track are circular orbits. The step of moving the X-ray detector includes the step of moving the X-ray detector in such a manner that the X-ray detector and the object move concentrically around the X-ray source. The step of moving the object includes a step of moving the object such that the X-ray detector and the object move concentrically around the X-ray source.
最好X光檢測器係根據矩形的視野，以複數個檢測面接收X光受光而拍攝之矩形的X光檢測器，在使X光檢測器移動的步驟，包含以在各移動目標位置之X光檢測器之矩形的各邊可朝向同一方向的方式使X光檢測器沿著第1軌道平行移動的步驟。 Preferably, the X-ray detector is a rectangular X-ray detector that receives X-rays and receives light by a plurality of detection surfaces according to a rectangular field of view, and includes X at each moving target position in the step of moving the X-ray detector. The step of moving the X-ray detector in parallel along the first track in such a manner that the sides of the rectangle of the photodetector can face in the same direction.
最好照射X光的步驟係包含在X光檢測器及對象物移動的期間，連續地照射X光的步驟。 Preferably, the step of irradiating the X-rays includes the step of continuously irradiating the X-rays while the X-ray detector and the object move.
最好照射X光的步驟係包含對對象物照射複數次的X光之步驟。取得複數張投影影像的步驟係包含因應於X光所照射之時序進行複數次曝光的步驟。 Preferably, the step of illuminating the X-rays includes the step of irradiating the object with X-rays a plurality of times. The step of obtaining a plurality of projected images includes the step of performing a plurality of exposures in response to the timing of the X-ray illumination.
依據其他的實施形態，提供一種用以控制X光檢查裝置之程式，該X光檢查裝置係藉由使用X光檢測器以複數 個檢測面接收穿透過對象物之檢查對象區域的X光，以執行檢查對象區域之像的重建處理。程式係使X光檢查裝置執行以下的步驟：算出步驟，係在預設有供對象物與X光檢測器移動的軌道條件下，以透過檢查對象區域之一點的X光可被投影至X光檢測器之受光中心的方式算出X光檢測器的移動目標位置與對象物的移動目標位置；檢測器移動步驟，係使X光檢測器沿著已算出之X光檢測器的移動目標位置所在之該軌道條件中的第1軌道移動；對象物移動步驟，係使對象物沿著已算出之對象物的移動目標位置所在之軌道條件中的第2軌道移動；照射步驟，係在X光檢測器及對象物移動的期間，朝向對象物照射X光；取得步驟，係在X光檢測器及對象物移動的期間，藉由使X光檢測器在穿透過對象物的X光下曝露複數次，以取得複數張投影影像；及重建步驟，係使用重建運算法則，從複數張投影影像重建三維影像。 According to other embodiments, there is provided a program for controlling an X-ray inspection apparatus by using an X-ray detector in plural The detection faces receive X-rays that have passed through the inspection target region of the object to perform reconstruction processing of the image of the inspection target region. The program causes the X-ray inspection apparatus to perform the following steps: the calculation step is performed by projecting X-rays passing through one of the inspection target areas under the condition that the object and the X-ray detector are moved to be projected to the X-ray. The moving target position of the X-ray detector and the moving target position of the object are calculated by the light receiving center of the detector; the detector moving step is such that the X-ray detector is located along the calculated moving target position of the X-ray detector. The first track moves in the orbital condition; the object moving step moves the object along the second track in the orbital condition in which the calculated target position of the object is located; and the irradiation step is performed in the X-ray detector While the object is moving, the X-ray is irradiated toward the object; and the obtaining step is performed by exposing the X-ray detector to X-rays penetrating the object several times during the movement of the X-ray detector and the object. To obtain a plurality of projected images; and a reconstruction step, reconstructing a three-dimensional image from a plurality of projected images using a reconstruction algorithm.
最好第1軌道及第2軌道係圓軌道。程式係執行以下的步驟：在移動X光檢測器的步驟方面，係執行使X光檢測器及對象物可以X光源為中心呈同心圓狀移動方式移動X光檢測器的步驟；對象物移動的步驟方面，係執行使X光檢測器及對象物可以X光源為中心呈同心圓狀移動的方式移動對象物的步驟。 Preferably, the first track and the second track are circular orbits. The program performs the following steps: in the step of moving the X-ray detector, the step of moving the X-ray detector in such a manner that the X-ray detector and the object can move in a concentric manner around the X-ray source; the object moves In the step, the X-ray detector and the object are moved so that the X-ray source can move concentrically around the X-ray source.
最好X光檢測器係根據矩形的視野，以複數個檢測面接收X光而拍攝之矩形的X光檢測器；在使X光檢測器移動的步驟中，係執行以在各移動目標位置之X光檢測器之矩形的各邊可朝向同一方向的方式使X光檢測器沿著第1 軌道平行移動的步驟。 Preferably, the X-ray detector is a rectangular X-ray detector that receives X-rays in a plurality of detection planes according to a rectangular field of view; in the step of moving the X-ray detectors, is performed at each moving target position. X-ray detectors along the sides of the rectangle can be oriented in the same direction to make the X-ray detector along the first The step of moving the tracks in parallel.
最好程式係為，在照射X光的步驟方面，係執行在X光檢測器及對象物移動的期間，連續地照射X光的步驟。 Preferably, in the step of irradiating the X-rays, the step of continuously irradiating the X-rays during the movement of the X-ray detector and the object is performed.
最好程式係為：在照射X光的步驟方面，係執行對對象物照射複數次的X光之步驟；在取得複數張投影影像的步驟方面，係執行因應於X光所照射之時序進行複數次曝光的步驟。 Preferably, the step of performing the step of irradiating the X-rays is to perform the step of irradiating the object with a plurality of X-rays; and in the step of obtaining the plurality of projected images, performing the plurality of steps according to the timing of the X-ray irradiation The step of the second exposure.
依據另外之實施形態，係提供一種儲存有如上述之任一項的程式之電腦可讀取的資料記錄媒體。 According to another embodiment, a computer readable data recording medium storing the program of any of the above is provided.
在某形態，高速地取得X光檢查所需的X光影像。 In a certain form, an X-ray image required for X-ray inspection is acquired at high speed.
將從與附加之圖面所相關地理解之關於本發明之如下的詳細說明得知本發明之上述及其他的目的、特徵、形態及優點。 The above and other objects, features, aspects and advantages of the present invention will become apparent from the <RTIgt;
以下，一面參照圖面，一面說明本發明之實施形態。在以下的說明，對同一之元件附加相同的符號。那些元件的名稱及功能亦是相同。因此省略那些元件的詳細說明。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following description, the same elements are denoted by the same reference numerals. The names and functions of those components are also the same. Therefore, a detailed description of those components is omitted.
參照第1圖，說明一形態之X光檢查裝置100的構成。第1圖係表示X光檢查裝置100之硬體構成的方塊圖。 The configuration of the X-ray inspection apparatus 100 of one embodiment will be described with reference to Fig. 1 . Fig. 1 is a block diagram showing the hardware configuration of the X-ray inspection apparatus 100.
X光檢查裝置100具有X光產生器10、工作台18、X光檢測器驅動部22、X光檢測器23、影像取得控制機構30 、輸入部40、輸出部50、X光源控制機構60、運算部70及記憶體90。 The X-ray inspection apparatus 100 includes an X-ray generator 10, a table 18, an X-ray detector drive unit 22, an X-ray detector 23, and an image acquisition control unit 30. The input unit 40, the output unit 50, the X-ray source control unit 60, the calculation unit 70, and the memory 90.
X光產生器10包含X光焦點17。X光檢測器驅動部22包含正交型的雙軸機器手臂22.1與檢測器支撐部22.2。影像取得控制機構30包含檢測器驅動控制部32與影像資料取得部34。運算部70包含檢查對象位置控制部80。檢查對象物20搭載於工作台18。 The X-ray generator 10 includes an X-ray focus 17. The X-ray detector driving unit 22 includes an orthogonal type biaxial robot arm 22.1 and a detector supporting portion 22.2. The video acquisition control unit 30 includes a detector drive control unit 32 and a video material acquisition unit 34. The calculation unit 70 includes an inspection target position control unit 80. The inspection object 20 is mounted on the table 18.
X光產生器10係以通過X光焦點17的軸為中心軸，輸出X光。X光產生器10係被X光源控制機構60控制。X光源控制機構60控制電子束的輸出。具體而言，X光源控制機構60係從運算部70接受X光能量(管電壓、管電流)的指定。X光能量係根據檢查對象物20的構成而異。 The X-ray generator 10 outputs X-rays with the axis passing through the X-ray focal point 17 as a central axis. The X-ray generator 10 is controlled by an X-ray source control mechanism 60. The X-ray source control mechanism 60 controls the output of the electron beam. Specifically, the X-ray source control means 60 receives the designation of X-ray energy (tube voltage, tube current) from the calculation unit 70. The X-ray energy system differs depending on the configuration of the inspection object 20.
檢查對象物20被搬入工作台18。工作台18例如以X-Y-Z工作台構成，可移至任意的位置。工作台18的移動例如係根據圓軌道或線性軌道移動。在其他的形態中，工作台18可構成為如皮帶輸送帶般藉由在一方向移動而將檢查對象物20配置於檢查位置。 The inspection object 20 is carried into the table 18. The table 18 is constituted by, for example, an X-Y-Z table, and can be moved to an arbitrary position. The movement of the table 18 is, for example, moved according to a circular or linear track. In another aspect, the table 18 may be configured to move the inspection object 20 to the inspection position by moving in one direction as in the case of a belt conveyor.
X光檢測器驅動部22係透過檢測器驅動控制部32，根據來自運算部70的命令使X光檢測器23移至指定位置。又，檢測器驅動控制部32將在該時間點時之X光檢測器23的位置資訊送至運算部70。 The X-ray detector drive unit 22 transmits the X-ray detector 23 to a predetermined position in response to a command from the calculation unit 70 via the detector drive control unit 32. Further, the detector drive control unit 32 sends the position information of the X-ray detector 23 at the time point to the calculation unit 70.
更詳言之，在X光檢測器驅動部22，機器手臂22.1與檢測器支撐部22.2將X光檢測器23移至指定位置。例如，X光檢測器驅動部22構成為可根據XYθ工作台之自由度驅動X光檢測器23的XYθ動作機構。 More specifically, in the X-ray detector driving unit 22, the robot arm 22.1 and the detector supporting portion 22.2 move the X-ray detector 23 to a designated position. For example, the X-ray detector driving unit 22 is configured to drive the XYθ operating mechanism of the X-ray detector 23 in accordance with the degree of freedom of the XYθ stage.
此外，X光檢測器驅動部22係未限定為上述的構成，只要是可進行X-Y方向的移動或在X-Y平面內之θ轉動的構成，並對X光檢測器23之移動具有相同的功能者即可。 Further, the X-ray detector driving unit 22 is not limited to the above-described configuration, and may have a configuration in which movement in the XY direction or θ rotation in the XY plane is possible, and the same function is applied to the movement of the X-ray detector 23. Just fine.
X光檢測器23係檢出藉X光產生器10所輸出而透過檢查對象物20的X光並影像化的二維X光檢測器。例如，X光檢測器23係CCD(Charge Coupled Device；電荷耦合元件)相機、I.I(Image Intensifier；像強化管)管、空間效率佳的FPD(Flat Panel Detector；平板檢測器)。又，X光檢測器23係以高靈敏度者較理想，俾可在線上檢查使用亦可以是使用CdTe之直接變換方式的FPD。 The X-ray detector 23 detects a two-dimensional X-ray detector that is output by the X-ray generator 10 and transmits X-rays of the inspection object 20 and is visualized. For example, the X-ray detector 23 is a CCD (Charge Coupled Device) camera, an I.I (Image Intensifier) tube, and a space-efficient FPD (Flat Panel Detector). Further, the X-ray detector 23 is preferably a high-sensitivity one, and may be used for online inspection or an FPD using a direct conversion method of CdTe.
影像取得控制機構30係控制X光檢測器驅動部22對X光檢測器23之驅動及來自X光檢測器23之影像資料的取得。具體而言，檢測器驅動控制部32係以使X光檢測器23移至藉運算部70所指定之位置的方式控制X光檢測器驅動部22。影像資料取得部34取得X光檢測器23的影像資料。在使用複數個X光檢測器23的情況，影像資料取得部34可從運算部70取得所指定之X光檢測器23的影像資料。 The image acquisition control unit 30 controls the driving of the X-ray detector 23 by the X-ray detector driving unit 22 and the acquisition of the image data from the X-ray detector 23. Specifically, the detector drive control unit 32 controls the X-ray detector drive unit 22 such that the X-ray detector 23 is moved to the position designated by the borrowing unit 70. The image data acquisition unit 34 acquires the image data of the X-ray detector 23. When a plurality of X-ray detectors 23 are used, the image data acquisition unit 34 can acquire the image data of the designated X-ray detector 23 from the calculation unit 70.
輸入部40受理來自X光檢查裝置100之使用者的指示輸入。輸入部40例如係藉由使用在周知之電腦系統的鍵盤、滑鼠、觸控面板、無線通訊介面等而實現。 The input unit 40 accepts an instruction input from a user of the X-ray inspection apparatus 100. The input unit 40 is realized, for example, by using a keyboard, a mouse, a touch panel, a wireless communication interface, or the like of a well-known computer system.
輸出部50將量測結果等輸出至外部。輸出部50例如係以顯示由運算部70所構成之X光影像等的監視裝置實現。在其他的形態中，輸出部50係以輸出影像信號的介面實現。 The output unit 50 outputs the measurement result and the like to the outside. The output unit 50 is realized by, for example, a monitoring device that displays an X-ray image or the like constituted by the calculation unit 70. In other forms, the output unit 50 is implemented by an interface that outputs a video signal.
X光源控制機構60控制基於X光產生器10之X光的照 射時序、照射時間及強度。 The X-ray source control mechanism 60 controls the X-ray based on the X-ray generator 10 Shooting timing, illumination time and intensity.
運算部70係執行儲存於記憶體90的程式(未圖示)而控制各部，又，執行既定運算處理。 The calculation unit 70 executes a program (not shown) stored in the memory 90 to control each unit, and executes a predetermined calculation process.
檢查對象位置控制部80係藉由控制工作台18的移動，執行X光攝像所需的定位。 The inspection target position control unit 80 performs positioning required for X-ray imaging by controlling the movement of the table 18.
記憶體90儲存用以控制X光檢查裝置100之動作的程式、所取得之X光影像資料等。 The memory 90 stores a program for controlling the operation of the X-ray inspection apparatus 100, acquired X-ray image data, and the like.
參照第2圖，說明一形態之X光檢查裝置100的控制構成。第2圖係表示X光檢查裝置100所執行之一連串的處理之一部分的流程圖。 The control configuration of the X-ray inspection apparatus 100 of one embodiment will be described with reference to Fig. 2 . Fig. 2 is a flow chart showing a part of a series of processes performed by the X-ray inspection apparatus 100.
在步驟S102，運算部70係藉由驅動被放置檢查對象物20的工作台18以移動視野。 In step S102, the arithmetic unit 70 drives the stage 18 on which the inspection object 20 is placed to move the field of view.
在步驟S104，X光檢查裝置100拍攝透視影像。具體而言，影像資料取得部34從X光檢測器23接收從X光產生器10照射並透過檢查對象物20之X光的影像資料。影像資料被儲存於記憶體90。 In step S104, the X-ray inspection apparatus 100 captures a fluoroscopic image. Specifically, the image data acquisition unit 34 receives the image data of the X-rays that are irradiated from the X-ray generator 10 and transmitted through the inspection object 20 from the X-ray detector 23 . The image data is stored in the memory 90.
在步驟S106，運算部70檢查藉由攝像所得之透視影像。 In step S106, the arithmetic unit 70 checks the fluoroscopic image obtained by imaging.
在步驟S108，運算部70係根據該檢查結果，判斷是否需要檢查重建影像。若運算部70判斷需要檢查重建影像(在步驟S108為是)，將控制切換至步驟S110。在不是的情況(在步驟S108為否)，運算部70結束控制。 In step S108, the arithmetic unit 70 determines whether or not it is necessary to check the reconstructed image based on the result of the check. When the calculation unit 70 determines that it is necessary to check the reconstructed image (YES in step S108), the control is switched to step S110. If not (NO in step S108), the arithmetic unit 70 ends the control.
在步驟S110，運算部70執行一個視野的CT(Computed Tomography；電腦斷層)攝像處理。 In step S110, the arithmetic unit 70 performs CT (Computed Tomography) imaging processing of one field of view.
在步驟S112，運算部70係使用藉由CT攝像處理所得之影像而重建檢查對象物20的影像。 In step S112, the arithmetic unit 70 reconstructs the image of the inspection object 20 using the image obtained by the CT imaging processing.
在步驟S112，運算部70檢查重建影像。 In step S112, the arithmetic unit 70 checks the reconstructed image.
在步驟S116，運算部70判斷是否已結束全視野的檢查。若運算部70判斷已結束全視野的檢查(在步驟S116為是)，結束檢查。在不是的情況(在步驟S116為否)，運算部70使控制回到步驟S102。 In step S116, the arithmetic unit 70 determines whether or not the inspection of the full view has been completed. When the calculation unit 70 determines that the inspection of the full field of view has been completed (YES in step S116), the inspection is ended. If not (NO in step S116), the arithmetic unit 70 returns the control to step S102.
參照第3圖，說明在X光檢查裝置100中的X光檢測器23及攝像視野310的移動。第3圖係從上方表示X光檢測器23與攝像視野310移動之狀態的圖。 The movement of the X-ray detector 23 and the imaging field of view 310 in the X-ray inspection apparatus 100 will be described with reference to Fig. 3 . Fig. 3 is a view showing a state in which the X-ray detector 23 and the imaging field of view 310 are moved from above.
在一形態中，X光檢測器23及攝像視野310以X光產生器10為轉動中心朝逆時針方向轉動。X光檢測器23在X光檢測器軌道320的軌道上移動，檢查對象物20所含之攝像視野310在攝像視野軌道330的軌道上移動。 In one aspect, the X-ray detector 23 and the imaging field of view 310 are rotated counterclockwise with the X-ray generator 10 as a center of rotation. The X-ray detector 23 moves on the track of the X-ray detector track 320, and the imaging field of view 310 included in the inspection object 20 moves on the track of the imaging field of view track 330.
例如，在第3圖所示的例子中，在開始檢查的時間點，X光檢測器23配置於目標位置D1。此時，檢查對象物20所含的攝像視野310被定位於目標位置V1。在此狀態，X光產生器10一照射X光時，即取得攝像視野310的投影影像P1。 For example, in the example shown in FIG. 3, the X-ray detector 23 is disposed at the target position D1 at the time of starting the inspection. At this time, the imaging field of view 310 included in the inspection object 20 is positioned at the target position V1. In this state, when the X-ray generator 10 emits X-rays, the projected image P1 of the imaging field of view 310 is acquired.
然後，X光檢測器23被驅動，從目標位置D1移至目標位置D2。此時，載置著檢查對象物20的工作台18亦僅轉動相同的角度，而移至目標位置V2。在此狀態，X光產生器10一照射X光時，即取得投影影像P2。 Then, the X-ray detector 23 is driven to move from the target position D1 to the target position D2. At this time, the table 18 on which the inspection object 20 is placed is also rotated to the target position V2 by only rotating the same angle. In this state, when the X-ray generator 10 emits X-rays, the projected image P2 is obtained.
以後亦相同，在目標位置D3、V3取得投影影像P3， 在目標位置D4、V4取得投影影像P4。在需要重建n張投影影像的情況，迄至目標位置Dn、Vn為止地交互地進行移動與攝像。 The same is true in the future, and the projected image P3 is obtained at the target positions D3 and V3. The projected image P4 is obtained at the target positions D4 and V4. When it is necessary to reconstruct n projection images, the movement and imaging are interactively performed up to the target positions Dn and Vn.
參照第4圖，說明一形態的實施形態之X光檢查裝置400的構成。第4圖係表示X光檢查裝置400之硬體構成的方塊圖。 The configuration of the X-ray inspection apparatus 400 according to the embodiment of the present invention will be described with reference to Fig. 4 . Fig. 4 is a block diagram showing the hardware configuration of the X-ray inspection apparatus 400.
X光檢查裝置400具有X光產生器10、工作台18、正交型的雙軸機器手臂22.1、檢測器支撐部22.2、X光檢測器23、運算部410、主記憶部420、輔助記憶部425、輸入部40、輸出部50、X光檢測器位置控制機構440、X光影像取得機構445、光學相機位置控制機構450、相機460、光學影像取得機構455、工作台位置控制機構465及X光源控制機構60。檢查對象物20被搭載於工作台18。檢查對象物20包含攝像視野310。 The X-ray inspection apparatus 400 includes an X-ray generator 10, a table 18, an orthogonal type biaxial robot 22.1, a detector support unit 22.2, an X-ray detector 23, a calculation unit 410, a main memory unit 420, and an auxiliary memory unit. 425, input unit 40, output unit 50, X-ray detector position control unit 440, X-ray image acquisition unit 445, optical camera position control unit 450, camera 460, optical image acquisition unit 455, table position control unit 465, and X Light source control mechanism 60. The inspection object 20 is mounted on the table 18. The inspection object 20 includes an imaging field of view 310.
X光檢測器23被機器手臂22.1與檢測器支撐部22.2驅動成在X光檢測器軌道320移動。 The X-ray detector 23 is driven by the robot arm 22.1 and the detector support portion 22.2 to move on the X-ray detector track 320.
檢查對象物20的位置係以攝像視野310在攝像視野軌道330上移動的方式藉工作台位置控制機構465定位，並藉工作台18移至目標位置。此時，X光檢測器23及工作台18分別在X光檢測器軌道320及攝像視野軌道330上移動，俾使X光檢測器23總是檢測出從X光產生器10朝向攝像視野310照射之X光。 The position of the inspection object 20 is positioned by the table position control mechanism 465 in such a manner that the imaging field of view 310 moves on the imaging field of view 330, and is moved to the target position by the table 18. At this time, the X-ray detector 23 and the table 18 move on the X-ray detector track 320 and the imaging field of view 330, respectively, so that the X-ray detector 23 always detects the irradiation from the X-ray generator 10 toward the imaging field of view 310. X-ray.
運算部410控制X光檢查裝置400的動作。例如，在一形態中，運算部410係因應於檢查對象物20，設定從X光 產生器10輸出X光時的條件，並儲存於主記憶部420。該條件例如包含對X光產生器10的施加電壓、攝像時間等。X光源控制機構60係根據該條件控制基於X光產生器10之X光的照射。X光影像取得機構445係根據所設定之攝像時間，控制基於X光檢測器23之X光的曝光時間。 The calculation unit 410 controls the operation of the X-ray inspection apparatus 400. For example, in one aspect, the calculation unit 410 sets the X-ray from the inspection object 20 The condition when the X-ray is output by the generator 10 is stored in the main memory unit 420. This condition includes, for example, an applied voltage to the X-ray generator 10, an imaging time, and the like. The X-ray source control mechanism 60 controls the irradiation of the X-rays based on the X-ray generator 10 in accordance with the conditions. The X-ray image acquisition unit 445 controls the exposure time of the X-rays based on the X-ray detector 23 based on the set imaging time.
在一形態中，運算部410執行用以從所取得之投影影像重建檢查對象物20之三維影像的處理。在其他的形態中，運算部410判定檢查對象物20之好壞。例如，運算部410使用重建之三維的影像資料或透視資料，判定檢查對象物20之好壞。在此情況，運算部410係識別焊劑球的形狀，並判定該形狀是否為所預設之容許範圍內等，藉此，判定檢查對象物20之好壞。此外，用以判定好壞的運算法則及對該運算法則的輸入資訊係根據檢查對象物20而異。因此，因應於檢查對象物20之種類的運算法則或輸入資訊係作為攝像條件資訊，從輸入部40輸入並儲存於主記憶部420。 In one aspect, the calculation unit 410 executes processing for reconstructing a three-dimensional image of the inspection object 20 from the acquired projection image. In another aspect, the calculation unit 410 determines whether the inspection object 20 is good or bad. For example, the calculation unit 410 determines whether the object 20 to be inspected is good or not using the reconstructed three-dimensional image data or perspective data. In this case, the calculation unit 410 identifies the shape of the solder ball, determines whether the shape is within the preset allowable range, and the like, thereby determining whether the object 20 to be inspected is good or bad. Further, the algorithm for determining the quality of the algorithm and the input information for the algorithm vary depending on the object 20 to be inspected. Therefore, the algorithm or the input information in accordance with the type of the inspection target object 20 is input from the input unit 40 and stored in the main storage unit 420 as the imaging condition information.
主記憶部420係藉EEPROM(Electrically Erasable Programmale Read Only Memory；可電抹除可程式化唯讀記憶體)或HDD(Hard Disc Driver)或其他非揮發性地保持資料的記憶裝置所實現。主記憶部420儲存X光焦點位置與攝像條件等的資料、及用以控制X光檢查裝置400之動作的作業系統、用以判定好壞的運算法則、用以執行上述之各處理的程式。 The main memory unit 420 is implemented by an EEPROM (Electrically Erasable Programmale Read Only Memory) or HDD (Hard Disc Driver) or other non-volatile memory holding device. The main memory unit 420 stores data such as the X-ray focus position and imaging conditions, an operation system for controlling the operation of the X-ray inspection apparatus 400, an algorithm for determining the quality, and a program for executing the above-described respective processes.
輔助記憶部425係藉RAM(Random Access Memory；隨機存取記憶體)等之揮發性記憶體所實現。輔助記憶部 425係暫時保持藉運算部410所產生之資料、藉X光影像取得機構445所取得之影像資料、及經由輸入部40所輸入之資料等。 The auxiliary memory unit 425 is realized by a volatile memory such as a RAM (Random Access Memory). Auxiliary memory The 425 system temporarily holds the data generated by the calculation unit 410, the image data acquired by the X-ray image acquisition unit 445, and the data input via the input unit 40.
X光檢測器位置控制機構440將機器手臂22.1與檢測器支撐部22.2驅動成使X光檢測器23移至藉運算部410所指定之位置。 The X-ray detector position control mechanism 440 drives the robot arm 22.1 and the detector support portion 22.2 to move the X-ray detector 23 to a position designated by the borrowing unit 410.
X光影像取得機構445從X光檢測器23接收從X光產生器10所照射並透過檢查對象物20之X光的影像資料。影像資料儲存於主記憶部420。 The X-ray image acquisition unit 445 receives the image data of the X-rays that are irradiated from the X-ray generator 10 and transmitted through the inspection object 20 from the X-ray detector 23. The image data is stored in the main memory unit 420.
光學相機位置控制機構450係根據來自運算部410的命令，控制相機460的位置。相機460包含CCD(Charge Coupled Device)、CMOS(Complementary Metal Oxide Semiconductor；互補型金屬氧化半導體)等元件。具體而言，光學相機位置控制機構450係為了特定檢查對象物20的檢查位置，而移動相機460的位置，並拍攝搭載於工作台18之檢查對象物20。 The optical camera position control mechanism 450 controls the position of the camera 460 in accordance with a command from the arithmetic unit 410. The camera 460 includes an element such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor). Specifically, the optical camera position control unit 450 moves the position of the camera 460 to specify the inspection position of the inspection target object 20, and captures the inspection object 20 mounted on the table 18.
光學影像取得機構455係接收藉相機460之攝影所得的影像資料，並將該影像資料儲存於輔助記憶部425。運算部410使該影像資料輸出至輸出部50。在輸出部50以監視裝置來實現的情況，會顯示檢查對象物20的影像。 The optical image acquisition unit 455 receives the image data obtained by the camera 460 and stores the image data in the auxiliary storage unit 425. The calculation unit 410 outputs the image data to the output unit 50. When the output unit 50 is realized by the monitoring device, the image of the inspection object 20 is displayed.
工作台位置控制機構465係根據運算部410的控制，使工作台18移動，藉此，執行X光攝像所需之工作台18的定位。 The table position control unit 465 moves the table 18 in accordance with the control of the calculation unit 410, thereby performing positioning of the table 18 required for X-ray imaging.
在一形態中，X光檢測器位置控制機構440係控制檢測器移動機構(例如機器手臂22.1與檢測器支撐部22.2) ，俾能一面維持檢查對象物20中的一點被投影至X光檢測器23之受光中心的狀態，X光檢測器23一面沿著所預設之第1軌道(例如X光檢測器軌道320)移動。工作台位置控制機構465係控制工作台18的驅動，俾能一面維持檢查對象物20中的一點被投影至X光檢測器23之受光中心的狀態，檢查對象物20一面沿著所預設之第2軌道(例如攝像視野軌道330)移動。X光源控制機構60係在X光檢測器23及檢查對象物20移動的期間控制X光產生器10，俾朝向檢查對象物20照射X光。X光影像取得機構445係在X光檢測器23及檢查對象物20移動的期間，使X光檢測器23於透過檢查對象物20之X光曝露複數次，藉此，取得複數張投影影像。運算部410係使用重建運算法則從依此方式所得之複數張投影影像重建三維影像。 In one form, the X-ray detector position control mechanism 440 controls the detector movement mechanism (eg, robot arm 22.1 and detector support portion 22.2) The 俾 can maintain a state in which a point in the inspection object 20 is projected to the light receiving center of the X-ray detector 23, and the X-ray detector 23 is along a predetermined first track (for example, the X-ray detector track 320). mobile. The table position control unit 465 controls the driving of the table 18, and maintains a state in which one point of the inspection object 20 is projected onto the light receiving center of the X-ray detector 23, and the object 20 is inspected along the preset. The second track (for example, the imaging field of view track 330) moves. The X-ray source control unit 60 controls the X-ray generator 10 while the X-ray detector 23 and the inspection object 20 are moving, and emits X-rays toward the inspection object 20. The X-ray image acquisition unit 445 causes the X-ray detector 23 to expose the X-rays transmitted through the inspection object 20 a plurality of times during the movement of the X-ray detector 23 and the inspection object 20, thereby acquiring a plurality of projection images. The calculation unit 410 reconstructs the three-dimensional image from the plurality of projection images obtained in this manner using a reconstruction algorithm.
在其他的形態中，第1軌道及第2軌道係圓軌道。X光檢測器位置控制機構440使X光檢測器23移動，工作台位置控制機構使檢查對象物20移動，俾使X光檢測器23及檢查對象物20以X光產生器10為中心呈同心圓狀移動。 In other forms, the first track and the second track are circular orbits. The X-ray detector position control unit 440 moves the X-ray detector 23, and the table position control mechanism moves the inspection object 20, so that the X-ray detector 23 and the inspection object 20 are concentric with the X-ray generator 10 as a center. Move in a circular shape.
較佳為，X光源控制機構60係在檢查對象物20及X光檢測器23移動的期間驅動X光產生器10，俾能連續照射X光。 Preferably, the X-ray source control means 60 drives the X-ray generator 10 while the inspection object 20 and the X-ray detector 23 are moving, and the X-ray can be continuously irradiated.
較佳為，X光源控制機構60將X光產生器10控制成對檢查對象物20照射X光複數次。X光檢測器23係因應於照射X光的時序，曝光複數次。 Preferably, the X-ray source control unit 60 controls the X-ray generator 10 to irradiate the inspection object 20 with X-rays a plurality of times. The X-ray detector 23 is exposed a plurality of times in response to the timing of irradiating the X-rays.
在此，再參照第4圖，整理X光檢查裝置400的技術構 想，係如下所示。 Here, referring to FIG. 4, the technical structure of the X-ray inspection apparatus 400 is arranged. I think, it is as follows.
(1)在將檢查對象物20中的著眼點總是投影至X光檢測器23之受光中心的狀態，X光檢測器23及攝像視野310分別在所預設之移動軌道上連續地移動。 (1) When the eye-pointing point in the inspection object 20 is always projected to the light-receiving center of the X-ray detector 23, the X-ray detector 23 and the imaging field of view 310 are continuously moved on the predetermined moving orbit.
(2)在(1)的移動當中，X光產生器10係連續地或在X光檢測器23處於曝光狀態的期間中照射X光。 (2) In the movement of (1), the X-ray generator 10 irradiates X-rays continuously or during a period in which the X-ray detector 23 is in an exposure state.
(3)在(1)的移動當中，X光檢測器23於X光中曝露複數次，保存藉複數次之曝光所取得的X光影像，作為投影影像。 (3) During the movement of (1), the X-ray detector 23 is exposed to the X-rays a plurality of times, and the X-ray image obtained by the exposure of the plurality of times is stored as a projection image.
(4)使用CT重建運算法則，使在(3)所保存之複數張投影影像三維影像化。 (4) Using the CT reconstruction algorithm, the plurality of projection images saved in (3) are three-dimensionally imaged.
依據此種技術構想， Based on this technical concept,
(a)對一個攝像視野內的檢查對象物20，透過檢查對象物20並照射於X光檢測器23之中心的位置在連續動作中不變。 (a) The position of the inspection target object 20 in one imaging field of view that passes through the inspection object 20 and is incident on the center of the X-ray detector 23 does not change during continuous operation.
(b)因為藉由控制X光檢測器23的曝光(快門)時序，得到複數張投影影像，所以使用那些影像，進行重建。 (b) Since a plurality of projected images are obtained by controlling the exposure (shutter) timing of the X-ray detector 23, those images are used for reconstruction.
結果，攝像所需的時間變短。 As a result, the time required for imaging becomes shorter.
此外，在本實施形態中，說明了X光檢測器軌道320及攝像視野軌道330是圓軌道的情況，但是X光檢測器軌道320及攝像視野軌道330未限定為圓軌道，亦可以是多角形、矩形的形狀。 Further, in the present embodiment, the case where the X-ray detector track 320 and the imaging visual field track 330 are circular orbits has been described, but the X-ray detector track 320 and the imaging visual field track 330 are not limited to a circular orbital, and may be polygonal. , the shape of the rectangle.
參照第5圖，說明本實施形態的X光檢查裝置400中之X光檢測器23與攝像視野310的移動。第5圖係表示以X光 產生器10為中心從上面所觀察到的X光檢查裝置400的圖。 The movement of the X-ray detector 23 and the imaging field of view 310 in the X-ray inspection apparatus 400 of the present embodiment will be described with reference to Fig. 5 . Figure 5 shows the X-ray The generator 10 is a view of the X-ray inspection apparatus 400 as viewed from above.
如第5圖所示，X光檢測器23在X光檢測器軌道320之上朝逆時針方向移動。具體而言，X光檢測器23係至少在作為X光攝影所需的曝光地點之目標位置D1、D2、D3、D4檢測出X光。此外，在第5圖所示的例子，雖然X光檢測器23沒有自轉，但是在其他的形態中，亦可X光檢測器23自轉。 As shown in Fig. 5, the X-ray detector 23 moves counterclockwise over the X-ray detector track 320. Specifically, the X-ray detector 23 detects X-rays at least at the target positions D1, D2, D3, and D4 which are exposure points required for X-ray imaging. Further, in the example shown in Fig. 5, although the X-ray detector 23 does not rotate, in another embodiment, the X-ray detector 23 may be rotated.
又，關於檢查對象物20所含的攝像視野310，在作為攝像用的位置之目標位置V1、V2、V3、V4、…Vn，進行X光攝影，取得投影影像P1’、P2’、P3’、P4’、…Pn’。與X光檢測器23一樣，在第5圖所示的例子，雖然攝像視野310沒有自轉，但是在其他的形態中，亦可攝像視野310自轉。 Further, the imaging field of view 310 included in the inspection object 20 is subjected to X-ray imaging at the target positions V1, V2, V3, V4, ..., Vn, which are imaging positions, and the projection images P1', P2', P3' are obtained. , P4', ... Pn'. Similarly to the X-ray detector 23, in the example shown in Fig. 5, although the imaging field of view 310 does not rotate, in other aspects, the imaging field of view 310 may be rotated.
此外，有關X光檢測器23的目標位置與攝像視野310的目標位置之關係，係以X光檢測器23的目標位置Dn可位於連接X光產生器10與攝像視野310的目標位置Vn之線上的方式控制X光檢測器23及攝像視野310的移動。即，X光檢測器23與攝像視野310係相對於X光產生器10以相同的角速度移動。此時，X光檢測器23係於仍然在受光面的中心抓到攝像視野310之著眼點的狀態，連續地移動至X光檢測器軌道320上的目標位置D1~Dn。在攝像視野310及X光檢測器23移動的期間，X光檢測器23曝露於透過攝像視野310的X光。此外，因為X光檢測器23係在仍然抓到著眼點之狀態下移動，所以X光檢測器位置控制機 構440及工作台位置控制機構465係以使用如同伺服馬達或線性馬達般可進行使用位置量測的結果之回授控制的驅動裝置者較佳。 Further, regarding the relationship between the target position of the X-ray detector 23 and the target position of the imaging field of view 310, the target position Dn of the X-ray detector 23 may be located on the line connecting the target position Vn of the X-ray generator 10 and the imaging field of view 310. The mode controls the movement of the X-ray detector 23 and the imaging field of view 310. That is, the X-ray detector 23 and the imaging field of view 310 are moved at the same angular velocity with respect to the X-ray generator 10. At this time, the X-ray detector 23 continuously moves to the target positions D1 to Dn on the X-ray detector track 320 while still grasping the eye point of the imaging field of view 310 at the center of the light receiving surface. While the imaging field of view 310 and the X-ray detector 23 are moving, the X-ray detector 23 is exposed to the X-rays transmitted through the imaging field of view 310. In addition, since the X-ray detector 23 is moved while still grasping the eye point, the X-ray detector position control machine The structure 440 and the table position control mechanism 465 are preferably driven by a feedback device that can perform feedback control using the position measurement as with a servo motor or a linear motor.
參照第6圖，說明著眼點。第6圖係以檢查對象物20為基準所表示X光檢測器23與X光產生器10之相對位置的圖。即，在本實施形態的X光檢查裝置400，為了理解著眼點，顯示在固定檢查對象物20之狀態下從檢查對象物20所觀察之X光檢測器23與X光產生器10的相對位置。 Refer to Figure 6 for an eye point. Fig. 6 is a view showing the relative positions of the X-ray detector 23 and the X-ray generator 10 based on the inspection object 20. In the X-ray inspection apparatus 400 of the present embodiment, the relative position of the X-ray detector 23 and the X-ray generator 10 viewed from the inspection object 20 in the state in which the inspection object 20 is fixed is displayed in order to understand the point of view. .
著眼點意指在投影影像，X光檢測器23的中心總是抓到檢查對象物20中的一點。將著眼點所存在之檢查對象物20中的XY平面稱為著眼面。 Focusing means that at the center of the X-ray detector 23, a point in the inspection object 20 is always caught in the projected image. The XY plane in the inspection object 20 in which the eye point is located is referred to as the eye surface.
檢查對象物20係具有著眼面610，其作為X光檢查裝置400之檢查對象的面。著眼面610包含著眼點620。X光檢測器23係以總是抓到著眼點620的方式與攝像視野310同步移動。 The inspection object 20 has an eye surface 610 which serves as a surface to be inspected by the X-ray inspection apparatus 400. The eye 610 includes an eye point 620. The X-ray detector 23 moves in synchronization with the imaging field of view 310 in such a manner that the eye point 620 is always caught.
參照第7圖，說明本實施形態之X光檢查裝置400的控制構成。第7圖係表示X光檢查裝置400所具有之運算部410執行之一連串的處理之一部分的流程圖。 The control configuration of the X-ray inspection apparatus 400 of the present embodiment will be described with reference to Fig. 7. Fig. 7 is a flowchart showing a part of a series of processes performed by the arithmetic unit 410 included in the X-ray inspection apparatus 400.
在步驟S710，運算部410係在檢查對象物20中的著眼點620總是投影至X光檢測器23之受光中心的狀態，使X光檢測器23及攝像視野310在供各自之移動所預設的軌道(X光檢測器軌道320及攝像視野軌道330)上連續地移動。又，運算部410使計算曝光次數用的計數器起始化。 In step S710, the calculation unit 410 always projects the eye-point 620 in the inspection object 20 to the light-receiving center of the X-ray detector 23, and causes the X-ray detector 23 and the imaging field of view 310 to be moved by the respective movements. The track (X-ray detector track 320 and imaging field track 330) is continuously moved. Further, the arithmetic unit 410 initializes the counter for calculating the number of exposures.
在步驟S720，運算部410係於該移動當中，在目標位置V1(或D1)、V2(或D2)、V3(或D3)、V4(或D4)、…Vn(或Dn)，將X光產生器10驅動成連續地照射X光，或在X光檢測器23處於曝光狀態的期間中，使X光產生器10照射X光。 In step S720, the computing unit 410 is in the movement, at the target position V1 (or D1), V2 (or D2), V3 (or D3), V4 (or D4), ... Vn (or Dn), X-ray The generator 10 is driven to continuously irradiate X-rays, or to cause the X-ray generator 10 to emit X-rays while the X-ray detector 23 is in an exposure state.
在步驟S730，X光檢測器23係在曝露於X光後，輸出投影影像，並傳輸至X光影像取得機構445。投影影像的資料保存於主記憶部420。然後，在一形態中，運算部410係為了使影像重建的處理高速化，而使所取得之投影影像輸入三維影像重建運算，並開始影像重建。此外，在其他的形態中，亦可使用在取得所需要之張數的投影影像後開始影像重建的構成。 In step S730, the X-ray detector 23 outputs the projected image after being exposed to the X-ray, and transmits it to the X-ray image acquisition unit 445. The data of the projected image is stored in the main memory unit 420. Then, in one aspect, the calculation unit 410 converts the acquired projection image into a three-dimensional image reconstruction operation in order to speed up the image reconstruction processing, and starts image reconstruction. Further, in another embodiment, it is also possible to use a configuration in which image reconstruction is started after acquiring a required number of projected images.
在步驟S740，運算部410將X光檢測器23的曝光次數增加1。 In step S740, the arithmetic unit 410 increases the number of exposures of the X-ray detector 23 by one.
在步驟S750，運算部410判斷是否已取得所預設之張數的投影影像。例如，運算部410判斷是否曝光次數與所預設之次數n相同。若運算部410判斷曝光次數與所預設之次數n相同(在步驟S750為是)，將控制切換至步驟S760。在不是的情況(在步驟S750為否)，運算部410將控制切換至步驟S730，X光檢測器23再次曝露於X光。 In step S750, the arithmetic unit 410 determines whether or not the predetermined number of projected images have been acquired. For example, the computing unit 410 determines whether the number of exposures is the same as the preset number n. If the calculation unit 410 determines that the number of exposures is the same as the preset number n (YES in step S750), the control is switched to step S760. If not (NO in step S750), the arithmetic unit 410 switches the control to step S730, and the X-ray detector 23 is exposed to the X-ray again.
在步驟S760，n張投影影像P1’~Pn的取得結束。運算部410係使用CT重建運算法則，從主記憶部420所保存之n張投影影像構成檢查對象物20的三維影像。此外，如步驟S730所說明，為了使X光檢查高速化，以每拍攝一張投影影像，在拍攝位置之三維影像重建運算中輸入該投 影影像較為理想。例如，運算部410在取得第2張投影影像的期間，使用第1張的投影影像執行重建運算。 In step S760, the acquisition of the n projected images P1' to Pn is completed. The calculation unit 410 forms a three-dimensional image of the inspection object 20 from the n projection images stored in the main storage unit 420 using the CT reconstruction algorithm. Further, as described in step S730, in order to speed up the X-ray inspection, each projection image is captured, and the projection is input in the three-dimensional image reconstruction operation at the shooting position. Shadow images are ideal. For example, the computing unit 410 performs a reconstruction operation using the first projected image while the second projected image is being acquired.
參照第8圖及第9圖，說明X光檢查裝置的動作型式。第8圖係表示X光檢查裝置100之各構成元件之動作型式的時序圖。第9圖係表示本實施形態之X光檢查裝置400之動作型式的時序圖。 The operation pattern of the X-ray inspection apparatus will be described with reference to Figs. 8 and 9. Fig. 8 is a timing chart showing the operation patterns of the respective constituent elements of the X-ray inspection apparatus 100. Fig. 9 is a timing chart showing the operation type of the X-ray inspection apparatus 400 of the present embodiment.
參照第8圖，如圖形810所示，X光檢查裝置100係作為X光檢測器位置控制機構(例如機器手臂22.1與檢測器支撐部22.2)的動作型式，反覆停止與移動。此時，從圖形810、820得知，在一形態中，工作台位置控制機構(例如工作台18)與X光檢測器23係不同步地移動，而在相異的時序，停在各自的目標位置。 Referring to Fig. 8, as shown in the graph 810, the X-ray inspection apparatus 100 is an operation type of the X-ray detector position control means (for example, the robot arm 22.1 and the detector support portion 22.2), and is repeatedly stopped and moved. At this time, it is known from the patterns 810 and 820 that, in one form, the table position control mechanism (for example, the table 18) moves asynchronously with the X-ray detector 23, and stops at the respective timings at different timings. target location.
X光檢測器23與檢查對象物20一被定位時，遂執行攝像。如圖形840所示，X光產生器10反覆停止與照射X光。此時，如圖形830所示，X光檢測器23係以與X光產生器10之動作同步的方式反覆停止與曝光。如第8圖所示，在X光檢查裝置100，X光攝像的動作時間係除了進行X光攝像而產生投影影像P1、P2、P3、P4、…Pn以外，還包含未進行攝像的期間。即，因為僅在X光檢測器23位於目標位置時可進行X光攝像，所以攝像時間受限制。 When the X-ray detector 23 is positioned with the inspection object 20, imaging is performed. As shown in the form 840, the X-ray generator 10 repeatedly stops and illuminates the X-rays. At this time, as shown in the graph 830, the X-ray detector 23 repeatedly stops and exposes in synchronization with the operation of the X-ray generator 10. As shown in FIG. 8, in the X-ray inspection apparatus 100, the operation time of the X-ray imaging is such that, in addition to the X-ray imaging, the projection images P1, P2, P3, P4, ..., Pn are generated, and the imaging period is not included. That is, since X-ray imaging can be performed only when the X-ray detector 23 is at the target position, the imaging time is limited.
相對地，參照第9圖，在本實施形態的X光檢查裝置400，因為X光檢測器23係總是在抓到屬檢查對象物20之一點的著眼點之情形下進行移動，所以X光檢測器23總是處於可檢測出X光之狀態。即，即使X光檢測器23與工作 台18分別是正朝向目標位置移動的期間，亦可進行X光攝像。 On the other hand, in the X-ray inspection apparatus 400 of the present embodiment, the X-ray detector 23 always moves while grasping the point of focus of one of the objects to be inspected 20, so that the X-ray is moved. The detector 23 is always in a state in which X-rays can be detected. That is, even if the X-ray detector 23 is working Each of the stages 18 is moving toward the target position, and X-ray imaging is also possible.
具體而言，如圖形910所示，X光檢測器位置控制機構440從停止狀態開始移動時，使X光檢測器23持續沿著X光檢測器軌道320移動。從圖形920得知，搭載著檢查對象物20的工作台18係以與X光檢測器23之移動同步的方式在攝像視野軌道330上開始移動。 Specifically, as shown in the graph 910, when the X-ray detector position control mechanism 440 starts moving from the stopped state, the X-ray detector 23 is continuously moved along the X-ray detector track 320. It is known from the pattern 920 that the table 18 on which the inspection object 20 is mounted starts moving on the imaging field of view 330 so as to be synchronized with the movement of the X-ray detector 23.
如圖形940所示，隨著X光檢測器23及工作台18開始移動，X光產生器10係同步地開始照射X光。在此，在本實施形態中，因為X光檢測器23總是抓著眼點，所以X光檢測器23總是可檢測出穿透過檢查對象物20的X光。因此，如圖形930所示，為了得到重建檢查對象物20的三維影像所需之張數的投影影像，X光檢測器23係根據所預設之攝像條件，因應於該張數，執行曝光的停止。依此方式，因為只要得到複數張投影影像後使曝光停止即可，所以迄至機構的定位結束前不必使曝光停止。因此，用以取得所需張數之投影影像的時間比在以往之攝像型態的時間更短。 As shown in the figure 940, as the X-ray detector 23 and the table 18 start moving, the X-ray generator 10 starts to illuminate the X-rays simultaneously. Here, in the present embodiment, since the X-ray detector 23 always grips the eye point, the X-ray detector 23 can always detect the X-ray that has passed through the inspection object 20. Therefore, as shown in the figure 930, in order to obtain a projected image of the number of sheets required to reconstruct the three-dimensional image of the inspection object 20, the X-ray detector 23 performs exposure according to the preset imaging conditions in response to the number of sheets. stop. In this way, since it is only necessary to stop the exposure after obtaining a plurality of projection images, it is not necessary to stop the exposure until the positioning of the mechanism is completed. Therefore, the time for obtaining the projected image of the required number of sheets is shorter than the time of the conventional imaging type.
如以上所示，依據本實施形態的X光檢查裝置400，由於並行地執行X光檢測器23及工作台18的移動(所謂的「機構移動」)與攝像，因為用以取得在以往之X光檢查裝置相同的曝光時間及相同張數之投影影像之移動時間及攝像時間的總時間比使用以往的X光檢查裝置之情況的總時間更短，所以可使X光攝像檢查高速化。 As described above, according to the X-ray inspection apparatus 400 of the present embodiment, the movement of the X-ray detector 23 and the table 18 (so-called "mechanism movement") and imaging are performed in parallel, since the conventional X is used. The same exposure time of the optical inspection apparatus and the total movement time of the projection image and the total imaging time of the same number of sheets are shorter than the total time of the conventional X-ray inspection apparatus, so that the X-ray imaging inspection can be speeded up.
以下，說明第2實施形態。本發明的X光檢查裝置1000係在X光檢測器23及檢查對象物20各自具有以轉軸為中心自轉的構成上，與第1實施形態的X光檢查裝置400相異。 Hereinafter, the second embodiment will be described. The X-ray inspection apparatus 1000 of the present invention is different from the X-ray inspection apparatus 400 of the first embodiment in that the X-ray detector 23 and the inspection object 20 each have a configuration that rotates around the rotation axis.
因此，參照第10圖，說明本實施形態之X光檢查裝置1000的構成。第10圖係表示X光檢查裝置1000的構成之一部分的圖。此外，用以控制X光檢查裝置1000之動作的機構係使用與第1實施形態之X光檢查裝置400之構成一樣的硬體構成所實現。因此，不重複那些說明。 Therefore, the configuration of the X-ray inspection apparatus 1000 of the present embodiment will be described with reference to Fig. 10 . Fig. 10 is a view showing a part of the configuration of the X-ray inspection apparatus 1000. Further, the mechanism for controlling the operation of the X-ray inspection apparatus 1000 is realized by using the same hardware configuration as that of the X-ray inspection apparatus 400 of the first embodiment. Therefore, those instructions are not repeated.
如第10圖所示，X光檢查裝置1000除了X光檢查裝置400的構成以外，更具有X光檢測器轉動機構1010與檢查對象轉動機構1020。X光檢測器轉動機構1010使X光檢測器23以轉軸1011為中心轉動。即，X光檢測器23會自轉。檢查對象轉動機構1020使檢查對象物20以轉軸1021為中心轉動。即，控制工作台18的位置使檢查對象物20自轉。此時，以轉軸1011為中心的轉動角度與以轉軸1021為中心的轉動角度係被維持成相同的角度。藉此，在使用藉在各轉動角度之攝像所得的影像重建三維影像時，著眼之斷層的影像不會抖動。 As shown in FIG. 10, the X-ray inspection apparatus 1000 further includes an X-ray detector rotation mechanism 1010 and an inspection target rotation mechanism 1020 in addition to the configuration of the X-ray inspection apparatus 400. The X-ray detector rotating mechanism 1010 rotates the X-ray detector 23 around the rotating shaft 1011. That is, the X-ray detector 23 will rotate. The inspection target rotation mechanism 1020 rotates the inspection object 20 around the rotation axis 1021. That is, the position of the control table 18 is controlled to rotate the inspection object 20. At this time, the rotation angle around the rotation shaft 1011 and the rotation angle around the rotation shaft 1021 are maintained at the same angle. Thereby, when reconstructing a three-dimensional image by using an image obtained by imaging at each rotation angle, the image of the slice that is focused on does not shake.
參照第11圖，說明藉第2實施形態之X光檢查裝置1000所得的影像。第11圖係表示在X光檢測器23及檢查對象物20分別轉動之狀態所得的影像之轉移的圖。 The image obtained by the X-ray inspection apparatus 1000 of the second embodiment will be described with reference to Fig. 11 . Fig. 11 is a view showing transition of an image obtained in a state where the X-ray detector 23 and the inspection object 20 are respectively rotated.
在狀態1111，進行檢查對象物20所含之檢查對象1120的攝影以作為最初的攝像。具體而言，檢查對象1120的X光影像被取得作為影像1101。X光檢測器23的曝光結 束時(攝像結束時)，X光檢測器23及檢查對象物20分別在X光檢測器軌道320及攝像視野軌道330上移動，而且自轉，並轉移至狀態1112。 In the state 1111, the imaging of the inspection object 1120 included in the inspection object 20 is performed as the first imaging. Specifically, the X-ray image of the inspection object 1120 is acquired as the image 1101. Exposure junction of X-ray detector 23 At the time of the beam (when the imaging is completed), the X-ray detector 23 and the inspection object 20 move on the X-ray detector track 320 and the imaging field of view 330, respectively, and rotate, and shift to the state 1112.
在狀態1112，X光檢測器23再度曝光。檢查對象1120的X光影像被取得作為影像1102。曝光結束時，X光檢測器23及檢查對象物20進一步移動及自轉，並轉移至狀態1113。 In state 1112, X-ray detector 23 is again exposed. The X-ray image of the inspection object 1120 is acquired as the image 1102. When the exposure is completed, the X-ray detector 23 and the inspection object 20 further move and rotate, and shift to the state 1113.
在狀態1113一進行曝光時即取得影像1103。然後，X光檢測器23和檢查對象物20移動及自轉，並轉移至狀態1114。進而，在狀態1114一進行曝光時即取得影像1104。依此方式，取得重建檢查對象之影像所需的投影影像。 When the exposure is performed in the state 1113, the image 1103 is acquired. Then, the X-ray detector 23 and the inspection object 20 move and rotate, and shift to the state 1114. Further, when the exposure is performed in the state 1114, the image 1104 is acquired. In this way, the projection image required to reconstruct the image of the inspection object is obtained.
因為所取得之影像1101、1102、1103、1104係分別以著眼點為中心的轉軸為中心作轉動的影像，所以各影像係已結束定位之狀態。因此，可推導出將這些影像重建所得之影像1130係無抖動且清晰的影像。 Since the acquired images 1101, 1102, 1103, and 1104 are respectively rotated images centering on the axis of rotation centering on the eye point, each image system has finished positioning. Therefore, it is possible to deduce that the image 1130 reconstructed from these images is a jitter-free and clear image.
如以上所示，依據本實施形態的X光檢查裝置1000，因為不需要在攝像中停止轉動，所以可使X光攝像高速化。 As described above, according to the X-ray inspection apparatus 1000 of the present embodiment, since it is not necessary to stop the rotation during imaging, the X-ray imaging can be speeded up.
此外，上述之實施形態之X光檢查裝置400、1000的控制機構係可使用具有周知之構成的電腦系統實現。 Further, the control mechanisms of the X-ray inspection apparatuses 400 and 1000 of the above-described embodiments can be realized by a computer system having a well-known configuration.
因此，參照第12圖，說明實現X光檢查裝置400、1000之控制機構的電腦系統1200。第12圖係表示電腦系統1200之硬體構成的方塊圖。 Therefore, a computer system 1200 that realizes a control mechanism of the X-ray inspection apparatuses 400 and 1000 will be described with reference to FIG. Figure 12 is a block diagram showing the hardware configuration of the computer system 1200.
電腦系統1200在主要的構成元件方面，具有：執行程式的CPU1；滑鼠2與鍵盤3，係接受使用者對電腦系統 1200所輸入的指示；RAM4，係暫時儲存藉CPU1執行程式所產生之資料、或者經由滑鼠2或鍵盤3所輸入之資料；硬碟5，係非揮發地儲存資料；光碟驅動裝置6；監視器8；通訊IF(Interface；介面)9。各構成元件彼此藉匯流排連接。CD-ROM9及其他光碟安裝於光碟驅動裝置6。 The computer system 1200 has, in terms of main constituent elements, a CPU 1 that executes a program, a mouse 2 and a keyboard 3, and accepts a user-to-computer system. 1200 input instructions; RAM4, temporarily store data generated by the CPU1 execution program, or data input via the mouse 2 or the keyboard 3; hard disk 5, non-volatile storage of data; optical disk drive device 6; monitoring 8; communication IF (Interface; interface) 9. The constituent elements are connected to each other by a bus bar. The CD-ROM 9 and other optical disks are mounted on the optical disk drive unit 6.
在電腦系統1200的處理係利用各硬體及藉CPU1所執行之軟體所實現。這種軟體係有儲預儲存於硬碟5的情況。又，亦有軟體係儲存於CD-ROM9或其他電腦可讀取之資料記錄媒體，並作為程式產品流通的情況。或者，亦有該軟體係利用與網際網路或其他網路連接之資訊提供業者提供可下載之程式產品的情況。這種軟體係藉光碟驅動裝置6或其他資料讀取裝置從資料記錄媒體讀取，或者經由通訊IF7下載後，暫時儲存於硬碟5。該軟體係藉CPU1從硬碟5讀出後，以可執行之程式的形式儲存於RAM4。CPU1係執行該程式。 The processing in the computer system 1200 is implemented by using various hardware and software executed by the CPU 1. This soft system has a case where the storage is pre-stored on the hard disk 5. In addition, there are cases where the soft system is stored on a CD-ROM 9 or other computer-readable data recording medium and distributed as a program product. Alternatively, the soft system may use a provider of information to connect to the Internet or other network to provide downloadable program products. The soft system is read from the data recording medium by the optical disk drive device 6 or other data reading device, or temporarily downloaded to the hard disk 5 after being downloaded via the communication IF7. The soft system is read from the hard disk 5 by the CPU 1, and stored in the RAM 4 in the form of an executable program. CPU1 executes the program.
構成第12圖所示之電腦系統1200的各構成元件係一般性者。因此，可說本發明之本質的部分係儲存於RAM4、硬碟5、CD-ROM9或其他資料記錄媒體的軟體，或者可經由網路下載的軟體。此外，因為電腦系統1200之各硬體的動作係周知，所以不重複詳細的說明。 The constituent elements constituting the computer system 1200 shown in Fig. 12 are general. Therefore, it can be said that the essential part of the present invention is a software stored in the RAM 4, the hard disk 5, the CD-ROM 9 or other data recording medium, or a software which can be downloaded via the network. In addition, since the operation of each hardware of the computer system 1200 is well known, detailed description will not be repeated.
此外，作為資料記錄媒體，未限定為CD-ROM、FD(Flexible Disk)、硬碟，亦可以是磁帶、卡帶、光碟(MO(Magnetic Optical Disc)/MD(Mini Disc))/DVD(Digital Versatile Disc))、IC(Integrated Circuit)卡(包含記憶卡)、光卡、遮罩ROM、EPROM(Electrically Programmale Read Only Memory)、EEPROM(Electrically Erasable Programmale Read Only Memory)、快閃ROM等之半導體記憶體等固定地載持程式的媒體。 In addition, as a data recording medium, it is not limited to a CD-ROM, a FD (Flexible Disk), a hard disk, and may be a magnetic tape, a cassette, a compact disc (MO (Magnetic Optical Disc)/MD (Mini Disc))/DVD (Digital Versatile). Disc)), IC (Integrated Circuit) card (including memory card), optical card, mask ROM, EPROM (Electrically Programmale Read Only Memory), EEPROM (Electrically Erasable Programmale Read Only Memory), semiconductor memory such as flash ROM, etc.
在此所指的程式係不僅是可藉CPU直接執行的程式，可包含原始程式形式的程式、已壓縮處理的程式、密碼化的程式等。 The program referred to here is not only a program that can be directly executed by the CPU, but also a program in the form of a source program, a program that has been compressed, a program that is encrypted, and the like.
應認為這次所揭示之實施形態在全部的事項上是舉例表示，而不是用以限制者。本發明之範圍不是根據上述的說明，而是根據申請專利範圍所表示，意指包含與申請專利範圍均等之意義及範圍內之所有的變更。 It should be understood that the embodiments disclosed herein are illustrative of all matters and are not intended to be limiting. The scope of the present invention is defined by the scope of the claims and the scope of the claims and the scope of the claims.
1‧‧‧CPU 1‧‧‧CPU
2‧‧‧滑鼠 2‧‧‧mouse
3‧‧‧鍵盤 3‧‧‧ keyboard
4‧‧‧RAM 4‧‧‧RAM
5‧‧‧硬碟 5‧‧‧ Hard disk
6‧‧‧光碟驅動裝置 6‧‧‧Disc drive
8‧‧‧監視器 8‧‧‧Monitor
9‧‧‧CD-ROM 9‧‧‧CD-ROM
10‧‧‧X光產生器 10‧‧‧X-ray generator
17‧‧‧X光焦點 17‧‧‧X-ray focus
18‧‧‧工作台 18‧‧‧Workbench
20‧‧‧檢查對象物 20‧‧‧Check objects
22‧‧‧X光檢測器驅動部 22‧‧‧X-ray detector drive unit
22.1‧‧‧機器手臂 22.1‧‧‧Machine arm
22.2‧‧‧檢測器支撐部 22.2‧‧‧Detector support
23‧‧‧X光檢測器 23‧‧‧X-ray detector
30‧‧‧影像取得控制機構 30‧‧‧Image acquisition control agency
32‧‧‧檢測器驅動控制部 32‧‧‧Detector Drive Control Department
34‧‧‧影像資料取得部 34‧‧‧Image Data Acquisition Department
40‧‧‧輸入部 40‧‧‧ Input Department
50‧‧‧輸出部 50‧‧‧Output Department
60‧‧‧X光源控制機構 60‧‧‧X light source control mechanism
70、410‧‧‧運算部 70, 410‧‧‧ Computing Department
80‧‧‧檢查對象位置控制部 80‧‧‧Check object position control unit
90‧‧‧記憶體 90‧‧‧ memory
100、400、1000‧‧‧X光檢查裝置 100, 400, 1000‧‧‧X-ray inspection equipment
310‧‧‧攝像視野 310‧‧‧Video field of view
320‧‧‧X光檢測器軌道 320‧‧‧X-ray detector track
330‧‧‧攝像視野軌道 330‧‧‧Video field of view track
420‧‧‧主記憶部 420‧‧‧Main Memory
425‧‧‧輔助記憶部 425‧‧‧Auxiliary Memory Department
440‧‧‧X光檢測器位置控制機構 440‧‧‧X-ray detector position control mechanism
445‧‧‧X光影像取得機構 445‧‧‧X-ray image acquisition agency
450‧‧‧光學相機位置控制機構 450‧‧‧Optical camera position control mechanism
455‧‧‧光學影像取得機構 455‧‧‧ Optical Image Acquisition Agency
460‧‧‧相機 460‧‧‧ camera
465‧‧‧工作台位置控制機構 465‧‧‧Workbench position control mechanism
610‧‧‧著眼面 610‧‧‧ Eyes
620‧‧‧著眼點 620‧‧‧ Focus
1010‧‧‧X光檢測器轉動機構 1010‧‧‧X-ray detector rotation mechanism
1011、1021‧‧‧轉軸 1011, 1021‧‧‧ shaft
1020‧‧‧檢查對象轉動機構 1020‧‧‧Check object rotation mechanism
第1圖係表示X光檢查裝置100之硬體構成的方塊圖。 Fig. 1 is a block diagram showing the hardware configuration of the X-ray inspection apparatus 100.
第2圖係表示X光檢查裝置100所執行之一連串的處理之一部分的流程圖。 Fig. 2 is a flow chart showing a part of a series of processes performed by the X-ray inspection apparatus 100.
第3圖係從上方顯示X光檢測器23與攝像視野310移動之狀態的圖。 Fig. 3 is a view showing a state in which the X-ray detector 23 and the imaging field of view 310 are moved from above.
第4圖係表示X光檢查裝置400之硬體構成的方塊圖。 Fig. 4 is a block diagram showing the hardware configuration of the X-ray inspection apparatus 400.
第5圖係表示以X光產生器10為中心從上觀察X光檢查裝置400的圖。 Fig. 5 is a view showing the X-ray inspection apparatus 400 viewed from above with the X-ray generator 10 as the center.
第6圖係以檢查對象物20為基準所表示X光檢測器23與X光產生器10之相對位置的圖。 Fig. 6 is a view showing the relative positions of the X-ray detector 23 and the X-ray generator 10 based on the inspection object 20.
第7圖係表示X光檢查裝置400所具有之運算部410所執行之一連串的處理之一部分的流程圖。 Fig. 7 is a flow chart showing a part of a series of processing executed by the arithmetic unit 410 included in the X-ray inspection apparatus 400.
第8圖係表示X光檢查裝置100之各構成元件之動作型態的時序圖。 Fig. 8 is a timing chart showing the operation patterns of the respective constituent elements of the X-ray inspection apparatus 100.
第9圖係表示本實施形態之X光檢查裝置400之動作型態的時序圖。 Fig. 9 is a timing chart showing an operation mode of the X-ray inspection apparatus 400 of the present embodiment.
第10圖係表示X光檢查裝置1000的構成之一部分的圖。 Fig. 10 is a view showing a part of the configuration of the X-ray inspection apparatus 1000.
第11圖係表示在X光檢測器23及檢查對象物20分別轉動之狀態所得的影像之轉移的圖。 Fig. 11 is a view showing transition of an image obtained in a state where the X-ray detector 23 and the inspection object 20 are respectively rotated.
第12圖係表示電腦系統1200之硬體構成的方塊圖。 Figure 12 is a block diagram showing the hardware configuration of the computer system 1200.
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| TW101133421A TW201312102A (en) | 2011-09-14 | 2012-09-13 | X-ray inspecting device, method for controlling the same, program for controlling the same and recording media for stroing the program thereof |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2013061257A (en) |
| TW (1) | TW201312102A (en) |
| WO (1) | WO2013039032A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114026411A (en) * | 2020-03-11 | 2022-02-08 | 欧姆龙株式会社 | X-ray inspection apparatus and X-ray inspection method |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3764086A1 (en) | 2019-07-12 | 2021-01-13 | Excillum AB | Method for x-ray imaging a sample, corresponding x-ray source and x-ray imaging system |
| JP7437222B2 (en) | 2020-04-22 | 2024-02-22 | 株式会社サキコーポレーション | Inspection equipment |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62172698A (en) * | 1986-01-24 | 1987-07-29 | Hitachi Medical Corp | X-ray computer tomography device |
| JP4386812B2 (en) * | 2003-08-27 | 2009-12-16 | パナソニック株式会社 | X-ray inspection equipment |
| JPWO2009078415A1 (en) * | 2007-12-17 | 2011-04-28 | 株式会社ユニハイトシステム | X-ray inspection apparatus and method |
| JP5444718B2 (en) * | 2009-01-08 | 2014-03-19 | オムロン株式会社 | Inspection method, inspection device, and inspection program |
| JP2011149738A (en) * | 2010-01-19 | 2011-08-04 | Saki Corp:Kk | Method of correcting inspection device using tool for correction and inspection device mounted with tool for correction |
| JP4598880B1 (en) * | 2010-04-23 | 2010-12-15 | 東芝Ｉｔコントロールシステム株式会社 | CT apparatus and imaging method of CT apparatus |
-
2011
- 2011-09-14 JP JP2011200134A patent/JP2013061257A/en not_active Withdrawn
-
2012
- 2012-09-10 WO PCT/JP2012/073056 patent/WO2013039032A1/en active Application Filing
- 2012-09-13 TW TW101133421A patent/TW201312102A/en unknown
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114026411A (en) * | 2020-03-11 | 2022-02-08 | 欧姆龙株式会社 | X-ray inspection apparatus and X-ray inspection method |
| CN114026411B (en) * | 2020-03-11 | 2022-12-09 | 欧姆龙株式会社 | X-ray inspection apparatus and X-ray inspection method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2013061257A (en) | 2013-04-04 |
| WO2013039032A1 (en) | 2013-03-21 |
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